WO2022156098A1 - Module d'égalisation de module de condensateur et procédé de dissipation de chaleur associé - Google Patents

Module d'égalisation de module de condensateur et procédé de dissipation de chaleur associé Download PDF

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Publication number
WO2022156098A1
WO2022156098A1 PCT/CN2021/094635 CN2021094635W WO2022156098A1 WO 2022156098 A1 WO2022156098 A1 WO 2022156098A1 CN 2021094635 W CN2021094635 W CN 2021094635W WO 2022156098 A1 WO2022156098 A1 WO 2022156098A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
equalization
module
equalization circuit
heat dissipation
Prior art date
Application number
PCT/CN2021/094635
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English (en)
Chinese (zh)
Inventor
万二平
何啸月
何灵
陈佳文
米海珍
傅博宇
乔志军
王恒
关祚洋
Original Assignee
宁波中车新能源科技有限公司
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Application filed by 宁波中车新能源科技有限公司 filed Critical 宁波中车新能源科技有限公司
Publication of WO2022156098A1 publication Critical patent/WO2022156098A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0013—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries acting upon several batteries simultaneously or sequentially
    • H02J7/0014—Circuits for equalisation of charge between batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the invention relates to the field of electronic device design, in particular to an equalization module of a capacitor module and a heat dissipation method thereof.
  • an equalization module is often configured to process the voltage of each capacitor unit, so as to improve the overall lifespan of the super capacitor unit and the module.
  • the balance module of the existing standard capacitor module usually adopts a single circuit board 10, which is fixed on the module cover plate 4 (used to cover the capacitor module box) with a fixing member, and the circuit board is used.
  • the protective cover is used for protection, and a certain gap is left between the circuit board 10, the module cover 4 and the circuit board protective cover.
  • the low thermal conductivity of the circuit board 10 results in a high temperature of the circuit board 10 (up to 85° C.), and the circuit board 10 is overheated, resulting in a decrease in the balancing ability and a shortened life of the circuit board 10, resulting in poor consistency of the supercapacitor cells. It further affects the life of supercapacitor cells and modules. At the same time, an excessively high circuit board temperature will also lead to changes in the impedance characteristics of the measuring components such as chip units arranged on the same circuit board, thus causing unpredictable effects on the equalization capability of the equalization module.
  • the present invention proposes an equalization module for a capacitor module, which includes a sequence of The provided heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, and the fixing member for connecting the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board, wherein:
  • the first equalization circuit board and the second equalization circuit board are arranged in parallel and spaced apart,
  • the first equalization circuit board is provided with an equalization circuit for equalizing the voltage of the module;
  • the second equalization circuit board is provided with a chip circuit for processing the voltage signal of the module.
  • a flexible heat conduction sheet is further arranged between the heat dissipation plate and the first equalization circuit board, and two contact surfaces of the flexible heat conduction sheet are respectively in contact with the heat dissipation plate and the first equalization circuit board.
  • a flexible pressure strip is further provided between the first equalization circuit board and the second equalization circuit board, so that the first equalization circuit board is attached to the flexible heat conduction sheet.
  • the fixing member includes a fixing bolt and a fixing nut.
  • the fixing nut fastens the second equalizing circuit board
  • the second equalizing circuit board compresses the flexible pressure strip
  • the first equalizing circuit board compresses the flexible heat conduction sheet.
  • a module cover plate for fixing the heat dissipation plate is also included, and the heat dissipation plate is arranged above the module cover plate.
  • circuit board protective cover with an accommodating cavity
  • the circuit board protective cover is detachably connected to the module cover, and the heat dissipation plate, the first equalization circuit board, and the second equalization circuit board are in in the accommodating cavity.
  • equalization circuit of the first equalization circuit board is electrically connected with the chip circuit of the second equalization circuit board through a connector.
  • the fixing member is provided with a through hole, and the equalization module is electrically connected with the external capacitor module through the through hole.
  • the present invention also provides a method for equalizing module heat dissipation of the capacitor module, comprising the steps of:
  • S1 The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal
  • the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat
  • the heat can also be transferred into the accommodating cavity of the circuit board shield through the gap between the first equalizing circuit board and the second equalizing circuit board.
  • the present invention at least contains the following beneficial effects:
  • An equalization module of a capacitor module and a heat dissipation method thereof by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board and the heat dissipation method
  • the flexible heat conduction sheet closely attached between the boards transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the effect of high temperature on the equalization ability of the circuit board.
  • the main "equalization circuit” that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit” including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board,
  • the first equalization circuit board and the second equalization circuit board are only in contact with the air except for the fixing member, and due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided;
  • the first equalizing circuit board By arranging a flexible pressure strip between the first equalizing circuit board and the second equalizing circuit board, when the fixing member is fastened, the first equalizing circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalizing circuit board can be Sufficient clearance remains between the circuit board and the second equalizing circuit board without causing hard damage to the circuit board.
  • 1 is a schematic structural diagram of an equalization module of a capacitor module
  • FIG. 2 is a schematic diagram of a capacitor module of an equalization module of a capacitor module
  • FIG. 3 is a schematic structural diagram of an equalization module of a standard capacitor module
  • FIG. 4 is a method step diagram of a method for dissipating heat from a balanced module of a capacitor module
  • 1-second equalization circuit board 2-first equalization circuit board, 3-heat dissipation plate, 4-module cover plate, 5-fixing piece, 6-through hole, 7-circuit board protective cover, 8-electrode interface, 9-electrode through hole, 10-circuit board.
  • the equalization module can better dissipate heat, and avoid the influence of high temperature working conditions on the equalization capability of the circuit board and the impedance characteristics of the measurement element.
  • the present invention proposes a capacitor.
  • the equalization module of the module includes a heat dissipation plate 3 (in this embodiment, an aluminum plate is used for the heat dissipation plate 3), a first equalization circuit board 2, and a second equalization circuit board 1, which are arranged in sequence.
  • the first equalization circuit board 2 and the second equalization circuit board 1 are arranged in parallel and spaced apart,
  • the first equalizing circuit board 2 is provided with an equalizing circuit for equalizing the voltage of the module;
  • the second equalizing circuit board 1 is provided with a chip circuit for processing the voltage signal of the module.
  • the reason why the present invention divides the equalization circuit board into two circuit boards is that the main heat dissipation of the equalization module comes from the resistance heating of the equalization circuit. Therefore, if the equalization circuit is placed on the first equalization circuit board 2, the first Except for the connection of the fixing member 5, the equalizing circuit board 2 and the second equalizing circuit board 1 are only in contact with the air, so based on the characteristics of poor air convection thermal conductivity, the chip circuits on the second equalizing circuit board 1 (including the chips unit and various detection elements) will not be affected by the high temperature of the first equalization circuit board 2 . Compared with the standard capacitor module (as shown in FIG. 3 ), which only uses a single circuit board 10 , it is undoubtedly avoided that the same circuit board is easily affected by the heat of the equalization circuit, so that the equalization module has better working accuracy and longer service life.
  • the present invention is provided with a flexible heat conduction sheet (the flexible heat conduction sheet in this embodiment) between the heat dissipation plate 3 and the first equalization circuit board 2
  • the thermal conductive silica gel is used), and the two contact surfaces of the flexible thermal conduction sheet are respectively in contact with the heat dissipation plate 3 and the first equalization circuit board 2 .
  • its overall shape is consistent with the board of the first equalization circuit 2, so as to ensure balanced contact with the contact surface of the first equalization circuit board 2 and avoid local heat accumulation in the circuit.
  • a flexible pressure strip is also arranged between the first equalization circuit board 2 and the second equalization circuit board 1 , so that the first equalization circuit board 2 is attached to the flexible heat conduction sheet.
  • two fixing parts 5 that is, fixing parts 5 at the four corners of the circuit board
  • a strip of flexible bead (not in contact with electronic components, and a material with low thermal conductivity is used) is respectively disposed between the two fixing members 5 on the corresponding side.
  • the through holes 6 are used to electrically connect the equalization module with the capacitor modules in the capacitor module through the through holes 6 .
  • the fixing member 5 includes a fixing bolt and a fixing nut.
  • the fixing nut fastens the second equalizing circuit board 1
  • the second equalizing circuit board 1 compresses the flexible pressure strip under the action of the force of the fixing nut, and the flexible pressure strip is also under the action of the force.
  • the first equalization circuit board 2 is forced to compress the flexible heat conduction sheet, so that the first equalization circuit board 2 fully contacts the flexible heat conduction sheet, thereby greatly improving the heat dissipation efficiency.
  • the heat dissipation plate 3 also includes a module cover plate 4 for fixing the heat dissipation plate 3, the heat dissipation plate 3 is arranged above the module cover plate 4, and the heat obtained by the heat dissipation plate 3 also finally passes through the module cover plate 4 (with the The area of air contact is large) is transmitted into the air.
  • circuit board protective cover 7 with an accommodating cavity
  • the circuit board protective cover 7 is detachably connected to the module cover 4, and the heat dissipation plate 3, the first equalizing circuit board 2, the The two equalizing circuit boards 1 are both located in the accommodating cavity.
  • the electrode 8 is electrically connected to the capacitor in the capacitor module by connecting the electrode through hole 9 at the corresponding position.
  • equalization circuit of the first equalization circuit board 2 and the chip circuit of the second equalization circuit board 1 are electrically connected through connectors, so as to realize the transmission of corresponding signals.
  • a method for dissipating heat for a balanced module of a capacitor module includes the steps:
  • S1 The chip circuit on the second equalization circuit board analyzes the voltage signal of the module and sends a control signal
  • the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat
  • the heat can also be transferred into the accommodating cavity of the circuit board protective cover through the interval between the first equalizing circuit board and the second equalizing circuit board.
  • the equalization module of the capacitor module and the heat dissipation method thereof by dividing the circuit board of the equalization module into a first equalization circuit board and a second equalization circuit board, using the first equalization circuit board
  • the flexible heat conduction sheet closely attached to the heat dissipation plate transfers the heat generated by the first equalization circuit board from the flexible heat conduction sheet to the module cover plate through the heat dissipation plate, thereby greatly improving the heat dissipation efficiency and avoiding the equalization ability of the circuit board. Under the influence of high temperature, the consistency of the super capacitor monomer is good.
  • the main “equalization circuit” that dissipates heat during the operation of the equalization module is placed on the first equalization circuit board, and the "chip circuit” including chips and measuring elements that are easily affected by high temperature is placed on the second equalization circuit board, and the first equalization circuit board is installed.
  • the contact between the equalization circuit board and the second equalization circuit board is only through the air except for the fixing member. Due to the poor thermal conductivity of air convection, the influence of the heat dissipation of the first equalization circuit board on the second equalization circuit board can be avoided.
  • the first equalization circuit board By arranging a flexible pressure strip between the first equalization circuit board and the second equalization circuit board, when the fixing member is fastened, the first equalization circuit board can be closely attached to the flexible heat conduction sheet, and at the same time, the first equalization circuit board and the Sufficient gaps are reserved between the second equalizing circuit boards without causing hard damage to the circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)

Abstract

La présente divulgation concerne un module d'égalisation d'un module de condensateur, comprenant une plaque de dissipation de chaleur (3), une première carte de circuit imprimé d'égalisation (2) et une deuxième carte de circuit imprimé d'égalisation (1) disposées en séquence, et un élément de fixation (5), la première carte de circuit imprimé d'égalisation (2) et la deuxième carte de circuit imprimé d'égalisation (1) étant agencées en parallèle à un intervalle ; la première carte de circuit imprimé d'égalisation (2) est pourvue d'un circuit d'égalisation utilisé pour égaliser une tension de module ; et la deuxième carte de circuit imprimé d'égalisation (1) est pourvue d'un circuit de puce utilisé pour traiter un signal de tension de module. La carte de circuit imprimé du module d'égalisation est divisée en la première carte de circuit imprimé d'égalisation (2) et la deuxième carte de circuit imprimé d'égalisation (1), et en utilisant une feuille de conduction thermique flexible fixée de manière serrée entre la première carte de circuit imprimé d'égalisation (2) et la plaque de dissipation de chaleur (3), la chaleur générée par la première carte de circuit d'égalisation (2) est transférée à une plaque de recouvrement de module (4) par la feuille de conduction thermique flexible à travers la plaque de dissipation de chaleur (3), ce qui permet d'améliorer considérablement l'efficacité de dissipation de chaleur.
PCT/CN2021/094635 2021-01-20 2021-05-19 Module d'égalisation de module de condensateur et procédé de dissipation de chaleur associé WO2022156098A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110072766.0 2021-01-20
CN202110072766.0A CN113013937A (zh) 2021-01-20 2021-01-20 一种电容模组的均衡模块及其散热方法

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WO2022156098A1 true WO2022156098A1 (fr) 2022-07-28

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN116884771A (zh) * 2023-09-05 2023-10-13 中宝电气有限公司 一种断路器电容取电组件

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WO2014199181A1 (fr) * 2013-06-14 2014-12-18 Goodwolfe Energy Limited Module de gestion de cellule, batterie et procédés correspondants
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US20130108894A1 (en) * 2011-11-02 2013-05-02 Yeon-Sung Jung Secondary battery
WO2014199181A1 (fr) * 2013-06-14 2014-12-18 Goodwolfe Energy Limited Module de gestion de cellule, batterie et procédés correspondants
CN204928300U (zh) * 2015-09-29 2015-12-30 东风商用车有限公司 一种锂电池均衡散热系统
CN205544487U (zh) * 2016-04-19 2016-08-31 深圳市道通智能航空技术有限公司 一种充电电池均衡装置及充电器
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116884771A (zh) * 2023-09-05 2023-10-13 中宝电气有限公司 一种断路器电容取电组件
CN116884771B (zh) * 2023-09-05 2023-12-01 中宝电气有限公司 一种断路器电容取电组件

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