CN219575510U

CN219575510U - Solid-state relay

Info

Publication number: CN219575510U
Application number: CN202320483843.6U
Authority: CN
Inventors: 吴忠淳; 雷海鸣
Original assignee: SHENZHEN HONGTAIDA INDUSTRY CO LTD
Current assignee: SHENZHEN HONGTAIDA INDUSTRY CO LTD
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-08-22
Anticipated expiration: 2033-03-01

Abstract

The utility model relates to a solid-state relay which comprises a radiator, a shell and a main circuit board, wherein the shell is fixedly arranged on one side of the radiator, the main circuit board is positioned in the shell, a plurality of connecting components are arranged between the main circuit board and the radiator, the connecting components are used for installing the main circuit board on the radiator, a transistor is arranged on one side, close to the radiator, of the main circuit board, a radiating fin is fixedly arranged on one side, far away from the main circuit board, of the transistor, a first insulating adhesive tape is fixedly arranged on one side, close to the main circuit board, of the radiator, and the radiating fin is adhered to the first insulating adhesive tape. The utility model has the effect of facilitating the heat conduction from the radiating fin to the radiator.

Description

Solid-state relay

Technical Field

The utility model relates to the field of relays, in particular to a solid-state relay.

Background

Solid state relays are a new type of contactless switching devices consisting of solid state electronic components. Some solid state relays have heat dissipation requirements, so the backside of some solid state relays will be fitted with a heat sink.

Currently, related art discloses a solid state relay including a heat sink, a main circuit board, and a housing mounted at one side of the heat sink. The main circuit board is located inside the shell, and the main circuit board is installed on one side of the radiator, which is close to the shell. The main circuit board typically has transistors, which also require heat dissipation. And a radiating fin is fixedly arranged on one surface of the main circuit board, which is close to the radiator, and the radiating fin is connected with a transistor of the main circuit board. And one side of the radiator, which is close to the main circuit board, is provided with an insulating gasket and a bolt, and the insulating gasket is fixedly arranged on the radiator through the bolt. The heat sink is abutted against the insulating gasket. The heat of the transistor is transferred into the radiating fin, and then the heat of the radiating fin is conducted from the insulating gasket to the radiator for radiating. The insulating spacer separates the heat sink from the heat sink, thereby reducing the occurrence of short circuits due to current flow from the transistor into the heat sink.

With respect to the related art as described above, the inventors consider that the heat sink and the heat sink press the insulating pad, and the insulating pad needs to be increased in thickness in order not to be crushed by the heat sink and the heat sink. However, the thickness of the insulating spacer increases, and the insulating spacer reduces the heat conduction efficiency of the heat sink to the heat sink, thereby affecting the heat dissipation of the transistor.

Disclosure of Invention

In order to facilitate heat conduction from the radiating fins to the radiator, the utility model provides a solid state relay.

The utility model provides a solid-state relay, which adopts the following technical scheme:

the utility model provides a solid-state relay, includes radiator, casing and main circuit board, casing fixed mounting is in one side of radiator, the main circuit board is located inside the casing, install a plurality of coupling assembling between main circuit board and the radiator, coupling assembling is used for installing the main circuit board in the radiator, the transistor is installed to one side that the main circuit board is close to the radiator, one side fixed mounting that the transistor kept away from the main circuit board has the fin, one side fixed mounting that the radiator is close to the main circuit board has first insulating tape, the fin is pasted in first insulating tape.

By adopting the technical scheme, the heat generated by the transistor on the main circuit board is conducted to the radiating fin, and then the heat of the radiating fin is transferred into the radiator from the first insulating adhesive tape for radiating. The first insulating adhesive tape is not easy to crack when being extruded by the radiating fin and the radiator, and the thickness of the first insulating adhesive tape is small, so that the radiating fin is convenient to conduct heat to the radiator. Meanwhile, the first insulating adhesive tape is soft and elastic, so that the situation that the radiating fin is damaged after the radiating fin and the first insulating adhesive tape are mutually extruded is reduced.

Optionally, one side of keeping away from the radiator of main circuit board fixed mounting has the temperature detection circuit board, main circuit board is connected with temperature detection circuit board electricity, temperature detection circuit board electricity is connected with the display, the display inlays and locates the casing, temperature detection circuit board is used for detecting the temperature of main circuit board and sends to the demonstration, the display is used for showing the temperature.

By adopting the technical scheme, the temperature detection circuit board detects the temperature of the main circuit board and sends the temperature to the display, and then the display displays the temperature, so that the temperature of the solid state relay is convenient to check.

Optionally, the coupling assembling includes gag lever post, limiting plate and spacing ring, limiting plate fixed mounting is in the one end of gag lever post, the gag lever post runs through one side that main circuit board and radiator are close to main circuit board, the spacing rod is located to spacing ring thread bush.

Through adopting above-mentioned technical scheme, let the gag lever post pass radiator and main circuit board, afterwards with the spacing ring from the one end screw in that the gag lever post kept away from the limiting plate. The main circuit board and the radiator are respectively extruded through the limiting rings and the limiting plates, so that the radiating fins on the main circuit board are driven to tightly abut against the first insulating adhesive tape, and the radiating fins are convenient to guide heat into the radiator through the first insulating adhesive tape.

Optionally, a second insulating tape is adhered to a side, close to the main circuit board, of the first insulating tape, and a portion, beyond the transistor, of the heat sink is located between the first insulating tape and the second insulating tape.

Through adopting above-mentioned technical scheme, second insulating tape and second insulating tape paste the fin together and surpass the part of transistor to be favorable to improving the stability that the fin contacted with the radiator, and then improve the heat dissipation ability.

Optionally, the second insulating tape is wound around the heat sink and the portion of the heat sink beyond the transistor.

Through adopting above-mentioned technical scheme, the fin passes through the ligature of second insulating tape in the radiator to improve the stability that the fin contacted with the radiator, and then make things convenient for the fin to introduce the radiator with heat.

Optionally, the transistor is provided with a pressing component, and the pressing component is used for pressing the transistor and the radiating fin on the first insulating adhesive tape.

Through adopting above-mentioned technical scheme, after placing the transistor in first insulating tape, compress tightly the subassembly and compress tightly the transistor, compress tightly the subassembly and promote the transistor, the transistor drives the fin and supports to paste in first insulating tape to make things convenient for the heat of fin to lead into the radiator through first insulating tape.

Optionally, the compression assembly includes insulating clamp plate and bolt, one side of insulating clamp plate supports and pastes in the transistor one side that is close to main circuit board, insulating clamp plate passes through bolt fixed mounting in the radiator.

By adopting the technical scheme, the radiating fin on the transistor is placed on the first insulating adhesive tape. And then placing the insulating pressing plate on one side of the transistor far away from the radiating fin, and screwing the insulating pressing plate into the radiator after penetrating the insulating pressing plate by using a bolt. The transistor is pressed by the insulating pressing plate, so that the occurrence of the condition that gaps exist between the first insulating adhesive tape and the radiating fins is reduced

Optionally, the insulating pressing plate has elasticity.

Through adopting above-mentioned technical scheme, can expend with heat and contract with cold when transistor and fin generate heat and cool down, have certain elasticity through insulating clamp plate to the condition that receives the extrusion of insulating clamp plate and damage appears when reducing the transistor expend with heat.

In summary, the present utility model includes at least one of the following beneficial technical effects:

1. the first insulating adhesive tape separates the radiating fin and the radiator, so that the situation that transistor current on the main circuit board flows into the radiator to cause short circuit is reduced, meanwhile, the first insulating adhesive tape is not easy to crack under the extrusion of the radiating fin and the radiator, and the thickness of the first insulating adhesive tape is small, so that the radiating fin is convenient to guide heat into the radiator;

2. the temperature of the main circuit board is detected through the temperature detection circuit board and then sent to the display, and the display displays the temperature, so that the temperature of the solid state relay is conveniently checked.

Drawings

FIG. 1 is a schematic overall structure of an embodiment of the present utility model;

FIG. 2 is a schematic view of the reduced housing and display of FIG. 1;

FIG. 3 is a schematic diagram of the structure of FIG. 2 after the main circuit board and the temperature sensing circuit board are reduced;

fig. 4 is a schematic view of the structure of fig. 3 after the second insulating tape and compression assembly has been reduced.

Reference numerals illustrate: 1. a heat sink; 2. a housing; 3. a main circuit board; 4. a temperature detection circuit board; 5. a display; 6. a heat sink; 7. a connection assembly; 71. a limit rod; 72. a limiting plate; 73. a limiting ring; 8. a first insulating tape; 9. a second insulating tape; 11. a compression assembly; 111. an insulating pressing plate; 112. a bolt; 12. and a transistor.

Detailed Description

The utility model is described in further detail below with reference to fig. 1-4.

The embodiment of the utility model discloses a solid-state relay.

Referring to fig. 1 and 2, a solid state relay includes a heat sink 1, a housing 2, a main circuit board 3, a temperature detection circuit board 4, and a display 5. The casing 2 is fixedly arranged on one side of the radiator 1, and the main circuit board 3 and the temperature detection circuit board 4 are both positioned inside the casing 2. The main circuit board 3 is electrically connected with the temperature detection circuit board 4, and the temperature detection circuit board 4 is electrically connected with the display 5. The display 5 is embedded in the housing 2.

The temperature detection circuit board 4 is used for detecting the temperature of the main circuit board 3 and sending the temperature to the display 5, and the display 5 displays the temperature, so that the temperature of the solid state relay can be conveniently checked.

Referring to fig. 2 and 3, a transistor 12 is fixedly mounted on a side of the main circuit board 3 close to the heat sink 1, and a heat sink 6 is fixedly mounted on a side of the transistor 12 remote from the main circuit board 3. The heat generated by the transistor 12 is conducted to the heat sink 6 to dissipate the heat.

Referring to fig. 2, a plurality of connection assemblies 7 are provided between the main circuit board 3 and the heat sink 1, and the connection assemblies 7 include a stopper rod 71, a stopper plate 72, and a stopper ring 73. The limiting plate 72 is fixedly mounted at one end of the limiting rod 71, and the limiting rod 71 penetrates through the radiator 1 and the main circuit board 3. The limiting ring 73 is sleeved on the limiting rod 71 in a threaded manner.

The end of the limiting rod 71 away from the limiting plate 72 may sequentially pass through the radiator 1 and the main circuit board 3, and then the limiting ring 73 is screwed in from the end of the limiting rod 71 away from the limiting plate 72. The end of the limiting rod 71 away from the limiting plate 72 can sequentially pass through the main circuit board 3 and the radiator 1, and then the limiting ring 73 is screwed in from the end of the limiting rod 71 away from the limiting plate 72.

In the embodiment of the present utility model, one end of the limit lever 71, which is far from the limit plate 72, sequentially passes through the radiator 1 and the main circuit board 3. The limiting ring 73 is screwed, and the limiting ring 73 drives the main circuit board 3 to move towards the radiator 1.

Referring to fig. 3 and 4, a first insulating tape 8 is adhered to a side of the heat sink 1 close to the main circuit board 3, and a side of the first insulating tape 8 away from the heat sink 1 is adhered to the heat sink 6. The heat sink 6 partially extends beyond the transistor 12, thereby facilitating heat dissipation from the transistor 12 through the heat sink 6.

The heat sink 6 and the transistor 12 are mounted to the first insulating tape 8, and then the pins of the transistor 12 are bent toward the main circuit board 3. The limiting ring 73 is rotated, and the limiting ring 73 drives the main circuit board 3 to move towards the radiator 1, so that pins of the transistor 12 are inserted into the main circuit board 3. The pins of the transistor 12 are then soldered to the main circuit board 3.

The heat on the heat sink 6 is conducted to the heat sink 1 through the first insulating tape 8 for heat dissipation. The first insulating tape 8 is not easily cracked under the extrusion of the heat sink 6 and the heat spreader 1, and the thickness of the first insulating tape 8 is small at the same time, thereby facilitating the heat conduction of the heat sink 6 to the heat spreader 1. Meanwhile, when the main circuit board 3 and the heat sink 6 generate heat, the main circuit board 3 may be bent upward, and adhered to the heat sink 6 through the first insulating tape 8, thereby reducing the occurrence of the upward bending of the main circuit board 3.

Referring to fig. 3, a second insulating tape 9 is attached to a side of the first insulating tape 8 adjacent to the main circuit board 3, and a portion of the heat sink 6 beyond the transistor 12 is located between the first insulating tape 8 and the second insulating tape 9. The second insulating tape 9 is wound around the heat sink 1 and the portion of the heat sink 6 beyond the transistor 12. The second insulating tape 9 presses the heat sink 6 against the first insulating tape 8, so that the situation that the part of the heat sink 6 beyond the transistor 12 is bent and is not abutted against the first insulating tape 8 is reduced, and heat conduction from the heat sink 6 to the heat sink 1 through the first insulating tape 8 is facilitated.

Referring to fig. 3, the transistor 12 is provided with a pressing assembly 11, and the pressing assembly 11 includes an insulating pressing plate 111 and a bolt 112. One surface of the insulating pressing plate 111 abuts against one side of the transistor 12 close to the main circuit board 3, and the insulating pressing plate 111 is fixedly mounted on the heat sink 1 through bolts 112. After the transistor 12 and the heat sink 6 are attached to the first insulating tape 8, the insulating pressing plate 111 is pressed against the transistor 12, and then the insulating pressing plate 111 is mounted to the heat sink 1 using bolts 112. The transistor 12 is pressed tightly by the insulating pressing plate 111, and the transistor 12 drives the radiating fin 6 to be abutted against the first insulating adhesive tape 8, so that the radiating fin 6 is convenient to conduct heat to the radiator 1.

The insulating pressing plate 111 has elasticity, and when the heat sink 6 and the transistor 12 expand with heat and contract with cold, the transistor 12 presses the insulating pressing plate 111. Bending is performed by the elasticity of the insulating pressing plate 111 itself, so that the occurrence of damage after the transistor 12 is pressed with the insulating pressing plate 111 is reduced.

The implementation principle of the solid-state relay provided by the embodiment of the utility model is as follows: when the first insulating adhesive tape 8 is extruded by the radiating fins 6 and the radiator 1, the first insulating adhesive tape 8 is not easy to crack, and meanwhile, the thickness of the first insulating adhesive tape 8 is small, so that heat of the radiating fins 6 is conveniently led into the radiator 1.

The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.

Claims

1. A solid state relay, characterized by: including radiator (1), casing (2) and main circuit board (3), casing (2) fixed mounting is in one side of radiator (1), main circuit board (3) are located inside casing (2), install a plurality of coupling assembling (7) between main circuit board (3) and radiator (1), coupling assembling (7) are used for installing main circuit board (3) in radiator (1), transistor (12) are installed to one side that main circuit board (3) is close to radiator (1), one side fixed mounting that main circuit board (3) were kept away from to transistor (12) has fin (6), one side fixed mounting that radiator (1) is close to main circuit board (3) has first insulating tape (8), fin (6) paste in first insulating tape (8).

2. A solid state relay according to claim 1, wherein: one side that radiator (1) was kept away from to main circuit board (3) is fixed mounting has temperature detection circuit board (4), main circuit board (3) are connected with temperature detection circuit board (4) electricity, temperature detection circuit board (4) electricity is connected with display (5), display (5) are inlayed and are located casing (2), temperature detection circuit board (4) are used for detecting the temperature of main circuit board (3) and send to the demonstration, display (5) are used for showing the temperature.

3. A solid state relay according to claim 1, wherein: the connecting assembly (7) comprises a limiting rod (71), a limiting plate (72) and a limiting ring (73), wherein the limiting plate (72) is fixedly arranged at one end of the limiting rod (71), the limiting rod (71) penetrates through one side, close to the main circuit board (3), of the main circuit board (3) and the radiator (1), and the limiting ring (73) is sleeved on the limiting rod (71) in a threaded mode.

4. A solid state relay according to claim 1, wherein: a second insulating adhesive tape (9) is adhered to one side, close to the main circuit board (3), of the first insulating adhesive tape (8), and the part, exceeding the transistor (12), of the radiating fin (6) is located between the first insulating adhesive tape (8) and the second insulating adhesive tape (9).

5. A solid state relay as defined in claim 4, wherein: the second insulating tape (9) is wound on the radiator (1) and the part of the radiating fin (6) beyond the transistor (12).

6. A solid state relay according to claim 1, wherein: the transistor (12) is provided with a pressing component (11), and the pressing component (11) is used for pressing the transistor (12) and the radiating fin (6) on the first insulating adhesive tape (8).

7. A solid state relay as claimed in claim 6, wherein: the pressing assembly (11) comprises an insulating pressing plate (111) and bolts (112), one surface of the insulating pressing plate (111) is abutted against one side, close to the main circuit board (3), of the transistor (12), and the insulating pressing plate (111) is fixedly mounted on the radiator (1) through the bolts (112).

8. A solid state relay according to claim 7, wherein: the insulating pressing plate (111) has elasticity.