CN208143670U - Intelligent terminal radiator structure - Google Patents
Intelligent terminal radiator structure Download PDFInfo
- Publication number
- CN208143670U CN208143670U CN201721705039.9U CN201721705039U CN208143670U CN 208143670 U CN208143670 U CN 208143670U CN 201721705039 U CN201721705039 U CN 201721705039U CN 208143670 U CN208143670 U CN 208143670U
- Authority
- CN
- China
- Prior art keywords
- heat
- shielding case
- intelligent terminal
- thermally conductive
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims abstract description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 7
- 229910000570 Cupronickel Inorganic materials 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000499 gel Substances 0.000 claims abstract description 7
- 238000004021 metal welding Methods 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 239000006260 foam Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model intelligent terminal radiator structure, including：The top of heat source is arranged in shielding case, the shielding case；Heat pipe, the heat pipe are arranged between the heat source and the shielding case；Heat Conduction Material, the Heat Conduction Material are filled between the heat pipe and the heat source.The Heat Conduction Material includes but is not limited to thermally conductive gel, heat conductive pad, heat conductive silica gel or thermally conductive gum.The heat pipe is fixed with the shielding case using metal welding or thermally conductive gum is adhesively fixed.The material of the shielding case includes but is not limited to thermally conductive copper alloy or shielding foreign white copper.The utility model intelligent terminal radiator structure can have 7 degree~8 degree of range of decrease income (by taking CPU heat source as an example), and ibid the front and rear surfaces temperature difference of terminal is smaller, promote user experience.
Description
Technical field
The utility model relates to a kind of intelligent terminal radiator structures.
Background technique
The dominant frequency of smart mobile phone chips is higher and higher, can generate a large amount of heat, and excessive heat will affect relaxing for user
Suitable sense, may also can equally burn out hardware.
Hardware is mostly used to radiate at present, such as graphite radiating, and one kind is exactly kernel optimization heat dissipation hardware heat dissipation aspect, it is existing
The heat sink conception of some terminals：Graphite or heat-conducting glue are attached to thermally conductive on shell；Or heat conducting pipe be attached to it is thermally conductive on shell.Most of factories
The method that quotient solves heat dissipation problem is all in terms of framework using highly heat-conductive material.Traditional Heat Conduction Material is mainly metal material
Material, such as copper, aluminium, silver.But metal material density is big, the coefficient of expansion is high, cannot still expire in the occasion for requiring high-heat conductive efficency
Sufficient requirement (if the thermal coefficient of silver, copper, aluminium is respectively 430W/m.K, 400W/m.K, 238W/m.K), so with mobile phone
The promotion of chip dominant frequency, cell phone manufacturer start to improve hardware heat sink conception.
Utility model content
The purpose of this utility model is to provide a kind of intelligent terminal radiator structures of heat radiation energy for promoting terminal.
In order to solve the above technical problems, the utility model intelligent terminal radiator structure, including：Shielding case, the shielding case
The top of heat source is set；Heat pipe, the heat pipe are arranged between the heat source and the shielding case.
The Heat Conduction Material is any in following material：Thermally conductive gel, heat conductive pad, heat conductive silica gel or thermally conductive back
Glue.
The heat pipe is fixed with the shielding case using metal welding or thermally conductive gum is adhesively fixed.
The material of the shielding case is thermally conductive copper alloy or shielding foreign white copper.
The radiator structure further includes Heat Conduction Material, and the Heat Conduction Material is filled between the heat pipe and the heat source.
Intelligent terminal radiator structure, including：The top of heat source is arranged in shielding case, the shielding case；Heat pipe, the heat pipe
The top of the shielding case is set；Heat Conduction Material, the Heat Conduction Material are filled between the shielding case and the heat source.
The Heat Conduction Material is any in thermally conductive gel, heat conductive pad, heat conductive silica gel or thermally conductive gum.
The heat pipe is fixed with the shielding case using metal welding or thermally conductive gum is adhesively fixed.
The material of the shielding case is thermally conductive copper alloy or shielding foreign white copper.
The utility model intelligent terminal radiator structure can have 7 degree~8 degree of range of decrease income (by taking CPU heat source as an example), ibid
The front and rear surfaces temperature difference of terminal is smaller, promotes user experience.
Detailed description of the invention
Fig. 1 is one structural schematic diagram one of the utility model intelligent terminal radiator structure embodiment；
Fig. 2 is one structural schematic diagram two of the utility model intelligent terminal radiator structure embodiment；
Fig. 3 is two structural schematic diagram one of the utility model intelligent terminal radiator structure embodiment；
Fig. 4 is two structural schematic diagram two of the utility model intelligent terminal radiator structure embodiment.
Description of symbols in the utility model intelligent terminal radiator structure attached drawing：
1- heat source 2- heat pipe 3- shielding case
4- notch 5- groove
Specific embodiment
The utility model intelligent terminal radiator structure is described in further detail with reference to the accompanying drawing.
Embodiment one
As shown in Figure 1, the sectional view of the utility model intelligent terminal radiator structure, in order to make it easy to understand, Fig. 1 show heat
Pipe is located at the sectional view in shielding case, from Fig. 1, skilled person will appreciate that, the radiator structure of the intelligent terminal is actually
Lamination, most lower or penetralia are heat source 1, and centre is heat pipe 2, and top is shielding case 3.On heat source 1 (including but not limited to CPU)
Directly place heat pipe 2.Heat pipe 2 and heat source 1 reserve safety clearance, and this gap (includes but is not limited to lead using Heat Conduction Material filling
Thermal gels, heat conductive pad, heat conductive silica gel, thermally conductive gum etc.).In another technical solution of the utility model, the heat pipe 2
It can also directly be contacted with heat source.To preferably play the effect of its heat dissipation.Skilled person will appreciate that aforementioned CPU is
Central processing unit is the abbreviation of English " Central Processing Unit ", refers to one piece of integrated circuit, be intelligent terminal
Arithmetic core (Core) and control core (Control Unit).Its function mainly explains intelligent terminal instruction and place
Manage the data in intelligent terminal software.
Other than the positional relationship of heat pipe 2 and heat source 1, thermally conductive shielding case 3 is directly placed in 2 top of heat pipe, and (material includes not
It is limited to thermally conductive copper alloy, shielding foreign white copper etc.), meanwhile, the bossed structure in top of thermally conductive shielding case 3, for being adapted to heat
The shape of pipe 2, by heat pipe 2 in the ridge structure of thermally conductive shielding case 3, that is to say, that the ridge structure on thermally conductive shielding case 3
Heat pipe 2 is wrapped in it, then fixes and (is including but not limited to brazed, hot pressing, SMT welding etc.) or lead using metal welding
Hot gum is adhesively fixed.Such ridge structure helps to save material and cost.Certainly, skilled person will appreciate that, such as
Fruit do not use ridge structure but all covering heat pipe 2 and heat source 1 scheme be also it is feasible, also in the protection of the utility model
In range.
Meanwhile heat pipe 2 is not limited only to inside thermally conductive shielding case 3, can extend shielding case 3, specifically, referring to figure
The radiator structure schematic diagram of the utility model shown in 2, Fig. 2, in order to make it easy to understand, the shielding case top in Fig. 2 is with transparent shape
Formula is shown, for the structure inside clearer display shielding case.In fact, the shielding case is completely obscured state, from
It should be invisible internal structure in the figure, because the heat source 1 and the heat pipe 2 are covered by shielding case 3.In shielding case
3 end is equipped with notch 4, and the position of notch 4 is corresponding with ridge structure, and the end of heat pipe 2 can be stretched out from notch 4, in addition,
Conducting foam (not shown) is filled in the gap of heat pipe 2 and notch 4, to guarantee the function of shielding of shielding case.
In addition, as can be known from Fig. 2, the heat source 2 can be distributed in the week of heat pipe 2 with more than one, the heat source 1
It encloses, and in being coated on by the shielding case 3, can equally play the role of heat dissipation in this way.That is, same root heat pipe 2 can be helped
Multiple heat sources 1 are helped to radiate.
Embodiment two
As shown in figure 3, the utility model intelligent terminal radiator structure, described Fig. 3 is cutting for the utility model intelligent terminal
Face figure, as in the first embodiment, the sectional view is in order to preferably show the internal junction of the intelligent terminal radiator structure of the utility model
Structure.As can be known from Fig. 3, the radiator structure of the intelligent terminal includes stacked structure, and bottom or penetralia are heat source 1, intermediate
For shielding case 3, top is heat pipe 2.Thermally conductive shielding case 3 is directly placed on heat source 1 (including but not limited to CPU), and (material includes
But it is not limited to thermally conductive copper alloy, shielding foreign white copper etc.).Shielding case 3 and heat source 1 reserve safety clearance, and this gap is using thermally conductive
It directly puts 3 top of material filling (including but not limited to thermally conductive gel, heat conductive pad, heat conductive silica gel, thermally conductive gum etc.) shielding case
Heat pipe 2 is set, heat pipe 2 is fixed and (is including but not limited to brazed, hot pressing, SMT welding etc.) using metal welding with thermally conductive shielding case 3
Or thermally conductive gum is adhesively fixed.
Meanwhile the length of heat pipe 2 is not limited only in the areal extent that thermally conductive shielding case 3 is covered, heat pipe 2 can extend
Thermally conductive shielding case 3.
The radiator structure schematic diagram of the utility model shown in Fig. 4 is distinguished in order to facilitate understanding and with Fig. 2 of embodiment one,
Shielding case in Fig. 4 uses its internal structure of gray scale transparence display.In the present embodiment, the heat source 1 is located in shielding case 3
Portion, the heat pipe 2 are located at outside shielding case 3.The heat pipe 2 is fixed with shielding case 3, has one or more inside the shielding case 3
A heat source 1.As shown in Figure 4, a groove 5 is set at 3 a side of shielding case, cabling is used for, however, to ensure that the screen of shielding case 3
Effect is covered, the groove 5 also needs to be blocked with conducting foam (not shown) while cabling, to guarantee shielding case 3
Shield effectiveness.
The preferred embodiment created to the utility model above is illustrated, but the utility model is created not
It is limited to the embodiment, those skilled in the art can also make various on the premise of not violating the inventive spirit of the present invention
Equivalent variation or replacement, these equivalent variation or replacement are all included in the scope defined by the claims of the present application.
Claims (10)
1. intelligent terminal radiator structure, which is characterized in that including：
The top of heat source is arranged in shielding case, the shielding case；
Heat pipe, the heat pipe are arranged between the heat source and the shielding case.
2. intelligent terminal radiator structure according to claim 1, which is characterized in that the top of the shielding case is equipped with protuberance
Structure, the end of shielding case be equipped with notch, the position of the notch is corresponding with ridge structure, and the end of heat pipe can be from notch
Conducting foam is filled in the gap of middle stretching, the heat pipe and notch.
3. intelligent terminal radiator structure according to claim 1, which is characterized in that the heat pipe and the shielding case use
Metal welding is fixed or thermally conductive gum is adhesively fixed.
4. intelligent terminal radiator structure according to claim 1, which is characterized in that the material of the shielding case is conduction copper
Alloy or shielding foreign white copper.
5. intelligent terminal radiator structure according to claim 1, which is characterized in that it further include Heat Conduction Material, it is described thermally conductive
Material is filled between the heat pipe and the heat source.
6. intelligent terminal radiator structure according to claim 5, which is characterized in that the Heat Conduction Material is in following material
It is any：Thermally conductive gel, heat conductive pad, heat conductive silica gel or thermally conductive gum.
7. intelligent terminal radiator structure, which is characterized in that including：
The top of heat source is arranged in shielding case, the shielding case；
The top of the shielding case is arranged in heat pipe, the heat pipe；
Heat Conduction Material, the Heat Conduction Material are filled between the shielding case and the heat source.
8. intelligent terminal radiator structure according to claim 7, which is characterized in that the Heat Conduction Material be thermally conductive gel,
It is any in heat conductive pad, heat conductive silica gel or thermally conductive gum.
9. intelligent terminal radiator structure according to claim 7, which is characterized in that the heat pipe and the shielding case use
Metal welding is fixed or thermally conductive gum is adhesively fixed.
10. intelligent terminal radiator structure according to claim 7, which is characterized in that the material of the shielding case is thermally conductive
Copper alloy or shielding foreign white copper.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721705039.9U CN208143670U (en) | 2017-12-08 | 2017-12-08 | Intelligent terminal radiator structure |
| PCT/CN2018/111757 WO2019109749A1 (en) | 2017-12-08 | 2018-10-24 | Smart terminal heat dispersion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721705039.9U CN208143670U (en) | 2017-12-08 | 2017-12-08 | Intelligent terminal radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208143670U true CN208143670U (en) | 2018-11-23 |
Family
ID=64284077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721705039.9U Active CN208143670U (en) | 2017-12-08 | 2017-12-08 | Intelligent terminal radiator structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208143670U (en) |
| WO (1) | WO2019109749A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201255863Y (en) * | 2008-09-16 | 2009-06-10 | 华为技术有限公司 | Server heat radiating construction and server |
| WO2015139213A1 (en) * | 2014-03-18 | 2015-09-24 | 华为终端有限公司 | Heat dissipation assembly and electronic device |
| CN105472940B (en) * | 2014-08-20 | 2018-08-17 | 南京中兴新软件有限责任公司 | Heat dissipation of terminal device and mobile terminal |
| CN204377305U (en) * | 2014-12-16 | 2015-06-03 | 中兴通讯股份有限公司 | A kind of heat abstractor, circuit board and terminal |
| CN106170199B (en) * | 2016-08-31 | 2023-01-20 | 广东虹勤通讯技术有限公司 | Heat dissipation shielding system and communication product |
-
2017
- 2017-12-08 CN CN201721705039.9U patent/CN208143670U/en active Active
-
2018
- 2018-10-24 WO PCT/CN2018/111757 patent/WO2019109749A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019109749A1 (en) | 2019-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai zhongchain Technology Co.,Ltd. Assignor: BLACKSHARK TECHNOLOGIES (NANCHANG) Co.,Ltd. Contract record no.: X2019360000004 Denomination of utility model: Intelligent terminal heat radiation structure Granted publication date: 20181123 License type: Common License Record date: 20191223 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230310 Address after: 518055 1501, Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370, Liuxian Avenue, Fuguang Community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Grey Shark Technology Co.,Ltd. Address before: 330008 room 319, office building, Jiao Qiao Town, Nanchang economic and Technological Development Zone, Qingshan Lake, Nanchang, Jiangxi Patentee before: BLACKSHARK TECHNOLOGIES (NANCHANG) Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231130 Address after: Building 3, Tongfu Industrial Zone, Shajing Street Office, Bao'an District, Shenzhen City, Guangdong Province, 518000 Patentee after: SHENZHEN MYGT CO.,LTD. Address before: 518055 1501, Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370, Liuxian Avenue, Fuguang Community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen Grey Shark Technology Co.,Ltd. |