CN220895496U - Semiconductor device with reverse pins - Google Patents
Semiconductor device with reverse pins Download PDFInfo
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- CN220895496U CN220895496U CN202322300733.4U CN202322300733U CN220895496U CN 220895496 U CN220895496 U CN 220895496U CN 202322300733 U CN202322300733 U CN 202322300733U CN 220895496 U CN220895496 U CN 220895496U
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- pin
- semiconductor device
- hole
- chip
- pin assembly
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000005452 bending Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 38
- 238000010586 diagram Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor heat dissipation, in particular to a pin-reversed semiconductor device, which comprises a plastic shell, wherein the plastic shell is provided with a mounting surface, the mounting surface is provided with a groove, a first pin assembly and a second pin assembly which are not coplanar are arranged in the plastic shell, the second pin is provided with a bending structure, the bending structure bends towards the mounting surface, the first pin assembly faces towards one end far away from the mounting surface, a heat dissipation part is connected onto the first pin assembly and is used for transferring heat of the pin assembly, one part of the heat dissipation part is positioned outside the groove, and the original semiconductor device is reversely designed so that pins of the semiconductor device face upwards.
Description
Technical Field
The utility model relates to the technical field of semiconductor devices, in particular to a semiconductor device with reverse pins.
Background
For the structure of semiconductor products, the current common implementation manner is to weld the chip and the bottom plate frame, the chip and the metal linking strip, and the metal linking strip and the bottom plate frame by using a bottom plate metal frame, a plurality of chips and a plurality of metal linking strips connected to form a circuit, and a welding connector (such as a soldering lug or soldering paste), so as to form a welding assembly, and then, the final semiconductor device product is formed by using the processes of compression molding and the like.
In the conventional semiconductor device shown in fig. 9, the conventional first pins 100 and the conventional second pins 101 are connected to the circuit board 6, and the chip 4 is faced upward, and the bottom of the conventional semiconductor device product is exposed for heat dissipation. Finally, since the semiconductor device product itself is small, it does not have much space on the circuit board to mount additional heat sinks.
With the development of higher density, higher power and miniaturization of semiconductor products, the higher power makes the heat dissipation problem of the products more serious while bringing convenience to our lives. The heat is mostly dissipated by the bottom of the device, the bottom of the device is close to the circuit board, so that a heat dissipation part for helping heat dissipation is difficult to install on the device, the heat dissipation requirement of a high-power device is far insufficient, a large amount of heat generated during the operation of the device is difficult to effectively dissipate by only relying on the bottom of the device, the heat is continuously accumulated in the device, the aging and cracking of the device can be accelerated, the electrical failure of the device is caused, and the chip is seriously and directly burnt out at the excessive temperature.
Disclosure of utility model
The utility model aims at: the semiconductor device with reverse pins is provided for solving the problems that in the prior art, the heat of a chip is mostly dissipated by the bottom of the device, the bottom is close to a circuit board, the space is limited, and a heat dissipation part for helping heat dissipation is difficult to install on the circuit board.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a reverse semiconductor device of pin, includes the plastic shell, the plastic shell is equipped with the installation face, the groove has been seted up to the installation face, be equipped with non-coplanar first pin subassembly and second pin subassembly in the plastic shell, the second pin subassembly exists the structure of bending, just the structure of bending orientation the installation face is buckled, first pin subassembly orientation is kept away from the one end of installation face, be connected with the radiating part on the first pin subassembly, the radiating part is used for the transmission the heat of pin subassembly, a part of radiating part is located outside the groove.
It should be noted that the mounting surface of the plastic housing mentioned in this patent actually means that the plastic housing is attached to one surface of the circuit board as the mounting surface of the plastic housing after the semiconductor device is attached to the circuit board.
The utility model relates to a semiconductor device with reverse pins, which is characterized in that a first pin assembly and a second pin assembly which are not coplanar are arranged in the semiconductor device, the directions of the first pin assembly and the second pin assembly are opposite, and as a bending structure exists in the second pin assembly, the bending structure bends towards a mounting surface, namely, compared with the original semiconductor device, the first pin assembly and the second pin assembly of the semiconductor device are reversely arranged, so that a heating end of the semiconductor device is positioned at the top of the semiconductor device, the space between the pin assembly and a plastic shell mounting surface in the semiconductor device is further increased, and other heat dissipation components are arranged on the heating end for dissipating heat, so that heat in the pin assembly is transferred to the heat dissipation element and then is transferred to the outside from the heat dissipation element. The pin assembly of the original semiconductor device is reversely designed so that the pins of the pin assembly face upwards, and the advantage of the pin assembly is that the heat dissipation space and efficiency of the top of the semiconductor device can be increased, so that the performance and service life of the pin assembly are improved.
As a preferred embodiment of the present utility model, the first lead assembly includes a first lead portion and a bottom plate frame connected to the first lead portion, where the bottom plate frame is located on an upper end surface of the chip and the bottom plate frame is connected to the upper end surface of the chip, and is used for absorbing heat of the chip.
As a preferable scheme of the utility model, the second pin assembly comprises a link bar and a second pin part connected with the link bar, one end of the link bar is connected with the lower end face of the chip, the other end of the link bar is connected with the second pin part, and the second pin part is in contact with the external environment.
As a preferred embodiment of the present utility model, the chassis frame of the first pin assembly is connected to a heat sink for conducting heat.
As a preferable scheme of the utility model, the heat dissipation part comprises transverse connecting rods, the transverse connecting rods are arranged on two sides of the bottom plate frame, at least two vertical connecting rods are symmetrically arranged above the transverse connecting rods, a top cover is arranged above the vertical connecting rods and used for absorbing heat of the bottom plate frame, and a convex part is arranged on one surface, far away from the chip, of the top cover of the heat dissipation part.
As a preferable scheme of the utility model, a plastic shell is arranged outside the pin assembly, a first through hole, a second through hole and a third through hole are respectively arranged at two ends of the plastic shell, wherein the first through hole and the second through hole are coplanar, the third through hole is opposite to the first through hole and the second through hole, the first through hole and the second through hole are used for placing a first pin part, and the third through hole is used for placing a second pin part.
As a preferable scheme of the utility model, the convex part on the heat dissipation part is matched with the groove at the upper end of the plastic shell.
As a preferable scheme of the utility model, the heat dissipation part body is a copper structural part, so that the heat conduction is faster.
As a preferred aspect of the present utility model, the protruding member is coplanar with the mounting surface.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
in the application, the surface of the mounting surface is the bottom of the semiconductor device, and the surface of the second pin 2 is the top of the semiconductor device.
1. The utility model relates to a semiconductor device with reverse pins, which is characterized in that the pins of the semiconductor device are reversely arranged, so that a heating end connected with the pins is positioned at the top of the semiconductor device, the space between a pin assembly and a plastic shell mounting surface in the semiconductor device is further increased, and other heat dissipation components can be arranged on the heating end of the pin assembly for heat dissipation, so that heat in the pin assembly is transferred to a heat dissipation piece and then is transferred to the outside from the heat dissipation piece. The semiconductor device has the advantages that the heat dissipation at the top of the semiconductor device has enough space, the heat dissipation effect is good, namely, the original semiconductor device is reversely designed, so that the pins of the semiconductor device face upwards, and the heat dissipation space and efficiency at the top of the semiconductor device can be increased, so that the performance and service life of the semiconductor device are improved.
2. The utility model relates to a semiconductor device with reverse pins, and because the device is in a structure with the pins upwards, a chip of the device is positioned at the top of the semiconductor device, namely, the chip is positioned at one end far away from a mounting surface of a plastic shell, and at the moment, a main heating end is positioned at the top, so that a better heat dissipation effect can be achieved through an external heat dissipation device.
Drawings
FIG. 1 is a schematic diagram of a reverse pin semiconductor device and circuit board connection structure according to the present utility model;
Fig. 2 is a schematic diagram showing an internal structure of a semiconductor device with inverted leads according to the present utility model;
FIG. 3 is a schematic diagram of a second pin assembly of the reverse pin semiconductor device of the present utility model;
FIG. 4 is a schematic diagram of a first pin assembly of the reverse pin semiconductor device of the present utility model;
FIG. 5 is a schematic diagram of a heat spreader of a semiconductor device with inverted leads according to the present utility model;
FIG. 6 is an elevation view of a plastic housing of the semiconductor device shown in the present utility model with pins reversed;
FIG. 7 is a schematic diagram of a plastic housing of a semiconductor device with inverted leads according to the present utility model;
FIG. 8 is a schematic diagram of a pin-reversed semiconductor device of the present utility model connected to a circuit board;
fig. 9 is a schematic diagram of the structure of an original semiconductor device in the background of the utility model.
Icon: 1-a plastic housing; 11-a first through hole; 12-a second through hole; 13-a third through hole; 14-groove; 15-mounting surface; 2-a first pin assembly; 21-a floor frame; 22-first pin portion; 3-a second pin assembly; 31-a link bar; 32-a second lead portion; 4-chip; 5-a heat sink; 51-a vertical connecting rod; 52-a male member; 53-top cap; 54-transverse connecting rods; 6-a circuit board; 100-a conventional second pin; 101-conventional first pins.
Detailed Description
The present utility model will be described in detail with reference to the accompanying drawings.
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Example 1
The conventional first pins 101 and the conventional second pins 100 are in contact with the external environment as shown in fig. 9, and the chip 4 is faced upward, and the bottom of the conventional semiconductor device product is exposed for heat dissipation, so that when the semiconductor device is applied to a circuit, the bottom of the semiconductor device is close to the circuit board 6 after the pins are connected, and the bottom of the semiconductor device is very close to the circuit board 6, which hinders heat flow and dissipation. Finally, since the semiconductor device product itself is small, it does not have much space on the circuit board 6 to mount additional heat sinks.
1-2 And 8, wherein the semiconductor device comprises a plastic housing 1, the plastic housing 1 is provided with a mounting surface 15, the plastic housing 1 is mounted with an external radiating end through the mounting surface 15, the mounting surface 15 is provided with a groove 14, the radiating piece 5 can directly contact with the external radiating end through the groove 14 by providing the groove 14 on the plastic housing 1, a first pin component 2 and a second pin component 3 which are not coplanar are arranged inside the plastic housing 1, the first pin component 2 is arranged towards one end far away from the mounting surface 15, the second pin component 3 is arranged towards one end close to the mounting surface 15, and the bending part of the bending part faces the mounting surface 15 due to the bending part of the second pin component 3, so that the bending part faces the first pin component 2 oppositely;
Further, the heat dissipation element 5 is connected to the upper end of the first pin assembly 2, and is configured to absorb heat on the first pin assembly 2 and transfer the heat to an external heat dissipation end for heat dissipation.
It should be noted that the mounting surface 15 of the plastic housing 1 mentioned in this patent actually refers to the surface of the plastic housing 1 that is attached to the circuit board 6.
The chip 4 is further arranged between the first pin assembly 2 and the second pin assembly 3, so that two end faces of the chip 4 are respectively connected with the first pin assembly 2 and the second pin assembly 3, and heat can be transferred to the first pin assembly 2 and the second pin assembly 3 when the chip 4 works and heats, so that heat multi-path transfer is realized, and heat dissipation efficiency is improved, as shown in fig. 2.
The first pin assembly 2 includes a bottom plate frame 21, one end of the bottom plate frame 21 is connected with a first pin portion 22, and the other end is connected with the upper end surface of the chip 4, so that heat generated by the chip 4 during operation is transferred to the bottom plate frame 21, and then transferred from the bottom plate frame 21 to the first pin portion 22 for heat dissipation;
Alternatively, since the semiconductor device is disposed in the reverse direction, the bottom plate frame 21 is located at the upper end face of the semiconductor device.
The first lead assembly 2 includes a first lead portion 22 and a base frame 21, and the base frame 21 is connected to one surface of the chip 4, as shown in fig. 4.
The second pin assembly 3 is composed of a link bar 31 and a second pin portion 32, one end of the link bar 31 is connected with the chip 4, the other end is connected with the second pin portion 32, one end of the second pin portion 32 is connected with the link bar 31, and the other end is in contact with the outside for transferring heat, as shown in fig. 3.
The bottom plate frame 21 of the second lead assembly 3 is connected to the heat sink 5, and the heat conduction is achieved through the heat sink 5 by the connection between the bottom plate frame 21 and the heat sink 5, as shown in fig. 2.
The heat dissipation element 5 includes transverse connection rods 54, the transverse connection rods 54 are disposed on two sides of the bottom plate frame 21, at least two vertical connection rods 51 are symmetrically disposed above the transverse connection rods 54, a top cover 53 is disposed above the vertical connection rods 51 and is used for absorbing heat of the bottom plate frame 21, and a protruding element 52 is disposed on a surface, far from the chip 4, of the top cover 53 of the heat dissipation element 5 and is used for transferring heat, as shown in fig. 5.
The pin assembly is provided with a plastic housing 1 outside, and the two ends of the plastic housing 1 are provided with a first through hole 11, a second through hole 12 and a third through hole 13 for placing the first pin portion 22 and the second pin portion 32, as shown in fig. 1 and fig. 6-7.
The plastic housing 1 outside the pin assembly wraps the portion provided with the chip 4, the side of the plastic housing 1 away from the chip 4 is provided with a groove 14, and the groove 14 is located on the mounting surface 15, so that the protruding part 52 of the heat dissipation part 5 is also located at the end away from the chip 4, as shown in fig. 2.
The convex piece 52 on the heat dissipation piece 5 is matched with the groove 14 at the upper end of the plastic shell.
The protruding member 52 is coplanar with the mounting surface 15, so that the protruding member 52 can be contacted with the external environment to realize heat dissipation.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (9)
1. The utility model provides a reverse semiconductor device of pin, its characterized in that, includes plastic shell (1), plastic shell (1) is equipped with installation face (15), groove (14) have been seted up to installation face (15), be equipped with first pin subassembly (2) and second pin subassembly (3) of non-coplanarity in plastic shell (1), second pin subassembly (3) have the structure of bending, just the structure of bending orientation installation face (15) is buckled, first pin subassembly (2) are kept away from towards the one end of installation face (15), be connected with radiator (5) on first pin subassembly (2), radiator (5) are used for the transmission the heat of pin subassembly, radiator (5) a part are located outside groove (14).
2. A semiconductor device with reverse pins according to claim 1, characterized in that a chip (4) is arranged between the first pin assembly (2) and the second pin assembly (3).
3. A semiconductor device according to claim 2, wherein the first lead assembly (2) comprises a first lead portion (22) and a bottom plate frame (21) connected to the first lead portion (22), the bottom plate frame (21) being located on an upper end face of the chip (4) and the bottom plate frame (21) being connected to the upper end face of the chip (4) for absorbing heat of the chip (4).
4. A semiconductor device according to claim 2, wherein the second pin assembly (3) comprises a link bar (31) and a second pin portion (32) connected to the link bar (31), and one end of the link bar (31) is connected to the lower end surface of the chip (4), and the other end is connected to the second pin portion (32).
5. A reverse-leaded semiconductor device according to claim 4, wherein the chassis frame (21) of the first lead assembly (2) is connected to the heat sink (5).
6. The semiconductor device with reverse pins according to claim 5, wherein the heat sink (5) comprises transverse connection rods (54), the transverse connection rods (54) are arranged on two sides of the bottom plate frame (21), at least two vertical connection rods (51) are symmetrically arranged above the transverse connection rods (54), a top cover (53) is arranged above the vertical connection rods (51) and used for absorbing heat of the bottom plate frame (21), and a convex part (52) is arranged on one surface, far away from the chip (4), of the top cover (53) of the heat sink (5).
7. The semiconductor device with reverse pins according to claim 4, wherein the pin assembly is externally provided with a plastic housing (1), two ends of the plastic housing (1) are respectively provided with a first through hole (11), a second through hole (12) and a third through hole (13), wherein the first through hole (11) and the second through hole (12) are coplanar, the third through hole (13) is opposite to the first through hole (11) and the second through hole (12), the first through hole (11) and the second through hole (12) are used for placing a first pin part (22), and the third through hole (13) is used for placing a second pin part (32).
8. A semiconductor device with reversed pins according to claim 6, characterized in that the protruding part (52) of the heat sink (5) is adapted to the groove (14) in the upper end of the plastic housing.
9. A reverse-leaded semiconductor device according to claim 6, wherein the heat sink (5) is a copper structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322300733.4U CN220895496U (en) | 2023-08-25 | 2023-08-25 | Semiconductor device with reverse pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322300733.4U CN220895496U (en) | 2023-08-25 | 2023-08-25 | Semiconductor device with reverse pins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220895496U true CN220895496U (en) | 2024-05-03 |
Family
ID=90877111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322300733.4U Active CN220895496U (en) | 2023-08-25 | 2023-08-25 | Semiconductor device with reverse pins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220895496U (en) |
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2023
- 2023-08-25 CN CN202322300733.4U patent/CN220895496U/en active Active
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