CN220526898U - Power device and electronic equipment - Google Patents

Abstract

The utility model discloses a power device and electronic equipment, wherein the power device comprises a substrate, a packaging part and a pin structure, at least part of the substrate is made of conductive materials, the substrate is provided with a bonding surface and a radiating surface which are oppositely arranged along the thickness direction of the substrate, the bonding surface is provided with a wafer structure, the packaging part is packaged outside the substrate and the wafer structure, the pin structure comprises a plurality of pins which are circumferentially distributed along the substrate, one end of at least one pin of the plurality of pins is electrically connected to the bonding surface, the other end of the at least one pin extends towards the direction away from the radiating surface in the thickness direction of the substrate and penetrates through the packaging part, and the packaging part is arranged in a locally hollowed-out way on one side corresponding to the radiating surface so as to expose the radiating surface. Through exposing the radiating surface at least partially in the fretwork part of encapsulation portion to make power device's heat can be conducted to outside radiator fast through the radiating surface, improved radiating efficiency, and need not additionally to increase the heat conduction glue and also can realize quick heat dissipation, greatly reduced the cost.

Description

Power device and electronic equipment

Technical Field

The utility model relates to the technical field of power devices, in particular to a power device and electronic equipment.

Background

Power devices are basic components in the power electronics field, and in order to adapt to different circuit and process requirements, power devices of different package structure types are produced in the industry. The common packaging structure is a PIN (PIN) packaging structure at the bottom of the power device, the power device is welded on the circuit board and then radiates heat through the opposite side of the bottom, and the power device is packaged in a plastic packaging mode so as to seal and protect other components in the power device.

However, the plastic packaging method not only results in poor overall heat dissipation efficiency of the power device, but also requires adding heat-conducting glue to improve the heat dissipation efficiency of the power device, resulting in high cost.

Disclosure of Invention

The utility model mainly aims to provide a power device and electronic equipment, and aims to solve the problems of poor heat dissipation effect and high cost of a packaging structure of a PIN at the bottom of the power device, so that the power device has good heat dissipation performance and low cost.

In order to achieve the above object, the present utility model provides a power device, including:

the substrate is at least partially made of conductive materials, and is provided with a bonding surface and a radiating surface which are oppositely arranged along the thickness direction of the substrate, and a wafer structure is arranged on the bonding surface;

a package part, which is packaged outside the substrate and the wafer structure;

the pin structure comprises a plurality of pins distributed along the circumferential direction of the substrate, one end of at least one pin of the plurality of pins is electrically connected to the bonding surface, and the other end extends away from the heat dissipation surface in the thickness direction of the substrate and penetrates through the packaging part;

the packaging part is arranged on one side surface of the packaging part, which corresponds to the radiating surface, in a partially hollowed-out manner so as to expose the radiating surface.

Optionally, along the laminating face is directional in the direction of heat dissipation face, the base plate is including base plate body and the heat dissipation layer that sets gradually, the heat dissipation layer is dorsad the side of base plate body forms the heat dissipation face, the base plate body is dorsad the side of heat dissipation layer forms the laminating face.

Optionally, a conductive copper layer is disposed on a side surface of the substrate body facing away from the heat dissipation layer, and the side surface of the conductive copper layer facing away from the substrate body forms the bonding surface; and/or the number of the groups of groups,

an insulating layer is further arranged between the substrate body and the heat dissipation layer, and the heat dissipation layer is a heat conduction copper layer.

Optionally, at least one pin of the plurality of pins includes:

the connecting piece is fixed to the joint surface at one end part, and a through hole is formed in the end surface of the other end part of the connecting piece in a penetrating manner; the method comprises the steps of,

and one end of the terminal is inserted into the through hole, and the other end of the terminal penetrates through the packaging part.

Optionally, the plurality of pins include a plurality of signal pins and a plurality of power pins, and the plurality of power pins are all disposed on the same side of the substrate.

Optionally, the substrate has a first side and a second side that are disposed opposite to each other along a circumferential direction of the substrate, the plurality of signal pins are disposed on the first side, and the plurality of power pins are disposed on the second side;

the plurality of pins further comprises a plurality of empty pins, and the empty pins are arranged on one of the first side and the second side, which is smaller in number of pins.

Optionally, the power device further includes a temperature sensor, where the temperature sensor is disposed on the bonding surface, and the temperature sensor is disposed at intervals with the wafer structure and is electrically connected to the corresponding pin;

the encapsulation is encapsulated outside the temperature sensor.

Optionally, the plurality of pins includes a plurality of signal pins and a plurality of power pins;

the power device comprises at least two power tubes, and each power tube comprises at least one wafer structure, at least one signal pin and at least one power pin.

Optionally, each of the die structures includes a plurality of dies electrically connected to each other.

The utility model also provides electronic equipment comprising the power device.

According to the technical scheme, the radiating surface is at least partially exposed in the hollowed-out part of the packaging part, so that the radiating surface can be directly contacted with the radiator of the electronic equipment, heat generated in the power device in the working process can be directly and rapidly conducted to the radiator through the radiating surface, the radiating efficiency of the power device adopting the bottom PIN packaging structure is greatly improved, and the rapid radiating of the power device can be realized without additionally adding heat conducting materials such as heat conducting glue, so that the cost is greatly reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of an embodiment of a power device according to the present utility model;

fig. 2 is a schematic perspective view of the pin and die structure of fig. 1.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Power device	311	Connecting piece
1	Substrate board	312	Terminal for connecting a plurality of terminals
				11	Radiating surface	31a	Power pin
12	Bonding surface	31b	Signal pin
				1a	Conductive copper layer	31c	Empty pin
2	Encapsulation part	4	Wafer structure
				31	Pin	41	Wafer

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the case where a directional instruction is involved in the embodiment of the present utility model, the directional instruction is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional instruction is changed accordingly.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Power devices are basic components in the power electronics field, and in order to adapt to different circuit and process requirements, power devices of different package structure types are produced in the industry. The common packaging structure is a PIN (PIN) packaging structure at the bottom of the power device, the power device is welded on the circuit board and then radiates heat through the opposite side of the bottom, and the power device is packaged in a plastic packaging mode so as to seal and protect other components in the power device. However, the plastic packaging method not only results in poor overall heat dissipation efficiency of the power device, but also requires adding heat-conducting glue to improve the heat dissipation efficiency of the power device, resulting in high cost.

In view of this, the utility model provides a power device and an electronic device, which aim to solve the problems of poor heat dissipation effect and high cost of a packaging structure of a PIN at the bottom of the power device, so that the power device has good heat dissipation performance and low cost. Fig. 1 to fig. 2 are embodiments of a power device provided by the present utility model.

Referring to fig. 1 to 2, a power device 100 includes a substrate 1, a package portion 2 and a pin structure, wherein at least a portion of the substrate 1 is made of a conductive material, the substrate 1 has a bonding surface 12 and a heat dissipation surface 11 that are disposed opposite to each other along a thickness direction of the substrate 1, the bonding surface 12 is provided with a die structure 4, the package portion 2 is packaged outside the substrate 1 and the die structure 4, the pin structure includes a plurality of pins 31 distributed along a circumferential direction of the substrate 1, one end of at least one pin 31 of the plurality of pins 31 is electrically connected to the bonding surface 12, and the other end extends toward the heat dissipation surface 11 in the thickness direction of the substrate 1 and is penetrated out of the package portion 2, and the package portion 2 is disposed with a local hollow on a side corresponding to the heat dissipation surface 11 so as to expose the heat dissipation surface 11.

According to the technical scheme, the radiating surface 11 is at least partially exposed in the hollowed-out part of the packaging part 2, so that the radiating surface 11 can be directly contacted with the radiator of the electronic equipment, heat generated in the power device 100 in the working process can be directly and rapidly conducted to the radiator through the radiating surface 11, the radiating efficiency of the power device adopting the bottom PIN packaging structure is greatly improved, and the rapid radiating of the power device can be realized without additionally adding heat conducting materials such as heat conducting glue, so that the cost is greatly reduced.

In addition, through the electrical connection between the wafer structure 4 and the pins 31 and the substrate 1 to realize functions, the direction of at least one pin 31 in the plurality of pins 31 is limited to extend towards the direction away from the radiating surface 11 in the thickness direction of the substrate 1, so that the process mode of the power device 100 is not limited to flat paste welding, the power device 100 can be connected in a plug-in welding mode, the tightness of device connection is enhanced, the application of the power device 100 is more flexible in this setting mode, and the pins 31 are electrically connected to the circuit board through plug-in welding, and the welding efficiency of the power device 100 is improved.

Moreover, PIN of other conventional power device still goes out PIN (PIN) and horizontal extension from power device's side, and be multistage bending setting along base plate thickness direction, and through flat welding at the circuit board surface, this kind of structural style makes the whole space that the device occupy after the installation great, and can't dismantle, and this application is through the vertical setting of edge power device 100 thickness direction of prescribing a limit to the PIN, be convenient for reduce power device 100's whole height, be favorable to miniaturized setting, and set up heat dissipation face 11 and part on power device 100's opposite side of going out the PIN side show, make power device 100 have the characteristics that easy dismounting and heat dispersion are strong simultaneously.

The present utility model is not limited to the specific form in which the pins 31 exhibit the pin direction, and in one embodiment, at least one pin 31 of the plurality of pins 31 includes a connecting member 311 and a terminal 312, one end portion of the connecting member 311 is fixed to the bonding surface 12, an end surface of the other end portion of the connecting member 311 is provided with a through hole, one end of the terminal 312 is inserted into the through hole, and the other end of the terminal 312 is disposed penetrating through the package portion 2. In this embodiment, the connection piece 311 is configured as a copper pillar, the terminal 312 is configured as a conductive fish-eye terminal, and the specific process is as follows, one end of the copper pillar is fixed on the substrate 1 by welding, so that the copper pillar can be electrically conducted with the substrate 1, the end surface of the other end is provided with a through hole in a penetrating manner, and after packaging, the copper pillar is inserted into the through hole of the copper pillar by press-fit interference fit of the conductive fish-eye terminal, so that the power device 100 can be in a pin-out form in a direction opposite to the radiating surface 11; in another embodiment, the connecting piece 311 is provided as an insulating column, the terminal 312 is provided as a conductive fish-eye terminal, the insulating column is provided with a through hole penetrating through the end surfaces of the two end parts, one end of the conductive fish-eye terminal penetrates through the through hole and is welded with the bonding surface 12 of the substrate 1 to realize electrical conduction, the other end of the conductive fish-eye terminal penetrates out of the packaging part 2, the insulating column wraps one end of the conductive fish-eye terminal, and the insulating column can be made of insulating resin. When the power device 100 is mounted on a circuit board, the pins 31 are generally assembled downward, so that the pins can be understood as being led out from the bottom of the device, and the pins are led out to realize the bottom pin arrangement of the pins 31, so that the packaging is convenient, and the heat dissipation surface 11 can be understood as a top heat dissipation surface, so that the power device 100 is convenient to dissipate heat after being welded on the circuit board.

In other embodiments, the leads 31 may be formed on the substrate 1 by plating nickel on the surface of a copper wire or a iron wire, and the present utility model is not limited thereto.

It can be understood that the pins 31 may be divided into signal pins 31b and power pins 31a according to their functions, and are used for signal acquisition, transmission and power circulation, and in this embodiment, the plurality of pins 31 include a plurality of signal pins 31b and a plurality of power pins 31a, and the plurality of power pins 31a are all disposed on the same side edge of the substrate 1. That is, on the basis of unifying the pin-out directions, the pins 31 with the same function are disposed on the same side of the substrate 1, so that corresponding connection is facilitated, that is, the power pins 31a and the signal pins 31b may be disposed on opposite sides of the substrate 1, respectively. Here, the opposite side edges of the substrate 1 are opposite side edges along the longitudinal or width direction of the substrate 1.

It is understood that a plurality of signal pins 31b may be disposed on the other side of the substrate 1, and the signal pins 31b may be mixed with the power pins 31a, i.e. the power pins 31a and the signal pins 31b are disposed on the corresponding sides of the substrate 1.

It should be noted that the number of the signal pins 31b and the number of the power pins 31a are not limited in the present utility model, and the number of the two may be the same or different. When the pins 31 of different functions are mixed, the number of the power pins 31a and the number of the signal pins 31b on the same side may be the same or different.

In order to increase the strength of the power device 100, the plurality of pins 31 further includes a plurality of idle pins 31c, i.e. pins 31 not connected to the electronic device, which temporarily cannot realize the functions of signal collection and transmission or power circulation, the function of the empty pins 31c is to support and strengthen the connection, and the number of the specific arrangement of the empty pins 31c can be determined according to the actual design requirement.

In one embodiment, the substrate 1 has a first side and a second side opposite to each other along a circumferential direction thereof, the plurality of signal pins 31b are disposed on the first side, the plurality of power pins 31a are disposed on the second side, and the free pins 31c are disposed on one of the first side and the second side with a smaller number of pins. That is, the empty pins 31c are disposed on the side of the substrate 1 with few functional pins, i.e. in this structure, when a plurality of empty pins 31c are disposed on the same side, the structure is suitable for the situation that the difference of the number of pins on the first side and the second side is obvious and the number of empty pins 31c is small, so as to provide better balance support, make up the difference of the number of pins on the first side and the second side, and increase the connection force when the devices are connected.

In other embodiments, a plurality of empty pins 31c may be disposed on the first side and the second side, such that the number of pins on the first side and the second side are equivalent. The pin quantity difference is suitable for the working condition that the pin quantity difference between the first side edge and the second side edge is not obvious.

Further, the substrate 1 comprises a substrate body and a heat dissipation layer which are sequentially arranged along the direction that the bonding surface 12 points to the heat dissipation surface 11, the side of the heat dissipation layer facing away from the substrate body forms a heat dissipation surface 11, and the side of the substrate body facing away from the heat dissipation layer forms a bonding surface 12. In order to improve the heat dissipation efficiency of the power device 100, a heat dissipation layer needs to be provided on the other side of the substrate body opposite to the bonding surface 12, and the package 2 is partially hollowed out to partially expose the heat dissipation layer. When the substrate body is made of a conductive material, the heat dissipation layer 11 may be made of a heat conductive but non-conductive material to achieve an insulating effect.

The utility model is not limited to the specific materials of the parts of the substrate 1, and only needs to meet the conductive function, in one embodiment, the side surface of the substrate body facing away from the heat dissipation layer is provided with the conductive copper layer 1a, and the side surface of the conductive copper layer 1a facing away from the substrate body forms the bonding surface 12, and it is understood that the wafer structure 4 and the pins 31 can be fixedly connected to the conductive copper layer 1a, and at this time, the substrate body can be made of non-conductive materials such as ceramics, and the conductive function is realized through the conductive copper layer 1a. In another embodiment, when the heat dissipation layer is a copper layer, the substrate body is coated with copper on both sides, and the substrate body is made of non-conductive material such as ceramic, so as to ensure insulation between the conductive copper layer 1a and the heat dissipation layer.

In other embodiments, the substrate body may be a copper plate with good electrical conductivity, which is not limited in the present utility model. An insulating layer is further arranged between the substrate body and the heat dissipation layer, the heat dissipation layer is a heat conduction copper layer, and good heat transfer and heat dissipation effects can be guaranteed by the heat conduction copper layer. It will be appreciated that when the substrate body is electrically conductive, each pin 31 is directly connected to the substrate body, and the heat dissipation layer is a heat conductive copper layer and also has an electrically conductive function, so that an insulating effect is required by providing an insulating layer, and meanwhile, the insulating layer can also have a mechanical bonding effect.

In one embodiment, the substrate 1 includes a heat dissipation layer, an insulating layer and a substrate body stacked in sequence, the substrate body is made of non-conductive material, the heat dissipation layer is a heat conductive copper layer, a side surface of the substrate body facing away from the heat dissipation layer is provided with a conductive copper layer, and the insulating layer bonds the heat conductive copper layer on the substrate body. Thereby ensuring good conductive heat dissipation effect.

It should be noted that, when the bonding surface 12 is set to be the conductive copper layer 1a, the conductive copper layer 1a may be set to be a whole piece structure, or may be a plurality of single-piece structures, at this time, part of the wafer monomers and part of the connecting pieces 311 may be installed on the same copper sheet, so as to facilitate integrated setting, and make the process simple.

For ease of processing, simplified process and ease of manufacture, the heat dissipating surface 11 is insulated from the interior of the device.

Since the power device 100 is an important component in the power electronic circuit, during the working process, the temperature condition of the power device is to be closely monitored, and the temperature condition cannot exceed the preset temperature threshold value, otherwise, the power device 100 is easy to cause faults, therefore, in this embodiment, the power device 100 further includes a temperature sensor, the temperature sensor is disposed on the bonding surface 12, and the temperature sensor is disposed at a distance from the wafer structure 4 and electrically connected to the corresponding pins 31, and the packaging part 2 is packaged outside the temperature sensor. One implementation of the temperature sensor may be a thermistor, specifically, the thermistor is welded on the bonding surface 12 of the substrate 1, and the thermistor is connected to the corresponding signal pin 31b. The temperature is obtained by measuring the voltage signal across the thermistor through the signal pin 31b connected to the thermistor, so that one thermistor can be correspondingly connected to two signal pins 31b. The thermistor can be a negative temperature coefficient NTC thermistor. In other embodiments, the temperature sensor may take other forms, as the utility model is not limited in this regard.

It will be appreciated that the overall volume of the power device 100 should be adaptively increased when a temperature sensor is provided.

The utility model is not limited to the application scenario of the power device 100, and can be applied to a half-bridge circuit, a rectifier, an inverter, a booster circuit, a step-down circuit, and the like.

Further, when the power device 100 is applied to the half-bridge circuit, the plurality of pins 31 includes a plurality of signal pins 31b and a plurality of power pins 31a, and the power device 100 includes at least two power transistors, that is, the power device 100 is formed by packaging at least two power transistors together, specifically, each power transistor includes at least one die structure 4, at least one signal pin 31b and at least one power pin 31a. The present utility model is not limited to a specific form of the power tube, and may include any one of the following, for example: diodes, thyristors, metal oxide semiconductor field effect transistors MOSFETs, insulated gate bipolar transistors IGBTs, silicon carbide SiC or gallium nitride GaN.

The number of the corresponding connected dies of the power tube is not particularly limited, in one embodiment, each die structure 4 includes a plurality of dies 41 electrically connected to each other, it is understood that the dies 41 include one or more of an IGBT chip, a MOS transistor chip, and a diode chip, in this embodiment, referring to fig. 2, the die 41 with a larger volume is the IGBT chip or the MOS transistor chip, and the die 41 with a smaller volume is the diode chip.

Further, each power tube is correspondingly and electrically connected to a plurality of wafers 41, or each power tube is correspondingly and electrically connected to a different wafer 41. One power tube can be arranged corresponding to one wafer 41, or one power tube can be arranged corresponding to a plurality of wafers 41.

Further, the two power transistors are different in number from each other with respect to the signal pins 31b and/or the power pins 31a which are electrically connected. For example, one power tube corresponds to 2 signal pins 31b and 2 power pins 31a, the other power tube corresponds to 3 signal pins 31b and 3 power pins 31a, and the number of the signal pins 31b and the power pins 31a corresponding to each power tube is reasonably and electrically connected according to actual needs. In this embodiment, the power device 100 includes two power transistors, where the two power transistors correspond to three power pins 31a, and the three power pins 31a are all disposed on the same side of the substrate 1.

It should be noted that, regarding the specific dimensions of the power pins 31a and the signal pins 31b, those skilled in the art may set according to actual needs, and the present utility model is not limited specifically with respect to the distance between the adjacent pins 31.

In one embodiment, the lead-out directions of the plurality of leads 31 are all toward the substrate 1 facing away from the heat dissipation surface 11. That is, the power pins 31a and the signal pins 31b are distributed at the bottom of the substrate 1, the heat dissipation surface 11 can be regarded as being arranged at the top of the substrate 1, and the function of bottom pin output is realized by matching the connecting piece 311 with the through hole with the terminal 312 in the packaging part 2, so that the installation limit of the power device 100 is made up, the power device 100 can be welded by adopting a plug-in welding mode, the flexibility of application is improved, the wiring and the practical application in a circuit board are convenient, and the heat dissipation surface 11 is exposed in a top heat dissipation mode, so that after the power device 100 is welded on the circuit board, the power device 100 can be directly contacted with a radiator through the heat dissipation surface 11 to realize rapid heat conduction, the heat dissipation efficiency of the power device 100 is greatly improved, and auxiliary heat conduction is not required to be additionally increased, thereby reducing the cost. Meanwhile, the plurality of power pins 31a and the plurality of signal pins 31b are distributed at two opposite sides. And the empty pins 31c are arranged on one side with fewer pins, so that better balance support is provided, the difference between the pins on the first side and the pins on the second side is compensated, and the connecting force is increased when the devices are connected.

The utility model also provides an electronic device, which comprises the power device 100, and the electronic device comprises all the technical characteristics of the power device 100, so that the electronic device also has the technical effects brought by all the technical characteristics, and the technical effects are not repeated here.

Specifically, the electronic device may be a notebook, a tablet (ipad), a desktop, a server, a display, and various peripherals in the computer field; mobile phones, telephones and other various terminals and local side devices in the network communication field can also be included; the intelligent wearable equipment in the consumer electronics field, traditional black and white household appliances and various digital products can also be included; and can also comprise industrial personal computers, automobiles, various instruments and meters, control equipment and the like in the industrial control field.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. A power device, which comprises a power source, characterized by comprising the following steps:

the substrate is at least partially made of conductive materials, and is provided with a bonding surface and a radiating surface which are oppositely arranged along the thickness direction of the substrate, and a wafer structure is arranged on the bonding surface;

a package part, which is packaged outside the substrate and the wafer structure;

the pin structure comprises a plurality of pins distributed along the circumferential direction of the substrate, one end of at least one pin of the plurality of pins is electrically connected to the bonding surface, and the other end extends away from the heat dissipation surface in the thickness direction of the substrate and penetrates through the packaging part;

the packaging part is partially hollowed out on one side surface corresponding to the radiating surface so as to expose the radiating surface;

the corresponding pins are vertically arranged along the thickness direction of the power device.

2. The power device of claim 1, wherein the substrate includes a substrate body and a heat dissipation layer disposed in sequence along a direction in which the bonding surface is directed toward the heat dissipation surface, a side of the heat dissipation layer facing away from the substrate body forming the heat dissipation surface, and a side of the substrate body facing away from the heat dissipation layer forming the bonding surface.

3. The power device of claim 2, wherein a side of the substrate body facing away from the heat dissipation layer is provided with a conductive copper layer, and a side of the conductive copper layer facing away from the substrate body forms the bonding surface; and/or the number of the groups of groups,

an insulating layer is further arranged between the substrate body and the heat dissipation layer, and the heat dissipation layer is a heat conduction copper layer.

4. The power device of claim 1, wherein at least one pin of the plurality of pins comprises:

the connecting piece is fixed to the joint surface at one end part, and a through hole is formed in the end surface of the other end part of the connecting piece in a penetrating manner; the method comprises the steps of,

and one end of the terminal is inserted into the through hole, and the other end of the terminal penetrates through the packaging part.

5. The power device of claim 1, wherein the plurality of pins comprises a plurality of signal pins and a plurality of power pins, the plurality of power pins all disposed on a same side of the substrate.

6. The power device of claim 5, wherein the substrate has a first side and a second side disposed opposite to each other along a circumferential direction thereof, the plurality of signal pins being disposed on the first side, the plurality of power pins being disposed on the second side;

the plurality of pins further comprises a plurality of empty pins, and the empty pins are arranged on one of the first side and the second side, which is smaller in number of pins.

7. The power device of claim 1, further comprising a temperature sensor disposed on the bonding surface, the temperature sensor being spaced apart from the die structure and electrically connected to the corresponding pin;

the encapsulation is encapsulated outside the temperature sensor.

8. The power device of claim 1, wherein the plurality of pins comprises a plurality of signal pins and a plurality of power pins;

the power device comprises at least two power tubes, and each power tube comprises at least one wafer structure, at least one signal pin and at least one power pin.

9. The power device of claim 8, wherein each of the die structures comprises a plurality of dies electrically connected to one another.

10. An electronic device comprising a power device as claimed in any one of claims 1 to 9.