CN202058083U - Mainboard radiation structure of computer case of industrial control computer - Google Patents
Mainboard radiation structure of computer case of industrial control computer Download PDFInfo
- Publication number
- CN202058083U CN202058083U CN201120144161XU CN201120144161U CN202058083U CN 202058083 U CN202058083 U CN 202058083U CN 201120144161X U CN201120144161X U CN 201120144161XU CN 201120144161 U CN201120144161 U CN 201120144161U CN 202058083 U CN202058083 U CN 202058083U
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- China
- Prior art keywords
- mainboard
- heat sink
- radiation
- radiation board
- board
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Abstract
Provided is a mainboard radiation structure of a computer case of an industrial control computer. A movable horizontal case cover is covered on a case body of the computer case of the industrial control computer, the mainboard arranged horizontally is fixed on the casing wall at the bottom of the case body, and a radiation board which is a solid metal flat board is covered on the mainboard. A plurality of parallel radiation grooves are evenly arranged on the upper surface of the radiation board, and arrangement direction of the radiation grooves is perpendicular to length direction of the radiation board. Two ends of the radiation board bend downward, and bending edges are arranged outside the mainframe. End portions of the radiation board are fixed on the casing wall at the bottom of the case body, the middle portion of the radiation board is a horizontal section which is adhered on a central processing unit (CPU), north bridge chips and south bridge chips, and the CPU, the north bridge chips and south bridge chips are arranged on the mainboard. Width of the horizontal section of the radiation board is larger than that of the mainboard, and the case cover is located above the radiation board and butted against the horizontal section of the radiation board. A main heating element on the mainboard is directly contacted with the casing of the computer case to radiate through the radiation board, no middle media exists, no fans are needed, radiation effect is better, and impact resistance of the whole case body is reinforced.
Description
Technical field
The utility model relates to a kind of mainboard radiator structure of computer, relates in particular to the Industry Control computer.
Background technology
The Industry Control computer is an industrial control computer, popular saying is exactly the computing machine that designs for industry spot specially, it is to develop from PC, but because industry spot generally has strong vibrations, dust is many especially, other has very high characteristics such as electromagnetic force interference, and general factory works continuously generally in promptly 1 year not have a rest.Therefore, industrial computer is compared with common computer must have following characteristics: the ability of higher antimagnetic, dustproof, protecting against shock is arranged, require to have continuously long-time stable ability to work of carrying out.
The rationality of radiator structure is to be related to the key factor that can computing machine long-term stable operation.At present the most general mainboard heat radiation solution is to utilize interactive heat dissipation channel structure heat radiation: outside Cryogenic air enters cabinet by the high speed ball fan and the suction of cabinet both sides louvre of cabinet front portion, near north and south bridge chip, arrival CPU, behind the process cpu heat, a hot-air part is extracted cabinet out from two high speed ball extraction fans at cabinet rear portion, and a part is discharged cabinet by power supply fan in addition.
Because industrial PC works long hours at moist, cold, hot or remote environment, and under rugged surroundings, keep the requirement of continual stable operation in 24 hours high especially to system, the fan that present radiator structure uses is more, after long-term the use, in case radiator fan fault, radiating effect will variation, until the stability that influences industrial PC work operation.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of and need not to utilize the radiator fan just can be to the mainboard radiator structure of the industrial PC cabinet of mainboard heat radiation.
The utility model is achieved through the following technical solutions:
A kind of mainboard radiator structure of industrial PC cabinet is characterized in that:
The horizontal case lid of covering activity on the casing of industrial PC cabinet,
The mainboard of horizontal arrangement is fixed on the bottom half shell wall,
Cover heat sink on the mainboard, heat sink is solid metal plate, and upper surface is evenly offered the parallel radiating groove of multiple tracks, radiating groove offer the length direction of direction perpendicular to heat sink,
The downward bending in the two ends of heat sink, bending edges are positioned at the mainboard outside, and the heat sink end is fixed on the bottom half shell wall, and the heat sink middle part is a horizontal segment, and horizontal segment is close to CPU and the north and south bridge chip on the mainboard, and heat sink horizontal segment width is more than or equal to the mainboard width,
Case lid is positioned at the heat sink top, is pressed on the heat sink horizontal segment.
The heat radiation of mainboard is actually the heat radiation to CPU and north and south bridge chip, in the radiator structure of the present utility model, CPU directly contacts with casing by heat sink with the north and south bridge chip, do not need intermediate medium, so very fast meeting is passed to CPU and south bridge heat above the casing, and then passing to the cabinet outside, radiating efficiency is good; Simultaneously, heat sink is connected the cabinet case lid as a whole with casing, has strengthened the intensity of cabinet, and impact resistance is stronger.
Further, can be at the bottom half shell wall to upper process twice boss, boss is close in inboard, heat sink two ends, between the two bolt.This structure is convenient to the fixing of heat sink, and the overall construction intensity height of heat sink and bottom half shell wall.
Further again, heat sink is preferably the aluminum heat sink, and good heat dissipation effect, while can be played the effect of protection mainboard structure.
Further again, consider the casing and the mainboard size that have the Industry Control computer now, the thickness of heat sink is generally 2～5mm, and cooling surface area is 20000～25000mm
2
The beneficial effects of the utility model are:
1, the main heater element on the mainboard directly contacts heat radiation with the cabinet housing by heat sink, does not have intermediate medium, need not fan;
2, heat sink is the structure of the big cooling surface area of integral type, compares with small-sized heat radiator of configuration on local certain element, and radiating effect is better;
3, heat sink is connected casing as a wholely with case lid, has strengthened the impact resistance of whole box body.
Description of drawings
Fig. 1 is a perspective exploded view of the present utility model
Among Fig. 1: 1 is the bottom half shell wall, and 1-1 is a boss, and 2 is case lid, and 3 is mainboard, and 4 is heat sink, and 4-1 is a radiating groove.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
In the utility model, the horizontal case lid 2 of covering activity on the casing of industrial PC cabinet, the mainboard 3 of horizontal arrangement is fixed on the bottom half shell wall 1, cover heat sink 4 on the mainboard 3, heat sink 4 is solid metal plate, upper surface is evenly offered the parallel radiating groove 4-1 of multiple tracks, and radiating groove 4-1 offers the length direction of direction perpendicular to heat sink 4
The downward bending in the two ends of heat sink 4, bending edges is positioned at mainboard 3 outsides, bottom half shell wall 1 is to upper process twice boss 1-1, boss 1-1 is close in inboard, heat sink 4 two ends, bolt between the two, and heat sink 4 middle parts are horizontal segment, horizontal segment is close to CPU and the north and south bridge chip on the mainboard, heat sink 4 horizontal segment width are more than or equal to mainboard 3 width, and case lid 2 is positioned at heat sink 4 tops, are pressed on heat sink 4 horizontal segments.
Element on the mainboard 3 is based on the part of low-power consumption, the total power consumption of system is no more than 8W, the radiator structure compactness of system, the original paper of big power consumption, be directly to contact with casing by heat sink 4 as the heat radiation of CPU and north and south bridge chip, do not need intermediate medium, so very fast meeting is passed to CPU and south bridge heat on the case lid 2, and then pass to the cabinet outside.
Claims (4)
1. the mainboard radiator structure of an industrial PC cabinet is characterized in that:
The horizontal case lid (2) of covering activity on the casing of industrial PC cabinet,
The mainboard of horizontal arrangement (3) is fixed on the bottom half shell wall (1),
Mainboard (3) go up to cover heat sink (4), and heat sink (4) is solid metal plate, and upper surface is evenly offered the parallel radiating groove of multiple tracks (4-1), radiating groove (4-1) offer the length direction of direction perpendicular to heat sink (4),
The downward bending in two ends of heat sink (4), bending edges is positioned at mainboard (3) outside, heat sink (4) end is fixed on the bottom half shell wall (1), heat sink (4) middle part is a horizontal segment, horizontal segment is close to CPU and the north and south bridge chip on the mainboard, heat sink (4) horizontal segment width is more than or equal to mainboard (3) width
Case lid (2) is positioned at heat sink (4) top, is pressed on heat sink (4) horizontal segment.
2. the mainboard radiator structure of industrial PC cabinet according to claim 1 is characterized in that: bottom half shell wall (1) is to upper process twice boss (1-1), and boss (1-1), bolt between the two are close in heat sink (4) inboard, two ends.
3. the mainboard radiator structure of industrial PC cabinet according to claim 1 is characterized in that: described heat sink (4) is the aluminum heat sink.
4. the mainboard radiator structure of industrial PC cabinet according to claim 1 is characterized in that: the thickness of described heat sink (4) is 2～5mm, and cooling surface area is 20000～25000mm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120144161XU CN202058083U (en) | 2011-05-09 | 2011-05-09 | Mainboard radiation structure of computer case of industrial control computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120144161XU CN202058083U (en) | 2011-05-09 | 2011-05-09 | Mainboard radiation structure of computer case of industrial control computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202058083U true CN202058083U (en) | 2011-11-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120144161XU Expired - Fee Related CN202058083U (en) | 2011-05-09 | 2011-05-09 | Mainboard radiation structure of computer case of industrial control computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202058083U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107533347A (en) * | 2015-04-10 | 2018-01-02 | 菲尼克斯电气开发及制造股份有限公司 | Capsule with multiple heat-delivery surfaces |
| CN108247677A (en) * | 2017-12-28 | 2018-07-06 | 浙江捷尚人工智能研究发展有限公司 | Has the robot of internal heat dissipating function |
-
2011
- 2011-05-09 CN CN201120144161XU patent/CN202058083U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107533347A (en) * | 2015-04-10 | 2018-01-02 | 菲尼克斯电气开发及制造股份有限公司 | Capsule with multiple heat-delivery surfaces |
| CN108247677A (en) * | 2017-12-28 | 2018-07-06 | 浙江捷尚人工智能研究发展有限公司 | Has the robot of internal heat dissipating function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20150509 |
|
| EXPY | Termination of patent right or utility model |