M336667 八、新型說明： 【新型所屬之技術領域】 本創作係-種散熱片ϋ過無間隙緊密結合的扣合結構，以扣合方 式使柳之散熱片分麵後對應卿為散熱片組，使散熱片組料高 效率熱傳遞，可應用於電腦中發熱性電子元件之熱能發散。 _ 【先前技術】 . 隨著電子技術不斷的進步與發展，結合了高晝質、高音質的多媒 «體電腦受到消費者普遍的喜愛與使用，並加速了電腦普及化的程度。、 眾所皆知的’電腦系統的效能表現，主要取決在所使用的主機 板’以及裝設此主機板上諸如中央處理器、記憶體、晶片組等...各式 元件的性能，並以新-代的中央處_以及主要晶片_言，由於呈 備了更為精細複雜的核心結構，是以可提供頻率相當高的執行時脈，、 以及更為強大的運算功能。 然而，隨著操作效能的大幅增加，中央處理器與晶片組在運轉時 •所產生的溫度也愈來愈高；為了有效降低主機板上各元件的操作溫 .度，以防止溫度過高導致主機板故障或損壞，如何有效的冷卻中央處 理器與其週邊的元件，已成為#今域板設計縣祕突破的一個重 要言果題。 而針對已知，目前 ，目闕剌於制及其之發触奸元件之散 熱器，為配合高效能之好元件f求讀齡，較透賴導管 熱異片及導熱底座緊結—體域，以快速傳遞電子元件產生之敎能作 大面積的熱發散，齡之，熱導管與健、導熱底朗之結合設 5 M336667 職合料，___子树 遞 良好的結合緊密度暨緊結架構，將會提昇製成之散二及巧1 率，為目前的散埶器结構運用夂接、政'、、、M及其放煞效 h 運用各種|_卡扣方式加工成型，於敕許 成支上，有其不便歧時間加工縣之浪冑。 正旦 【新型内容】 〈所欲解決之技術問題> 本_人有鑑於此，運用各散熱片相互延伸之扣合部及扣卡部結 丨構此夠提供方便快速之組合功效 、、'口 一種散熱㈣綱。 合上述條件之 〈技術手段及功效> =之主要目的在於提供—種散細組扣合結構提供方 ^心功效目的，係'為複數個散熱片之分顺有—主料部，兮主 =、、部^分別水平延伸出—導熱翼部，該各導熱翼部與主導熱部延 2角叹魏扣合部，且該導減部平行扣合部設有數扣卡部，各導 ^狀扣合部及扣切供轉之賴W後對餘姊合卡翻 i用ΓΓ散熱片間形成一導流道，藉由上述相互卡制組合結構提供 S用者方便快速之組合散熱片，並能夠迅速的將氣流導流向各散、 =導_帶走熱源，而_效的降低散糾所吸收熱源之功效 本創作之另-主要目的在於提供—種散熱片組扣合結構，並中， 組之導熱翼部設成寬林—之·，可於相對需要較高效率M336667 VIII, new description: [New technology field] This creation department - a type of heat sink with a gap-tight combination of the fastening structure, in a snap-fit way to make the heat sink of the Liu after the face is corresponding to the heat sink group, High-efficiency heat transfer of the heat sink assembly can be applied to the heat dissipation of the heat-generating electronic components in the computer. _ [Prior Art] With the continuous advancement and development of electronic technology, the combination of high-quality, high-quality multi-media «body computers are popular with consumers and use, and accelerate the popularity of computers. The well-known 'performance of computer systems depends mainly on the motherboard used' and the performance of various components such as central processing unit, memory, chipset, etc. on this motherboard. With the new-generation central office and the main wafers, the implementation of a more sophisticated core structure is to provide a relatively high frequency of execution clocks, and more powerful computing functions. However, as the operating efficiency increases significantly, the temperature generated by the central processing unit and the chipset is increasing. In order to effectively reduce the operating temperature of the components on the motherboard, the temperature is prevented from being too high. If the motherboard is faulty or damaged, how to effectively cool the central processor and its surrounding components has become an important issue for the breakthrough of the county board design. For the known, at present, the heat sink that witnesses the system and its smashing components, in order to meet the high-performance components, is more suitable for reading the age, and is more closely related to the heat-dissipating duct and the heat-conducting base. The heat generated by the rapid transmission of electronic components can be used for large-area heat dissipation. The combination of heat pipe and heat and heat conduction is set to 5 M336667, and ___ sub-tree is well combined with compactness and tight structure. It will improve the production of the second and the first rate, and use the splicing, politics, and M, and the effect of the 埶 、 目前 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用 运用On the branch, there is a waste of time to process the county. Zhengdan [new content] <Technical problems to be solved> In view of this, the use of the fastening parts and the buckle parts of the heat sinks mutually extend the structure to provide a convenient and quick combination function, A type of heat dissipation (four). The main purpose of the above-mentioned "Technical Means and Efficacy" = is to provide a kind of scatter-type fastening structure to provide the purpose of the heart function, which is the division of the plurality of heat sinks - the main material part, the main =, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , After the joints and the buckles are turned over, the heat sinks are formed between the heat sinks and the heat sinks are formed by the joints, and the combination of the above-mentioned mutual card provides a convenient and quick combination of the heat sinks. Quickly direct the airflow to each of the scattered, = lead to take away the heat source, and the effect of the _ effect is reduced by the absorption of the heat source. The main purpose of this creation is to provide a heat sink group fastening structure, and The heat-conducting wing is set to a wide forest - it can be relatively more efficient
政核，該賴翼部可設鱗邊形態，並形鱗邊導流道，另益W 6 M336667 效率散熱處，可使該導減部設置為寬邊流道職，藉由各散熱片組 之導熱翼部設成寬窄不-之形態相互扣卡，使成型數疏密的不—之導 流道排列以因應不同之散熱需求以提高散熱之效應者。 【實施方式】 為使貴審查委員能進—步瞭解本創作之結構，特徵及盆他目 的，玆以如后之較佳實施_以圖式詳細制如后，惟相例所 之貫施例係供說明之用，並非為專利巾請上之唯—限制者。 請配合參閱第1、2圖所示，本創作之散熱片組扣合結構，係藉 由數散熱片（1 Q )快速扣合卡糖列組合而成散熱片組（幻，藉由 ==α 〇) _應概扣合卡制，並且岭魏_導 饥；口 d片（1〇 )間之間隙，使冷卻氣流帶走各散敎片（1〇 之熱源，達職速組合以及纽降低散刻（丄Q)所 功效目的； ·、、、洞又 该散熱片（10)設為〔字形體 片狀之主導埶Αβ…… 、丄U)具有一長條 y ^ )，社導熱部（11)兩端分別水平延伸出- 短片狀之導妖置部Γ 1 Ο ^ ^ 伸轉角ΐΓ 導片（11)與導熱翼部（12)延 申~角4_陷槽狀之扣合部（丨3 )， 合部（1以，T 卞…、異1 2 )由扣 _ 水平延伸出一凸狀之扣卡部（1 4 )，該扣卡部Μ η L伸至相鄰之散4(14) 扣卡部（Ί w υ口 °K 13)處，予以垂直彎折穿入 合形成散熱h使 能夠诚片之散熱片Q0)組 並於兩兩散心η 各散熱片（1〇)相互扣卡後， 、（10)之間形成一長方形穿孔之導流道（丄5 )，該 M336667 導流道（1 5)供冷卻氣流迅速導流入各 5 )並將熱源帶走。 (^ ^考、5 51為本創作另—實施例，該複數各散妖 二=(1 ◦ B)分別相鄰對應扣合卡制組合成散熱片組U、) ;A ):二:::广)(1 〇 B )分別具有規格不同之導熱翼部(1 •= 異部（11B)，該主導熱部（iia)_分別林1 _ Μ乍片狀之導熱翼部（12A)，其該導熱翼部（12幻之4延 A A)及扣卡部(1 4 A)設為亦略窄狀，使該導_邻(7 Μ組合時形成較密之導流道⑴幻，另該主導敎部、Q l(^ ::::扣合部(13B)及扣卡部 泠'、、、異口K 1 1 A )組合時形成較寬鬆之導流道（工 ^ 片G 〇幻（1 〇 W分別前後對應扣卡組合魏 散熱 h錯疏密排列組合，使各散熱片（10 A)(1⑽） .較寬卿列組合之導流道（1 5 A )及導流道（i 賴窄或 ^列組合之導流道（1 5 A )及導流道（1 5 B )能夠將 心’並迅速將冷卻氣流導流將各散熱片（玉 熱源帶走，達到有效降低各散熱片（1〇 吸收之 功效目的。 ）所吸收熱源之 綜上所述，本創作確實可達到上 申請要件，纽法提出申請。^項功施’故本創作應符專利 8 M336667 【圖式簡單說明】 第1圖：係本創作之單一結構立體示意圖。 第2圖：係本創作立體結構結合示意圖。 第3圖：係本創作單一結構局部示意圖。 第4圖：係本創作另一實施例結構示意圖。 第5圖：係本創作實施例侧視示意圖。 【主要元件符號說明】 (A)散熱片組 (10) (10A)(10B)散熱片 (11) (11A)(11B)主導熱部 (12) (12A)(12B)導熱翼部 (13) (13A)(13B)扣合部 (14) (14A)(14B)扣卡部 (15) (15A)(15B)導流道In the political nucleus, the flank can be set with a scaled edge shape, and the scaly side guide channel, and the W 6 M336667 efficiency heat dissipation portion can be set as a wide-side flow path by each heat sink group. The heat-conducting wing portions are arranged in a wide and narrow manner, and the heat-dissipating wings are arranged to be mutually buckled, so that the number of the forming channels that are not densely formed is arranged to meet the effect of different heat dissipation to improve the heat dissipation effect. [Embodiment] In order to enable your review committee to further understand the structure, characteristics and objectives of the creation, it is better to implement it as follows. For the purpose of explanation, it is not for the patentee. Please refer to Figures 1 and 2 for details. The heat sink unit snap-on structure of this creation is a combination of several heat sinks (1 Q) to quickly form a heat sink group (phantom, by == α 〇) _ should be deducted card system, and Ling Wei _ lead hunger; mouth d film (1 〇) gap, so that the cooling airflow to take away all the sputum tablets (1 〇 heat source, up to the speed combination and New Zealand Reduce the effect of the scatter (丄Q); ·,, and the hole and the heat sink (10) are set to [the shape of the body-shaped 埶Αβ..., 丄U) has a long strip y ^), the heat conduction The two ends of the part (11) are horizontally extended - the short-shaped guide demon part Γ 1 Ο ^ ^ The extension angle ΐΓ The guide piece (11) and the heat-conducting wing part (12) extend to the angle 4_ trap-like connection The part (丨3), the joint part (1, T 卞..., the difference 1 2 ) extends from the buckle _ horizontally to a convex buckle portion (1 4 ), and the buckle portion Μ η L extends to the adjacent portion Disperse 4 (14) buckle part (Ί w υ mouth °K 13), bend it vertically to form a heat sink h, enable the heat sink Q0) group and disperse the η each heat sink (1 〇) After the cards are deducted from each other, a rectangular shape is formed between (10) The flow channel perforation (Shang 5), which M336667 flow channel (15) for rapidly cooling airflow flows into the respective guide 5) and the heat source away. (^ ^ test, 5 51 is the creation of another - embodiment, the plural each of the demon two = (1 ◦ B) respectively adjacent to the corresponding card combination into a heat sink group U,); A): two:: :广)(1 〇B ) respectively have different heat transfer wings (1 •= special part (11B), the main heat part (iia)_ separate forest 1 _ Μ乍 piece-shaped heat transfer wing part (12A), The heat conducting wing portion (12 phantom 4 AA) and the buckle portion (14 A) are also slightly narrowed, so that the guiding _ o (the 7 Μ combination forms a dense guide channel (1) illusion, another The leading stern, Q l (^ :::: fastening part (13B) and the buckle part 泠 ', ,, and the different mouth K 1 1 A ) form a loose guide channel (work piece G 〇 Fantasy (1 〇W respectively corresponding to the deduction card combination Wei heat dissipation h wrong dense arrangement, so that each heat sink (10 A) (1 (10)). Wide channel combination of the guide channel (1 5 A) and the guide channel (i The diversion channel (1 5 A) and the diversion channel (1 5 B) can separate the heart and quickly direct the cooling airflow to take away the heat sinks (the jade heat source is taken away to achieve effective reduction). Each heat sink (1 〇 absorption of the purpose of the effect.) The absorption of the heat source, as described above, this creation does Can apply for the application requirements, Newfa filed an application. ^ Item Gongshi's original creation should be patented 8 M336667 [Simple description of the diagram] Figure 1: This is a three-dimensional schematic diagram of the single structure of the creation. Figure 2: This book Schematic diagram of the three-dimensional structure combination. Fig. 3 is a partial schematic diagram of a single structure of the present creation. Fig. 4 is a schematic view showing the structure of another embodiment of the present creation. Fig. 5 is a side view showing the creation of the present embodiment. (A) Heat sink set (10) (10A) (10B) Heat sink (11) (11A) (11B) Leading heat part (12) (12A) (12B) Heat transfer wing (13) (13A) (13B) Buckle (14) (14A) (14B) buckle section (15) (15A) (15B) guide