CN202058083U - Mainboard radiation structure of computer case of industrial control computer - Google Patents

Abstract

A heat dissipation structure for the main board of an industrial computer case. The case body of the industrial control computer case is covered with a movable horizontal case cover. The horizontally arranged main board is fixed on the bottom shell wall of the case body. The main board is covered with a heat dissipation plate, which is a solid metal The upper surface of the flat plate is evenly opened with multiple parallel heat dissipation grooves. The direction of the heat dissipation grooves is perpendicular to the length direction of the heat dissipation plate. The two ends of the heat dissipation plate are bent downwards. On the shell wall at the bottom of the body, the middle part of the cooling plate is a horizontal section, which is close to the CPU and the north-south bridge chips on the main board. The width of the horizontal section of the cooling plate is greater than or equal to the width of the main board. superior. The main heating element on the main board directly contacts with the chassis shell through the heat dissipation plate to dissipate heat, there is no intermediate medium, no fan is needed, the heat dissipation effect is better, and the impact resistance of the entire box is strengthened.

Description

A heat dissipation structure of a mainboard of an industrial computer case

technical field

The utility model relates to a cooling structure for a main board of a computer, in particular to an industrial control computer. the

Background technique

Industrial control computer is industrial control computer. In layman’s terms, it is a computer specially designed for industrial sites. It evolved from PCs. However, industrial sites generally have strong vibrations, a lot of dust, and high electromagnetic fields. Force interference and other characteristics, and the general factory is continuous operation, that is, there is generally no rest in a year. Therefore, compared with ordinary computers, industrial computers must have the following characteristics: high anti-magnetic, dust-proof, and shock-proof capabilities, and require the ability to work continuously and stably for a long time. the

The rationality of the heat dissipation structure is an important factor related to whether the computer can work stably for a long time. At present, the most common motherboard heat dissipation solution is to use the interactive heat dissipation channel structure to dissipate heat: the external low-temperature air is sucked into the chassis by the high-speed ball fan in the front of the chassis and the cooling holes on both sides of the chassis, passes through the north and south bridge chips, reaches the vicinity of the CPU, and passes through the CPU to dissipate heat. After the cooler, part of the hot air is drawn out of the chassis from the two high-speed ball exhaust fans at the rear of the chassis, and the other part is exhausted from the chassis through the power supply fan. the

Since industrial computers work in humid, cold, hot or remote environments for a long time, and the requirements for the system to maintain 24-hour uninterrupted and stable operation in harsh environments are particularly high, the current heat dissipation structure uses many fans. Finally, once the heat dissipation fan fails, the heat dissipation effect will deteriorate until it affects the stability of the industrial computer's work and operation. the

Utility model content

The technical problem to be solved by the utility model is to provide a heat dissipation structure for the mainboard of the industrial control computer case that can dissipate heat from the mainboard without using a cooling fan. the

The utility model is achieved through the following technical solutions:

A main board heat dissipation structure of an industrial computer case, characterized in that:

The box body of the industrial control computer case is covered with a movable horizontal box cover,

The horizontally configured main board is fixed on the bottom shell wall of the box,

The main board is covered with a cooling plate. The cooling plate is a solid metal plate. Multiple parallel cooling slots are evenly opened on the upper surface. The opening direction of the cooling slots is perpendicular to the length direction of the cooling plate.

The two ends of the cooling plate are bent downward, and the bending edge is located outside the main board. The end of the cooling plate is fixed on the bottom wall of the box. The middle part of the cooling plate is a horizontal section, which is close to the CPU and the north-south bridge chips on the main board. The width of the horizontal section of the cooling plate is greater than or equal to the width of the main board,

The case cover is located above the heat dissipation plate and pressed against the horizontal section of the heat dissipation plate. the

The heat dissipation of the motherboard is actually the heat dissipation of the CPU and the North and South Bridge chips. In the heat dissipation structure of the utility model, the CPU and the North and South Bridge chips are directly in contact with the casing through the heat dissipation plate, and no intermediate medium is needed, so the CPU and the North and South Bridge chips will be quickly separated. The heat from the south bridge is transmitted to the top of the chassis, and then to the outside of the chassis, with good heat dissipation efficiency; at the same time, the cooling plate connects the chassis cover and the box body as a whole, which strengthens the strength of the chassis and has stronger impact resistance. the

Further, two bosses can protrude upward from the shell wall at the bottom of the box, and the inner sides of both ends of the cooling plate are close to the bosses, and the two are fixed with bolts. This structure facilitates the fixing of the heat dissipation plate, and the overall structural strength of the heat dissipation plate and the shell wall at the bottom of the box is high. the

Furthermore, the heat dissipation plate is preferably an aluminum heat dissipation plate, which has a good heat dissipation effect and can protect the structure of the main board at the same time. the

Furthermore, considering the size of the box body and the main board of the existing industrial control computer, the thickness of the cooling plate is generally 2-5 mm, and the cooling surface area is 20000-25000 mm ² .

The beneficial effects of the utility model are:

1. The main heating element on the main board directly contacts the chassis shell to dissipate heat through the cooling plate, there is no intermediate medium, and no fan is needed;

2. The heat dissipation plate is an integrated structure with a large heat dissipation surface area, which has a better heat dissipation effect than a small heat sink on a local component;

3. The cooling plate connects the box body and the box cover as a whole, which strengthens the impact resistance of the whole box body. the

Description of drawings

Fig. 1 is the three-dimensional exploded schematic view of the utility model

Among Fig. 1: 1 is the shell wall at the bottom of the box body, 1-1 is the boss, 2 is the box cover, 3 is the main board, 4 is the cooling plate, and 4-1 is the cooling groove. the

Detailed ways

Below in conjunction with accompanying drawing, the utility model is further described. the

In the utility model, the box body of the industrial control computer case is covered with a movable horizontal box cover 2, and the horizontally configured main board 3 is fixed on the bottom shell wall 1 of the box body, and the main board 3 is covered with a cooling plate 4, which is a solid metal Flat plate, the upper surface is evenly provided with a plurality of parallel heat dissipation grooves 4-1, and the opening direction of the heat dissipation grooves 4-1 is perpendicular to the length direction of the heat dissipation plate 4,

The two ends of the cooling plate 4 are bent downward, and the bending edge is located outside the main board 3. The shell wall 1 at the bottom of the box body protrudes upwards with two bosses 1-1. Bolts are fixed between them, the middle part of the cooling plate 4 is a horizontal section, and the horizontal section is close to the CPU and the north-south bridge chips on the main board. The width of the horizontal section of the cooling plate 4 is greater than or equal to the width of the main board 3. On the radiating plate 4 horizontal sections. the

The heat dissipation plate 4 is an aluminum heat dissipation plate, the thickness of the heat dissipation plate 4 is 3 mm, and the heat dissipation surface area is 22643.5 mm ² .

The components on the main board 3 are mainly low-power parts, the total power consumption of the system is no more than 8W, and the heat dissipation structure of the system is compact. The case contact does not require an intermediate medium, so the heat from the CPU and the south bridge will be transferred to the case cover 2 quickly, and then to the outside of the case. the

Claims (4)

1. A motherboard heat dissipation structure of an industrial computer case, characterized in that: The box body of the industrial control computer box is covered with a movable horizontal box cover (2), The main board (3) arranged horizontally is fixed on the shell wall (1) at the bottom of the box body, The main board (3) is covered with a cooling plate (4), the cooling plate (4) is a solid metal flat plate, and a plurality of parallel cooling slots (4-1) are evenly opened on the upper surface, and the opening direction of the cooling slots (4-1) is vertical In the length direction of the cooling plate (4), The two ends of the cooling plate (4) are bent downwards, the bent edge is located outside the main board (3), the end of the cooling plate (4) is fixed on the shell wall (1) at the bottom of the box, and the middle part of the cooling plate (4) is horizontal section, the horizontal section is close to the CPU and the north-south bridge chips on the mainboard, the width of the horizontal section of the cooling plate (4) is greater than or equal to the width of the mainboard (3), The case cover (2) is positioned above the heat dissipation plate (4) and pressed against the horizontal section of the heat dissipation plate (4). 2. The heat dissipation structure of the main board of the industrial computer case according to claim 1, characterized in that: the shell wall (1) at the bottom of the box protrudes upwards with two bosses (1-1), and the inner sides of the two ends of the heat dissipation plate (4) are tight. Paste the boss (1-1), and fix it with bolts. 3. The heat dissipation structure of the motherboard of the industrial computer case according to claim 1, characterized in that: the heat dissipation plate (4) is an aluminum heat dissipation plate. 4. The heat dissipation structure of the motherboard of the industrial computer case according to claim 1, characterized in that: the heat dissipation plate (4) has a thickness of 2-5 mm and a heat dissipation surface area of 20000-25000 mm ² .

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