1279184 九、發明說明： 【發明所屬之技術領域】 本發明與一種散熱裝置有關，特別是與一種負壓式散 _ 熱裝置有關。 【先前技術】 隨著對於個人電腦運算能力需求的增加，例如中央處 理器（CPU)或圖形處理器（GPU)等許多重要元件，不 • 斷地增加電晶體的密度，雖然提昇了效能，但其操作過程 也產生了大置的熱能。對於多數電子產品的積體電路晶片 而言，熱源的產生不僅會影響電子晶片操作性能，而且長 期處在過高的操作溫度環境下，更可能會使晶片的使用壽 命大幅縮減。 目前電子元件所使用的散熱系統可採用下列不同的方 式：直接操作於電子裝置熱製造元件之被動對流；添加主 _ 動冷卻解決方案，如風扇冷卻系統；放置散熱片與該熱製 造元件傳導接觸，接著使該散熱片與該元件於熱均衡中並 經由對流裝置散熱。 使用被動式散熱元件的方法，其效果端視所配置之散 • 熱元件（通常為散熱鰭片）的尺寸以及各元件間空氣對流 ' 的效果而定。然而，散熱鰭片的大小不可能過份擴張，較 大散熱鰭片通常會增加散熱鰭片元件成本，此外，大體積 的散熱鰭片也會佔據過大的空間。因此，具競爭性散熱設 備大小必須相當緊密且必須執行於足以使高效能組件不致 1279184 超過其操作熱規範之基準。 因此傳統使用被動式散熱元件的方法，已無法有效排 . 除這些高耗能電子元件所產生的廢熱。於是利用風扇來促 ， 進空氣對流，以達提昇散熱功效如今成為散熱領域克服散 熱問題常見的手段。 請參閱第一圖，其係為習知技術之散熱裝置之示意 圖，該裝置係設置於一電子元件101上，包括一散熱鰭片 0 111以及一散熱風扇121。該風扇121係裝設於該散熱鰭片 111上，其扇葉122轉動時，會產生一氣流123來吹拂該 散熱鰭片111，以藉由空氣的流動帶走該電子元件1〇1所 產生之多餘的廢熱。 然而，習知技術所採用之方式，係將風扇配置為向散 熱鰭片吹拂，以帶走廢熱，此時散熱之效果取決於風扇大 小、轉速以及搭配之散熱鰭片的尺寸，若要增加散熱效果， 需要提高扇、葉的大小以及風扇的轉速，雖然可以消除廢 • 熱，卻使得風扇轉動的聲音與氣流吹過散熱鰭片表面時產 生的風切聲成為嚴重的噪音干擾；此外，過大的風扇轉動 時所消耗的電能，也不符合現在要求輕薄短小主機之發展 趨勢。 職是之故，申請人鑑於習知技術中所產生之缺失，乃 經悉心試驗與研究，並一本鍥而不捨之精神，終構思出本 案「對流式散熱裝置」，以下為本案之簡要說明。 【發明内容】 6 1279184 f發明之構想係提出一種散熱裳置，包括一吸熱元 ^牛、一散熱元件以及-風扇。該散熱元件係由重疊排列於 X吸,、、、7L件上之多個散熱H片所組成，其中各該散熱韓片 ^間具有1距離以形成-間隙，且各該散熱鰭片係具有 =孔，該等通孔共同形成—通道，且該通道係具有封閉 =封閉端。該風扇係對應設置於該通道之該封閉端之另 一端。該風扇轉動產生之氣流係由各該散熱鰭片之間之該 間隙流入’並由該風扇流出，以散逸該散熱元件所^ 熱量。 依據本發明之-實施例，該散熱裝置更包括 件，以連接該吸熱元件以及該散熱元件。 ’、、 ，佳者▲，該導熱元件為—導熱f，其係固定於該吸熱 70牛上，且该導熱管係接觸各該散熱鰭片。 較佳者，該導熱管係穿過各該散熱鰭片。 依據本發明之另—實施例，各該散_片係 一圓形之該通孔。 /、有 該等通孔係分別位於各該 該通道之該封閉端係直接 該通道之該封閉端係為一 依據本發明之另一實施例 散熱鰭片之中央。 依據本發明之另一實施例 與該吸熱元件接觸。 依據本發明之另一實施例 不具有該通孔之該散熱鰭片。 本發明之另一構想係提出一種散熱 元件、—«轉、H㊃及1 = 一吸熱 乐一風扇。該散熱 7 1279184 元件係由重疊排列於該吸熱元件上方之多個散熱縛片所組 成其中各该散熱籍片之間具有一定距離以形成一間隙， 且各该散熱鰭片係具有―通孔，該等通孔共同形成一通 C孩第風扇係對應設置於該通道之一端，以及該第二 風扇係對應設置於該通道之另一端。其中，該第一與第二 風扇轉動時，氣流係由各該散熱鰭片之間之該間隙流入，1279184 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a heat sink, and more particularly to a negative pressure type heat sink. [Prior Art] As the demand for computing power of personal computers increases, such as a central processing unit (CPU) or a graphics processing unit (GPU), many important components do not increase the density of the transistor, although the performance is improved. The operation also produces large amounts of thermal energy. For integrated circuit chips of most electronic products, the generation of heat sources not only affects the operation performance of the electronic wafer, but also the long operating temperature environment, which is more likely to greatly reduce the life of the wafer. At present, the heat dissipation system used in electronic components can be used in the following different ways: direct operation of passive convection of components of the electronic device; addition of a main-cooling solution, such as a fan cooling system; placement of heat sinks in conductive contact with the thermally fabricated component Then, the heat sink and the component are thermally equalized and dissipated via the convection device. The effect of using a passive heat sink depends on the size of the configured heat sink (usually the heat sink fins) and the effect of air convection between the components. However, the size of the heat sink fins may not be excessively expanded, and the larger heat sink fins generally increase the cost of the heat sink fin components, and in addition, the large heat sink fins occupy an excessive space. Therefore, competitive heat sinks must be fairly compact and must be implemented on a baseline sufficient for high performance components to not exceed 1279184's operating thermal specifications. Therefore, the traditional method of using passive heat dissipating components has been unable to effectively discharge the waste heat generated by these high energy consuming electronic components. Therefore, the use of fans to promote air convection to improve heat dissipation is now a common means of overcoming heat dissipation in the field of heat dissipation. Referring to the first drawing, which is a schematic diagram of a heat dissipating device of the prior art, the device is disposed on an electronic component 101 and includes a heat dissipating fin 0 111 and a heat dissipating fan 121. The fan 121 is mounted on the heat dissipation fin 111. When the blade 122 rotates, an air flow 123 is generated to blow the heat dissipation fin 111 to take away the electronic component 1〇1 by the flow of air. Excess waste heat. However, the conventional technology adopts a method in which the fan is configured to blow the heat sink fins to take away the waste heat, and the heat dissipation effect depends on the size of the fan, the rotation speed, and the size of the heat sink fins to be added. The effect is that the fan and the size of the fan and the fan speed need to be increased. Although the waste heat can be eliminated, the sound of the fan rotating and the wind cut caused by the airflow blowing over the surface of the heat sink fin become severe noise interference; The power consumed by the fan is not in line with the current trend of demanding thin and light short hosts. For the sake of the job, the Applicant has conceived the "convection heat sink" in the light of the lack of experience in the prior art, and has carefully tested and researched it. The following is a brief description of the case. SUMMARY OF THE INVENTION 6 1279184 f The idea of the invention is to provide a heat sink, including a heat absorbing element, a heat dissipating component, and a fan. The heat dissipating component is composed of a plurality of heat dissipating H chips arranged in an overlapping manner on the X-sucking, s, and 7L members, wherein each of the heat dissipating heat-dissipating fins has a distance to form a gap, and each of the heat dissipating fins has = holes, which together form a channel, and the channel has a closed = closed end. The fan is correspondingly disposed at the other end of the closed end of the passage. The air flow generated by the rotation of the fan flows into and out of the gap between the heat radiating fins to dissipate the heat of the heat dissipating component. According to an embodiment of the invention, the heat sink further includes a member for connecting the heat absorbing member and the heat dissipating member. ',,, preferably ▲, the heat conducting element is - heat conduction f, which is fixed on the heat sink 70, and the heat pipe contacts each of the heat sink fins. Preferably, the heat pipe is passed through each of the heat dissipation fins. According to another embodiment of the invention, each of the sheets is a circular through hole. And having the through holes respectively located at the closed end of each of the channels, the closed end of the channel being a center of the heat dissipating fin according to another embodiment of the present invention. According to another embodiment of the invention, the heat absorbing element is in contact. According to another embodiment of the present invention, the heat dissipation fins of the through holes are not provided. Another idea of the present invention is to provide a heat dissipating component, - "turn, H four and 1 = a heat-absorbing fan. The heat dissipating 7 1279184 component is composed of a plurality of heat dissipating fins arranged over the heat absorbing element, wherein each of the heat dissipating fins has a certain distance to form a gap, and each of the heat dissipating fins has a through hole. The through holes together form a one-way C-fan system corresponding to one end of the channel, and the second fan system is correspondingly disposed at the other end of the channel. Wherein, when the first and second fans rotate, the airflow flows from the gap between the heat dissipation fins,
並由4第-與第二風扇流出，以散逸該散熱元件所接收之 熱量。 依據本發明之一實施例，該散熱裝置更包括一導熱元 件，以連接該吸熱元件以及該散熱元件。 車乂佺者，該導熱元件為一導熱管，其係固定於該吸熱 元件上，且該導熱管係接觸各該散熱鰭片。 … 較佳者，該導熱管係穿過各該散熱鰭片。 依據本發明之另一實施例，各該散熱鰭片係分別具有 一圓形之該通孔。And flowing out of the 4th - and second fans to dissipate the heat received by the heat dissipating component. According to an embodiment of the invention, the heat sink further includes a heat conducting component for connecting the heat absorbing element and the heat dissipating component. In the rudder, the heat conducting component is a heat conducting pipe fixed to the heat absorbing component, and the heat conducting pipe contacts each of the heat radiating fins. Preferably, the heat pipe is passed through each of the heat dissipation fins. According to another embodiment of the present invention, each of the heat dissipating fins has a circular through hole.
依據本發明之另一實施例 散熱鰭片之中央。 該等通孔係分別位於各該 本發明之另一構想係提出一種散熱方法，包括：提供 一吸熱元件，以吸收一電子元件產生之熱能；提供一具有 玉通遏之一散熱元件，以接收該吸熱元件之熱能，其中該 ^70件係由多個散減片所組成，各該散熱鰭片並具有 疋距離以形成一間隙，且各該散熱鰭片分別具有一通 孔，該等通孔共同形成該通道；以及提供至少一風扇，其 係配置於該散熱元件上，使該風扇轉動時，於該散熱元件 8 1279184 • 之該通道產生一負壓，使氣流由各該散熱鰭片之間之間隙 流入，並由該風扇流出，以散逸該散熱元件所接收之熱量。 依據本發明之一實施例，該散熱元件未配置該風扇之 另一端係為封閉的。 依據本發明之另一實施例，該散熱元件之兩端係同時 分別配置一風扇。 依據本發明之另一實施例，各該散熱片係分別具有一 $ 圓形之該通孔。 依據本發明之另一實施例，該等通孔係分別位於各該 散熱鰭片之中央。 依據本發明之另一實施例，本發明所提供之散熱方 法，更包括提供一導熱元件，以連接該吸熱元件以及該散 熱元件。 較佳者，該導熱元件為一導熱管，其係固定於該吸熱 元件上，且該導熱管係接觸各該散熱鰭片。 • 為了易於說明，本發明得藉由下述之較佳實施例及圖 示而得到充分暸解，並使得熟習本技藝之人士可以據以完 成之，然本發明之實施型態並不限制於下列實施例中。 【實施方式】 "本發明係利用散熱元件之配置，使得風扇轉動時產生 一吸風負壓力，將冷卻風流自外界吸入至散熱鰭片進行散 熱，當廢熱藉由吸熱元件傳遞至散熱鰭片時，使得廢熱能 透過此配置達到靜音與高效能散熱。此外，.透過本發明所 1279184 * 提供之散熱裝置，風扇配置的位置可以兼顧到周邊電子元 件的散熱效果。 請參閱第二圖，其為依據本發明之散熱元件之示意 圖。散熱元件20係由多個散熱鰭片21堆疊而成，各該等 散熱鰭片21分別具有一通孔22，以形成該散熱元件20之 通道。該通孔22之形狀包括但不限於圓形、矩形、橢圓形 等，只要所形成之通道可供空氣流通即可。於較佳實施例 φ 中，該通孔22係為圓形，且分別位於各該散熱鰭片21之 中央。 . 請參閱第三圖，其為依據本發明之散熱元件之一較佳 實施例之側視示意圖。本實施例中散熱裝置係配置一個風 扇，該散熱裝置包括吸熱元件31、散熱元件32以及風扇 33。散熱元件32係由前述之多個具有通孔之散熱鰭片所堆 疊而成，而各該通孔即共同形成通道34。散熱元件之一端 固定在吸熱元件31表面，風扇33則配置於散熱元件32之 • 另一端。當風扇33轉動時，產生一吸風負壓力，氣流會沿 著方向A從相鄰散熱鰭片之間隙流入通道34中，並以風 扇33為出口，依方向B集中排出。由於散熱元件32係直 接固定於吸熱元件31表面，故其未配置風扇33之一端係 直接與吸熱元件31之表面接觸，而形成封閉的狀態。 接下來請參閱第四圖，其為依據本發明之散熱裝置之 一較佳實施例之侧視示意圖。本實施例中散熱裝置除了吸 熱元件41、散熱元件42以及風扇44,更包含了導熱管43。 導熱管43係固著於吸熱元件41表面，其延伸之管線係用 1279184 • 於接觸、支持散熱元件42，於本實施例中，導熱管43係 穿過散熱元件42。 當風扇44轉動時，產生一吸風負壓力，氣流係沿著方 向A由相鄰散熱鰭片之間隙流入通道45中，並自風扇44 處沿著方向B排出。值得注意的是，在本實施例中，散熱 元件42未配置風扇44之另一端點46之最後一片散熱鰭片 不具有通孔，因此散熱元件42之端點46係成為一個封閉 • 面。 請參閱第五圖，其為依據本發明之散熱裝置之另一較 佳實施例之側視示意圖。本實施例中，散熱裝置包括吸熱 元件51、散熱元件52、導熱管53以及配置於散熱元件52 兩端之兩個風扇54、55。風扇54、55係為相反方向之配 置，使風扇54、55轉動時，產生一吸風負壓力，氣流係沿 著方向A由相鄰散熱鰭片之間隙流入通道56中，並分別 由風扇54、55處沿著方向B、C排出。 • 本發明所提供之散熱方法，係透過吸入式的冷卻風流 設定，可有效降低風扇運轉時的風切聲，降低系統噪音。 依據本發明所提供之散熱方法，吸風時風的流動是全面且 流速低，而吹出時是風速快有集中區域，而低流速的風流 經散熱鰭片會比高流速流經散熱鰭片更能降低噪音，所以 此配置有效降低風扇運轉時的噪音。 此外，可視系統需求適度增大所配置之風扇之尺寸， 相較於同樣風扇尺寸大小之習知散熱裝置，本發明所提供 之散熱裝置可具有較低之噪音以及較佳之散熱效果。若以 11 1279184 使用者能接受之噪音程度而言，在產生相同噪音之條件 下，本發明所提供之散熱裝置可提供較佳之散熱效果。 由上述可知，本發明係利用散熱元件以及風扇配置位 置之交互關係，使散熱效果得以最佳化，達到優質之散熱 性能。 本發明得由熟悉本技藝之人士任施匠思而為諸般修 飾，然皆不脫如附申請專利範圍所欲保護者。According to another embodiment of the present invention, the center of the heat sink fin. The other embodiments of the present invention provide a heat dissipation method, comprising: providing a heat absorbing element to absorb heat generated by an electronic component; and providing a heat dissipating component having a jade pass to receive The heat energy of the heat absorbing element, wherein the 70 parts are composed of a plurality of diffusing fins, each of the heat dissipating fins has a 疋 distance to form a gap, and each of the heat dissipating fins has a through hole, the through holes Forming the channel together; and providing at least one fan disposed on the heat dissipating component, such that when the fan rotates, a negative pressure is generated in the channel of the heat dissipating component 8 1279184 to cause airflow from each of the heat dissipating fins The gap flows in and flows out of the fan to dissipate the heat received by the heat dissipating component. According to an embodiment of the invention, the heat dissipating component is not configured to be closed at the other end of the fan. According to another embodiment of the present invention, both ends of the heat dissipating component are respectively configured with a fan. According to another embodiment of the invention, each of the heat sinks has a through hole of a circular shape. According to another embodiment of the present invention, the through holes are respectively located at the center of each of the heat dissipation fins. According to another embodiment of the present invention, the heat dissipation method provided by the present invention further includes providing a heat conducting component for connecting the heat absorbing component and the heat radiating component. Preferably, the heat conducting component is a heat conducting tube fixed to the heat absorbing component, and the heat conducting pipe contacts each of the heat radiating fins. The present invention will be fully understood by the following description of the preferred embodiments and the accompanying drawings. In the examples. [Embodiment] The present invention utilizes the arrangement of the heat dissipating components such that a negative suction pressure is generated when the fan rotates, and the cooling airflow is drawn from the outside to the heat dissipating fins for heat dissipation, and the waste heat is transmitted to the heat dissipating fins through the heat absorbing element. At this time, waste heat can be muted and efficiently dissipated through this configuration. In addition, through the heat sink provided by the invention 1279184*, the position of the fan arrangement can balance the heat dissipation effect of the peripheral electronic components. Please refer to the second figure, which is a schematic view of a heat dissipating component in accordance with the present invention. The heat dissipating component 20 is formed by stacking a plurality of heat dissipating fins 21, and each of the heat dissipating fins 21 has a through hole 22 to form a passage of the heat dissipating component 20. The shape of the through hole 22 includes, but is not limited to, a circular shape, a rectangular shape, an elliptical shape, and the like as long as the formed passage is available for air circulation. In the preferred embodiment φ, the through holes 22 are circular and located at the center of each of the heat dissipation fins 21, respectively. Referring to the third drawing, which is a side elevational view of a preferred embodiment of a heat dissipating component in accordance with the present invention. In the embodiment, the heat dissipating device is provided with a fan, and the heat dissipating device comprises a heat absorbing element 31, a heat dissipating component 32 and a fan 33. The heat dissipating component 32 is formed by stacking a plurality of the above-mentioned heat dissipating fins having through holes, and each of the through holes forms a channel 34. One end of the heat dissipating member is fixed to the surface of the heat absorbing member 31, and the fan 33 is disposed at the other end of the heat dissipating member 32. When the fan 33 rotates, a suction negative pressure is generated, and the airflow flows into the passage 34 from the gap of the adjacent heat radiating fins in the direction A, and is discharged in the direction B by the fan 33 as an outlet. Since the heat dissipating member 32 is directly fixed to the surface of the heat absorbing member 31, one end of the undisposed fan 33 is directly in contact with the surface of the heat absorbing member 31 to form a closed state. Next, please refer to the fourth figure, which is a side view of a preferred embodiment of a heat sink according to the present invention. In addition to the heat absorbing element 41, the heat dissipating component 42, and the fan 44, the heat dissipating device of the present embodiment further includes a heat transfer pipe 43. The heat pipe 43 is fixed to the surface of the heat absorbing member 41, and the extended pipe is used for contacting and supporting the heat dissipating member 42. In the present embodiment, the heat pipe 43 passes through the heat dissipating member 42. When the fan 44 rotates, a suction negative pressure is generated, and the air flow flows into the passage 45 from the gap of the adjacent heat radiating fins in the direction A, and is discharged from the fan 44 in the direction B. It should be noted that in the present embodiment, the last heat sink fin of the other end point 46 of the heat dissipating component 42 that is not disposed with the fan 44 does not have a through hole, so that the end point 46 of the heat dissipating component 42 becomes a closed surface. Please refer to the fifth drawing, which is a side elevational view of another preferred embodiment of the heat sink according to the present invention. In this embodiment, the heat sink includes a heat absorbing element 51, a heat dissipating component 52, a heat pipe 53, and two fans 54, 55 disposed at both ends of the heat dissipating component 52. The fans 54, 55 are arranged in opposite directions. When the fans 54, 55 are rotated, a suction negative pressure is generated, and the air flow flows into the passage 56 from the gap of the adjacent heat radiating fins along the direction A, and is respectively driven by the fan 54. 55 is discharged along directions B and C. • The heat dissipation method provided by the present invention is set by the suction cooling air flow, which can effectively reduce the wind cut sound during the fan operation and reduce the system noise. According to the heat dissipation method provided by the present invention, the wind flow is comprehensive and the flow rate is low when sucking air, and the wind speed has a concentrated area when blowing, and the low flow velocity wind flows through the heat dissipation fins more than the high flow rate through the heat dissipation fins. It reduces noise, so this configuration effectively reduces the noise during fan operation. In addition, the size of the configured fan is moderately increased by the requirements of the visual system. Compared with the conventional heat sink of the same fan size, the heat sink provided by the present invention can have lower noise and better heat dissipation. The heat sink provided by the present invention can provide better heat dissipation effect under the condition that the noise is acceptable to the user in the case of 11 1279184. As can be seen from the above, the present invention utilizes the interaction relationship between the heat dissipating component and the fan arrangement position to optimize the heat dissipation effect and achieve high quality heat dissipation performance. The present invention has been modified by those skilled in the art and is intended to be modified as described in the appended claims.
12 .1279184 【圖式簡單說明】 第一圖係為習知之散熱裝置之示意圖。 第二圖係為依據本發明之散熱元件之示意圖。 第三圖係為依據本發明之散熱裝置之一實施例之側視 示意圖。 第四圖係為依據本發明之散熱裝置之一較佳實施例之 側視示意圖。 第五圖係為依據本發明之散熱裝置之另一較佳實施例 之側視示意圖。12 .1279184 [Simple description of the diagram] The first diagram is a schematic diagram of a conventional heat sink. The second figure is a schematic view of a heat dissipating component in accordance with the present invention. The third drawing is a side view of an embodiment of a heat sink according to the present invention. Figure 4 is a side elevational view of a preferred embodiment of a heat sink in accordance with the present invention. Figure 5 is a side elevational view of another preferred embodiment of a heat sink in accordance with the present invention.
【主要元件符號說明】 101電子元件 111散熱鰭片 121散熱風扇 122風扇扇葉 123氣流 20散熱元件 21散熱鰭片 22通孔 31吸熱元件 32散熱元件 33風扇 34通道 41吸熱元件 42散熱元件 43風扇 44導熱管 45通道 46封閉端點 51吸熱元件 52散熱元件 53導熱管 54風扇 55風扇 ABC氣流方向 56通道 13[Main component symbol description] 101 electronic component 111 heat sink fin 121 heat sink fan 122 fan blade 123 airflow 20 heat sink component 21 heat sink fin 22 through hole 31 heat sink component 32 heat sink component 33 fan 34 channel 41 heat sink component 42 heat sink component 43 fan 44 heat pipe 45 channel 46 closed end 51 heat absorbing element 52 heat sink element 53 heat pipe 54 fan 55 fan ABC air flow direction 56 channel 13