CN115623670B

CN115623670B - Heat dissipation device and power supply

Info

Publication number: CN115623670B
Application number: CN202211620794.2A
Authority: CN
Inventors: 段晓炼; 韦威胜; 王元洪; 马肖华
Original assignee: Shenzhen Yiyuan Technology Co ltd
Current assignee: Shenzhen Yiyuan Technology Co ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-04-07
Anticipated expiration: 2042-12-16
Also published as: CN115623670A

Abstract

The invention relates to a heat dissipation device and a power supply. The heat sink includes: a mounting circuit board having a first surface and a second surface in a thickness direction and fixed on the main circuit board; a transistor disposed on the first surface; a functional device at least partially located on a side where the first surface is located; and the heat dissipation mechanism is arranged on the second surface and is fixedly connected with the main circuit board, and the mounting circuit board is fixed on the heat dissipation mechanism. The heat generated by the transistor can be discharged by the heat dissipation mechanism, so that the heat dissipation effect of the heat dissipation device is ensured. Meanwhile, the installation circuit board has double fixing functions, so that the installation circuit board is effectively prevented from loosening relative to the main circuit board, the installation stability and the installation reliability of the installation circuit board are improved, and the stability and the reliability of the power supply work are prevented from being influenced by the loosening of the installation circuit board.

Description

Heat dissipation device and power supply

Technical Field

The invention relates to the technical field of power supplies, in particular to a heat dissipation device and a power supply comprising the same.

Background

The conventional power supply includes a transistor, which is a metal-oxide semiconductor field effect transistor, i.e., a MOS transistor, and the transistor generates heat during operation, and in order to prevent the heat from accumulating for a long time and affecting the service life of the power supply, the transistor is usually directly disposed on a heat sink, so that the heat sink dissipates heat to the transistor in time. Although the traditional power supply can realize heat dissipation, the defect of poor working stability exists generally.

Disclosure of Invention

The invention solves the technical problem of how to simultaneously consider the heat dissipation performance and the stability of the power supply operation.

A heat dissipation device, comprising:

a mounting circuit board having a first surface and a second surface in a thickness direction and fixed on the main circuit board;

a transistor disposed on the first surface;

a functional device at least partially located on a side where the first surface is located; and

and the heat dissipation mechanism is arranged on the second surface and is used for being fixedly connected with the main circuit board, and the mounting circuit board is fixed on the heat dissipation mechanism.

In one embodiment, a through hole is formed in the mounting circuit board, the through hole penetrates through the first surface and the second surface simultaneously, and the transistor and the heat dissipation mechanism both cover the through hole.

In one embodiment, the functional device is a transformer, the transformer comprises a transformation body and pins, the transformation body is positioned on one side where the first surface is positioned, and the pins penetrate through the mounting circuit board; the number of the transistors is multiple, and the transistors are arranged on the first surface at intervals and arranged around the pins. Therefore, the distance from the pin to the transistor is short enough to ensure that an electric loop is short as possible between the pin and the transistor, and therefore the conversion efficiency of the whole power supply is improved.

In one embodiment, the heat dissipation mechanism includes a heat sink and a heat conduction assembly, the heat sink and the mounting circuit board are arranged at a distance along the thickness direction of the mounting circuit board, and the heat conduction assembly is connected between the heat sink and the second surface.

In one embodiment, the heat conducting assembly includes a heat conducting pad and a heat absorbing block, the heat conducting pad has a larger covering area than the heat absorbing block, the heat absorbing block has a larger thickness than the heat conducting pad, the heat absorbing block is connected to the second surface, and the heat conducting pad is connected between the heat absorbing block and the heat sink.

In one embodiment, the heat conducting pad is made of an insulating material and has a heat conductivity greater than or equal to 1W/MK; the heat radiator comprises heat radiating fins, the heat conductivity coefficient of the heat radiating fins is larger than or equal to 90W/MK, and the heat conductivity coefficient of the heat absorbing block is larger than that of the heat radiator. Therefore, the heat radiator can be ensured to have a good heat dissipation effect, and the heat absorption block and the heat conduction pad are also ensured to have good heat absorption effect and heat conduction effect respectively.

In one embodiment, the heat sink further comprises a positioning column and a fastening piece, the positioning column is fixed on the heat sink, the installation circuit board is abutted against the positioning column so that the heat sink and the installation circuit board are separated by a set distance, and the fastening piece is connected with the positioning column so as to fix the installation circuit board. Therefore, the radiator can be prevented from damaging the mounting plate, and the phenomenon of short circuit of the mounting circuit board and other parts is avoided.

In one embodiment, the positioning column includes a thick section and a thin section which are coaxially arranged, the cross-sectional dimension of the thick section is larger than that of the thin section, the thick section is fixed on the radiator, the thick section has a supporting surface which is abutted with the mounting circuit board, the thin section is convexly arranged on the supporting surface and penetrates through the mounting circuit board, and the fastener is inserted in the thin section. So make the supporting surface carry out fine spacing to the installation circuit board, ensure to keep setting for the interval between installation circuit board and the radiator.

In one embodiment, the mounting circuit board includes a mounting body on which the transistor and the heat dissipation mechanism are disposed, and a plurality of bosses protruding and spaced apart from an edge of the mounting body. The mounting stability of the mounting circuit board can be improved.

A power supply comprises a main circuit board and the heat dissipation device, wherein the mounting circuit board is inserted into the main circuit board, and the heat dissipation mechanism is fixedly connected with the main circuit board. Therefore, the power supply has a reasonable heat dissipation effect, and the conversion rate of the power supply can be improved.

One technical effect of one embodiment of the invention is that: the functional device is positioned on one side where the first surface is positioned, and the heat dissipation mechanism is directly arranged on the second surface, so that the interference of the functional device on the heat dissipation mechanism can be eliminated, and enough space for installing the heat dissipation mechanism exists on one side where the second surface of the circuit board is positioned. The heat generated by the transistor can be discharged by the heat dissipation mechanism, so that the heat dissipation effect of the heat dissipation device is ensured. Meanwhile, the installation circuit board is used for being fixed on the main circuit board, the heat dissipation mechanism is used for being fixed on the main circuit board, and the installation circuit board is fixed on the heat dissipation mechanism, namely the installation circuit board is directly fixed on the main circuit board; on the other hand, the installation circuit board is also fixed on the main circuit board through the heat dissipation mechanism, so that the installation circuit board has double fixing functions relative to the main circuit board, the connection strength between the installation circuit board and the main circuit board is improved, the anti-vibration effect of the installation circuit board is improved, the installation circuit board is effectively prevented from loosening under the vibration effect, and finally the working stability and reliability of the heat dissipation device and the power supply are improved.

Drawings

Fig. 1 is a schematic perspective view of a power supply according to an embodiment;

FIG. 2 is an exploded view of the power supply of FIG. 1;

FIG. 3 is a schematic perspective view of a heat dissipation device in the power supply shown in FIG. 1;

FIG. 4 is a schematic diagram of a first exemplary exploded structure of the heat dissipation device shown in FIG. 3;

FIG. 5 is a second exemplary exploded view of the heat sink shown in FIG. 3;

fig. 6 is a schematic plan sectional view of the heat dissipation device shown in fig. 3.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Referring to fig. 1, 2 and 3, a power supply 10 according to an embodiment of the present invention may be a charging pile for charging an electric vehicle, the charging pile may be movable, the power supply 10 includes a heat sink 11 and a main circuit board 12, and the heat sink 11 is fixed on the main circuit board 12. The heat sink 11 includes a mounting circuit board 100, a transistor 200, a functional device 300, and a heat dissipation mechanism 400, and the transistor 200, the functional device 300, and the heat dissipation mechanism 400 are all disposed on the mounting circuit board 100.

Referring to fig. 2, 3 and 4, in some embodiments, both the mounting circuit board 100 and the main circuit board 12 may be substantially rectangular, the area of the mounting circuit board 100 may be smaller than the area of the main circuit board 12, and the thickness of the mounting circuit board 100 may be greater than or equal to the thickness of the main circuit board 12, thereby reasonably improving the thermal conductivity of the mounting circuit board 100. The mounting circuit board 100 includes a mounting main body 110 and a plurality of protruding portions 120, the number of the protruding portions 120 is plural, the plurality of protruding portions 120 may be protrudingly disposed on one edge of the mounting main body 110, and the plurality of protruding portions 120 are disposed at intervals in an extending direction of the edge, the protruding portions 120 are commonly referred to as gold fingers. The main circuit board 12 is provided with a jack 12a, and the jack 12a can penetrate through the entire main circuit board 12 in the thickness direction, so that the jack 12a is a through hole. In the process of installing the heat dissipation device 11 on the main circuit board 12, the protruding portion 120 is inserted into the insertion hole 12a, so that the heat dissipation device 11 can be well positioned, and the installation accuracy and the installation efficiency of the heat dissipation device 11 relative to the main circuit board 12 are improved. The boss 120 may be interference-fitted with the receptacle 12a, thereby achieving an interference connection relationship between the mounting circuit board 100 and the main circuit board 12. After the protruding part 120 is mated with the insertion hole 12a, the protruding part 120 may also be soldered at the insertion hole 12a, so that the protruding part 120 is soldered with the main circuit board 12.

The mounting circuit board 100 has a first surface 131 and a second surface 132, and the first surface 131 and the second surface 132 are two surfaces in the thickness direction of the mounting circuit board 100, so that the first surface 131 and the second surface 132 are oppositely oriented and are spaced apart in the thickness direction of the mounting circuit board 100. The mounting body 110 of the mounting circuit board 100 is provided with a through hole 133, and the through hole 133 penetrates through both the first surface 131 and the second surface 132, i.e. the through hole 133 has an opening on both the first surface 131 and the second surface 132. The through holes 133 have a small diameter, and the through holes 133 may be distributed on the mounting body 110 at a certain density, and the through holes 133 may be regarded as meshes opened on the mounting body 110.

In some embodiments, the transistor 200 is a metal-oxide semiconductor field effect transistor 200, i.e., a MOS transistor, and the transistor 200 generates a certain amount of heat during operation. The transistor 200 may be fixed to the first surface 131 by means of a pad bonding. A plurality of through holes 133 are formed at the bonding position of the transistor 200, and after the transistor 200 is bonded, the through holes 133 at the bonding position are covered by the transistor 200, so that the opening of the through holes 133 on the first surface 131 is blocked by the transistor 200. The number of the transistors 200 may be multiple, a plurality of the transistors 200 are disposed on the first surface 131 at intervals, and the distance between any two adjacent transistors 200 may be equal. For example, the plurality of transistors 200 are arranged to form three rows, a first row having two transistors 200, a second row having two transistors 200, and a third row having four transistors 200. The first and second rows may extend in parallel to each other, and the third row may extend perpendicular to the first and second rows, so that the first and second rows are spaced apart along the third row. In a colloquial manner, all of the transistors 200 may be arranged to form a flat-bottomed U-shaped structure.

Referring to fig. 4, 5 and 6, in some embodiments, the functional device 300 may be a transformer 310 for changing power, the transformer 310 includes a transformer body 311 and a pin 312, the transformer body 311 is located on a side where the first surface 131 is located, the transformer body 311 is spaced from the first surface 131 by a certain distance along a thickness direction of the mounting circuit board 100, and of course, the transformer body 311 is also spaced from the transistor 200 by a certain distance along the thickness direction of the mounting circuit board 100, that is, the transformer body 311 is not in contact with the transistor 200. The pin 312 is inserted into the mounting body 110 of the mounting circuit board 100, and the pin 312 is spaced apart from the transistor 200. The plurality of transistors 200 are disposed around the pin 312 such that the distance from the pin 312 to each transistor 200 is as small as possible, i.e., the pin 312 is disposed as close to each transistor 200 as possible, such that the electrical loop between the pin 312 and each transistor 200 is as short as possible, thereby improving the conversion efficiency of the overall power supply 10.

Since the transformation body 311 is located on the side where the first surface 131 is located, the transformation body 311 can cover the transistors 200. If the heat dissipation mechanism 400 is directly fixed on the transistor 200 at the side where the first surface 131 is located, this will cause the transformer body 311 to interfere with the installation of the heat dissipation mechanism 400, so that the transformer body 311 cannot be installed at the side where the first surface 131 is located, i.e. there is not enough space at the side where the first surface 131 is located for installing the heat dissipation mechanism 400. Therefore, the heat dissipation mechanism 400 can be disposed on the second surface 132, such that the heat dissipation mechanism 400 is located on the side where the second surface 132 is located, and there is enough space for installing the heat dissipation mechanism 400 on the side where the second surface 132 is located, thereby effectively avoiding the interference of the transformer body 311 on the installation of the heat dissipation mechanism 400.

Referring to fig. 3, 4 and 5, in some embodiments, the heat dissipation mechanism 400 includes a heat sink 410 and a heat conducting element 420, the heat sink 410 and the mounting circuit board 100 are spaced apart from each other along the thickness direction of the mounting circuit board 100, and the heat conducting element 420 is connected between the heat sink 410 and the second surface 132. For example, the heat conducting assembly 420 may include a heat conducting pad 421 and a heat absorbing block 422, the heat absorbing block 422 may be made of copper or other metal material with high thermal conductivity, the thermal conductivity of the heat absorbing block 422 may be greater than that of the heat conducting pad 421, and the thermal conductivity of the heat absorbing block 422 may be greater than that of the heat sink 410. The heat absorbing block 422 can be fixed on the second surface 132 by reflow soldering, a plurality of through holes 133 are opened at the soldering position of the heat absorbing block 422, and after the heat absorbing block 422 is soldered, the heat absorbing block 422 covers the through holes 133 at the soldering position, so that the heat absorbing block 422 blocks the opening of the through holes 133 on the second surface 132. When the transistor 200 generates heat during operation, on one hand, the heat generated by the transistor 200 is directly conducted to the heat sink 422 through the mounting circuit board 100 due to the fact that the mounting circuit board 100 has a certain thickness and thus has a high thermal conductivity coefficient; on the other hand, in view of the through-hole 133, the heat generated by the transistor 200 will also be transferred to the heat sink 422 through the through-hole 133. Therefore, heat generated during the operation of the transistor 200 is rapidly conducted to the heat sink 422 through the mounting circuit board 100 and the through-hole 133, so that the heat sink 422 can rapidly absorb the heat generated during the operation of the transistor 200. The number of the heat sink blocks 422 may be plural. A plurality of heat sink blocks 422 are spaced apart on the second surface 132.

In some embodiments, the thermal pad 421 may have a certain flexibility, and the thermal pad 421 may also have a good insulation property, for example, the thermal pad 421 may be made of a flexible silicone material. The coverage area of the thermal pad 421 may be larger than that of a single heat sink 422, and the coverage area of the thermal pad 421 may also be larger than the sum of the coverage areas of all the heat sinks 422, so that the thermal pad 421 can cover all the heat sinks 422. It is ensured that each heat absorbing block 422 can be in contact with the thermal pad 421 so that heat on each heat absorbing block 422 can be conducted through the thermal pad 421. The thickness of the heat absorbing block 422 can be larger than that of the heat conducting pad 421, so that the heat absorbing block 422 has a higher heat conductivity coefficient, and the heat absorbing effect of the heat absorbing block 422 is improved. On the other hand, the heat sink block 422 may also allow a certain distance between the heat sink 410 and the mounting circuit board 100. The thermal conductivity of the thermal pad 421 may be 1W/MK or more.

In some embodiments, the thermal conductivity of the heat spreader 410 may be greater than or equal to 90W/MK, and the heat spreader 410 includes heat dissipation fins, such that the heat dissipation area of the heat spreader 410 may be increased. The heat sink 410 may be fixed to the main circuit board 12 by bolts, so that the entire heat sink 11 is fixed to the main circuit board 12. For example, the heat sink 410 may be provided with threaded holes, and bolts may be inserted into the main circuit board 12 and engaged with the threaded holes of the heat sink 410, so that the heat sink 410 may be fixed on the main circuit board 12 when the bolts are tightened. The bolts can be inserted into the threaded holes from the side of the main circuit board 12 opposite to the heat sink 410, and the number of the bolts is equal to the number of the threaded holes, that is, the bolts and the threaded holes form a one-to-one correspondence relationship, and each threaded hole is penetrated with one bolt. By providing a plurality of bolts, the stability and reliability of the connection between the heat sink 410 and the main circuit board 12 can be improved. Through the fixation of the heat sink 410, the mounting circuit board 100 can be effectively prevented from shaking relative to the main circuit board 12, and the failure of the protruding portion 120 and other components arranged on the protruding portion 120 due to vibration can be avoided. The heat sink 410 may be made of aluminum, and the heat sink 410 may dissipate heat to the surrounding environment quickly by its own high thermal conductivity and large heat dissipation area.

Referring to fig. 6, when the transistor 200 generates heat, the heat generated by the transistor 200 may be conducted to the heat sink 422 through the mounting circuit board 100 and the through hole 133, so that the heat sink 422 absorbs the heat of the transistor 200 at a high speed, thereby preventing the heat from being accumulated in the transistor 200 for a long time to cause an over-high temperature of the transistor 200, and preventing the transistor 200 from being damaged due to the over-high temperature. Since the thermal pad 421 has a high thermal conductivity, the heat conducted to the heat absorbing block 422 is further conducted to the heat sink 410 through the thermal pad 421, and the heat sink 410 finally dissipates the heat to the surrounding environment, so as to achieve the rapid heat dissipation of the entire heat dissipation device 11.

Referring to fig. 3, 4 and 5, in some embodiments, the heat dissipation device 11 further includes a positioning pillar 500 and a fastening member 600, the positioning pillar 500 is used to ensure a reasonable distance between the mounting circuit board 100 and the heat sink 410, so as to prevent the heat sink 410 from contacting the mounting circuit board 100 and damaging the mounting circuit board 100, and further prevent the mounting circuit board 100 from short-circuiting due to damage. The fastening member 600 is connected to the positioning post 500, and the fastening member 600 is used to fixedly mount the circuit board 100.

Positioning column 500 includes thick section 510 and thin section 520, thick section 510 and thin section 520 are arranged coaxially, thick section 510 and thin section 520 can both be cylindrical, the cross-sectional dimension of thick section 510 is greater than the cross-sectional dimension of thin section 520, that is, the diameter of thick section 510 is greater than the diameter of thin section 520, the end of thick section 510 has a supporting surface 511, thin section 520 is convexly arranged on supporting surface 511, the middle portion of supporting surface 511 is covered by thin section 520, the edge portion of supporting surface 511 is not covered by thin section 520, so that the edge portion of supporting surface 511 is arranged around thin section 520. Thick section 510 is fixed on heat sink 410, for example thick section 510 can be fixed on heat sink 410 by welding, thin section 520 is arranged in installation circuit board 100 in a penetrating manner, both thin section 520 and thick section 510 can be provided with threaded holes, fastener 600 can be a bolt, fastener 600 can penetrate into threaded hole at the side where first surface 131 of installation circuit board 100 is located, then fastener 600 is screwed, so that installation circuit board 100 can be fixed, thereby realizing the fixed connection relationship between installation circuit board 100 and heat sink 410. The number of the positioning pillars 500 may be multiple, and multiple positioning pillars 500 may be disposed near the edge of the heat sink 410, for example, multiple positioning pillars 500 may be disposed around the heat conducting pad 421. By arranging a plurality of positioning columns 500 and through the action of the fasteners 600 and the positioning columns 500, the mounting circuit board 100 is fixed on the heat sink 410, and since the heat sink 410 and the mounting circuit board 100 are both fixed on the main circuit board 12, on one hand, the mounting circuit board 100 is directly fixed on the main circuit board 12 through the action of the jacks 12 a; on the other hand, the mounting circuit board 100 is indirectly fixed on the main circuit board 12 through the heat sink 410, which can be understood that the mounting circuit board 100 has a double fixing function, so that the mounting circuit board 100 is effectively prevented from loosening relative to the main circuit board 12, the mounting stability and reliability of the mounting circuit board 100 are improved, and the working stability and reliability of the power supply 10 are prevented from being influenced by the loosening of the mounting circuit board 100.

In fact, when the power supply 10 is used as a movable charging pile, the charging pile will vibrate during transportation, and if the connection strength between the mounting circuit board 100 and the main circuit board 12 is not good enough, that is, the anti-vibration effect of the mounting circuit board 100 is not good enough, the stability and reliability of the subsequent operation of the power supply 10 will be affected. For the power supply 10 in the above embodiment, the mounting circuit board 100 has a double fixing function, which can greatly improve the anti-vibration performance of the mounting circuit board 100, thereby preventing the impact of vibration during transportation on the mounting circuit board 100, and improving the stability and reliability of the operation of the power supply 10.

In the assembly process of the power supply 10, the protrusion 120 may be first fitted into the insertion hole 12a, then the heat sink 410 may be fixed to the main circuit board 12 by bolts, and then the protrusion 120 may be soldered to the main circuit board 12, thereby achieving the double fixing effect of the mounting circuit board 100.

After the fixing of the mounting circuit board 100 is completed, the second surface 132 of the mounting circuit board 100 abuts against the supporting surface 511 along the thickness direction of the mounting circuit board 100, i.e., the second surface 132 abuts against the edge portion of the supporting surface 511. The mounting circuit board 100 may be well restrained by the abutment of the second surface 132 with the support surface 511, thereby maintaining a set spacing between the mounting circuit board 100 and the heat sink 410, which may be substantially equal to the length of the thick section 510. After the fastening member 600 is tightened, the mounting circuit board 100 drives the heat absorbing block 422 to press the heat conducting pad 421, and the heat conducting pad 421 generates a certain flexible deformation, so that the heat conducting pad 421 is clamped between the heat absorbing block 422 and the heat sink 410, that is, a reasonable abutting force is provided between the heat conducting pad 421 and the heat absorbing block 422 as well as between the heat conducting pad 421 and the heat sink 410, so that a good contact relationship between the heat conducting pad 421 and the heat absorbing block 422 and the heat sink 410 can be well ensured, heat absorbed by the heat absorbing block 422 from the transistor 200 can be smoothly transmitted to the heat sink 410 through the heat conducting pad 421, and finally the heat sink 410 dissipates the heat to the surrounding environment, thereby achieving rapid heat dissipation of the transistor 200.

Therefore, with the heat dissipation device 11 in the above embodiment, since the transformer body 311 is located on the side where the first surface 131 is located and the transistor 200 is disposed on the first surface 131, the transformer body 311 will generate an interference effect, so that the heat dissipation mechanism 400 cannot be continuously mounted on the side where the first surface 131 is located and directly connected to the transistor 200. Since there is enough space on the side where the second surface 132 of the circuit board 100 is located, the heat dissipation mechanism 400 can be directly mounted on the second surface 132, so as to achieve effective heat dissipation of the transistor 200 by the heat dissipation mechanism 400. In fact, compared with the case that the heat sink 410 is directly disposed on the transistor 200, the above embodiment always keeps a certain distance between the heat sink 410 and the mounting circuit board 100, and the heat generated by the transistor 200 is conducted to the heat sink 410 through the thermal pad 421 under the action of the heat absorbing block 422, which is more beneficial to improving the heat dissipation effect of the transistor 200. Meanwhile, the transformer body 311 is located at a side where the first surface 131 is located, and the pin 312 is spaced apart from the transistor 200. The plurality of transistors 200 are disposed around the pin 312 such that the distance from the pin 312 to each transistor 200 is sufficiently short to ensure that each transistor 200 is disposed as close to the pin 312 as possible, such that there is as short an electrical circuit as possible between the pin 312 and each transistor 200, thereby improving the conversion efficiency of the overall power supply 10. Therefore, the heat dissipation device 11 can also improve the conversion rate of the power supply 10 on the basis of ensuring a good heat dissipation effect, that is, the heat dissipation device 11 can ensure that the power supply 10 has both good heat dissipation performance and high conversion rate.

If the heat sink 11 adopts a mode of directly fixing the transistor 200 to the heat sink 410 and fixing the heat sink 410 to the main circuit board 12, this only allows the main circuit board 12 to have a large area, resulting in a relatively high material cost of the main circuit board 12. With the heat dissipation device 11 in the above embodiment, the total material cost of both the main circuit board 12 and the mounting circuit board 100 can be reduced on the basis of satisfying the assembly requirement by reasonably reducing the thickness of the main circuit board 12 and appropriately increasing the thickness of the mounting circuit board 100, thereby reducing the manufacturing cost of the whole heat dissipation device 11. Meanwhile, the mounting circuit board 100 has a relatively high thickness, so that the heat conduction performance of the mounting circuit board 100 can be reasonably improved, a part of heat on the transistor 200 can be quickly conducted to the heat absorption block 422 through the mounting circuit board 100, the heat generated by the transistor 200 during operation is ensured to be timely discharged, and the transistor 200 and other parts are prevented from being damaged by high temperature generated due to heat accumulation.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A heat dissipating device, comprising:

a mounting circuit board having a first surface and a second surface in a thickness direction, the mounting circuit board being inserted in and soldered on a main circuit board;

a transistor disposed on the first surface;

the functional device is at least partially positioned on one side of the first surface, the functional device is a transformer, the transformer comprises a transformation main body and pins, the transformation main body is positioned on one side of the first surface, and the pins are arranged in the mounting circuit board in a penetrating mode; the number of the transistors is multiple, and the transistors are arranged on the first surface at intervals and arranged around the pins; and

and the heat dissipation mechanism is arranged on the second surface and is used for being fixedly connected with the main circuit board through a bolt, and the mounting circuit board is fixed on the heat dissipation mechanism.

2. The heat dissipation device of claim 1, wherein the spacing between two adjacent transistors is equal.

3. The heat dissipating device of claim 1, wherein a through hole is formed in the mounting circuit board, the through hole simultaneously penetrates through the first surface and the second surface, and the transistor and the heat dissipating mechanism both cover the through hole.

4. The heat dissipating device of claim 1, wherein the heat dissipating mechanism comprises a heat sink and a heat conducting component, the heat sink and the mounting circuit board being spaced apart in a thickness direction of the mounting circuit board, the heat conducting component being connected between the heat sink and the second surface.

5. The heat dissipation device of claim 4, wherein the thermally conductive assembly comprises a thermally conductive pad having a footprint larger than a footprint of the heat sink block, and a heat sink block coupled to the second surface, the thermally conductive pad coupled between the heat sink block and the heat spreader.

6. The heat dissipating device of claim 5, wherein the thermal pad is made of an insulating material and has a thermal conductivity of 1W/MK or more; the heat radiator comprises heat radiating fins, the heat conductivity coefficient is larger than or equal to 90W/MK, and the heat conductivity coefficient of the heat absorbing block is larger than that of the heat radiator.

7. The heat dissipating device of claim 4, further comprising a positioning post fixed to the heat sink and a fastening member, wherein the mounting circuit board abuts against the positioning post to space the heat sink from the mounting circuit board by a predetermined distance, and the fastening member is connected to the positioning post to fix the mounting circuit board.

8. The heat dissipating device of claim 7, wherein the positioning post comprises a thick section and a thin section which are coaxially arranged, the cross-sectional dimension of the thick section is larger than that of the thin section, the thick section is fixed on the heat sink, the thick section has a supporting surface abutting against the mounting circuit board, the thin section is convexly arranged on the supporting surface and penetrates through the mounting circuit board, and the fastening member is inserted into the thin section.

9. The heat dissipating device of claim 1, wherein the mounting circuit board comprises a mounting body and a plurality of bosses, the transistors and the heat dissipating mechanism being disposed on the mounting body, the plurality of bosses protruding and being spaced apart at an edge of the mounting body.

10. A power supply comprising a main circuit board and the heat dissipating device of any one of claims 1 to 9, wherein the mounting circuit board is inserted into the main circuit board, and the heat dissipating mechanism is fixedly connected to the main circuit board.