WO2019109749A1

WO2019109749A1 - Smart terminal heat dispersion structure

Info

Publication number: WO2019109749A1
Application number: PCT/CN2018/111757
Authority: WO
Inventors: 丁智成; 段海涛
Original assignee: 南昌黑鲨科技有限公司
Priority date: 2017-12-08
Filing date: 2018-10-24
Publication date: 2019-06-13
Also published as: CN208143670U

Abstract

Disclosed is a smart terminal heat dispersion structure comprising: a shielding hood, the shielding hood being provided above a heat source; a heat tube, the heat tube being provided between the heat source and the shielding hood; and a heat-conducting material, the heat-conducting material being filled between the heat tube and the heat source. The heat-conducting material comprises but is not limited to a heat-conducting gel, a heat-conducting pad, a heat-conducting silica gel or a heat-conducting gum. Metal welding fixing or heat-conducting gum adhesion fixing is used for the heat tube and the shielding hood. The material of the shielding hood comprises but is not limited to a heat-conducting copper alloy or a shielding copper-nickel alloy. The smart terminal heat dispersion structure of the present invention can achieve a 7-8 degree temperature reduction (taking a CPU heat source as an example), and front and back surfaces of the terminal above have a lower temperature difference, improving the user experience.

Description

Intelligent terminal heat dissipation structure

Technical field

The invention relates to a heat dissipation structure of an intelligent terminal.

technical background

The frequency of smartphone chips is getting higher and higher, which will generate a lot of heat. Excessive heat will affect the user's comfort, and it may also burn out the hardware.

At present, hardware cooling is used, such as graphite heat dissipation, and one is the core to optimize the heat dissipation of the hardware. The existing terminal heat dissipation scheme: graphite or thermal paste is attached to the housing for heat conduction; or the heat pipe is attached to the housing for heat conduction. Most manufacturers solve the heat dissipation problem by using high thermal conductivity materials in the architecture. Traditional thermal conductive materials are mainly metallic materials such as copper, aluminum, silver, and the like. However, the metal material has a high density and a high expansion coefficient. In the case where high thermal conductivity is required, the requirements for use cannot be met (for example, the thermal conductivity of silver, copper, and aluminum is 430 W/mK, 400 W/mK, 238 W/mK, respectively), so With the increase in the frequency of mobile phone chips, mobile phone manufacturers began to improve the hardware cooling solution.

Summary of invention

An object of the present invention is to provide a heat dissipation structure of an intelligent terminal that improves heat dissipation performance of a terminal.

In order to solve the above technical problem, the smart terminal heat dissipation structure of the present invention comprises: a shield cover disposed above the heat source; and a heat pipe disposed between the heat source and the shield cover.

The thermally conductive material is any one of the following materials: a thermally conductive gel, a thermal pad, a thermally conductive silicone or a thermally conductive adhesive.

The heat pipe and the shield cover are fixed by metal welding or thermal conductive adhesive bonding.

The shielding cover is made of a heat conductive copper alloy or a shielded white copper.

The heat dissipation structure further includes a heat conductive material filled between the heat pipe and the heat source.

The smart terminal heat dissipation structure includes: a shielding cover disposed above the heat source; a heat pipe disposed above the shielding cover; a heat conductive material, the heat conductive material filling the shielding cover and the Between heat sources.

The heat conductive material is any one of a heat conductive gel, a thermal pad, a thermal conductive silicone or a thermal conductive adhesive.

The heat dissipation structure of the intelligent terminal of the invention can have a reduction benefit of 7 degrees to 8 degrees (taking the CPU heat source as an example), and the temperature difference between the front and rear surfaces of the terminal is smaller, thereby improving the user experience.

DRAWINGS

1 is a schematic structural view 1 of a first embodiment of a heat dissipation structure of an intelligent terminal according to the present invention;

2 is a schematic structural view 2 of a first embodiment of a heat dissipation structure of an intelligent terminal according to the present invention;

3 is a schematic structural diagram 1 of a second embodiment of a heat dissipation structure of an intelligent terminal according to the present invention;

FIG. 4 is a schematic structural diagram 2 of a second embodiment of a heat dissipation structure of an intelligent terminal according to the present invention.

The heat dissipation structure of the intelligent terminal of the present invention is illustrated by the reference numerals in the drawings:

1-heat source 2 - heat pipe 3 - shield

4-notch 5-groove

Summary of the invention

The heat dissipation structure of the smart terminal of the present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1

As shown in FIG. 1 , a cross-sectional view of a heat dissipating structure of the smart terminal of the present invention is shown in FIG. 1 . FIG. 1 is a cross-sectional view of the heat pipe in the shield. As shown in FIG. 1 , the person skilled in the art may know that the smart terminal is The heat dissipating structure is actually laminated, the lowermost or innermost is the heat source 1, the middle is the heat pipe 2, and the top is the shield 3. The heat pipe 2 is placed directly on the heat source 1 (including but not limited to the CPU). The heat pipe 2 and the heat source 1 reserve a safety gap, and the gap is filled with a heat conductive material (including but not limited to a heat conductive gel, a thermal conductive pad, a thermal conductive silicone, a thermal conductive adhesive, etc.). In another embodiment of the invention, the heat pipe 2 can also be in direct contact with a heat source. So that the heat dissipation effect can be better played. Those skilled in the art will appreciate that the aforementioned CPU is a central processing unit and is an abbreviation of "Central Processing Unit" in English. It refers to an integrated circuit, which is an operation core (Core) and a control unit (Control Unit) of the intelligent terminal. Its function is mainly to explain the instructions of the intelligent terminal and to process the data in the intelligent terminal software.

In addition to the positional relationship between the heat pipe 2 and the heat source 1, the heat conducting shield 3 is directly placed above the heat pipe 2 (the material includes not limited to a heat conductive copper alloy, shielding copper, etc.), and at the same time, the top of the heat conducting shield 3 has a raised structure. In the shape of the heat pipe 2, the heat pipe 2 is embedded in the ridge structure of the heat conducting shield 3, that is, the ridge structure on the heat conducting shield 3 encloses the heat pipe 2 therein, and then fixed by metal welding (including but not Limited to brazing, hot pressing, SMT soldering, etc.) or thermal adhesive adhesive bonding. Such a raised structure helps to save material and cost. Of course, those skilled in the art will appreciate that it is also possible to cover all of the heat pipe 2 and the heat source 1 without using a ridge structure, and it is also within the scope of the present invention.

At the same time, the heat pipe 2 is not limited to the inside of the heat conducting shield 3, and the shield cover 3 can be extended. Specifically, referring to FIG. 2 and FIG. 2, the heat dissipation structure of the present invention is shown in FIG. Displayed in a transparent form, in order to more clearly show the structure inside the shield. In fact, the shield is in a completely shielded state, from which the internal structure should not be visible since both the heat source 1 and the heat pipe 2 are shielded by the shield 3. At the end of the shield case 3, a notch 4 is provided. The position of the notch 4 corresponds to the ridge structure, and the end of the heat pipe 2 can protrude from the notch 4, and in addition, the gap between the heat pipe 2 and the notch 4 is filled. Conductive foam (not shown) to ensure the shielding function of the shield.

In addition, as can be seen from FIG. 2, there may be more than one heat source 2, and the heat source 1 may be distributed around the heat pipe 2 and covered by the shield cover 3, so as to function as a heat sink. That is, the same heat pipe 2 can help the plurality of heat sources 1 to dissipate heat.

Embodiment 2

As shown in FIG. 3, the heat dissipation structure of the intelligent terminal of the present invention, FIG. 3 is a cross-sectional view of the smart terminal of the present invention, which is the same as the first embodiment, and the cross-sectional view is used to better demonstrate the internal structure of the heat dissipation structure of the smart terminal of the present invention. . As can be seen from FIG. 3, the heat dissipation structure of the smart terminal includes a stacked structure, the heat source 1 at the bottom or the innermost portion, the shield case 3 in the middle, and the heat pipe 2 at the top. The thermal shield 3 is placed directly on the heat source 1 (including but not limited to the CPU) (materials include, but are not limited to, thermally conductive copper alloys, shielded copper, etc.). The shielding cover 3 and the heat source 1 are reserved with a safety gap, and the gap is filled with a heat conductive material (including but not limited to a thermal conductive gel, a thermal conductive pad, a thermal conductive silicone, a thermal conductive adhesive, etc.). The heat pipe 2 is placed directly above the shielding cover 3, and the heat pipe 2 is The heat conducting shield 3 is fixed by metal welding (including but not limited to brazing, hot pressing, SMT soldering, etc.) or thermal adhesive bonding.

At the same time, the length of the heat pipe 2 is not limited to the area covered by the heat conducting shield 3, and the heat pipe 2 can extend out of the heat conducting shield 3.

FIG. 4 is a schematic view showing the heat dissipation structure of the present invention. For the sake of easy understanding and difference from FIG. 2 of the first embodiment, the shield cover of FIG. 4 is transparently displayed in grayscale. In the present embodiment, the heat source 1 is located inside the shield case 3, and the heat pipe 2 is located outside the shield case 3. The heat pipe 2 is fixed to the shield 3, and the shield 3 has one or more heat sources 1 inside. As can be seen from FIG. 4, a recess 5 is provided at one side of the shield cover 3 for routing, but in order to ensure the shielding effect of the shield 3, the recess 5 requires conductive foam while being routed ( The plugging is performed to ensure the shielding effect of the shield cover 3.

The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the embodiments, and those skilled in the art can make various equivalents without departing from the inventive spirit of the present invention. Variations or substitutions are intended to be included within the scope of the invention as defined by the appended claims.

Claims

The intelligent terminal heat dissipation structure is characterized in that it comprises:

a shield, the shield being disposed above the heat source;

a heat pipe disposed between the heat source and the shield.
The heat dissipation structure of the smart terminal according to claim 1, wherein the top of the shielding cover is provided with a raised structure, and a notch is provided at an end of the shielding cover, and the position of the notch corresponds to the raised structure. The end of the heat pipe may protrude from the notch, and the gap between the heat pipe and the notch is filled with conductive foam.
The heat dissipation structure of the smart terminal according to claim 1, wherein the heat pipe and the shield cover are fixed by metal welding or thermal adhesive.
The heat dissipation structure of the smart terminal according to claim 1, wherein the shielding cover is made of a thermally conductive copper alloy or a shielded white copper.
The intelligent terminal heat dissipation structure according to claim 1, further comprising a heat conductive material filled between the heat pipe and the heat source.
The heat dissipation structure of the smart terminal according to claim 5, wherein the heat conductive material is any one of the following materials: a thermal conductive gel, a thermal conductive pad, a thermal conductive silicone or a thermal conductive adhesive.
The intelligent terminal heat dissipation structure is characterized in that it comprises:

a shield, the shield being disposed above the heat source;

a heat pipe, the heat pipe being disposed above the shield;

a thermally conductive material that is filled between the shield and the heat source.
The heat dissipation structure of the smart terminal according to claim 7, wherein the heat conductive material is any one of a heat conductive gel, a thermal conductive pad, a thermal conductive silicone or a thermal conductive adhesive.
The heat dissipation structure of the smart terminal according to claim 7, wherein the heat pipe and the shield cover are fixed by metal welding or thermal adhesive.
The heat dissipation structure of the smart terminal according to claim 7, wherein the shielding cover is made of a thermally conductive copper alloy or a shielded white copper.