CN210725774U - Heat dissipation assembly and camera device with same - Google Patents
Heat dissipation assembly and camera device with same Download PDFInfo
- Publication number
- CN210725774U CN210725774U CN201920683022.0U CN201920683022U CN210725774U CN 210725774 U CN210725774 U CN 210725774U CN 201920683022 U CN201920683022 U CN 201920683022U CN 210725774 U CN210725774 U CN 210725774U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat conducting
- bottom plate
- conducting piece
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiation structure of electronic equipment, in particular to a heat radiation component and a camera device with the same, the heat radiation component comprises a bottom plate, a first heat conducting piece and a second heat conducting piece, the first heat conducting piece is clamped between the bottom plate and the second heat conducting piece, the first heat conducting piece has elasticity, when the bottom plate is connected with a shield, the bottom plate presses against the first heat conducting piece, the first heat conducting piece elastically deforms to elastically press the second heat conducting piece to be attached to the shield, heat generated by the electronic equipment is conducted to the bottom plate, because the first heat conducting piece has elasticity and is pressed between the bottom plate and the second heat conducting piece to generate elastic deformation, the heat on the bottom plate can be reliably conducted to the second heat conducting piece through the first heat conducting piece, the second heat conducting piece is reliably contacted with the shield under the elastic force action of the first heat conducting piece, therefore, heat generated by the operation of the electronic equipment can be reliably transferred to the shield and dissipated outwards.
Description
Technical Field
The utility model relates to an electronic equipment's heat radiation structure especially relates to a radiator unit and have its camera device.
Background
Because natural heat dissipation has advantages such as noiselessness, energy-concerving and environment-protective, still adopt natural heat dissipation mode to dispel the heat to the camera in some security protection and control class products at present. However, the heat dissipation effect of natural heat dissipation is limited, and especially when electronic equipment such as a video camera is installed outdoors, the electronic equipment is in a high-temperature environment with a temperature of 60 ℃ to 70 ℃ for a long time due to environmental reasons such as solar radiation, which puts high demands on the heat dissipation device of the electronic equipment.
The electronic devices disclosed in the related art are often mounted in a shield to prevent dust, moisture, sunlight, etc. in the environment from coming into contact with the electronic devices. However, the protective cover also hinders the process of radiating the electronic device outwards in the process of preventing dust, water and sun.
Therefore, the heat dissipation structure of the electronic device needs to be redesigned to meet the heat dissipation requirement.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a heat dissipation assembly and an image pickup apparatus having the same, in which the heat dissipation assembly can ensure reliable heat conduction between an electronic device and a shield, so that heat dissipated from the electronic device can be timely transferred to the shield and dissipated.
A heat dissipation assembly is applied between an electronic device and a shield and comprises a bottom plate, a first heat conduction piece and a second heat conduction piece, wherein the bottom plate is used for mounting the electronic device, the first heat conduction piece is clamped between the bottom plate and the second heat conduction piece, the first heat conduction piece is elastic, when the bottom plate is connected to the shield, the bottom plate presses against the first heat conduction piece, and the first heat conduction piece is elastically deformed to elastically press the second heat conduction piece to be attached to the shield.
In one embodiment, the bottom plate is provided with a connecting column, and the connecting column penetrates through the first heat-conducting member and is fixedly connected with the second heat-conducting member.
In one embodiment, the heat-conducting module further comprises a connecting piece, a counter bore is formed in the second heat-conducting piece, and the connecting column penetrates through the first heat-conducting piece and is fixedly connected with the connecting piece in the counter bore.
In one embodiment, the second heat conducting member is provided as a rigid heat conducting medium.
In one embodiment, the second heat conducting member is a metal block, a sheet metal member or a heat pipe.
In one embodiment, the first heat conducting member is provided as one or more of a heat conducting pad, a heat conducting foam and a heat conducting silicone grease.
In one embodiment, the bottom plate is fixed to the first heat-conducting member and the second heat-conducting member by bonding with a heat-conducting adhesive.
The utility model also provides a camera device, camera device includes guard shield and foretell radiator unit, electronic equipment is the camera.
In one embodiment, the heat sink assembly is positioned between the camera and the inner bottom surface of the shroud.
In one embodiment, a mounting chamber is formed in the shield, a boss for supporting the base plate is disposed in the mounting chamber, and the first and second heat-conducting members are disposed between the base plate and an inner bottom surface of the mounting chamber.
In the heat dissipation assembly, heat generated by electronic equipment in the working process is firstly conducted to the bottom plate, the first heat conducting piece has elasticity and is pressed between the bottom plate and the second heat conducting piece to generate elastic deformation, so that the heat on the bottom plate can be reliably conducted to the second heat conducting piece through the first heat conducting piece, and the second heat conducting piece is reliably contacted with the shield under the action of the elastic force of the first heat conducting piece, therefore, the heat generated by the electronic equipment can be reliably transmitted to the shield and dissipated outwards.
Drawings
FIG. 1 is a view of the overall installation structure of an electronic device, a shield and a heat dissipating assembly;
FIG. 2 is an exploded view of the unitary mounting structure of FIG. 1;
FIG. 3 is a top view of the integrated mounting structure of FIG. 1;
FIG. 4 is an overall view of the base plate when not secured to the boss on the shield;
fig. 5 is an overall view of the base plate after it is secured to the boss on the shroud.
Description of the reference numerals
1. An electronic device; 2. a shield; 20. installing a chamber; 21. a boss; 3. a base plate; 30. connecting columns; 4. a first heat-conducting member; 5. a second heat-conducting member; 50. a counter bore; 6. a connecting member; 7. and (5) fastening the screw.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the present application, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 5, the present invention firstly provides a heat dissipation assembly applied between an electronic device 1 and a shield 2, wherein: the protective cover 2 is used for separating the electronic device 1 from the external environment to achieve the protection functions of dust prevention, water prevention, sun protection and the like, and heat emitted outwards when the electronic device 1 works can be emitted outwards through the protective cover 2.
As shown in fig. 4 and 5, the heat dissipation device includes a bottom plate 3 for mounting the electronic device 1, a first heat conduction member 4 and a second heat conduction member 5, the first heat conduction member 4 is sandwiched between the bottom plate 3 and the second heat conduction member 5 and has a certain elastic deformation capability, when the bottom plate 3 is fixedly mounted on the shield 2, the first heat conduction member 4 is pressed between the bottom plate 3 and the second heat conduction member 5 and elastically deforms, so that the second heat conduction member 5 is elastically pressed against the attached shield 2 by the elastic force. Like this, the heat that electronic equipment 1 during operation outwards gived off at first conducts to bottom plate 3 on, then transmit to with bottom plate 3 direct contact and can heat conduction on first heat-conducting piece 4, because the elastic deformation of first heat-conducting piece 4, make bottom plate 3 and second heat-conducting piece 5 all reliably contact with first heat-conducting piece 4, the heat is reliably conducted to second heat-conducting piece 5 on, simultaneously, because second heat-conducting piece 5 elasticity supports and presses on guard shield 2, laminating between the two makes the heat of second heat-conducting piece 5 can effectively conduct to guard shield 2, so, from electronic equipment 1 to guard shield 2, the heat conduction is reliable, the conduction efficiency is high, be favorable to realizing the outside radiating process of electronic equipment 1 through guard shield 2.
In some embodiments, the first thermal conductive member 4 is provided as a combination of one or more of a thermal pad, a thermal foam, and a thermal silicone grease. The first heat-conducting member 4 may be a plate-like or block-like structure formed by prefabricating the above-mentioned materials and then installed between the bottom plate 3 and the second heat-conducting member 5, or may be formed by primarily connecting the second heat-conducting member 5 and the bottom plate 3, filling the first heat-conducting member, and then solidifying the first heat-conducting member and the second heat-conducting member. The second heat conducting member 5 may be a rigid heat conducting medium, such as a metal block, a sheet metal member, or a heat pipe, and may also be an elastic heat conducting medium similar to the first heat conducting member 4.
A mounting cavity 20 is formed in the shield 2, a boss 21 for supporting the base plate 3 is provided in the mounting cavity 20, and the base plate 3 and the boss 21 are connected by a fastening screw 7. When the heat sink is mounted, the edge of the bottom plate 3 is overlapped on the boss 21, and after the relative position of the bottom plate 3 is adjusted, the fastening screw 7 is screwed into the boss 21, so that the first heat-conducting member 4 and the second heat-conducting member 5 are arranged between the bottom plate 3 and the inner bottom surface of the mounting chamber 20. In order to allow the first heat-conductive member 4 to be elastically deformed between the base plate 3 and the second heat-conductive member 5, the distance between the base plate 3 and the inner bottom surface of the installation chamber 20 is smaller than the thickness of the first heat-conductive member 4, so that the base plate 3 is installed to the boss 21 while pressing the first heat-conductive member 4 to be elastically deformed.
The base plate 3 is provided with a connecting column 30 on a side facing the first heat-conducting member 4, which may be a structure directly formed on the base plate 3 or may be processed separately from the base plate 3 and then fixed to the base plate 3. The connecting column 30 can connect the bottom plate 3, the first heat-conducting member 4 and the second heat-conducting member 5 through the connecting member 6, so that the three members cannot be separated from each other in the stacking direction. In some embodiments, the second heat conduction member 5 is formed with a counterbore 50 on a side facing the inner bottom surface of the mounting chamber 20, the connection post 30 passes through the first heat conduction member 4 and protrudes into the counterbore 50, and the connection member 6 is completely disposed in the counterbore 50 and connected to the connection post 30 therein. So set up, can avoid connecting piece 6 to expose second heat-conducting member 5 and hinder the reliable contact heat conduction of second heat-conducting member 5 and installation cavity 20 inner bottom surface.
It will be understood that, although the connection of the connecting member 6 and the connecting post 30 connects the base plate 3, the first heat-conducting member 4 and the second heat-conducting member 5 through, this does not necessarily mean that the base plate 3, the first heat-conducting member 4 and the second heat-conducting member 5 are tightened, and this connection itself serves only to prevent the three members from being detached from each other between the installation and fixation of the base plate 3 to the boss 21. The first heat conduction member 4, the second heat conduction member 5 and the bottom plate 3 may be fixed by bonding with a heat conduction adhesive (such as a double-sided heat conduction adhesive), as long as the three are prevented from being separated from each other before the bottom plate 3 is fixed to the boss 21 of the shield 2.
Furthermore, the utility model provides a camera device, it includes guard shield 2, the radiator unit of aforementioned arbitrary one kind of embodiment and as the camera of electronic equipment 1 in guard shield 2, wherein, radiator unit sets up more than the interior diapire of guard shield 2, below the camera for heat conduction that the camera during operation produced is dispelled the heat to guard shield 2 on.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A heat dissipation assembly is applied between an electronic device (1) and a shield (2), and is characterized in that the heat dissipation assembly comprises a bottom plate (3) used for mounting the electronic device (1), a first heat conduction piece (4) and a second heat conduction piece (5), the first heat conduction piece (4) is clamped between the bottom plate (3) and the second heat conduction piece (5), the first heat conduction piece (4) has elasticity, when the bottom plate (3) is connected to the shield (2), the bottom plate (3) presses the first heat conduction piece (4), and the first heat conduction piece (4) elastically deforms to elastically press the second heat conduction piece (5) to be attached to the shield (2).
2. The heat dissipating assembly according to claim 1, characterized in that the bottom plate (3) is provided with a connecting column (30) which passes through the first heat conducting member (4) and is fixedly connected to the second heat conducting member (5).
3. The heat dissipating assembly according to claim 2, further comprising a connecting member (6), wherein the second heat conducting member (5) is provided with a counterbore (50), and the connecting column (30) passes through the first heat conducting member (4) and is fixedly connected with the connecting member (6) in the counterbore (50).
4. The heat sink assembly according to claim 1, wherein the second heat conducting member (5) is provided as a rigid heat conducting medium.
5. The heat dissipating assembly according to claim 4, characterized in that the second heat conducting member (5) is a metal block, a sheet metal member or a heat pipe.
6. The heat sink assembly according to claim 1, wherein the first heat conducting member (4) is provided as a combination of one or more of a heat conducting pad, a heat conducting foam, and a heat conducting silicone grease.
7. The heat sink assembly according to claim 1, wherein the base plate (3) is fixed to the first and second heat-conducting members (4, 5) by a heat-conducting adhesive.
8. An image pick-up device, characterized in that the image pick-up device comprises a cover (2) and a heat sink assembly according to any one of claims 1-7, and the electronic device (1) is a camera.
9. The camera device according to claim 8, characterized in that the heat sink assembly is located between the camera and the inner bottom surface of the shield (2).
10. The imaging apparatus according to claim 8, wherein a mounting chamber (20) is formed in the cover (2), a boss (21) for supporting the base plate (3) is provided in the mounting chamber (20), and the first heat-conducting member (4) and the second heat-conducting member (5) are provided between the base plate (3) and an inner bottom surface of the mounting chamber (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920683022.0U CN210725774U (en) | 2019-05-14 | 2019-05-14 | Heat dissipation assembly and camera device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920683022.0U CN210725774U (en) | 2019-05-14 | 2019-05-14 | Heat dissipation assembly and camera device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725774U true CN210725774U (en) | 2020-06-09 |
Family
ID=70931002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920683022.0U Active CN210725774U (en) | 2019-05-14 | 2019-05-14 | Heat dissipation assembly and camera device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210725774U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911111A (en) * | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115536254A (en) * | 2022-09-21 | 2022-12-30 | 华能新能源股份有限公司 | Heating annealing device |
-
2019
- 2019-05-14 CN CN201920683022.0U patent/CN210725774U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911111A (en) * | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112911111B (en) * | 2021-01-21 | 2022-09-02 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115536254A (en) * | 2022-09-21 | 2022-12-30 | 华能新能源股份有限公司 | Heating annealing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5324773B2 (en) | Circuit module and manufacturing method thereof | |
| US10444557B2 (en) | Display module and display device | |
| US5307236A (en) | Heatsink for contact with multiple electronic components mounted on a circuit board | |
| US8804336B2 (en) | Heat disspating apparatus and electronic device | |
| EP2770530A2 (en) | Electronic component unit and fixing structure | |
| CN210725774U (en) | Heat dissipation assembly and camera device with same | |
| JPH10308484A (en) | Heat radiation structure of electronic apparatus | |
| JP2006278941A (en) | Heat sink device and plug-in unit | |
| JP2000502843A (en) | Control device comprising at least two housing parts | |
| US11658096B2 (en) | Floating heat sink and elastic support thereof | |
| CN213989165U (en) | Radar device, radar mounting device, and mobile device | |
| WO2014155977A1 (en) | Heat dissipating sheet and heat dissipating structural body using same | |
| CN112802807A (en) | Chip heat dissipation device and manufacturing method | |
| CN208940087U (en) | Radiator and video camera | |
| US20120085527A1 (en) | Heat spreader with mechanically secured heat coupling element | |
| CN211210276U (en) | Heat radiation structure | |
| CN211403364U (en) | Heat dissipation device for electrical equipment | |
| CN209283643U (en) | A kind of radiator structure of underwater electronic compartment | |
| CN111479453A (en) | Copper-aluminum composite material heat dissipation structure for high-power-consumption single plate and mounting method thereof | |
| CN219459557U (en) | Movement and display device | |
| CN218332516U (en) | Heat dissipation device with anti-loosening structure | |
| CN212647406U (en) | Gasket type heat dissipation structure and electronic equipment | |
| CN216491688U (en) | Semiconductor photoelectronic device with good heat dissipation performance | |
| CN214477408U (en) | Heat radiation structure of power module | |
| CN114641177B (en) | Electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |