CN113013937A - Equalizing module of capacitor module and heat dissipation method thereof - Google Patents
Equalizing module of capacitor module and heat dissipation method thereof Download PDFInfo
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- CN113013937A CN113013937A CN202110072766.0A CN202110072766A CN113013937A CN 113013937 A CN113013937 A CN 113013937A CN 202110072766 A CN202110072766 A CN 202110072766A CN 113013937 A CN113013937 A CN 113013937A
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- circuit board
- equalizing
- module
- equalizing circuit
- heat
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0013—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries acting upon several batteries simultaneously or sequentially
- H02J7/0014—Circuits for equalisation of charge between batteries
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The invention discloses a balance module of a capacitor module and a heat dissipation method thereof, and particularly relates to the field of electronic instrument design, which mainly comprises a heat dissipation plate, a first balance circuit board, a second balance circuit board and a fixing piece, wherein the heat dissipation plate, the first balance circuit board and the second balance circuit board are sequentially arranged, and the fixing piece comprises: the first equalizing circuit board and the second equalizing circuit board are arranged in parallel and at intervals; the first equalizing circuit board is provided with an equalizing circuit for equalizing the voltage of the module; and the second equalizing circuit board is provided with a chip circuit for processing module voltage signals. The circuit board of the balancing module is divided into the first balancing circuit board and the second balancing circuit board, the flexible heat conduction sheet tightly attached between the first balancing circuit board and the heat dissipation plate is utilized, heat generated by the first balancing circuit board is transferred to the module cover plate through the heat dissipation plate by the flexible heat conduction sheet, and therefore heat dissipation efficiency is greatly improved.
Description
Technical Field
The invention relates to the field of electronic instrument design, in particular to a balancing module of a capacitor module and a heat dissipation method thereof.
Background
In the use process of large capacitor modules such as super capacitors, the voltage of each capacitor unit in the capacitor module generally needs to be equalized, so that each capacitor unit can run with relatively synchronous efficiency, or the standby state is maintained with the same voltage, so that the voltage consistency when the capacitor modules are put into use again is ensured, and further, the phenomenon that the whole loss degree of the capacitor module is accelerated due to the fact that the running power of individual capacitor units is too high or too low is avoided. Therefore, in the existing capacitor module, an equalizing module is often configured to process the voltage of each capacitor unit, so as to improve the overall service life of the super capacitor unit and the module.
However, as shown in fig. 3, the conventional equalizing module of the standard capacitor module generally employs a single circuit board 10, which is fixed to a module cover plate 4 (for covering the capacitor module box) by a fixing member and protected by a circuit board protection cover, and a certain gap is left between the circuit board 10, the module cover plate 4 and the circuit board protection cover. When the circuit board 10 works, two ends of the resistor on the circuit board 10 are powered on and enter a balanced working mode, the outer surface of the resistor on the circuit board 10 transfers heat through air through a reserved gap, however, the temperature of the circuit board 10 is high (can reach 85 ℃) due to slow air convection heat dissipation and low thermal conductivity coefficient of the circuit board 10 made of plastic materials, the temperature of the circuit board 10 is too high, the balanced capacity of the circuit board 10 is reduced, the service life of the circuit board 10 is shortened, the consistency of the super capacitor is poor, and the service lives of the super capacitor and the module are further influenced. Meanwhile, too high temperature of the circuit board may also cause changes in impedance characteristics of the measurement components such as chip units disposed on the same circuit board, thereby causing unpredictable effects on the equalization capability of the equalization module.
Disclosure of Invention
In order to solve the problems, the balance module can better radiate heat and avoid the influence of a high-temperature working state on the balance capacity of a circuit board and the impedance characteristic of a measuring element, the invention provides the balance module of the capacitor module, which comprises a heat radiation plate, a first balance circuit board and a second balance circuit board which are sequentially arranged, and a fixing part for connecting the heat radiation plate, the first balance circuit board and the second balance circuit board, wherein:
the first equalizing circuit board and the second equalizing circuit board are arranged in parallel and at intervals,
the first equalizing circuit board is provided with an equalizing circuit for equalizing the voltage of the module; and the second equalizing circuit board is provided with a chip circuit for processing module voltage signals.
Furthermore, a flexible heat conduction sheet is further arranged between the heat dissipation plate and the first equalizing circuit board, and two contact surfaces of the flexible heat conduction sheet are respectively in contact with the heat dissipation plate and the first equalizing circuit board.
Furthermore, a flexible pressing strip is arranged between the first equalizing circuit board and the second equalizing circuit board, so that the first equalizing circuit board is attached to the flexible heat conduction sheet.
Further, the fixing piece comprises a fixing bolt and a fixing nut, when the fixing nut fastens the second balanced circuit board, the second balanced circuit board compresses the flexible pressing strip, and the first balanced circuit board compresses the flexible heat conduction sheet.
Further, still include the module apron that is used for fixing the heating panel, the heating panel sets up in module apron top.
Further, still including having the circuit board protection casing that holds the chamber, the circuit board protection casing can dismantle the connection in module apron is last, just heating panel, first balanced circuit board, second balanced circuit board are in hold the chamber.
Further, the equalization circuit of the first equalization circuit board is electrically connected with the chip circuit of the second equalization circuit board through a connector.
Furthermore, a through hole is formed in the fixing piece, and the balancing module is electrically connected with the external capacitor module through the through hole.
The invention also provides a heat dissipation method for the equalizing module of the capacitor module, which comprises the following steps:
s1: the chip circuit on the second equalizing circuit board analyzes the module voltage signal and sends a control signal;
s2: the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;
s3: the flexible heat conducting sheet transfers heat from the first equalizing circuit board to the heat dissipation plate;
s4: the heat dissipation plate transfers heat to the outside air through the module cover plate.
Further, the heat can be transferred to the accommodating cavity of the circuit board protective cover through the interval between the first equalizing circuit board and the second equalizing circuit board.
Compared with the prior art, the invention at least has the following beneficial effects:
(1) according to the equalizing module of the capacitor module and the heat dissipation method thereof, the circuit board of the equalizing module is divided into the first equalizing circuit board and the second equalizing circuit board, and the heat generated by the first equalizing circuit board is transferred to the module cover plate through the heat dissipation plate by the flexible heat conducting sheet by utilizing the flexible heat conducting sheet tightly attached between the first equalizing circuit board and the heat dissipation plate, so that the heat dissipation efficiency is greatly improved, and the equalizing capacity of the circuit board is prevented from being influenced by high temperature;
(2) the method comprises the following steps that a main body balance circuit radiating in the operation process of a balance module is arranged on a first balance circuit board, a chip circuit which is easily influenced by high temperature and comprises a chip and a measuring element is arranged on a second balance circuit board, the first balance circuit board and the second balance circuit board are only contacted through air except for a fixing piece, and the influence of the radiation of the first balance circuit board on the second balance circuit board can be avoided due to poor air convection heat conductivity;
(3) through set up flexible layering between first balanced circuit board and second balanced circuit board for when the mounting fastening, can make first balanced circuit board can closely laminate and flexible heat-conduction on the piece, make simultaneously and remain sufficient space between first balanced circuit board and the second balanced circuit board, and can not cause hard damage to the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of an equalizing module of a capacitor module;
FIG. 2 is a schematic diagram of a capacitor module of an equalizing module of the capacitor module;
FIG. 3 is a schematic structural diagram of an equalizing module of a standard capacitor module;
FIG. 4 is a method step diagram of a method for dissipating heat from an equalization module of a capacitive module;
description of reference numerals: 1-second balanced circuit board, 2-first balanced circuit board, 3-heat dissipation plate, 4-module cover plate, 5-fixing piece, 6-through hole, 7-circuit board protective cover, 8-electrode interface, 9-electrode through hole and 10-circuit board.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Example one
In order to solve the above problems, the equalizing module can better dissipate heat, and avoid the influence of a high-temperature working state on the equalizing capability of the circuit board and the impedance characteristics of the measuring element, as shown in fig. 1 and fig. 2, the invention provides an equalizing module of a capacitor module, which comprises a heat dissipation plate 3 (in this embodiment, the heat dissipation plate 3 adopts an aluminum plate), a first equalizing circuit board 2, a second equalizing circuit board 1, and a fixing member 5 for connecting the heat dissipation plate 3, the first equalizing circuit board 2, and the second equalizing circuit board 1, wherein:
the first equalizing circuit board 2 and the second equalizing circuit board 1 are arranged in parallel and at intervals,
the first equalizing circuit board 2 is provided with an equalizing circuit for equalizing the voltage of the module; and the second equalizing circuit board 1 is provided with a chip circuit for processing module voltage signals.
In the invention, the equalizing circuit board is divided into the two circuit boards, and the heat generated by the main heat dissipation of the equalizing module from the resistor of the equalizing circuit is considered, so that if the equalizing circuit is placed on the first equalizing circuit board 2, and the first equalizing circuit board 2 is connected with the second equalizing circuit board 1 except for the fixing part 5 and is only contacted by air, the chip circuit (comprising a chip unit and various detection elements) on the second equalizing circuit board 1 cannot be influenced by the high temperature of the first equalizing circuit board 2 based on the characteristic of poor air convection heat conductivity. Compared with the standard capacitor module (as shown in fig. 3) which only adopts a single circuit board 10, the influence of the same circuit board being easily heated by the equalizing circuit is undoubtedly avoided, so that the equalizing module has better working precision and longer service life.
In order to conduct the heat generated by the first equalizing circuit board 2 out through the heat dissipating plate 3 in time, a flexible heat conducting sheet (in this embodiment, the flexible heat conducting sheet is made of heat conducting silica gel) is arranged between the heat dissipating plate 3 and the first equalizing circuit board 2, and two contact surfaces of the flexible heat conducting sheet are respectively in contact with the heat dissipating plate 3 and the first equalizing circuit board 2. In the embodiment, the whole shape of the first equalizing circuit board 2 is consistent with that of the first equalizing circuit board 2, so that the equalizing contact of the first equalizing circuit board 2 and the contact surface of the first equalizing circuit board is ensured, and the local heat accumulation of the circuit is avoided.
Meanwhile, a flexible pressing strip is arranged between the first equalizing circuit board 2 and the second equalizing circuit board 1, so that the first equalizing circuit board 2 is attached to the flexible heat conduction sheet. Specifically, in this embodiment, two fixing members 5 (i.e., the fixing members 5 at the four corners of the circuit board) are respectively disposed on one side and the other side of the through hole 6 of the first equalizing circuit board 2, and a strip-shaped flexible pressing strip (not in contact with the electronic component, and meanwhile, a material with low thermal conductivity is used) is respectively disposed between the two fixing members 5 on the corresponding sides.
The through hole 6 is used for electrically connecting the equalizing module with the capacitor module in the capacitor module through the through hole 6.
And the fixing piece 5 comprises a fixing bolt and a fixing nut, when the fixing nut fastens the second balanced circuit board 1, the second balanced circuit board 1 compresses the flexible pressing strip under the action of the force of the fixing nut, and the flexible pressing strip also forces the first balanced circuit board 2 to compress the flexible heat conducting sheet under the action of the force, so that the first balanced circuit board 2 is in full contact with the flexible heat conducting sheet, and the heat dissipation efficiency is greatly improved.
It should be noted that the flexible heat conductive sheet and the flexible press strip are not shown in the drawings in the form of actual structures, but those skilled in the art can fully understand the detailed structures and installation manners thereof according to the description of the present embodiment. And all adopt flexible material, then when the mounting fastens first balanced circuit board and second balanced circuit board, avoid causing the damage to the circuit board through the flexible contact.
Meanwhile, the heat dissipation plate comprises a module cover plate 4 used for fixing the heat dissipation plate 3, the heat dissipation plate 3 is arranged above the module cover plate 4, and heat obtained by the heat dissipation plate 3 is finally conducted into air through the module cover plate 4 (the area in contact with the air is large).
Further, the circuit board protection cover 7 is provided with a containing cavity, the circuit board protection cover 7 is detachably connected to the module cover plate 4, and the heat dissipation plate 3, the first equalizing circuit board 2 and the second equalizing circuit board 1 are located in the containing cavity. And the electrode 8 is electrically connected with the capacitor in the capacitor module through an electrode through hole 9 connected with the corresponding position.
Further, the equalization circuit of the first equalization circuit board 2 and the chip circuit of the second equalization circuit board 1 are electrically connected through a connector so as to realize transmission of corresponding signals.
Example two
In order to better explain the technical content of the present invention, the present embodiment describes the technical solution in the form of steps, as shown in fig. 4, a method for dissipating heat of an equalizing module of a capacitor module includes the steps of:
s1: the chip circuit on the second equalizing circuit board analyzes the module voltage signal and sends a control signal;
s2: the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;
s3: the flexible heat conducting sheet transfers heat from the first equalizing circuit board to the heat dissipation plate;
s4: the heat dissipation plate transfers heat to the outside air through the module cover plate.
Further, the heat can be transferred to the accommodating cavity of the circuit board protective cover through the interval between the first equalizing circuit board and the second equalizing circuit board.
In summary, according to the equalizing module of the capacitor module and the heat dissipation method thereof, the circuit board of the equalizing module is divided into the first equalizing circuit board and the second equalizing circuit board, and the flexible heat conduction sheet tightly attached between the first equalizing circuit board and the heat dissipation plate is utilized to transfer heat generated by the first equalizing circuit board to the module cover plate through the heat dissipation plate by the flexible heat conduction sheet, so that the heat dissipation efficiency is greatly improved, the equalizing capability of the circuit board is prevented from being influenced by high temperature, and the consistency of the super capacitor monomers is good.
The balance circuit is characterized in that a main body balance circuit radiating in the operation process of the balance module is arranged on the first balance circuit board, a chip circuit which is easily influenced by high temperature and contains a chip and a measuring element is arranged on the second balance circuit board, the first balance circuit board and the second balance circuit board are only contacted through air except for a fixing piece, and the influence of the radiation of the first balance circuit board on the second balance circuit board can be avoided due to poor air convection heat conductivity.
Through set up flexible layering between first balanced circuit board and second balanced circuit board for when the mounting fastening, can make first balanced circuit board can closely laminate and flexible heat-conduction on the piece, make simultaneously and remain sufficient space between first balanced circuit board and the second balanced circuit board, and can not cause hard damage to the circuit board.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides an equalizing module of electric capacity module, its characterized in that, including heating panel, first equalizing circuit board, the equalizing circuit board three of second that set gradually, and be used for connecting heating panel, first equalizing circuit board, the equalizing circuit board three's of second mounting, wherein:
the first equalizing circuit board and the second equalizing circuit board are arranged in parallel and at intervals, and an equalizing circuit for equalizing the voltage of the module is arranged on the first equalizing circuit board; and the second equalizing circuit board is provided with a chip circuit for processing module voltage signals.
2. The equalizing module for a capacitor module according to claim 1, wherein a flexible thermally conductive sheet is further disposed between the heat spreader plate and the first equalizing circuit board, and two contact surfaces of the flexible thermally conductive sheet are in contact with the heat spreader plate and the first equalizing circuit board, respectively.
3. The equalizing module of claim 2, wherein a flexible bead is disposed between the first equalizing circuit board and the second equalizing circuit board to allow the first equalizing circuit board to be attached to the flexible heat conducting strip.
4. The equalizing module for a capacitive module of claim 3, wherein the securing member comprises a securing bolt and a securing nut, the second equalizing circuit board compressing the flexible bead and the first equalizing circuit board compressing the flexible thermally conductive sheet when the securing nut secures the second equalizing circuit board.
5. The equalizing module for a capacitor module of claim 1, further comprising a module cover plate for securing said heat sink plate, said heat sink plate being disposed above said module cover plate.
6. The equalizing module of claim 5, further comprising a circuit board shield having a receiving cavity, wherein the circuit board shield is removably attached to the module cover, and wherein the heat sink, the first equalizing circuit board, and the second equalizing circuit board are disposed in the receiving cavity.
7. The equalizing module of claim 1, wherein the equalizing circuit of the first equalizing circuit board is electrically connected to the chip circuit of the second equalizing circuit board by a connector.
8. The equalizing module for a capacitor module as in claim 1, wherein the fastening member has a through hole, and the equalizing module is electrically connected to the capacitor module of the capacitor module through the through hole.
9. The method for dissipating heat from an equalizing module of a capacitive module according to any one of claims 1 to 8, comprising the steps of:
s1: the chip circuit on the second equalizing circuit board analyzes the module voltage signal and sends a control signal;
s2: the equalizing circuit on the first equalizing circuit board equalizes the voltage of the module according to the control signal and releases heat;
s3: the flexible heat conducting sheet transfers heat from the first equalizing circuit board to the heat dissipation plate;
s4: the heat dissipation plate transfers heat to the outside air through the module cover plate.
10. The equalizing module heat dissipating method of claim 9, wherein the heat is further transferred to the receiving cavity of the circuit board shield through the space between the first equalizing circuit board and the second equalizing circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110072766.0A CN113013937A (en) | 2021-01-20 | 2021-01-20 | Equalizing module of capacitor module and heat dissipation method thereof |
| PCT/CN2021/094635 WO2022156098A1 (en) | 2021-01-20 | 2021-05-19 | Equalization module of capacitor module and heat dissipation method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110072766.0A CN113013937A (en) | 2021-01-20 | 2021-01-20 | Equalizing module of capacitor module and heat dissipation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113013937A true CN113013937A (en) | 2021-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110072766.0A Pending CN113013937A (en) | 2021-01-20 | 2021-01-20 | Equalizing module of capacitor module and heat dissipation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113013937A (en) |
| WO (1) | WO2022156098A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116884771B (en) * | 2023-09-05 | 2023-12-01 | 中宝电气有限公司 | Circuit breaker capacitor electricity taking assembly |
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| KR20180101990A (en) * | 2017-03-06 | 2018-09-14 | 주식회사 우진더블유티피 | Hybrid power supply unit for electric skateboard and electric skateboard using the unit |
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2021
- 2021-01-20 CN CN202110072766.0A patent/CN113013937A/en active Pending
- 2021-05-19 WO PCT/CN2021/094635 patent/WO2022156098A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110104521A1 (en) * | 2009-10-30 | 2011-05-05 | Sanyo Electric Co., Ltd. | Battery system and electric vehicle including the same |
| CN203056624U (en) * | 2012-12-21 | 2013-07-10 | 北京康拓科技有限公司 | Mining flame-proof type heavy-current active equalization lithium ion storage battery power supply |
| CN204928300U (en) * | 2015-09-29 | 2015-12-30 | 东风商用车有限公司 | Balanced cooling system of lithium cell |
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| Publication number | Publication date |
|---|---|
| WO2022156098A1 (en) | 2022-07-28 |
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