WO2024093214A1

WO2024093214A1 - Chip heat dissipation assembly and electronic device

Info

Publication number: WO2024093214A1
Application number: PCT/CN2023/096862
Authority: WO
Inventors: 闫超
Original assignee: 中兴通讯股份有限公司
Priority date: 2022-11-01
Filing date: 2023-05-29
Publication date: 2024-05-10
Also published as: CN117998808A

Abstract

The present application belongs to the field of communication equipment and discloses a chip heat dissipation assembly and an electronic device. The chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting structure piece, and a heat sink, wherein: the chip assembly is arranged on the circuit board; the supporting structure piece is arranged at a preset position of the circuit board, the distance between the preset position and a target position is smaller than a first threshold, and the target position is the position on the circuit board corresponding to the location of the center of gravity of the heat sink; the heat sink is installed above the chip assembly; and when the heat sink is in an installed state, the face of the chip assembly away from the circuit board and the face of the supporting structure piece away from the circuit board are in contact with the heat sink.

Description

Chip cooling components and electronic equipment

cross reference

This application claims priority to a Chinese patent application filed with the Chinese Patent Office on November 1, 2022, with application number 202211366869.9 and title “Chip heat dissipation assembly and electronic device”. The entire contents of the application are incorporated by reference into this application.

Technical Field

The present application relates to the field of communication equipment, and in particular to a chip heat dissipation component and electronic equipment.

Background technique

With the development of the fifth generation mobile communication technology (5G), cloud computing, Internet of Things, industrial Internet, etc., the bandwidth and rate of a single box of bearer box equipment have reached 51.2T/ and 112G respectively. The power consumption of a single chip is expected to surge from 500 watts (Watt, W) to 1000W, and the size of the chip heat sink has also increased accordingly. At the same time, based on the cost of hardware design, the physical layer-less (PHYLESS) design has become the first choice for the industry's hardware solutions, which requires the chip to be closer and closer to the optical module connector.

Due to the substantial increase in the size of the heat sink and the close design of the chip to the optical module connector, the deviation between the center position of the chip and the heat sink becomes increasingly larger. In this case, during the chip assembly process and when the equipment is vibrated, there is a problem of excessive stress on the chip, resulting in chip damage.

Summary of the invention

The present application discloses a chip heat dissipation component and an electronic device.

include:

In a first aspect, an embodiment of the present application discloses a chip heat dissipation assembly, comprising: a circuit board, a chip assembly, a supporting structure and a heat sink, wherein: the chip assembly is arranged on the circuit board; the supporting structure is arranged at a preset position of the circuit board, and the distance between the preset position and a target position is less than a first threshold, wherein the target position is a position on the circuit board corresponding to the center of gravity position of the heat sink; the heat sink is installed above the chip assembly; when the heat sink is in an installed state, the surface of the chip assembly away from the circuit board and the surface of the supporting structure away from the circuit board are in contact with the heat sink.

In a second aspect, an embodiment of the present application discloses an electronic device, comprising the chip heat dissipation assembly described in the first aspect above.

An embodiment of the present application provides a chip heat dissipation assembly, in which a supporting structure is arranged at a preset position on a circuit board, and a distance between the preset position and a position on the circuit board corresponding to the center of gravity of the heat sink is less than a first threshold value, and when the heat sink is in an installed state, a surface of the chip assembly away from the circuit board and a surface of the supporting structure away from the circuit board are in contact with the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a chip heat dissipation assembly disclosed in an embodiment of the present application.

Detailed ways

The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

The terms "first", "second", etc. in the specification and claims of this application are used to distinguish Similar objects are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally indicates that the objects associated with each other are in an "or" relationship.

The present application discloses a chip heat dissipation component and an electronic device. FIG1 is a schematic structural diagram of a chip heat dissipation component disclosed in an embodiment of the present application.

As shown in Figure 1, the chip heat dissipation assembly disclosed in the present application includes a circuit board 110, a chip assembly 120, a supporting structure 130 and a heat sink 140, wherein: the chip assembly 120 is arranged on the circuit board 110; the supporting structure 130 is arranged at a preset position of the circuit board 110, and the distance between the preset position and the target position is less than a first threshold, wherein the target position is a position on the circuit board 110 corresponding to the center of gravity position of the heat sink 140; the heat sink 140 is installed above the chip assembly 120; when the heat sink 140 is in an installed state, the surface of the chip assembly 120 away from the circuit board 110 and the surface of the supporting structure 130 away from the circuit board 110 are in contact with the heat sink 140.

In the present application, a support structure 130 is set at a preset position of the circuit board 110. Since the distance between the preset position and the position on the circuit board 110 corresponding to the center of gravity of the heat sink 140 is less than the first threshold, when the heat sink 140 is installed, the support structure 130 can support the heat sink 140, and when the heat sink 140 is in the installed state, the surface of the chip component 120 away from the circuit board 110 (that is, the upper surface of the chip component 120) and the surface of the support structure 130 away from the circuit board 110 (that is, the upper surface of the support structure 130) are in contact with the heat sink 140, that is, when the heat sink 140 is in the installed state, the height of the chip component 120 is equal to the height of the support structure 130. The heights of the support structure 130 are equal, so that the support structure 130 can share the pressure of the radiator 140 while supporting the radiator 140, reduce the stress of the chip assembly 120, avoid the situation where the deviation between the center position of the chip assembly 120 and the radiator 140 becomes larger and larger, and the chip assembly 120 is damaged due to excessive stress during the assembly process of the chip assembly 120 and in the case of vibration, thereby ensuring the reliability of the installation of the radiator 140.

In addition, when the heat sink 140 is in the installed state, the surface of the chip assembly 120 away from the circuit board 110 and the surface of the supporting structure 130 away from the circuit board 110 are in contact with the heat sink 140, that is, when the heat sink 140 is in the installed state, the height of the chip assembly 120 is equal to the height of the supporting structure 130, and it can also ensure that the chip assembly 120 is in contact with a large area of the bottom of the heat sink 140, thereby ensuring the effectiveness and uniformity of the contact between the chip assembly 120 and the heat sink 140, and then ensuring the reliability of the performance of the heat sink 140.

In a possible implementation, the preset position is a position on the circuit board 110 corresponding to the center of gravity of the heat sink 140, that is, the support structure 130 is arranged on the circuit board 110 at a position corresponding to the center of gravity of the heat sink 140. It should be noted that the center of gravity of the heat sink 140 is a position obtained through simulation analysis.

In another possible implementation manner, the preset position is a position close to the target position.

The embodiment of the present application provides a chip heat dissipation assembly, by setting a support structure 130 at a preset position of the circuit board 110, and the distance between the preset position and the position on the circuit board 110 corresponding to the center of gravity position of the heat sink 140 is less than a first threshold value, when the heat sink 140 is in an installed state, the surface of the chip assembly 120 away from the circuit board 110 and the surface of the support structure 130 away from the circuit board 110 are in contact with the heat sink 140, which can reduce the stress of the chip assembly 120, avoid the situation where the deviation between the center position of the chip assembly 120 and the heat sink 140 becomes larger and larger, and the chip assembly 120 is damaged due to excessive stress in the chip assembly 120 during the assembly process of the chip assembly 120 and in the case of vibration, thereby ensuring the heat sink 140 is installed. The reliability of the installation of the heat sink 140 and the ability to ensure that the chip assembly 120 contacts the bottom of the heat sink 140 over a large area ensure the effectiveness and uniformity of the contact between the chip assembly 120 and the heat sink 140, thereby ensuring the reliability of the performance of the heat sink 140.

In the embodiment of the present application, as shown in FIG1 , the support structure 130 may include a height-matching structure 131 and an elastic member 132, wherein the height-matching structure 131 is disposed at the preset position, and the elastic member 132 is disposed on the surface of the height-matching structure 131 away from the circuit board 110. In other words, the support structure 130 may be an elastic component, and the height of the support structure 130 may be adjusted by compressing the height of the elastic member 132, so that when the heat sink 140 is in the installed state, the height of the support structure 130 is equal to the height of the chip component 120. Since the support structure 130 includes the height-matching structure 131 and the elastic member 132, the height-matching structure 131 is disposed at the preset position of the circuit board 110, and the elastic member 132 is disposed on the surface of the height-matching structure 131 away from the circuit board 110, the installation of the support structure 130 is relatively easy and the controllability is also relatively strong.

In the present application, as shown in FIG1 , the chip assembly 120 may include a chip 121 and a heat-conducting medium 122, wherein the chip 121 is disposed on the circuit board 110, and the heat-conducting medium 122 is disposed on the surface of the chip 121 away from the circuit board 110. That is, the chip 121 contacts a large area of the bottom of the heat sink 140 through the heat-conducting medium 122, thereby achieving heat dissipation. Optionally, the thickness of the heat-conducting medium 122 may be compressed, but the thickness and uniformity of the compressed heat-conducting medium 122 must be within a specified range.

In one implementation, the difference between the height of the height-matching structure 131 and the height of the chip 121 may be less than the second threshold. Exemplarily, the height of the height-matching structure 131 may be approximately equal to the height of the chip 121. It should be noted that the present application does not specifically limit the numerical range of the second threshold, and the specific numerical value of the second threshold may be set according to actual conditions.

In the present application, the elastic coefficient of the elastic member 132 and the elastic coefficient of the thermal conductive medium 122 are In the case where the height of the height-matching structure 131 is approximately equal to the height of the chip 121, there may be a certain difference between the height of the chip 121 after welding and the height of the height-matching structure 131. Since the heat-conducting medium 122 has a deformation range requirement after compression, it is necessary to adjust the above difference through the elastic member 132 to achieve that when the heat sink 140 is in the installed state, the height of the chip assembly 120 is equal to the height of the supporting structure 130, to ensure that the heat-conducting medium 122 is evenly compressed, so that the heat dissipation of the chip 121 is effective and balanced.

In a possible implementation, when the heat sink 140 is not installed, the height of the chip assembly 120 may be different from the height of the support structure 130. That is, when the heat sink 140 is not installed, the chip assembly 120 and the support structure 130 are both in a compressible state and have a certain compression space, so that when the heat sink 140 is installed, the height of the support structure 130 is equal to the height of the chip assembly 120.

In one implementation, the support structure 130 may be a spring member, that is, during installation of the heat sink 140 , the spring member is compressed so that when the heat sink 140 is in an installed state, the height of the chip assembly 120 is equal to the height of the support structure 130 .

In the embodiment of the present application, as shown in FIG1 , the heat sink 140 may include a first elastic mounting member 141 and a second elastic mounting member 142, wherein the first elastic mounting member 141 is disposed at a position of the heat sink 140 close to the chip assembly 120, and the second elastic mounting member 142 is disposed at a position of the heat sink 140 close to the support structure 130. After the heat sink 140 is mounted above the chip assembly 120 and the support structure 130, the heat sink 140 may be fixed by the first elastic mounting member 141 disposed on the heat sink 140 close to the chip assembly 120 and the second elastic mounting member 142 disposed on the heat sink 140 close to the support structure 130.

In one implementation, the elastic coefficient of the first elastic mounting member 141 may be different from the elastic coefficient of the second elastic mounting member 142. After the chip assembly 120 and the supporting structure 130 are positioned above the chip assembly 120, the heights of the chip assembly 120 and the supporting structure 130 can be further adjusted by means of a first elastic mounting member 141 on the heat sink 140 close to the chip assembly 120 and a second elastic mounting member 142 on the heat sink 140 close to the supporting structure 130, so as to ultimately keep the heat sink 140 balanced to ensure good contact between the heat sink 140 and the chip assembly 120, to evenly dissipate heat from the chip assembly 120, and to avoid the risk of unilateral crushing of the chip assembly 120.

In addition, an embodiment of the present application also discloses an electronic device, including the chip heat dissipation assembly described in the above embodiment.

The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

A chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting structure and a heat sink, wherein:

The chip assembly is arranged on the circuit board;

The supporting structure is arranged at a preset position of the circuit board, and a distance between the preset position and a target position is less than a first threshold, wherein the target position is a position on the circuit board corresponding to the center of gravity of the heat sink;

The heat sink is installed above the chip assembly;

When the heat sink is in the installed state, the surface of the chip assembly away from the circuit board and the surface of the supporting structure away from the circuit board are in contact with the heat sink.
According to the chip heat dissipation assembly according to claim 1, wherein the supporting structure comprises a height-matching structure and an elastic member, the height-matching structure is arranged at the preset position, and the elastic member is arranged on the surface of the height-matching structure away from the circuit board.
The chip heat dissipation assembly according to claim 2, wherein the chip assembly comprises a chip and a heat-conducting medium, the chip is arranged on the circuit board, and the heat-conducting medium is arranged on the surface of the chip away from the circuit board.
The chip heat dissipation assembly according to claim 3, wherein the difference between the height of the height-matching structural member and the height of the chip is less than a second threshold.
The chip heat dissipation assembly according to claim 4, wherein the elastic coefficient of the elastic member is different from the elastic coefficient of the thermal conductive medium.
The chip heat dissipation assembly according to claim 1, wherein when the heat sink is in an unmounted state, a height of the chip assembly is different from a height of the supporting structure.
The chip heat dissipation assembly according to claim 1, wherein the supporting structure is a spring member.
The chip heat dissipation assembly according to any one of claims 1 to 7, wherein the heat dissipation The heat sink comprises a first elastic mounting member and a second elastic mounting member, wherein the first elastic mounting member is arranged at a position of the heat sink close to the chip assembly, and the second elastic mounting member is arranged at a position of the heat sink close to the supporting structure member.
The chip heat dissipation assembly according to claim 8, wherein the elastic coefficient of the first elastic mounting member is different from the elastic coefficient of the second elastic mounting member.
An electronic device comprising the chip heat dissipation assembly according to any one of claims 1 to 9.