CN211090154U

CN211090154U - Electronic module with low warping degree

Info

Publication number: CN211090154U
Application number: CN201922452708.1U
Authority: CN
Inventors: 杨春辉
Original assignee: Jiangsu Weike Electronics Co ltd
Current assignee: Jiangsu Weike Electronics Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-07-24
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses an electronic module with low angularity, including ya keli installation cell body and mainboard, the inside all fixed mounting in both sides of yakeli installation cell body has the installation external member, fixed mounting has glass fiber board between the installation external member, the mainboard is installed through caulking groove inlay to the inside of glass fiber board, there is ceramic substrate at the top of mainboard through base plate fixed mounting, ceramic substrate's top fixed mounting has the silicon chip. The utility model discloses the ya keli installation cell body that sets up is through installing the external member not only effectual holistic operation intensity that has increased electronic module, and glass fiber board has increased the module with the mainboard and has born the weight of the intensity, has improved electronic die's anti warpage performance, and the combination operation between base plate and the ceramic substrate has realized avoiding or reducing because of electronic module receives the condition that electric power burns out and leads to whole discovery deformation, has guaranteed electronic module's operation intensity, makes it have good low angularity.

Description

Electronic module with low warping degree

Technical Field

The utility model relates to an electronic module technical field specifically is an electronic module with low angularity.

Background

In the semiconductor industry, System In Package (SIP) mainly integrates a plurality of functional electronic components into one package to achieve the purpose of function integration, and electronic components required by a module are mounted on a PCB and then cured by plastic sealant to prepare an electronic module.

Although the existing electronic module achieves basic operation performance, the following defects still exist: 1. the traditional electronic module is weak in warping resistance, deformation of the module is easily caused after long-time operation, even the electric elements on the module are damaged, and the practicability of the module is reduced; 2. the whole operation intensity of traditional electronic module is comparatively weak, the environment of unable better satisfying electronic module to long-time operation leads to electronic module's life to reduce easily, consequently needs improve this, with the above-mentioned problem of solution.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic module with low angularity in order to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic module with low angularity, includes ya keli installation cell body and mainboard, the inside both sides of ya keli installation cell body all fixed mounting have the installation external member, fixed mounting has glass fiber board between the installation external member, the mainboard is installed through caulking groove inlay to the inside of glass fiber board, there is ceramic substrate at the top of mainboard through base plate fixed mounting, ceramic substrate's top fixed mounting has the silicon chip.

Preferably, the ceramic substrate, the silicon wafer and the substrate are welded and fixed through welding layers.

Preferably, electronic elements are uniformly distributed on the top of the silicon wafer, and the electronic elements are fixedly connected with the silicon wafer through aluminum wires.

Preferably, the bottom of caulking groove evenly distributed has the bleeder vent, and bonds through the silver colloid layer between caulking groove and the mainboard.

Preferably, the edge of the glass fiber plate is provided with a matched edge band.

Preferably, four angles of inferior gram force installation cell body all are equipped with the mounting hole of supporting use, it is fixed through fastening screw installation between installation external member and the inferior gram force installation cell body.

Compared with the prior art, the beneficial effects of the utility model are that:

1. The yakeli installation groove body is provided with the installation sleeve, so that the overall operation strength of the electronic module is effectively improved, the condition that the electronic module is damaged is avoided or reduced, the anti-warping performance of the electronic module is improved, and the operation performance of the module is improved.

2. The glass fiber board that sets up has increased the module with the mainboard and has born the weight of intensity, avoids or reduces the serious condition of whole wearing and tearing because of electronic module's electrical components long-time operation leads to, has improved electronic die's anti warpage performance, and the combination operation between base plate and the ceramic substrate has realized avoiding or reducing because of electronic module receives the condition that electric power burns out and leads to whole discovery deformation, has guaranteed electronic module's operating strength, makes it have good low warpage.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

Fig. 2 is a schematic view of a first partial structure of the present invention;

Fig. 3 is a second partial structural schematic view of the present invention;

Fig. 4 is a third partial structural schematic diagram of the present invention.

In the figure: 1. an acrylic mounting groove body; 101. mounting holes; 2. installing a kit; 3. a glass fiber board; 301. edging; 302. caulking grooves; 303. air holes are formed; 4. a main board; 401. an electronic component; 402. a silver glue layer; 403. an aluminum wire; 5. a substrate; 6. a ceramic substrate; 601. welding the layers; 7. and (3) a silicon wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, the present invention provides an embodiment: an electronic module with low warping degree comprises an acrylic installation groove body 1 and a main board 4, wherein a ceramic substrate 6 is fixedly installed at the top of the main board 4 through a substrate 5, a silicon wafer 7 is fixedly installed at the top of the ceramic substrate 6 in an adhering mode, and the combined operation between the substrate 5 and the ceramic substrate 6 is realized, so that the situation that the whole body is deformed due to the fact that the electronic module is burnt and damaged by electric power is avoided or reduced, the operation strength of the electronic module is ensured, the electronic module has good low warping degree, installation sleeve parts 2 are fixedly installed on two sides inside the acrylic installation groove body 1, the integral operation strength of the electronic module is effectively increased through the installation sleeve parts 2 by the acrylic installation groove body 1, the situation that the electronic module is damaged is avoided or reduced, the anti-warping performance of the electronic module is improved, the operation performance of the module is improved, and a glass fiber plate 3 is fixedly installed between the installation sleeve parts, the mainboard 4 is inlayed through caulking groove 302 in glass fiber board 3's inside, and glass fiber board 3 has increased the module with mainboard 4 and has born the weight of the intensity, avoids or reduces because of the long-time operation of electronic module's electrical apparatus part leads to the serious condition of whole wearing and tearing, has improved electronic die's anti warpage performance.

Further, the ceramic substrate 6, the silicon wafer 7, and the substrate 5 are fixed by soldering via the soldering layer 601. In the embodiment, the welding layer 601 is made of a low-carbon welding material, so that the effect of supporting, mounting and fixing is achieved, and the bonding performance and firmness between the ceramic substrate 6 and the silicon wafer 7 and between the ceramic substrate 5 are ensured.

Further, electronic elements 401 are uniformly distributed on the top of the silicon wafer 7, and the electronic elements 401 are fixedly connected with the silicon wafer 7 through aluminum wires 403. In the embodiment, the electronic component 401 is an operating device matched with an electronic module, so that the normal operation of the electronic module is realized, and the aluminum wire 403 has the effect of receiving the electronic component 401, so that the connection operation of the electronic module is guaranteed.

Furthermore, the bottom of the caulking groove 302 is uniformly distributed with vent holes 303, and the caulking groove 302 and the main board 4 are bonded through a silver glue layer 402. In the embodiment, bleeder vent 303 has improved the radiating effect of caulking groove 302 to the module, has reduced electronic module's strain, and silver glue film 402 has increased laminating nature and fastness between caulking groove 302 and mainboard 4 simultaneously.

Further, the edge of the glass fiber plate 3 is provided with a flange 301 used in cooperation. In the embodiment, the band 301 increases the wear resistance of the glass fiber plate 3 and the joint, thereby avoiding or reducing the situation that the glass fiber plate 3 is worn, and improving the practicability of the electronic module.

Further, four angles of the acrylic installation groove body 1 are all provided with installation holes 101 for matching use, and the installation sleeve 2 and the acrylic installation groove body 1 are fixedly installed through fastening screws. In the embodiment, the staff can install and dismantle yakeli installation cell body 1 through mounting hole 101, and the convenience when having kept the staff to overhaul is guaranteed to fastening screw has guaranteed the fastness between installation external member 2 and the yakeli installation cell body 1.

The working principle is as follows: during operation, the electronic module is fixedly installed through the acrylic installation groove body 1, the glass fiber plate 3 is limited and fixed through the installation kit 2, and the external connecting wire and the aluminum wire 403 are electrically connected with the electronic element 401.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an electronic module with low angularity, includes ya keli installation cell body (1) and mainboard (4), its characterized in that: all fixed mounting in inside both sides of ya keli installation cell body (1) has installation external member (2), fixed mounting has glass fiber board (3) between installation external member (2), the inside of glass fiber board (3) is inlayed through caulking groove (302) and is installed mainboard (4), there are ceramic substrate (6) at the top of mainboard (4) through base plate (5) fixed mounting, the top fixed mounting of ceramic substrate (6) has silicon chip (7).

2. An electronic module according to claim 1, wherein: the ceramic substrate (6), the silicon wafer (7) and the substrate (5) are welded and fixed through the welding layer (601).

3. An electronic module according to claim 1, wherein: electronic elements (401) are uniformly distributed on the top of the silicon wafer (7), and the electronic elements (401) are fixedly connected with the silicon wafer (7) through aluminum wires (403).

4. An electronic module according to claim 1, wherein: the bottom of the caulking groove (302) is uniformly distributed with vent holes (303), and the caulking groove (302) is bonded with the main board (4) through a silver glue layer (402).

5. An electronic module according to claim 1, wherein: and the edge of the glass fiber plate (3) is provided with a flange (301) matched with the glass fiber plate.

6. An electronic module according to claim 1, wherein: four angles of ya keli installation cell body (1) all are equipped with supporting mounting hole (101) of using, it is fixed through fastening screw installation between installation external member (2) and the ya keli installation cell body (1).