CN208159101U - Electronic device and electronic equipment - Google Patents
Electronic device and electronic equipment Download PDFInfo
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- CN208159101U CN208159101U CN201820619845.2U CN201820619845U CN208159101U CN 208159101 U CN208159101 U CN 208159101U CN 201820619845 U CN201820619845 U CN 201820619845U CN 208159101 U CN208159101 U CN 208159101U
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- support frame
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Abstract
A kind of electronic device and electronic equipment.The electronic device includes support frame, radiator and electronic component, the side of the radiator is connect with support frame as described above, the other side of the radiator is connect with the electronic component, and thus the radiator at least partly conducts the heat generated in electronic component work to support frame as described above.In the electronic device, support frame can be with auxiliary heat dissipation, to improve the heat dissipation effect of electronic device.
Description
Technical field
At least one embodiment of the disclosure is related to a kind of electronic device and electronic equipment.
Background technique
With the development of society, electronic product using more and more, user also has the performance of electronic product more next
Higher demand.Electronic product can generate heat in use.The heat dissipation effect of current electronic product still cannot expire
Foot requires, and the high temperature that heat accumulation generates can cause adverse effect in the speed of service, service life etc. to electronic product.In addition, in electricity
In the case that sub- product is for wearing, high temperature caused by heat dissipation is bad can also cause user's body uncomfortable.
Utility model content
At least one embodiment of the disclosure provides a kind of electronic device, including support frame, radiator and electronic component, described
The side of radiator is connect with support frame as described above, and the other side of the radiator is connect with the electronic component, thus described to dissipate
Hot device at least partly conducts the heat generated in electronic component work to support frame as described above.
For example, in the electronic device that at least one embodiment of the disclosure provides, the radiator and support frame as described above one
It is body formed.
For example, the electronic device that at least one embodiment of the disclosure provides, further includes heat-conducting glue, wherein the heat-conducting glue
Connect the radiator and support frame as described above.
For example, the radiator includes the first cooling fin in the electronic device that at least one embodiment of the disclosure provides,
First cooling fin is connected with support frame as described above.
For example, support frame is provided with the radiator in the electronic device that at least one embodiment of the disclosure provides
Surface on be provided at least one concaveconvex structure.
For example, support frame as described above is provided with described dissipate in the electronic device that at least one embodiment of the disclosure provides
At least one metal strip is provided on the surface of hot device, wherein at least one of described metal strip is set as from the heat dissipation
Device extends to far from the radiator.
For example, support frame as described above is provided with described dissipate in the electronic device that at least one embodiment of the disclosure provides
Be provided at least one second cooling fin on the surface of hot device, second cooling fin on said surface not with the radiator
Overlapping.
For example, the radiator includes radiator fan in the electronic device that at least one embodiment of the disclosure provides.
For example, support frame as described above includes Heat Conduction Material in the electronic device that at least one embodiment of the disclosure provides.
At least one embodiment of the disclosure provides a kind of electronic equipment, including any of the above-described electronics dress as described in the examples
It sets.
For example, further include display panel and lens in the electronic equipment that at least one embodiment of the disclosure provides, it is described aobvious
Show that panel connect with the electronic component signal and is located on support frame as described above, the lens are located at the remote of the display panel
Side from support frame as described above.
For example, the display panel includes the first display in the electronic equipment that at least one embodiment of the disclosure provides
Plate and the second display daughter board, the lens include the first lens and the second lens；Wherein, first lens are located at described first
Show the side of the separate support frame as described above of daughter board, second lens are located at the separate support of the second display daughter board
The side of frame.
In the electronic device and electronic equipment that at least one embodiment of the disclosure provides, radiator can be by electronic component
The heat of generation is at least partly conducted to radiate, support frame and radiator radiate jointly, and electricity can be improved on support frame
The heat dissipation effect of sub-device.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the embodiment of the present disclosure, the attached drawing to embodiment is simply situated between below
It continues, it should be apparent that, the accompanying drawings in the following description merely relates to some embodiments of the present disclosure, rather than the limitation to the disclosure.
Fig. 1 is a kind of sectional view for electronic device that an embodiment of the present disclosure provides；
Fig. 2 is the sectional view for another electronic device that an embodiment of the present disclosure provides；
Fig. 3 is the structural schematic diagram of one of the electronic device that an embodiment of the present disclosure provides radiator；
Fig. 4 is the sectional view for another electronic device that an embodiment of the present disclosure provides；
Fig. 5 is the floor map for another electronic device that an embodiment of the present disclosure provides；
Fig. 6 is the sectional view for another electronic device that an embodiment of the present disclosure provides；And
Fig. 7 is the structural schematic diagram for a kind of electronic equipment that an embodiment of the present disclosure provides.
Appended drawing reference：
100- support frame；The first main surface of 101-；The second main surface of 102-；110- concaveconvex structure；120- metal strip；130-
Second cooling fin；200- radiator；The first cooling fin of 210-；220- radiator fan；300- electronic component；400- heat-conducting glue；
500- display panel；510- first shows daughter board；520- second shows daughter board；600- lens；The first lens of 610-；620- second
Lens.
Specific embodiment
To keep the purposes, technical schemes and advantages of the embodiment of the present disclosure clearer, below in conjunction with the embodiment of the present disclosure
Attached drawing, the technical solution of the embodiment of the present disclosure is clearly and completely described.Obviously, described embodiment is this public affairs
The a part of the embodiment opened, instead of all the embodiments.Based on described embodiment of the disclosure, ordinary skill
Personnel's every other embodiment obtained under the premise of being not necessarily to creative work, belongs to the range of disclosure protection.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be tool in disclosure fields
The ordinary meaning for thering is the personage of general technical ability to be understood." first ", " second " used in the disclosure and similar word are simultaneously
Any sequence, quantity or importance are not indicated, and are used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means that the element or object before the word occur covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, it is either direct or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
Radiator would generally be set in electronic product to radiate for heating device (such as CPU etc.).For specific
The radiator of structure, the power of radiator and the size of radiator are related, obtain better heat dissipation effect if necessary, need more
Powerful radiator, correspondingly, the size of radiator can be bigger.Heat sink size increase will increase electronic product size and
Weight, and will increase the manufacturing cost of electronic product.It illustratively, is VR (Virtual Reality, void with electronic product
Quasi- reality) for glasses, heat sink size increase can occupy excessive space and VR eye sizes and weight are increased, and increase
Add the weight bearing sense of user, so that the experience to user generates adverse effect；If heat sink size is insufficient, caused by heat gathers
High temperature can also make that user's is uncomfortable.
At least one embodiment of the disclosure provides a kind of electronic device, including support frame, radiator and electronic component, heat dissipation
The side of device is connect with support frame, and the other side of radiator is connect with electronic component, during thus radiator works electronic component
The heat of generation is at least partly conducted to support frame, and is dissipated by support frame.
In the electronic device of embodiment of the disclosure, the heat that electronic component generates in the process of running can be conducted to scattered
To radiate in hot device, radiator can conduct partial heat into support frame during being radiated.In this way, support
Frame can distribute heat to the external world by modes such as heat radiation, thermal convections, while not influencing radiator work, support frame
It can play the role of auxiliary heat dissipation.Radiator and support frame radiate jointly can be improved the heat dissipation effect of electronic device, reduce
The design power and design size of radiator；The weight and size for reducing electronic device, reduce the cost of electronic device；Drop
Low electronic component and the temperature of electronic device in the process of running including the electronic component improve the application experience of user.
It should be noted that at least one embodiment of the disclosure, support frame and radiator, radiator and electronic component
Between connection can be (such as thermally conductive in following embodiments for the connection of direct contact or by other structures
Glue) it is attached, as long as the other structures can be thermally conductive.
In the following, in conjunction with attached drawing to according at least one embodiment of the disclosure electronic device and electronic equipment carry out it is detailed
Explanation.
Fig. 1 is a kind of sectional view for electronic device that an embodiment of the present disclosure provides.For example, the disclosure at least one
In embodiment, as shown in Figure 1, electronic device includes support frame 100, radiator 200 and electronic component 300, the one of radiator 200
Side is connect with support frame 100, and the other side of radiator 200 is connect with electronic component 300.Radiator 200 is by 300 work of electronic component
The heat generated in work is at least partly conducted to support frame 100.Support frame 100 can dissipate the heat imported by radiator 200
It is sent in the external world, plays the role of auxiliary heat dissipation, improve the heat dissipation effect of electronic device.
It is carried out in the following, establishing rectangular coordinate system in space on the basis of support frame with the position to each structure in electronic device
Directive property explanation.For example, as shown in Figure 1, X-axis, Y-axis (perpendicular to paper, being not shown in the figure, with reference to the Y-axis in Fig. 3) are parallel to
100 place face of support frame, Z axis is perpendicular to 100 place face of support frame.
For example, at least one embodiment of the disclosure, as shown in Figure 1, electronic component 300 is located at the remote of radiator 200
Side from support frame 100.In this way, being conducive to the heat that electronic component 300 generates at work is conducted to radiator 200,
And by uniform conductive to radiator 200, asked such as performance decline, ageing equipment caused by thus slowing down because of heat concentration of local
Topic, improves the heat dissipation effect of electronic device.In addition, size of the radiator 200 on Z axis can be designed as be less than X-axis (or
Person's Y-axis) on size, in this way, design thickness of the electronic device on Z axis can be reduced, and 200 He of radiator can be increased
Contact area between electronic component 300 improves the efficiency that electronic component 300 conducts heat into radiator 200.
For example, support frame includes Heat Conduction Material in the electronic device that at least one embodiment of the disclosure provides.In this public affairs
It opens at least one embodiment, with no restrictions to the type of the material of support frame, as long as support frame can have heat sinking function i.e.
It can.For example, the thermal coefficient of the Heat Conduction Material in support frame is about 50W/ (mK)~300W/ (mK), further it is, for example,
60W/ (mK), 100W/ (mK), 150W/ (mK), 200W/ (mK), 250W/ (mK) etc..For example, Heat Conduction Material can
Think one of metal material, such as magnesium alloy, aluminium alloy, cold forging aluminium and other Heat Conduction Materials or combination, or nitrogen
Change aluminium.The intensity of cold forging aluminium is big, thermal conductivity is high so that support frame while with biggish rigidity have it is good it is thermally conductive and
Heat dissipation performance.
In at least one embodiment of the disclosure, with no restrictions to the type of electronic component.For example, electronic component can wrap
Include CPU, storage equipment, high speed processor, power module, connector, luminescent device etc., can by clamping, threadeds connection, glue
The modes such as knot, setting on a heat sink, and pass through the realizations such as conducting wire set in addition, signal wire power supply and signal input and output
Function.
It include that the two directly connects to the connection type between radiator and support frame at least one embodiment of the disclosure
Touching modes such as (such as by) being clamped, be threadedly coupled, by thermally conductive gluing knot etc. so that can be between radiator and support frame
Row heat transfer.
For example, the electronic device that at least one embodiment of the disclosure provides, further includes heat-conducting glue, wherein thermally conductive glue connection
Radiator and support frame.Illustratively, as shown in Figure 1, being provided with heat-conducting glue 400 between support frame 100 and radiator 200.It leads
Radiator 200 can be fixed on support frame 100 by hot glue 400, and heat-conducting glue 400 has the good capacity of heat transmission, can be with
Partial heat in radiator 200 is conducted into support frame 100.The material of heat-conducting glue 400 may include heat conductive silica gel, thermally conductive
Silicone grease or other materials.
For example, radiator and support frame are integrally formed in the electronic device that at least one embodiment of the disclosure provides.Figure
The sectional view of the 2 another electronic devices provided for an embodiment of the present disclosure.Illustratively, as shown in Fig. 2, radiator 200
It is integrally formed with support frame 100.In this way, relative to embodiment shown in FIG. 1, can be improved radiator 200 and support frame 100 it
Between heat transfer efficiency, and improve the stability of the structure of electronic device.
For example, at least one embodiment of the disclosure provide electronic device in, radiator include the first cooling fin, first
Cooling fin is connected with support frame.Illustratively, as depicted in figs. 1 and 2, radiator 200 includes the first cooling fin 210.First
Cooling fin 210 can be set to multiple, and the first cooling fin 210 can increase the heat dissipation area of radiator 200, will be by electronic component
300 heats imported are distributed by modes such as heat radiation, thermal convections into external environment.For example, as shown in Fig. 2, the first heat dissipation
Piece 210 can be integrally formed with support frame 100.For example,
For example, radiator includes radiator fan in the electronic device that at least one embodiment of the disclosure provides.Fig. 3 is
The structural schematic diagram of one of the electronic device that an embodiment of the present disclosure provides radiator is radiator shown in Fig. 2
200 plan view.Illustratively, as shown in figure 3, radiator 200 includes radiator fan 220.Radiator fan 220 can accelerate sky
Flow of air improves the effect that support frame 100 is radiated by thermal convection.For example, as shown in Figures 2 and 3, in radiator 200
In be provided with the first cooling fin 210 in the case where, radiator fan 220 can also be improved the first cooling fin 210 by thermal convection into
The effect of row heat dissipation, improves the efficiency of radiator heat-dissipation.
In at least one embodiment of the disclosure, to the first cooling fin 210 and radiation air of support frame 100, radiator 200
Fan 220 between positional relationship with no restrictions, as long as radiator fan 220 be set as increase the first cooling fin 210 on air stream
Speed air flow in dynamic speed or the first cooling fin 210 and support frame 100.
For example, radiator includes heat pipe, liquid cooling circulation pipe in the electronic device that at least one embodiment of the disclosure provides
Deng to further strengthen heat dissipation effect.
In at least one embodiment of the disclosure, with no restrictions to the positional relationship of radiator and support frame, as long as heat dissipation
Device can transmit heat to support frame.For example, in the electronic device that at least one embodiment of the disclosure provides, support frame
Including the first main surface, radiator is located in the first main surface.
Fig. 4 is the sectional view for another electronic device that an embodiment of the present disclosure provides.Illustratively, as shown in figure 4,
Support frame 100 includes the first main surface 101, and the first main surface 101 is the relatively large surface of area of support frame 100.Heat dissipation
Device 200 is arranged in the first main surface 101, and the heat for helping to be imported by radiator 200 in support frame 100 is in support frame 100
Middle diffusion improves the heat dissipation effect of support frame 100.
For example, at least one embodiment of the disclosure, as shown in figure 4, radiator 200 can be located at support frame 100
At the geometric center of first main surface 101, in this way, can be further improved the heat imported in support frame 100 by radiator 200
Diffusion in support frame 100 further increases the heat dissipation effect of support frame 100.
For example, in the electronic device that at least one embodiment of the disclosure provides, the table for being provided with radiator of support frame
At least one concaveconvex structure is provided on face.For example, the first main surface of support frame is provided at least one concaveconvex structure.Fig. 4
For the sectional view for another electronic device that an embodiment of the present disclosure provides.Illustratively, as shown in figure 4, support frame 100
At least one concaveconvex structure 110 (part of the first main surface 101 being located in dotted line frame) is provided in first main surface 101.
Concaveconvex structure 110 can increase the surface area of the first main surface 101, to increase the heat dissipation area of support frame 100, improve support
The heat dissipation effect of frame.
For example, at least one embodiment of the disclosure, as shown in figure 4, concaveconvex structure 110 is located at the first main surface 101
The not region Chong Die with radiator 200.For example, the not region Chong Die with radiator 200 of the first main surface 101 is both provided with
Concaveconvex structure 110 further increases the heat dissipation effect of support frame in this way, can be further improved the heat dissipation area of support frame 100
Fruit.
It should be noted that concaveconvex structure can at least one embodiment of the disclosure (such as embodiment shown in Fig. 4)
Think protrusion or recess or simultaneously including protrusion and recess.
For example, in the electronic device that at least one embodiment of the disclosure provides, the table for being provided with radiator of support frame
At least one metal strip can be set on face.For example, support frame further includes at least one metal in the first main surface
Item.For example, at least one of metal strip is set as from radiator to far from radiator at least one embodiment of the disclosure
Extend.
Fig. 5 is the floor map for another electronic device that an embodiment of the present disclosure provides.Illustratively, such as Fig. 5
Shown, support frame 100 includes at least one metal strip 120 being arranged in the first main surface 101.For example, metal strip 120 is opposite
It is higher in the thermal conductivity of the other parts of support frame, heat can be made to transmit along metal strip 120, by metal strip 120
Distribution in the first main surface 101 is designed, and can regulate and control distribution of the heat in support frame 100.For example, such as Fig. 5 institute
Show, metal strip 120 can be set to extend from radiator 200 to far from radiator 200.Illustratively, metal strip 120 is set as
Multiple, metal strip 120 can be set to the radial distribution centered on radiator 200.In this way, in heat by radiator 200
When importing support frame 100, partial heat can be transmitted along metal strip 120 to the fringe region of support frame 100, to improve heat
The uniformity coefficient being distributed in support frame 100 further increases the heat dissipation effect of support frame.
For example, in the electronic device that at least one embodiment of the disclosure provides, the table for being provided with radiator of support frame
At least one second cooling fin can be set on face.For example, support frame further includes at least one second cooling fin.For example, the
The setting of two cooling fins is not on the first major surface and Chong Die with radiator.
Fig. 6 is the sectional view for another electronic device that an embodiment of the present disclosure provides.Illustratively, as shown in fig. 6,
Support frame 100 includes multiple second cooling fins 130 being arranged in the first main surface 101.In this way, the part in support frame 100
Heat can import the second cooling fin 130 and radiate, to improve the heat dissipation area of entire support frame 100, improve
The heat dissipation effect of support frame 100.
For example, at least one embodiment of the disclosure, in the case where the second cooling fin is provided in support frame, second
Cooling fin can use heat-conducting glue or other way is fixed on the first major surface；Or support frame can be set and be integrated into
Type.For example, the material of the second cooling fin can be with the material of reference support frame, as long as the second cooling fin can be thermally conductive, this public affairs
This is not restricted for the embodiment opened.
It should be noted that the side of concaveconvex structure, metal strip, the second cooling fin is arranged in the first main surface of support frame
Formula can be combined with each other, as long as will not cause bad shadow to the performance of electronic device while increasing the heat dissipation area of support frame
Sound.
At least one embodiment of the disclosure provides a kind of electronic equipment, which may include aforementioned any embodiment
In electronic device.For example, the electronic equipment can so that the electronic equipment can be for applied to the display equipment of display field as an example
Think any product having a display function such as tablet computer, television set, display, laptop, Digital Frame, navigator
Or component.For example, display equipment can be applied to two dimension display or Three-dimensional Display field.For example, display equipment can be applied
In fields such as the field virtual reality (VR), augmented reality (VA), mixed realities (MR).
In the following, by electronic equipment be applied to the VR glasses in Three-dimensional Display field for, it is following to the disclosure at least one
Technical solution in embodiment is illustrated.
For example, other than aforementioned electronic, further including in the electronic equipment that at least one embodiment of the disclosure provides
Display panel and lens, display panel with electronic component by being electrically connected, the modes signal such as light connects connects and is located at support
On frame, lens are located at the side of the separate support frame of display panel.
Fig. 7 is the structural schematic diagram for a kind of electronic equipment that an embodiment of the present disclosure provides.Illustratively, such as Fig. 7 institute
Show, electronic equipment further includes display panel 500 and lens 600.Support frame 100 in electronic device includes and the first main surface
101 the second opposite main surfaces 102, display panel 500 and lens 600 are arranged in the second main surface 102, and display panel
500 between lens 600 and support frame 100.Electronic component 300 is, for example, central processing unit, such as SOC chip, and aobvious
Show the connection of 500 signal of panel to control the display panel 500 display state.Display panel 500 can be Organic Light Emitting Diode
(OLED) display panel, micro- LED (Micro-LED) display panel, liquid crystal display panel etc..In the operational process of electronic equipment
In, the heat that the electronic component 300 in electronic equipment generates is radiated jointly by radiator and support frame, and display panel 500
The heat of generation can also be radiated by support frame, it is possible thereby to improve the heat dissipation effect of electronic equipment, reduce setting for radiator
Size is counted to reduce the size and weight of electronic equipment.
For example, support frame 100 can be used as the support isostructural backboard of display panel 500；Or it can be in electronic equipment
To support the structures such as display panel 500, support frame 100 can be connect to provide rigid support additional setting backboard with backboard.
In electronic equipment as shown in Figure 7, display panel 500 can produce anaglyph, and the anaglyph is by saturating
The right and left eyes of user are respectively enterd after mirror 600, to realize the display of 3-D image.Lens 600 can make user see
Image is the virtual image, and the size of the virtual image and the distance of the eyes to user are greater than the size and extremely of display panel 500
The distance of eyes of user.In this way, lens 600 can increase visual angle and the image-forming range of the display image of display equipment, so that aobvious
Show that the design spacing of panel 500 and eyes of user can reduce, is conducive to the miniaturization for showing equipment.
In at least one implementation of the disclosure, with no restrictions to the set-up mode between display panel and lens, as long as aobvious
Show that panel and lens meet display and require, such as the 3-D image for meeting demand can be provided a user.
For example, beam splitter can be set in the light emission side of display panel at least one embodiment of the disclosure, the light splitting
The image that element can make display panel provide is converted to anaglyph.The beam splitter can be set on a display panel,
Also it can be set on lens.
For example, at least one embodiment of the disclosure provide electronic equipment in, display panel include first display daughter board and
Second display daughter board, lens include the first lens and the second lens, and the first lens are located at the separate support frame of the first display daughter board
Side, the second lens be located at second display daughter board separate support frame side.
Illustratively, as shown in fig. 7, display panel 500 includes that the first display daughter board 510 and second show daughter board 520, thoroughly
Mirror 600 include the first lens 610 and the second lens 620, the first lens 610 be located at first display daughter board 510 display side, second
Lens 620 are located at the display side of the second display daughter board 520.First display daughter board 510 and the second display daughter board 520 can mention respectively
For display image to constitute anaglyph.
At least one embodiment of the disclosure provides a kind of electronic device and electronic equipment, and can have following at least one
Item beneficial effect：
(1) in the electronic equipment that at least one embodiment of the disclosure provides, what radiator can generate electronic component
Heat is at least partly conducted to radiate, support frame and radiator radiate jointly, and electronic device can be improved on support frame
Heat dissipation effect.
(2) in the electronic equipment that at least one embodiment of the disclosure provides, can be arranged in the main surface of support frame
The structures such as concaveconvex structure, metal strip or the second cooling fin are to increase the heat dissipation area of support frame, to further increase electronics dress
The heat dissipation effect set.
For the disclosure, need to illustrate there are also the following：
(1) embodiment of the present disclosure attached drawing relates only to the structure being related to the embodiment of the present disclosure, and other structures can refer to
It is commonly designed.
(2) for clarity, in the attached drawing for describing implementation of the disclosure example, the thickness in layer or region is amplified
Or reduce, i.e., these attached drawings are not drawn according to actual ratio.
(3) in the absence of conflict, the feature in embodiment of the disclosure and embodiment can be combined with each other to obtain
New embodiment.
More than, the only specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, the disclosure
Protection scope should be subject to the protection scope in claims.
Claims (12)
1. a kind of electronic device, which is characterized in that including support frame, radiator and electronic component, wherein the one of the radiator
Side is connect with support frame as described above, and the other side of the radiator is connect with the electronic component, and thus the radiator will be described
The heat generated in electronic component work is at least partly conducted to support frame as described above.
2. electronic device according to claim 1, which is characterized in that the radiator and support frame as described above are integrally formed.
3. electronic device according to claim 1, which is characterized in that further include heat-conducting glue, wherein the thermally conductive glue connection
The radiator and support frame as described above.
4. electronic device according to claim 1-3, which is characterized in that the radiator includes the first heat dissipation
Piece, first cooling fin are connected with support frame as described above.
5. electronic device according to claim 1-3, which is characterized in that support frame as described above is provided with described dissipate
At least one concaveconvex structure is provided on the surface of hot device.
6. electronic device according to claim 1-3, which is characterized in that support frame as described above is provided with described dissipate
At least one metal strip is provided on the surface of hot device, wherein at least one of described metal strip is set as from the heat dissipation
Device extends to far from the radiator.
7. electronic device according to claim 1-3, which is characterized in that support frame as described above is provided with described dissipate
Be provided at least one second cooling fin on the surface of hot device, second cooling fin on said surface not with the radiator
Overlapping.
8. electronic device according to claim 1-3, which is characterized in that the radiator includes radiator fan.
9. electronic device according to any one of claim 1-3, which is characterized in that support frame as described above includes heat conduction material
Material.
10. a kind of electronic equipment, which is characterized in that including electronic device of any of claims 1-9.
11. electronic equipment according to claim 10, which is characterized in that further include：
Display panel connect with the electronic component signal and is located on support frame as described above；
Lens, positioned at the side of the separate support frame as described above of the display panel.
12. electronic equipment according to claim 11, which is characterized in that
The display panel includes the first display daughter board and the second display daughter board, and the lens include that the first lens and second are saturating
Mirror；
First lens are located at the side of the separate support frame as described above of the first display daughter board, and second lens are located at institute
State the side of the separate support frame as described above of the second display daughter board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820619845.2U CN208159101U (en) | 2018-04-27 | 2018-04-27 | Electronic device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820619845.2U CN208159101U (en) | 2018-04-27 | 2018-04-27 | Electronic device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208159101U true CN208159101U (en) | 2018-11-27 |
Family
ID=64376028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820619845.2U Active CN208159101U (en) | 2018-04-27 | 2018-04-27 | Electronic device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208159101U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109373817A (en) * | 2018-12-28 | 2019-02-22 | 珠海银河温控技术有限公司 | A kind of ballistic protective clothing with heating refrigerating function |
-
2018
- 2018-04-27 CN CN201820619845.2U patent/CN208159101U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109373817A (en) * | 2018-12-28 | 2019-02-22 | 珠海银河温控技术有限公司 | A kind of ballistic protective clothing with heating refrigerating function |
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