M336469 八、新型說明： 【新型所屬之技術領域】 本創作係-種散刻，制是—種能改變主機板上冷卻風扇的氣 f方向之設計，以有效降低中央處職的溫度，進而提昇域板使用 哥命與效能。 【先前技術】 .隨著電子技術獨的進步與發展，結合了高晝f、高音質的多媒 鲁體電腦受到消費者普遍的喜愛與使用，並加速了電腦普及化的程度。 而電腦相關產品的消費增加，也驅使相關產業的發展更加蓬勃迅速。 如同猶皆知的’電_統的效能表現，主要取決在所使關主機板， 以及裝設此主敵上諸如巾央處麵、記髓υ 的性能。 另乂新代的中央處理器以及主要晶片組而言，由於具備了更為精 細複雜的核讀構，是以可提供相當高效率的執行速度，以及更為強 大的運异魏。細，隨著操作效能的大幅增加，巾央處理器與晶片 .組在運轉時所產生的溫度_更需要有效驗。為了有断低主機板 上各兀件_作溫度，峨止溫度過將致域板故障或損壞，如何 有=冷卻巾央處職與其猶的元件，已絲當今域板設計業者 亟於突破的一個重要課題。 · ”而針對已知’目_於電腦及其使用之發鎌電子元件之散 熱器，為配合高效能之電子元件需求之散熱性，都是透過熱導管、導 熱翼片及導熱底座緊結—體組成，以快速傳遞電子元件產生之敎能作 M3 3 6469 M3 3 6469 孰效 /、、、 於整體 触:二屬，換'之，鱗，触麵、••蝴之結合設 πΙΐί寺都知直接反應對於電子元件之熱源傳遞效率，所以有 結合緊密度結轉，料提㈣成之散魅及其靜 率，為目前的散熱器結構運用各種複雜的卡扣方式加域型/、、、 成型上，有財便以及時間加卫成本之浪費。 【新型内容】 <所欲解決之技術問題> 本創作人有鑑於此，運用前窄後 报钍搂η σ ^ 傻見之、、、σ構排列形成開口一端為弧 能 的熱交換流道職，使散熱冷氣流順著熱交換 片所吸收熱源之功效目的者，二=’達到有效降低散熱 斑繼之-種具漸 <技術手段及功效> 數鱗本27要目的祕細—财漸赋舰賴轉，係為複 數政熱馳紅散齡構 片，該各料以财平延㈣兩導熱翼 i片依序窄邊對㈣·對寬邊 口政 擴張之結構，$各散^ 使賴__形成-扇型 霉及各砂片咖成—神後 流順著流道，迅速的流向各散熱片間隙並;^換_使政熱氣 的降低散熱片所吸收熱源之功效目的者。‘、、、源制快速亚有效 6 M336469 【實施方式】 為使責審查委員能進一步暸解本創作之結構，特徵及其他目 的’玆以如后之較佳實施_以圖式詳細說明如后，惟本_所說明 之貫施例係供說明之用，並非為專射請上之唯_限制者。 請配合參閱第i、2 _示，本創作之具漸進式擴張散熱結構， 如第1圖所示，該散熱結構（A)係由複數個散熱片（！ Q ) _组 ^而成，複數個散熱片（1 〇)排列後-端形成-弧科風口（ i 4;， ，藉由該上述弧形導風口（ 1 4 )能夠使-配合風扇⑻產生之冷卻 氣冰项著政熱片（1 Q )之間隙’迅速將冷卻氣流導流向各散熱片（1 .0)_二達到有效降低散熱片（1〇)所吸收之熱源之功效目的； 片Μ η Γ2圖所不’ 5亥各散熱片（10)設為C字形體，該各散熱 具有-長條片狀之主導熱片（1丄），該主導熱片（工工） 垂艇伸出，狀之導編（12)，該各散熱片⑴） 柯=—謝邊（1 2 Q )，賴（1 2 Q )以漸進式 .=延伸至另端形成寬邊（121)之設計，該各纖（1〇) 邊n 91、 喝乍邊（120)、寬邊（121)對寬 3 )、，之、、且口使各放熱片（1 0 )之間分別形成—導流道（1 供凹弧科風。(1 4 )，該弧形導風σ (1 4 )係 另1二〜具有目_端部之套合部（Β 1 )套合設置。 示，节夂^為本創作散熱結構（Α)結合示意圖所 不该各散熱片（1 〇)依序排列組人 該複數_⑴）-端形成1半^成—扇形狀之散熱結構⑷， • 牛圓弧形之集風口（ 1 5 )，藉由集 7 M336469 風口（15)㊣夠將風扇（B)產生之冷卻氣流集中，並順著各散熱 片（1 0 )間之導流道（1 3 )，迅速將冷卻氣流導流將散熱片（1 〇 ) 及收之木、源▼走，達到有效降低散熱片（1〇)所吸收熱源之功效目 的0 另明配s參考第5圖為本創作另一實施例，該各〔字形散熱片（1 0 )開放π之兩端分別S有數L形相對應之卡部（1 6 )，該各散熱片 .(1 〇 )兩側平行卡部（工6 )近轉角處分別設有一卡槽（口），該 各散熱片（1 1)由卡部（i 6)及卡槽（工7)相互卡設組合成散 熱結構（A )，該散熱結構⑷整體形成一扇型擴張之結構，且於該 各散熱片（1 Q )間形成—前窄後寬熱交換流道之導流道（丄3 )，並 7熱氣流順著流道，迅速的流向各散熱片（丄〇 )_帶走熱源， 達到快速組裝並有效的降低散熱片所魏_之功效目的者。 =所述’本創作確實可達耻賴項舰，故摘作應符專利 申明要件，茭依法提出申請。 【圖式簡單說明】 第1圖：係本創作之立體結構示意圖。 弟2圖：係本獅另—實_俯視示意圖。 第3圖：係本創作實施例結構示意圖。 ^ 4圖：穌_實_立體結構示意圖。 第5圖：係本創作之再—實施例示意圖。 M336469 【主要元件符號說明】 (A)散熱結構 (B1)套合部 (10)散熱片 (12)導熱翼片 (121)寬邊 (14)導風空間 > (1 6 )卡部 (B )風扇 1 1 )主導熱片 (12 0)窄邊 (13)導流道 15)集風口 1 7 )卡槽M336469 VIII, new description: [New technology field] This creation department - a kind of scatter, system is a kind of design that can change the gas f direction of the cooling fan on the motherboard, so as to effectively reduce the temperature of the central office, and thus improve The domain board uses the power and effectiveness. [Prior Art] With the unique advancement and development of electronic technology, the combination of high-quality, high-quality multimedia media has been widely loved and used by consumers, and has accelerated the popularity of computers. The increase in consumption of computer-related products has also driven the development of related industries to become more vigorous and rapid. As we all know, the performance of the electric system depends mainly on the performance of the main board and the main enemy, such as the towel. In addition to the new generation of central processing units and major chipsets, due to the more sophisticated and complex nuclear read structure, it is able to provide a relatively efficient execution speed and a stronger transmission. Fine, with the substantial increase in operational efficiency, the temperature generated by the processor and the wafer during operation is more effective. In order to reduce the temperature of the components on the motherboard, the temperature will be too high, which will cause the domain board to malfunction or be damaged. How to have the components of the cooling blade and its components, has become a breakthrough for today's domain board designers. An important topic. · "For the known 'eyes' on the computer and the heat sinks used in the electronic components, the heat dissipation required for the high-performance electronic components is tightly bonded through the heat pipe, the heat-conducting fins and the heat-conducting base. The composition, which can be used to quickly transmit electronic components, can be used as M3 3 6469 M3 3 6469 孰 / 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Direct response to the heat transfer efficiency of electronic components, so there is a combination of tightness carryover, material extraction (four) into the disenchantment and its static rate, for the current radiator structure using a variety of complex snaps plus domain /,,, In terms of molding, there is a waste of money and time to add cost. [New content] <Technical problems to be solved> The present creator has in view of this, using the narrow front report 钍搂η σ ^ stupid, σ 构 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成Technical means and efficacy> The scale of the purpose of the scales 27 - the wealth of the ship to turn, is the plural political and hot red scattered age structure, the material is financially flat (four) two heat-conducting wing i piece in order of narrow side pairs (four) · wide side The structure of oral expansion, $ 散 ^ Make __ form - fan type mold and sand tablets - God flows down the flow channel, quickly flow to the gap Reduce the efficiency of the heat sink absorbed by the heat sink. ',,, source system fast sub-effective 6 M336469 [Embodiment] In order to make the review committee can further understand the structure, characteristics and other purposes of this creation Good implementation _ Detailed description of the following is the following, but the application examples described in this _ are for illustrative purposes, not for the exclusive shots. Please refer to the i, 2 _, this creation The progressive expansion heat dissipation structure, as shown in Fig. 1, the heat dissipation structure (A) is formed by a plurality of heat sinks (! Q ) _ group ^, and a plurality of heat sinks (1 〇) are arranged at the rear end to form - arc chamber tuyere (i 4;, , by means of the arc-shaped air guiding port (14), capable of cooperating with the cooling air ice generated by the fan (8) The gap between the political hot films (1 Q) quickly directs the cooling airflow to the heat sinks (1. 0) _ two to effectively reduce the heat source absorbed by the heat sink (1 〇); the film Μ Γ Γ 2 map The '5 hai each heat sink (10) is set to a C-shaped body, and the heat dissipation has a long strip-shaped main heat sheet (1 丄), and the leading hot sheet (worker) is extended by the boat. Edit (12), the heat sink (1)) Ke = - Xie edge (1 2 Q), Lai (1 2 Q) with a progressive . = extended to the other end to form a wide side (121) design, the fibers ( 1〇) Side n 91, drink edge (120), wide side (121), width 3), and, and the mouth makes each heat release sheet (10) form a guide channel (1 for concave Arc style. (1 4 ), the arc-shaped wind guide σ (1 4 ) is set in the other two to the fitting portion (Β 1 ) having the head end portion. Show, 夂 夂 为本 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作• The circular arc-shaped air vent (15) is concentrated by the 7 M336469 tuyere (15) to concentrate the cooling airflow generated by the fan (B) and follow the guide between the fins (10). (1 3 ), quickly divert the cooling airflow to dissipate the heat sink (1 〇) and the receiving wood and source ▼ to achieve the effect of effectively reducing the heat source absorbed by the heat sink (1〇). In another embodiment of the present invention, each of the two ends of the [shaped heat sink (10) open π has a plurality of L-shaped corresponding card portions (16), and the heat sinks (1 〇) are parallel on both sides. A card slot (port) is respectively arranged at the corner of the card portion (work 6), and the heat sinks (1 1) are mutually coupled by the card portion (i 6) and the card slot (work 7) into a heat dissipation structure (A) The heat dissipation structure (4) integrally forms a fan-shaped expansion structure, and forms a guide channel (丄3) between the heat dissipation fins (1 Q ) and the front narrow and wide heat exchange flow path, and 7 Gas flow along the flow path flows rapidly each fin (Shang square) _ away heat, to achieve rapid and efficient assembly of the fins reduce the effect of the object by Wei _. = The above-mentioned creation can indeed reach the shame of the ship, so it should be accepted as a patent claim, and the application should be made according to law. [Simple description of the diagram] Fig. 1 is a schematic diagram of the three-dimensional structure of the creation. Brother 2 picture: the lion is another - real _ top view. Fig. 3 is a schematic structural view of the present embodiment. ^ 4 Figure: Schematic diagram of the solid state. Figure 5: A schematic diagram of the re-implementation of the present invention. M336469 [Description of main component symbols] (A) Heat dissipation structure (B1) Fitting part (10) Heat sink (12) Thermal fin (121) Wide side (14) Air guiding space > (1 6 ) Card part (B ) Fan 1 1 ) Leading hot plate (12 0) Narrow side (13) Guide channel 15) Collecting port 1 7 ) Card slot