WO2022156098A1 - Equalization module of capacitor module and heat dissipation method therefor - Google Patents
Equalization module of capacitor module and heat dissipation method therefor Download PDFInfo
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- WO2022156098A1 WO2022156098A1 PCT/CN2021/094635 CN2021094635W WO2022156098A1 WO 2022156098 A1 WO2022156098 A1 WO 2022156098A1 CN 2021094635 W CN2021094635 W CN 2021094635W WO 2022156098 A1 WO2022156098 A1 WO 2022156098A1
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- circuit board
- equalization
- module
- equalization circuit
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 239000003990 capacitor Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 16
- 238000012545 processing Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0013—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries acting upon several batteries simultaneously or sequentially
- H02J7/0014—Circuits for equalisation of charge between batteries
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Definitions
- the invention relates to the field of electronic device design, in particular to an equalization module of a capacitor module and a heat dissipation method thereof.
- an equalization module is often configured to process the voltage of each capacitor unit, so as to improve the overall lifespan of the super capacitor unit and the module.
- the balance module of the existing standard capacitor module usually adopts a single circuit board 10, which is fixed on the module cover plate 4 (used to cover the capacitor module box) with a fixing member, and the circuit board is used.
- the protective cover is used for protection, and a certain gap is left between the circuit board 10, the module cover 4 and the circuit board protective cover.
- the low thermal conductivity of the circuit board 10 results in a high temperature of the circuit board 10 (up to 85° C.), and the circuit board 10 is overheated, resulting in a decrease in the balancing ability and a shortened life of the circuit board 10, resulting in poor consistency of the supercapacitor cells. It further affects the life of supercapacitor cells and modules. At the same time, an excessively high circuit board temperature will also lead to changes in the impedance characteristics of the measuring components such as chip units arranged on the same circuit board, thus causing unpredictable effects on the equalization capability of the equalization module.
- the present invention proposes an equalization module for a capacitor module, which includes a sequence of The provided heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, and the fixing member for connecting the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, wherein:
- the first equalization circuit board and the second equalization circuit board are arranged in parallel and spaced apart,
- the first equalization circuit board is provided with an equalization circuit for equalizing the voltage of the module;
- the second equalization circuit board is provided with a chip circuit for processing the voltage signal of the module.
- a flexible heat conduction sheet is further arranged between the heat dissipation plate and the first equalization circuit board, and two contact surfaces of the flexible heat conduction sheet are respectively in contact with the heat dissipation plate and the first equalization circuit board.
- a flexible pressure strip is further provided between the first equalization circuit board and the second equalization circuit board, so that the first equalization circuit board is attached to the flexible heat conduction sheet.
- the fixing member includes a fixing bolt and a fixing nut.
- the fixing nut fastens the second equalizing circuit board
- the second equalizing circuit board compresses the flexible pressure strip
- the first equalizing circuit board compresses the flexible heat conduction sheet.
- a module cover plate for fixing the heat dissipation plate is also included, and the heat dissipation plate is arranged above the module cover plate.
- circuit board protective cover with an accommodating cavity
- the circuit board protective cover is detachably connected to the module cover, and the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board are in in the accommodating cavity.
- equalization circuit of the first equalization circuit board is electrically connected with the chip circuit of the second equalization circuit board through a connector.
- the fixing member is provided with a through hole, and the equalization module is electrically connected with the external capacitor module through the through hole.
- the present invention also provides a method for equalizing module heat dissipation of the capacitor module, comprising the steps of:
- S1 The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal
- the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat
- the heat can also be transferred into the accommodating cavity of the circuit board shield through the gap between the first equalizing circuit board and the second equalizing circuit board.
- the present invention at least contains the following beneficial effects:
- An equalization module of a capacitor module and a heat dissipation method thereof by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board and the heat dissipation method
- the flexible heat conduction sheet closely attached between the boards transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the effect of high temperature on the equalization ability of the circuit board.
- the main "equalization circuit” that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit” including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board,
- the first equalization circuit board and the second equalization circuit board are only in contact with the air except for the fixing member, and due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided;
- the first equalizing circuit board By arranging a flexible pressure strip between the first equalizing circuit board and the second equalizing circuit board, when the fixing member is fastened, the first equalizing circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalizing circuit board can be Sufficient clearance remains between the circuit board and the second equalizing circuit board without causing hard damage to the circuit board.
- 1 is a schematic structural diagram of an equalization module of a capacitor module
- FIG. 2 is a schematic diagram of a capacitor module of an equalization module of a capacitor module
- FIG. 3 is a schematic structural diagram of an equalization module of a standard capacitor module
- FIG. 4 is a method step diagram of a method for dissipating heat from a balanced module of a capacitor module
- 1-second equalization circuit board 2-first equalization circuit board, 3-heat dissipation plate, 4-module cover plate, 5-fixing piece, 6-through hole, 7-circuit board protective cover, 8-electrode interface, 9-electrode through hole, 10-circuit board.
- the equalization module can better dissipate heat, and avoid the influence of high temperature working conditions on the equalization capability of the circuit board and the impedance characteristics of the measurement element.
- the present invention proposes a capacitor.
- the equalization module of the module includes a heat dissipation plate 3 (in this embodiment, an aluminum plate is used for the heat dissipation plate 3), a first equalization circuit board 2, and a second equalization circuit board 1, which are arranged in sequence.
- the first equalization circuit board 2 and the second equalization circuit board 1 are arranged in parallel and spaced apart,
- the first equalizing circuit board 2 is provided with an equalizing circuit for equalizing the voltage of the module;
- the second equalizing circuit board 1 is provided with a chip circuit for processing the voltage signal of the module.
- the reason why the present invention divides the equalization circuit board into two circuit boards is that the main heat dissipation of the equalization module comes from the resistance heating of the equalization circuit. Therefore, if the equalization circuit is placed on the first equalization circuit board 2, the first Except for the connection of the fixing member 5, the equalizing circuit board 2 and the second equalizing circuit board 1 are only in contact with the air, so based on the characteristics of poor air convection thermal conductivity, the chip circuits on the second equalizing circuit board 1 (including the chips unit and various detection elements) will not be affected by the high temperature of the first equalization circuit board 2 . Compared with the standard capacitor module (as shown in FIG. 3 ), which only uses a single circuit board 10 , it is undoubtedly avoided that the same circuit board is easily affected by the heat of the equalization circuit, so that the equalization module has better working accuracy and longer service life.
- the present invention is provided with a flexible heat conduction sheet (the flexible heat conduction sheet in this embodiment) between the heat dissipation plate 3 and the first equalization circuit board 2
- the thermal conductive silica gel is used), and the two contact surfaces of the flexible thermal conduction sheet are respectively in contact with the heat dissipation plate 3 and the first equalization circuit board 2 .
- its overall shape is consistent with the board of the first equalization circuit 2, so as to ensure balanced contact with the contact surface of the first equalization circuit board 2 and avoid local heat accumulation in the circuit.
- a flexible pressure strip is also arranged between the first equalization circuit board 2 and the second equalization circuit board 1 , so that the first equalization circuit board 2 is attached to the flexible heat conduction sheet.
- two fixing parts 5 that is, fixing parts 5 at the four corners of the circuit board
- a strip of flexible bead (not in contact with electronic components, and a material with low thermal conductivity is used) is respectively disposed between the two fixing members 5 on the corresponding side.
- the through holes 6 are used to electrically connect the equalization module with the capacitor modules in the capacitor module through the through holes 6 .
- the fixing member 5 includes a fixing bolt and a fixing nut.
- the fixing nut fastens the second equalizing circuit board 1
- the second equalizing circuit board 1 compresses the flexible pressure strip under the action of the force of the fixing nut, and the flexible pressure strip is also under the action of the force.
- the first equalization circuit board 2 is forced to compress the flexible heat conduction sheet, so that the first equalization circuit board 2 fully contacts the flexible heat conduction sheet, thereby greatly improving the heat dissipation efficiency.
- the heat dissipation plate 3 also includes a module cover plate 4 for fixing the heat dissipation plate 3, the heat dissipation plate 3 is arranged above the module cover plate 4, and the heat obtained by the heat dissipation plate 3 also finally passes through the module cover plate 4 (with the The area of air contact is large) is transmitted into the air.
- circuit board protective cover 7 with an accommodating cavity
- the circuit board protective cover 7 is detachably connected to the module cover 4, and the heat dissipation plate 3, the first equalizing circuit board 2, the The two equalizing circuit boards 1 are both located in the accommodating cavity.
- the electrode 8 is electrically connected to the capacitor in the capacitor module by connecting the electrode through hole 9 at the corresponding position.
- equalization circuit of the first equalization circuit board 2 and the chip circuit of the second equalization circuit board 1 are electrically connected through connectors, so as to realize the transmission of corresponding signals.
- a method for dissipating heat for a balanced module of a capacitor module includes the steps:
- S1 The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal
- the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat
- the heat can also be transferred into the accommodating cavity of the circuit board protective cover through the interval between the first equalizing circuit board and the second equalizing circuit board.
- the equalization module of the capacitor module and the heat dissipation method thereof by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board
- the flexible heat conduction sheet closely attached to the heat dissipation plate transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the equalization ability of the circuit board. Under the influence of high temperature, the consistency of the super capacitor monomer is good.
- the main “equalization circuit” that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit” including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board, and the first equalization circuit board is installed.
- the contact between the equalization circuit board and the second equalization circuit board is only through the air except for the fixing member. Due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided.
- the first equalization circuit board By arranging a flexible pressure strip between the first equalization circuit board and the second equalization circuit board, when the fixing member is fastened, the first equalization circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalization circuit board and the Sufficient gaps are reserved between the second equalizing circuit boards without causing hard damage to the circuit boards.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Abstract
Provided is an equalization module of a capacitor module, comprising a heat dissipation plate (3), a first equalization circuit board (2) and a second equalization circuit board (1) arranged in sequence, and a fixing member (5), wherein the first equalization circuit board (2) and the second equalization circuit board (1) are arranged in parallel at an interval; the first equalization circuit board (2) is provided with an equalization circuit used for equalizing module voltage; and the second equalization circuit board (1) is provided with a chip circuit used for processing a module voltage signal. The circuit board of the equalization module is divided into the first equalization circuit board (2) and the second equalization circuit board (1), and by using a flexible heat conduction sheet tightly attached between the first equalization circuit board (2) and the heat dissipation plate (3), the heat generated by the first equalization circuit board (2) is transferred to a module cover plate (4) by the flexible heat conduction sheet through the heat dissipation plate (3), thereby greatly improving the heat dissipation efficiency.
Description
本发明涉及电子器械设计领域，具体涉及一种电容模组的均衡模块及其散热方法。The invention relates to the field of electronic device design, in particular to an equalization module of a capacitor module and a heat dissipation method thereof.
在超级电容等大电容模组的使用过程中，通常需要对电容模组中各电容单元的电压进行均衡处理，以使得各电容单元之间能以相对同步的效率运行，或以相同电压维持待机状态，以保证再次投入使用时的电压一致，进而避免个别电容单元运行功率过大或过低，导致的电容模组整体损耗程度加快。因此，在现有的电容模组当中，往往会配置一个均衡模块来对各电容单元的电压进行处理，以提高超级电容单体和模组的整体寿命。In the process of using large capacitor modules such as super capacitors, it is usually necessary to equalize the voltage of each capacitor unit in the capacitor module, so that each capacitor unit can operate at a relatively synchronous efficiency, or maintain standby at the same voltage. state to ensure that the voltage is consistent when it is put into use again, so as to prevent the running power of individual capacitor units from being too large or too low, resulting in faster overall loss of the capacitor module. Therefore, in the existing capacitor modules, an equalization module is often configured to process the voltage of each capacitor unit, so as to improve the overall lifespan of the super capacitor unit and the module.
然而现有的标准电容模组的均衡模块，如图3所示，通常采用单个电路板10，利用固定件固定在模组盖板4(用于封盖电容模组箱)上，并用电路板防护罩进行防护，电路板10、模组盖板4和电路板防护罩之间留有一定空隙。在电路板10工作时，电路板10上的电阻两端通电并进入均衡工作模式，电路板10上的电阻外表面通过预留的空隙通过空气传热，然而由于空气对流散热慢和塑料材质的电路板10热导系数低，导致电路板10温度高(可达85℃)，电路板10温度过高，导致电路板10的均衡能力下降、寿命缩短，从而使得超级电容单体的一致性差，进一步影响超级电容单体和模组的寿命。同时过高的电路板温度，也会导致设置于同一电路板上的芯片单元等测量元器件的阻抗特性的变化，从而对均衡模块的均衡能力造成无法预测的影响。However, the balance module of the existing standard capacitor module, as shown in FIG. 3 , usually adopts a single circuit board 10, which is fixed on the module cover plate 4 (used to cover the capacitor module box) with a fixing member, and the circuit board is used. The protective cover is used for protection, and a certain gap is left between the circuit board 10, the module cover 4 and the circuit board protective cover. When the circuit board 10 is working, the two ends of the resistor on the circuit board 10 are energized and enter the balanced working mode. The outer surface of the resistor on the circuit board 10 conducts heat through the air through the reserved space. However, due to the slow heat dissipation due to air convection and the plastic material The low thermal conductivity of the circuit board 10 results in a high temperature of the circuit board 10 (up to 85° C.), and the circuit board 10 is overheated, resulting in a decrease in the balancing ability and a shortened life of the circuit board 10, resulting in poor consistency of the supercapacitor cells. It further affects the life of supercapacitor cells and modules. At the same time, an excessively high circuit board temperature will also lead to changes in the impedance characteristics of the measuring components such as chip units arranged on the same circuit board, thus causing unpredictable effects on the equalization capability of the equalization module.
发明内容SUMMARY OF THE INVENTION
为解决上述问题，使得均衡模块能够更好得将热量散发出去，避免高温工作状态对电路板均衡能力和测量元件阻抗特性的影响，本发明提出了一种电容模组的均衡模块，包括有依次设置的散热板、第一均衡电路板、第二均衡电路 板三者，和用于连接所述散热板、第一均衡电路板、第二均衡电路板三者的固定件，其中：In order to solve the above problems, make the equalization module better dissipate the heat, and avoid the influence of the high temperature working state on the equalization capability of the circuit board and the impedance characteristics of the measurement element, the present invention proposes an equalization module for a capacitor module, which includes a sequence of The provided heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, and the fixing member for connecting the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, wherein:
所述第一均衡电路板与第二均衡电路板之间平行、间隔设置，The first equalization circuit board and the second equalization circuit board are arranged in parallel and spaced apart,
且所述第一均衡电路板上设有用于均衡模组电压的均衡电路；所述第二均衡电路板上设有用于处理模组电压信号的芯片电路。And the first equalization circuit board is provided with an equalization circuit for equalizing the voltage of the module; the second equalization circuit board is provided with a chip circuit for processing the voltage signal of the module.
进一步地，所述散热板与第一均衡电路板之间还设有柔性热传导片，所述柔性热传导片的两个接触面分别与散热板和第一均衡电路板接触。Further, a flexible heat conduction sheet is further arranged between the heat dissipation plate and the first equalization circuit board, and two contact surfaces of the flexible heat conduction sheet are respectively in contact with the heat dissipation plate and the first equalization circuit board.
进一步地，所述第一均衡电路板和第二均衡电路板之间还设有柔性压条，以使所述第一均衡电路板贴于所述柔性热传导片上。Further, a flexible pressure strip is further provided between the first equalization circuit board and the second equalization circuit board, so that the first equalization circuit board is attached to the flexible heat conduction sheet.
进一步地，所述固定件包括固定螺栓和固定螺母，当所述固定螺母紧固第二均衡电路板时，第二均衡电路板压缩柔性压条，第一均衡电路板压缩柔性热传导片。Further, the fixing member includes a fixing bolt and a fixing nut. When the fixing nut fastens the second equalizing circuit board, the second equalizing circuit board compresses the flexible pressure strip, and the first equalizing circuit board compresses the flexible heat conduction sheet.
进一步地，还包括用于固定所述散热板的模组盖板，所述散热板设置在所述模组盖板上方。Further, a module cover plate for fixing the heat dissipation plate is also included, and the heat dissipation plate is arranged above the module cover plate.
进一步地，还包括具有容纳腔的电路板防护罩，所述电路板防护罩可拆卸连接在所述模组盖板上，且所述散热板、第一均衡电路板、第二均衡电路板处于所述容纳腔中。Further, it also includes a circuit board protective cover with an accommodating cavity, the circuit board protective cover is detachably connected to the module cover, and the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board are in in the accommodating cavity.
进一步地，所述第一均衡电路板的均衡电路与第二均衡电路板的芯片电路通过接插件电连接。Further, the equalization circuit of the first equalization circuit board is electrically connected with the chip circuit of the second equalization circuit board through a connector.
进一步地，所述固定件上设有通孔，均衡模块通过通孔与外部电容模块电连接。Further, the fixing member is provided with a through hole, and the equalization module is electrically connected with the external capacitor module through the through hole.
本发明还提出了一种电容模组的均衡模块散热方法，包括步骤：The present invention also provides a method for equalizing module heat dissipation of the capacitor module, comprising the steps of:
S1：第二均衡电路板上的芯片电路分析模组电压信号并发送控制信号；S1: The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal;
S2：第一均衡电路板上的均衡电路根据控制信号均衡模组电压并释放热量；S2: The equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;
S3：柔性热传导片将热量由第一均衡电路板传递至散热板；S3: the flexible heat conduction sheet transfers the heat from the first equalization circuit board to the heat dissipation plate;
S4：散热板将热量通过模组盖板传递至外部空气。S4: The heat dissipation plate transfers heat to the outside air through the module cover.
进一步地，所述热量还可通过第一均衡电路板与第二均衡电路板之间的间 隔传递至电路板防护罩的容纳腔中。Further, the heat can also be transferred into the accommodating cavity of the circuit board shield through the gap between the first equalizing circuit board and the second equalizing circuit board.
与现有技术相比，本发明至少含有以下有益效果：Compared with the prior art, the present invention at least contains the following beneficial effects:
(1)本发明所述的一种电容模组的均衡模块及其散热方法，通过将均衡模块的电路板分为第一均衡电路板和第二均衡电路板，利用第一均衡电路板和散热板之间紧贴的柔性热传导片，将第一均衡电路板产生的热量由柔性热传导片通过散热板传递至模组盖板，从而大幅提高了散热效率，避免了电路板的均衡能力受高温影响；(1) An equalization module of a capacitor module and a heat dissipation method thereof according to the present invention, by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board and the heat dissipation method The flexible heat conduction sheet closely attached between the boards transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the effect of high temperature on the equalization ability of the circuit board. ;
(2)将均衡模块运行过程中散热的主体“均衡电路”设置于第一均衡电路板上，将容易受高温影响的包含芯片、测量元件的“芯片电路”设置于第二均衡电路板上，并且第一均衡电路板和第二均衡电路板之间除固定件外仅通过空气接触，而由于空气对流热传导性不佳，可以避免第一均衡电路板的散热对第二均衡电路板造成影响；(2) The main "equalization circuit" that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit" including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board, In addition, the first equalization circuit board and the second equalization circuit board are only in contact with the air except for the fixing member, and due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided;
(3)通过在第一均衡电路板和第二均衡电路板之间设置柔性压条，使得固定件紧固时，能够使第一均衡电路板能够紧密贴合与柔性热传导片上，同时使第一均衡电路板和第二均衡电路板之间保留足够的空隙，且不会对电路板造成硬性损坏。(3) By arranging a flexible pressure strip between the first equalizing circuit board and the second equalizing circuit board, when the fixing member is fastened, the first equalizing circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalizing circuit board can be Sufficient clearance remains between the circuit board and the second equalizing circuit board without causing hard damage to the circuit board.
图1为一种电容模组的均衡模块的结构示意图；1 is a schematic structural diagram of an equalization module of a capacitor module;
图2为一种电容模组的均衡模块的电容模组示意图；2 is a schematic diagram of a capacitor module of an equalization module of a capacitor module;
图3为标准电容模组的均衡模块的结构示意图；3 is a schematic structural diagram of an equalization module of a standard capacitor module;
图4为一种电容模组的均衡模块散热方法的方法步骤图；FIG. 4 is a method step diagram of a method for dissipating heat from a balanced module of a capacitor module;
附图标记说明：1-第二均衡电路板、2-第一均衡电路板、3-散热板、4-模组盖板、5-固定件、6-通孔、7-电路板防护罩、8-电极接口、9-电极通孔、10-电路板。Description of reference numerals: 1-second equalization circuit board, 2-first equalization circuit board, 3-heat dissipation plate, 4-module cover plate, 5-fixing piece, 6-through hole, 7-circuit board protective cover, 8-electrode interface, 9-electrode through hole, 10-circuit board.
以下是本发明的具体实施例并结合附图，对本发明的技术方案作进一步的 描述，但本发明并不限于这些实施例。The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.
实施例一Example 1
为解决上述问题，使得均衡模块能够更好得将热量散发出去，避免高温工作状态对电路板均衡能力和测量元件阻抗特性的影响，如图1和图2所示，本发明提出了一种电容模组的均衡模块，包括有依次设置的散热板3(本实施例中散热板3采用的是铝板)、第一均衡电路板2、第二均衡电路板1三者，和用于连接所述散热板3、第一均衡电路2板、第二均衡电路板1三者的固定件5，其中：In order to solve the above problems, the equalization module can better dissipate heat, and avoid the influence of high temperature working conditions on the equalization capability of the circuit board and the impedance characteristics of the measurement element. As shown in Figures 1 and 2, the present invention proposes a capacitor. The equalization module of the module includes a heat dissipation plate 3 (in this embodiment, an aluminum plate is used for the heat dissipation plate 3), a first equalization circuit board 2, and a second equalization circuit board 1, which are arranged in sequence. The fixing member 5 of the heat dissipation plate 3, the first equalization circuit board 2, and the second equalization circuit board 1, wherein:
所述第一均衡电路板2与第二均衡电路板1之间平行、间隔设置，The first equalization circuit board 2 and the second equalization circuit board 1 are arranged in parallel and spaced apart,
且所述第一均衡电路板2上设有用于均衡模组电压的均衡电路；所述第二均衡电路板1上设有用于处理模组电压信号的芯片电路。And the first equalizing circuit board 2 is provided with an equalizing circuit for equalizing the voltage of the module; the second equalizing circuit board 1 is provided with a chip circuit for processing the voltage signal of the module.
本发明之所以将均衡电路板拆分为两块电路板，是考虑到均衡模块主要的散热来自于均衡电路的电阻发热，因此如果将均衡电路都放置于第一均衡电路板2，而第一均衡电路板2与第二均衡电路板1之间除固定件5连接外，仅由空气接触，那么基于空气对流热传导性表现不佳的特性，第二均衡电路板1上的芯片电路(包括芯片单元和各类检测元件)就不会受到第一均衡电路板2的高温影响。相较于标准电容模组(如图3)仅采用单一的电路板10，无疑避免了同一电路板容易受均衡电路发热的影响，从而可以使得均衡模块工作精度更佳，使用寿命更长。The reason why the present invention divides the equalization circuit board into two circuit boards is that the main heat dissipation of the equalization module comes from the resistance heating of the equalization circuit. Therefore, if the equalization circuit is placed on the first equalization circuit board 2, the first Except for the connection of the fixing member 5, the equalizing circuit board 2 and the second equalizing circuit board 1 are only in contact with the air, so based on the characteristics of poor air convection thermal conductivity, the chip circuits on the second equalizing circuit board 1 (including the chips unit and various detection elements) will not be affected by the high temperature of the first equalization circuit board 2 . Compared with the standard capacitor module (as shown in FIG. 3 ), which only uses a single circuit board 10 , it is undoubtedly avoided that the same circuit board is easily affected by the heat of the equalization circuit, so that the equalization module has better working accuracy and longer service life.
而为了将第一均衡电路板2所产生的的热量及时通过散热板3传导出去，本发明在散热板3与第一均衡电路板2之间设置有柔性热传导片(本实施例中柔性热传导片采用的是导热硅胶)，所述柔性热传导片的两个接触面分别与散热板3和第一均衡电路板2接触。在本实施例中，其整体形状与第一均衡电路2板保持一致，从而保证其与第一均衡电路板2接触面的均衡接触，避免电路局部热量累积。In order to conduct the heat generated by the first equalization circuit board 2 through the heat dissipation plate 3 in time, the present invention is provided with a flexible heat conduction sheet (the flexible heat conduction sheet in this embodiment) between the heat dissipation plate 3 and the first equalization circuit board 2 The thermal conductive silica gel is used), and the two contact surfaces of the flexible thermal conduction sheet are respectively in contact with the heat dissipation plate 3 and the first equalization circuit board 2 . In this embodiment, its overall shape is consistent with the board of the first equalization circuit 2, so as to ensure balanced contact with the contact surface of the first equalization circuit board 2 and avoid local heat accumulation in the circuit.
同时，第一均衡电路板2和第二均衡电路板1之间还设有柔性压条，以使所述第一均衡电路板2贴于所述柔性热传导片上。具体为，在本实施例中，第一均衡电路板2的通孔6的一侧与另一侧的均设有两个固定件5(即电路板的 四个边角的固定件5)，相应一侧的两个固定件5之间分别设置有一条状柔性压条(不与电子元件接触，同时采用低热传导性的材料)。At the same time, a flexible pressure strip is also arranged between the first equalization circuit board 2 and the second equalization circuit board 1 , so that the first equalization circuit board 2 is attached to the flexible heat conduction sheet. Specifically, in this embodiment, two fixing parts 5 (that is, fixing parts 5 at the four corners of the circuit board) are provided on one side and the other side of the through hole 6 of the first equalizing circuit board 2 , A strip of flexible bead (not in contact with electronic components, and a material with low thermal conductivity is used) is respectively disposed between the two fixing members 5 on the corresponding side.
所述通孔6用于使均衡模块通过通孔6与电容模组中的电容模块电连接。The through holes 6 are used to electrically connect the equalization module with the capacitor modules in the capacitor module through the through holes 6 .
而固定件5包括固定螺栓和固定螺母，当固定螺母紧固第二均衡电路板1时，第二均衡电路板1在固定螺母的力的作用下压缩柔性压条，柔性压条也在力的作用下迫使第一均衡电路板2压缩柔性热传导片，从而使得第一均衡电路板2充分接触柔性热传导片，大大提高散热的效率。The fixing member 5 includes a fixing bolt and a fixing nut. When the fixing nut fastens the second equalizing circuit board 1, the second equalizing circuit board 1 compresses the flexible pressure strip under the action of the force of the fixing nut, and the flexible pressure strip is also under the action of the force. The first equalization circuit board 2 is forced to compress the flexible heat conduction sheet, so that the first equalization circuit board 2 fully contacts the flexible heat conduction sheet, thereby greatly improving the heat dissipation efficiency.
在这需要说明得是，柔性热传导片和柔性压条并未以实际结构的形式在附图中表现出来，但本领域技术人员完全可以根据本实施例的文字描述，得到其具体结构和安装方式。而之所以均采用柔性材料，则是为了在固定件紧固第一均衡电路板和第二均衡电路板时，通过柔性接触避免对电路板造成的损伤。It should be noted that the flexible heat conduction sheet and the flexible bead are not shown in the drawings in the form of actual structure, but those skilled in the art can fully obtain their specific structure and installation method according to the text description of this embodiment. The reason why flexible materials are used is to avoid damage to the circuit boards through flexible contact when the first equalizing circuit board and the second equalizing circuit board are fastened by the fixing member.
同时，还包括用于固定所述散热板3的模组盖板4，散热板3设置在所述模组盖板4上方，散热板3所得到的热量也最终通过模组盖板4(与空气接触的面积大)传导入空气。At the same time, it also includes a module cover plate 4 for fixing the heat dissipation plate 3, the heat dissipation plate 3 is arranged above the module cover plate 4, and the heat obtained by the heat dissipation plate 3 also finally passes through the module cover plate 4 (with the The area of air contact is large) is transmitted into the air.
进一步地，还包括具有容纳腔的电路板防护罩7，所述电路板防护罩7可拆卸连接在所述模组盖板4上，且所述散热板3、第一均衡电路板2、第二均衡电路板1均处于所述容纳腔中。而电极8通过连接对应位置的电极通孔9与电容模组中的电容电连接。Further, it also includes a circuit board protective cover 7 with an accommodating cavity, the circuit board protective cover 7 is detachably connected to the module cover 4, and the heat dissipation plate 3, the first equalizing circuit board 2, the The two equalizing circuit boards 1 are both located in the accommodating cavity. The electrode 8 is electrically connected to the capacitor in the capacitor module by connecting the electrode through hole 9 at the corresponding position.
进一步地，第一均衡电路板2的均衡电路与第二均衡电路板1的芯片电路通过接插件进行电连接，以实现相应信号的传递。Further, the equalization circuit of the first equalization circuit board 2 and the chip circuit of the second equalization circuit board 1 are electrically connected through connectors, so as to realize the transmission of corresponding signals.
实施例二 Embodiment 2
为了更好地对本发明的技术内容进行阐述，本实施例通过步骤的形式来对技术方案进行描述，如图4所示，一种电容模组的均衡模块散热方法，包括步骤：In order to better illustrate the technical content of the present invention, the present embodiment describes the technical solution in the form of steps. As shown in FIG. 4 , a method for dissipating heat for a balanced module of a capacitor module includes the steps:
S1：第二均衡电路板上的芯片电路分析模组电压信号并发送控制信号；S1: The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal;
S2：第一均衡电路板上的均衡电路根据控制信号均衡模组电压并释放热量；S2: The equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;
S3：柔性热传导片将热量由第一均衡电路板传递至散热板；S3: the flexible heat conduction sheet transfers the heat from the first equalization circuit board to the heat dissipation plate;
S4：散热板将热量通过模组盖板传递至外部空气。S4: The heat dissipation plate transfers heat to the outside air through the module cover.
进一步地，所述热量还可通过第一均衡电路板与第二均衡电路板之间的间隔传递至电路板防护罩的容纳腔中。Further, the heat can also be transferred into the accommodating cavity of the circuit board protective cover through the interval between the first equalizing circuit board and the second equalizing circuit board.
综上所述，本发明所述的一种电容模组的均衡模块及其散热方法，通过将均衡模块的电路板分为第一均衡电路板和第二均衡电路板，利用第一均衡电路板和散热板之间紧贴的柔性热传导片，将第一均衡电路板产生的热量由柔性热传导片通过散热板传递至模组盖板，从而大幅提高了散热效率，避免了电路板的均衡能力受高温影响，超级电容单体一致性好。To sum up, the equalization module of the capacitor module and the heat dissipation method thereof according to the present invention, by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board The flexible heat conduction sheet closely attached to the heat dissipation plate transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the equalization ability of the circuit board. Under the influence of high temperature, the consistency of the super capacitor monomer is good.
将均衡模块运行过程中散热的主体“均衡电路”设置于第一均衡电路板上，将容易受高温影响的包含芯片、测量元件的“芯片电路”设置于第二均衡电路板上，并且第一均衡电路板和第二均衡电路板之间除固定件外仅通过空气接触，而由于空气对流热传导性不佳，可以避免第一均衡电路板的散热对第二均衡电路板造成影响。The main "equalization circuit" that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit" including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board, and the first equalization circuit board is installed. The contact between the equalization circuit board and the second equalization circuit board is only through the air except for the fixing member. Due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided.
通过在第一均衡电路板和第二均衡电路板之间设置柔性压条，使得固定件紧固时，能够使第一均衡电路板能够紧密贴合与柔性热传导片上，同时使第一均衡电路板和第二均衡电路板之间保留足够的空隙，且不会对电路板造成硬性损坏。By arranging a flexible pressure strip between the first equalization circuit board and the second equalization circuit board, when the fixing member is fastened, the first equalization circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalization circuit board and the Sufficient gaps are reserved between the second equalizing circuit boards without causing hard damage to the circuit boards.
本文中所描述的具体实施例仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention pertains can make various modifications or additions to the described specific embodiments or substitute in similar manners, but will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.
Claims (10)
- 一种电容模组的均衡模块，其特征在于，包括有依次设置的散热板、第一均衡电路板、第二均衡电路板三者，和用于连接所述散热板、第一均衡电路板、第二均衡电路板三者的固定件，其中：An equalization module of a capacitor module is characterized in that it includes a heat dissipation plate, a first equalization circuit board, and a second equalization circuit board arranged in sequence, and is used for connecting the heat dissipation plate, the first equalization circuit board, The second equalization circuit board is a three-piece fixture, wherein:所述第一均衡电路板与第二均衡电路板之间平行、间隔设置，且所述第一均衡电路板上设有用于均衡模组电压的均衡电路；所述第二均衡电路板上设有用于处理模组电压信号的芯片电路。The first equalizing circuit board and the second equalizing circuit board are arranged in parallel and spaced apart, and the first equalizing circuit board is provided with an equalizing circuit for equalizing the voltage of the module; A chip circuit for processing module voltage signals.
- 如权利要求1所述的一种电容模组的均衡模块，其特征在于，所述散热板与第一均衡电路板之间还设有柔性热传导片，所述柔性热传导片的两个接触面分别与散热板和第一均衡电路板接触。The equalization module of a capacitor module according to claim 1, wherein a flexible heat conduction sheet is further provided between the heat dissipation plate and the first equalization circuit board, and two contact surfaces of the flexible heat conduction sheet are respectively In contact with the heat sink and the first equalization circuit board.
- 如权利要求2所述的一种电容模组的均衡模块，其特征在于，所述第一均衡电路板和第二均衡电路板之间还设有柔性压条，以使所述第一均衡电路板贴于所述柔性热传导片上。The equalization module of a capacitor module according to claim 2, wherein a flexible pressure strip is further provided between the first equalization circuit board and the second equalization circuit board, so that the first equalization circuit board is affixed to the flexible thermally conductive sheet.
- 如权利要求3所述的一种电容模组的均衡模块，其特征在于，所述固定件包括固定螺栓和固定螺母，当所述固定螺母紧固第二均衡电路板时，第二均衡电路板压缩柔性压条，第一均衡电路板压缩柔性热传导片。The equalization module of a capacitor module according to claim 3, wherein the fixing member comprises a fixing bolt and a fixing nut, and when the fixing nut fastens the second equalizing circuit board, the second equalizing circuit board The flexible bead is compressed, and the first equalization circuit board compresses the flexible heat conduction sheet.
- 如权利要求1所述的一种电容模组的均衡模块，其特征在于，还包括用于固定所述散热板的模组盖板，所述散热板设置在所述模组盖板上方。The equalization module of a capacitor module according to claim 1, further comprising a module cover plate for fixing the heat dissipation plate, and the heat dissipation plate is arranged above the module cover plate.
- 如权利要求5所述的一种电容模组的均衡模块，其特征在于，还包括具有容纳腔的电路板防护罩，所述电路板防护罩可拆卸连接在所述模组盖板上，且所述散热板、第一均衡电路板、第二均衡电路板处于所述容纳腔中。The equalization module of a capacitor module according to claim 5, further comprising a circuit board protective cover having an accommodating cavity, the circuit board protective cover being detachably connected to the module cover, and The heat dissipation plate, the first equalization circuit board, and the second equalization circuit board are located in the accommodating cavity.
- 如权利要求1所述的一种电容模组的均衡模块，其特征在于，所述第一均衡电路板的均衡电路与第二均衡电路板的芯片电路通过接插件电连接。The equalization module of a capacitor module according to claim 1, wherein the equalization circuit of the first equalization circuit board and the chip circuit of the second equalization circuit board are electrically connected through connectors.
- 如权利要求1所述的一种电容模组的均衡模块，其特征在于， 所述固定件上设有通孔，均衡模块通过通孔与电容模组中的电容模块电连接。The equalization module of the capacitor module according to claim 1, wherein the fixing member is provided with a through hole, and the equalization module is electrically connected to the capacitor module in the capacitor module through the through hole.
- 如权利要求1至8任一项所述的一种电容模组的均衡模块散热方法，其特征在于，包括步骤：The method for dissipating heat for a balanced module of a capacitor module according to any one of claims 1 to 8, wherein the method comprises the steps of:S1：第二均衡电路板上的芯片电路分析模组电压信号并发送控制信号；S1: The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal;S2：第一均衡电路板上的均衡电路根据控制信号均衡模组电压并释放热量；S2: The equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;S3：柔性热传导片将热量由第一均衡电路板传递至散热板；S3: the flexible heat conduction sheet transfers the heat from the first equalization circuit board to the heat dissipation plate;S4：散热板将热量通过模组盖板传递至外部空气。S4: The heat dissipation plate transfers heat to the outside air through the module cover.
- 如权利要求9所述的一种电容模组的均衡模块散热方法，其特征在于，所述热量还可通过第一均衡电路板与第二均衡电路板之间的间隔传递至电路板防护罩的容纳腔中。9. The method for dissipating heat from an equalization module of a capacitor module as claimed in claim 9, wherein the heat can also be transferred to the protective cover of the circuit board through the interval between the first equalization circuit board and the second equalization circuit board. in the receiving cavity.
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| PCT/CN2021/094635 WO2022156098A1 (en) | 2021-01-20 | 2021-05-19 | Equalization module of capacitor module and heat dissipation method therefor |
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| Country | Link |
|---|---|
| CN (1) | CN113013937A (en) |
| WO (1) | WO2022156098A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116884771A (en) * | 2023-09-05 | 2023-10-13 | 中宝电气有限公司 | Circuit breaker capacitor electricity taking assembly |
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- 2021-01-20 CN CN202110072766.0A patent/CN113013937A/en active Pending
- 2021-05-19 WO PCT/CN2021/094635 patent/WO2022156098A1/en active Application Filing
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| US20130108894A1 (en) * | 2011-11-02 | 2013-05-02 | Yeon-Sung Jung | Secondary battery |
| WO2014199181A1 (en) * | 2013-06-14 | 2014-12-18 | Goodwolfe Energy Limited | Cell management module, battery and methods therefor |
| CN204928300U (en) * | 2015-09-29 | 2015-12-30 | 东风商用车有限公司 | Balanced cooling system of lithium cell |
| CN205544487U (en) * | 2016-04-19 | 2016-08-31 | 深圳市道通智能航空技术有限公司 | Balanced device of rechargeable battery and charger |
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| KR20180101990A (en) * | 2017-03-06 | 2018-09-14 | 주식회사 우진더블유티피 | Hybrid power supply unit for electric skateboard and electric skateboard using the unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116884771A (en) * | 2023-09-05 | 2023-10-13 | 中宝电气有限公司 | Circuit breaker capacitor electricity taking assembly |
| CN116884771B (en) * | 2023-09-05 | 2023-12-01 | 中宝电气有限公司 | Circuit breaker capacitor electricity taking assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113013937A (en) | 2021-06-22 |
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