201120625 六、發明說明： 【發明所屬之技術領域】 本發明與電路板或電子裝置的散熱裝置有關， 尤其涉及具有相對地傾斜式風扇的結構設計之雙風 扇散熱裝置。 【先前技術】 隨著科技發展日新月異，電子裝置使用更高階 的積體電路來提升其運算能力，已成為趨勢。然而， 當積體電路執行運算時，該積體電路會產生大量的 熱旎’需藉由散熱裝置輔助該積體電路散熱，目前 該散熱裝置包括單風扇及雙風扇的設計，以雙風扇 來說目前已有多種作法，例如： 台灣587769號「散熱裝置」專利案係揭示一種 於-發熱元件上裝言卜散熱裝置，且該散熱裝置包 括一個以上的進氣風扇及一排風風扇的作法； 將一第一離心風扇及一第 外殼内的作法； 。灣2_4478G號「雙風賴熱额」專則 係揭示-種雙風扇散熱模組，該雙風扇散熱模㈣ 將一筮—私《 a e u ‘離心風扇並排收容於一 置」專利案係揭示一種 —第二風扇，搭配多個 台灣545104號「散熱裳 散熱裝置設置一第一風扇及 201120625 導熱管及多個散熱片的作法； 台灣577582號「雙散熱模組結構」專利案係揭 示一種將一主散熱裝置與一副散熱裝置透過若干導 熱管串接於一起，該主散熱裝置及該附散熱裝置分 別包括一風扇及一縛片組的作法； 台灣200410626號「電子元件散熱裝置」專利 案係揭示一種在一第一風扇及一第二風扇間增設第 三散熱片的作法； 台灣M245506號「強制排氣型之電腦主機散熱 裝置」專利案係揭示一種將一第一風扇及一第二風 扇分別裝置於一散熱構件之一第一側及一第二側的 作法； 上述相同或類似該 587769 、 200644780 、 545104、577582、200410626 及 200410626 號專利 案的作法，係將兩風扇以水平的設置。至於該 M245506號專利接露兩風扇的其中一者傾斜設置的 散熱機構，但仍僅侷限於將兩風扇分別設置於散熱 機構的兩相對側。 【發明内容】 本發明提供一種新的雙風扇散熱裝置，該雙風 扇散熱裝置係用於電路板上。該雙風扇散熱裝置包 201120625 括-散熱模組、一風罩、一第一風扇、一第二風扇 二隔件該風罩係罩住該散熱模組，該風罩包 括一盍板及一分隔件，該蓋板的下壁係面對該散熱 桓組的頂部’ ^該蓋板具有貫穿其上、下壁的一第 通孔及一第二通孔，該分隔件係位於該第一通孔 及該第—通孔之間，該分隔件係由該蓋板的下壁朝 該政熱杈組延伸；該第一風扇傾斜地設置於該風罩 上且位於該第一通孔内；第二風扇傾斜地設置於 «亥風罩上，且^立於該第二通孔内，該第二風扇之旋 轉中心的虛擬軸線與該第—風扇之旋轉中心的虛擬 軸線相交於該蓋板的上壁外；該分隔件設置於該風 罩内且位於該第一通孔及該第二通孔之間，該分隔 件係阻隔該第一風扇及該第二風扇。 較佳地，該第一風扇係以一第一角度傾斜設 置該第角度係該第一風扇的旋轉中心之虛擬軸 線與該散熱模組底部之夾角；該第二風扇係以一第 二角度傾斜設置，該第二角度係該第二風扇的旋轉 中心之虛擬軸線與該散熱模組底部之夾角。 較佳地，該散熱模組係由多個鰭片以間隔並排 設置形成，每一鰭片包括一第一斜邊及一第二斜 邊，分別面對該第一風扇及該第二風扇，且該第一 斜邊係順應該第一風扇，該第二斜邊係順應該第二 201120625 < 風扇。 相較於先前技術，本發明提供一種雙風扇散熱 裝置’係將兩散熱風扇以相面對的傾斜設置，以改 善該第一風扇及該第二風扇間產生的無效風流，以 提高散熱裝置的散熱效率。再者，由於該第一風扇 及該第二風扇間設置有分隔件，該分隔件亦可阻擋 兩風扇間互相的干擾氣流，且可降低干擾氣流產生 Φ 的嗔音。 更多的發明内容及其作用，將揭露於隨後的說 明。 L貫施方式】 第-圖顯示本發明之一雙風扇散熱裝置的㈣ 例子’該雙風扇散熱I置1係用於電路板2上，^ =風扇散熱裝置1包括-風單3、-第-風扇4 — ::風扇5、一散熱模㈣及—分隔件31。該口 示卡或主機板等。該第一風扇4及言 :二佳係轴流風扇，但不以此為限。 第-圖綠示本發明之 風罩3的熱裝置1 該風罩3且有^ , 糸罩住該散熱模組 、 且5亥蓋板30具有貫穿 201120625 上壁301及下壁300的一第一通孔302及一第二通 孔 303。 該分隔件31没置於該風罩3内且位於該第—通 孔302及該第二通孔303之間，該分隔件31係阻隔 該第一風扇4及該第二風扇5。 於此實施例中，該分隔件31係由該蓋板3〇的 下壁300朝該散熱模組6延伸，且該分隔件μ具有 兩相對的側壁310，每一側壁310係為弧形，且該 兩側壁310分別面對該第一風扇4及該第二風扇 5。當該第一風扇4及該第二風扇5同時作動時，會 產生至少兩方向的氣流而形成干擾氣流，所以可藉 由該分隔件31阻擋氣流相互干擾，以降低該雙風扇 散熱裝置1產生的噪音，及縮小氣流相互干擾之無 效區域。於實際應用中，該分隔件31亦可使用額外 增设的分隔板或其他方式阻隔該兩風扇，以降低該 散熱模組6上的無效散熱區域。 該第一風扇4傾斜地設置於該風罩3上，且位 於該第一通孔302内，第二風扇5傾斜地設置於該 風罩3上，且位於該第二通孔3〇3内，該第二風扇 的％轉中心之虛擬軸線與該第一風扇4的旋轉中 心之虛擬輛線L1相交於該蓋板30的上壁301外， 該兩風扇4、5設置方式如第一圖所示。 201120625 該第一風扇4係以一第一角度0 1傾斜設置， 該第角度Θ1係該苐一風扇4的旋轉中心之虛擬 軸線L1與該散熱模組6底部之夾角。該第二風扇5 係以一第二角度0 2傾斜設置，該第二角度0 2係該 第一風扇5的旋轉中心之虛擬軸線^2與該散熱模組 6底部之炎角。 該第一風扇4及該第二風扇5係可根據實際設 «十而求，任意設計該兩風扇4、5的傾斜角度，例如 將該第一風扇4與第二風扇5以不同角度設計，或 者兩風扇4、5以相對稱角度的設計，但不以此為 限。再者，由於本發明之該兩風扇4、5係設於風罩 3上，且位於通孔内3〇2、3〇3，所以該蓋板3〇的該 第一通孔302及該第二通孔3〇3亦可隨著風扇4、5 的傾斜角度，將通孔302、303的孔緣設計為相面對 地傾斜的結構。 於實際應用中，該風罩3更包括一第一固定架 3/及一第二固定架33,該第一固定架％係順應該 第一風扇4的傾斜連接於該風罩3内，且該第—固 定架32面對該蓋板3〇的該第一開口 3〇2，該第— 固疋架32係裝設該第一風扇4，而該第二固定架扣 係順應該第二風扇5的傾斜連接於該風罩3，且該 定架33面對該蓋板30的該第二開口 3〇3， 201120625 該第二固定架33係裝設該第二風扇5。該兩固定架 32、33係可直接形成於該風罩3内，或者藉由風扇 4、5本身之框架連接於該風罩3内。 凊參見第三圖及第四圖，該散熱模組6包括多 個鰭片60、一導熱件61及多個熱導管62，該散熱 模組係由多個鰭片60以間隔並排設置形成，每一鰭 片60包括一第一斜邊6〇1及一第二斜邊6〇2，分別 面對該第一風扇4及該第二風扇5，且該第一斜邊 係順應該第一風扇4的傾斜，該第二斜邊6〇2 係順應該第二風扇5的傾斜。該風罩6更包括兩相 對的側板34，該兩側板34分別從該蓋板3〇向下延 伸，該散熱模組6之該些間隔並排的鰭片6〇與該兩 側板34以同方向排列。 實際上，該鰭片60之該第一斜邊Θ01及該第二 斜邊602的傾斜面係為漸斜方式或階梯式往中間下 方傾斜，但該鰭片60亦可設計成平面或其他形式。 該導熱件61係貼合該些鰭片6〇的底部，每一 一熱官62之一端貫穿該些鰭片60,該導熱管62之 另鳊係貝牙該導熱件61。實際上，該導熱件η 係直接貼在該電路板2上的積體電路2〇表面，該導 熱件61將該積體電路2〇的熱能吸收後，由該些鰭 片60及貝穿該導熱件61之該些導熱管62將熱能分 201120625 散至外部’以提面其散熱效能。 於此實施例中，該散熱模組6與該風罩3間係 用一支撐件7抵靠該散熱模組6的底部，再利用螺 絲70鎖固該支撐件7及該風罩3對應之螺孔（未繪 示於圖中），然而，該散熱模組6與該風罩3的固^ 方式亦可藉由卡扣設計達成，故不以此為限。 第五圖繪示本發明之該雙風扇散熱裝置1的較 • 佳應用例子的示意圖，當相對傾斜的該第一風扇4 及該第二風扇5作動時，該第一風扇4產生風流， 使該風罩3外的空氣由該散熱模組6的進氣口進入 該散熱模組6内後，由該第一風扇4排出風罩3的 該蓋板30外’而第二風扇亦產生另一風流，引領該 風罩3之該蓋板3〇上方由該第—風扇4排出的㈣ 混合外部的空氣進入該散熱模組6後，由該散敎模 # 組6的出風口排至該風罩3外。然而，由於該散教 模組6之該些鰭片60排列方向與上述之氣流方向相 7 ’故本發明之雙風扇散熱裝置j可使些鳍片内的 氣流迅速且順暢的流通，以減少位於雙風扇之間的 無效散熱區域，進而提升電路板2的散熱效果。 然而，本發明之雙風扇散熱裝置丨亦可使用兩 吹的風扇，自該風罩3之該蓋板3〇的第一通孔3〇2 及第二通孔303上方引導外部空氣吹向該散熱模組 11 I si 201120625 乂使政熱模組6内的熱氣排出，故本發明之相對 的傾斜式風扇設計，可應用於多種散熱機構。 綵上所述，本發明之雙風扇散熱裝置係將兩風 扇用相對地傾斜式設計’以減少兩風扇間產生的干 擾軋流，進而提升該雙風扇散熱裝置對該電路板之 積體電m統的散熱效率。此外’該分隔件亦可 阻擋該雙風扇間的干擾氣流產生，並減少該雙風扇 作動時的燥音。 無論如何’任何人都可以從上述例子的說明中 獲得足夠教導，並據而了解到本發明確實具有產業 上之利用性及進步性，且本發明在同—領域中均未 見有相同或類似技術揭露在先而具足有新賴性θ 本發明確已符合發明專利要件，爰依法提出申&。 12 201120625 【圖式簡單說明] 第圖係、、s不根據本發明之一較佳具體實施例之一 雙風扇散熱裝置的示意圖。 第二圖係綠示箆—国 第圖之風罩與第一風扇及第二風扇 之爆炸圖。 第三圖係繪示第一圖 乐圖之散熱模組的示意圖。 第四圖係纟會示第一圖夕雒^ ^ ®之雙風扇散熱裝置的爆炸圖。 ^ 苐五圖係纟會示本於明夕4 μ . • 月之該雙風扇散熱裝置的應用示 意圖。 【主要元件符號說明】 1雙風扇散熱裝置 20積體電路 2電路板 3風罩 30蓋板 300下壁 301上壁 3 0 2第一通孔 303第二通孔 31分隔件 310側壁 32第一固定架 33第二固定架 34側板 LI、L2虛擬軸線 0 1第一角度 0 2第二角度 4第一風扇 5第二風扇 6散熱模組 60鰭片 1 S1 201120625 61導熱件 601第一斜邊 7支撐件 62熱導管 602第二斜邊 70螺絲201120625 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink of a circuit board or an electronic device, and more particularly to a double fan heat sink having a structural design of a relatively inclined fan. [Prior Art] With the rapid development of technology, it has become a trend for electronic devices to use higher-order integrated circuits to improve their computing power. However, when the integrated circuit performs the operation, the integrated circuit generates a large amount of heat. The heat dissipation device needs to assist the integrated circuit to dissipate heat. Currently, the heat sink includes a single fan and a dual fan design, and the dual fan is used. It is said that there are various methods at present, for example: Taiwan Patent No. 587769 "Heat Dissipation Device" discloses a heat dissipation device on a heating element, and the heat dissipation device includes more than one intake fan and a exhaust fan. ; a first centrifugal fan and a first inner casing; Bay 2_4478G "Double Wind Lai Hot" specializes in revealing a kind of dual-fan cooling module. The dual-fan cooling module (4) will reveal a kind of "aeu" centrifugal fan side by side in a patent system. The second fan, with a number of Taiwanese 545104 "heat sinking heat sink set a first fan and 201120625 heat pipe and a plurality of heat sinks; Taiwan 577582 "double heat module structure" patent case reveals a kind of master The heat sink and a heat sink are connected in series through a plurality of heat pipes, and the main heat sink and the heat sink respectively comprise a fan and a die set; Taiwan Patent No. 200410626 "Electronic component heat sink" patent case reveals A method of adding a third heat sink between a first fan and a second fan; the Taiwanese M245506 "forced exhaust type computer host heat sink" patent case discloses a first fan and a second fan respectively The device is disposed on a first side and a second side of a heat dissipating member; the same or similar to the above 587769, 200644780, 545104, 577582, 20041062 The practice of patents 6 and 200410626 is to set the two fans horizontally. As for the M245506 patent, one of the two fans is provided with a tilting heat dissipating mechanism, but it is still limited to the two fans being disposed on opposite sides of the heat dissipating mechanism. SUMMARY OF THE INVENTION The present invention provides a new dual fan heat sink that is used on a circuit board. The dual-fan heat sink package 201120625 includes a heat dissipation module, a windshield, a first fan, and a second fan two spacers. The windshield covers the heat dissipation module, and the wind cover includes a seesaw and a partition. The lower wall of the cover plate faces the top of the heat dissipation stack. The cover has a first through hole and a second through hole extending through the upper and lower walls thereof. The partition is located at the first pass. Between the hole and the first through hole, the partition member extends from the lower wall of the cover plate toward the enthalpy group; the first fan is disposed obliquely on the hood and located in the first through hole; The two fans are disposed obliquely on the hood and are disposed in the second through hole. The virtual axis of the center of rotation of the second fan intersects the virtual axis of the center of rotation of the first fan on the cover The partitioning member is disposed in the hood and located between the first through hole and the second through hole, and the partition blocks the first fan and the second fan. Preferably, the first fan is inclined at a first angle, and the first angle is an angle between a virtual axis of the rotation center of the first fan and a bottom of the heat dissipation module; the second fan is inclined at a second angle. The second angle is an angle between a virtual axis of the rotation center of the second fan and a bottom of the heat dissipation module. Preferably, the heat dissipation module is formed by a plurality of fins arranged side by side at intervals. Each of the fins includes a first oblique side and a second oblique side respectively facing the first fan and the second fan. And the first beveled edge conforms to the first fan, and the second beveled edge conforms to the second 201120625 <fan. Compared with the prior art, the present invention provides a dual-fan heat dissipating device that sets the two cooling fans to face each other to improve the ineffective airflow generated between the first fan and the second fan to improve the heat dissipation device. Cooling efficiency. Moreover, since the partitioning member is disposed between the first fan and the second fan, the partitioning member can also block the mutual interference airflow between the two fans, and can reduce the noise of the interference airflow generating Φ. Further invention and its effects will be disclosed in the following description. L-application mode] The first figure shows a (four) example of a dual-fan heat sink of the present invention. The dual-fan heat-dissipation I-set 1 is used on the circuit board 2, and the fan heat sink 1 includes - wind single 3, - - Fan 4 - :: Fan 5, a heat sink (4) and - divider 31. The card or motherboard, etc. The first fan 4 and the second best axial fan are not limited thereto. The first embodiment shows a heat device 1 of the windshield 3 of the present invention. The windshield 3 has a heat sink module, and the 5th cover plate 30 has a first through the upper wall 301 and the lower wall 300 of 201120625. A through hole 302 and a second through hole 303. The partitioning member 31 is not disposed in the hood 3 and is located between the first through hole 302 and the second through hole 303. The partitioning member 31 blocks the first fan 4 and the second fan 5. In this embodiment, the partition member 31 extends from the lower wall 300 of the cover plate 3 toward the heat dissipation module 6 , and the partition member μ has two opposite side walls 310 , and each of the side walls 310 is curved. The two side walls 310 face the first fan 4 and the second fan 5, respectively. When the first fan 4 and the second fan 5 are simultaneously activated, airflow in at least two directions is generated to form an interference airflow, so that the airflow can be blocked by the partitioning member 31 to reduce the generation of the dual fan heat sink 1. The noise, and the ineffective area where the airflow interferes with each other. In practical applications, the partitioning member 31 may also block the two fans by using an additional partitioning plate or other means to reduce the ineffective heat dissipation area on the heat dissipation module 6. The first fan 4 is disposed on the hood 3 and is disposed in the first through hole 302. The second fan 5 is disposed on the hood 3 obliquely and located in the second through hole 3〇3. The virtual axis of the %-to-center of the second fan intersects the virtual vehicle line L1 of the center of rotation of the first fan 4 outside the upper wall 301 of the cover 30. The two fans 4, 5 are arranged as shown in the first figure. . The first fan 4 is inclined at a first angle 0 1 , and the first angle Θ 1 is an angle between the virtual axis L1 of the center of rotation of the first fan 4 and the bottom of the heat dissipation module 6 . The second fan 5 is inclined at a second angle 0 2 , which is the virtual axis of the center of rotation of the first fan 5 and the inflammatory angle of the bottom of the heat dissipation module 6. The first fan 4 and the second fan 5 can be arbitrarily designed according to the actual setting, and the inclination angles of the two fans 4 and 5 are arbitrarily designed. For example, the first fan 4 and the second fan 5 are designed at different angles. Or the two fans 4, 5 are designed with a relative angle, but not limited thereto. Furthermore, since the two fans 4 and 5 of the present invention are disposed on the hood 3 and are located in the through holes 3〇2 and 3〇3, the first through holes 302 of the cover plate 3 and the first The two-way hole 3〇3 can also design the hole edges of the through holes 302 and 303 to face each other with the inclination angle of the fans 4 and 5. In a practical application, the hood 3 further includes a first fixing frame 3 / and a second fixing frame 33 , the first fixing frame % is connected to the hood 3 in accordance with the inclination of the first fan 4, and The first fixing frame 32 faces the first opening 3〇2 of the cover plate 3, the first fixing frame 32 is equipped with the first fan 4, and the second fixing frame buckle is compliant with the second The slanting of the fan 5 is connected to the windshield 3, and the fixing frame 33 faces the second opening 3〇3 of the cover plate 30, and the second fixing frame 33 is equipped with the second fan 5. The two fixing frames 32, 33 can be formed directly in the hood 3 or can be connected to the hood 3 by the frame of the fans 4, 5 themselves. Referring to the third and fourth figures, the heat dissipation module 6 includes a plurality of fins 60, a heat conducting member 61 and a plurality of heat pipes 62 formed by a plurality of fins 60 arranged side by side. Each of the fins 60 includes a first beveled edge 6〇1 and a second beveled edge 6〇2, respectively facing the first fan 4 and the second fan 5, and the first beveled edge is compliant with the first The inclination of the fan 4 is adapted to the inclination of the second fan 5. The hood 6 further includes two opposite side plates 34 respectively extending downward from the cover plate 3, and the spaced-apart fins 6〇 of the heat dissipation module 6 are in the same direction as the two side plates 34. arrangement. In fact, the inclined surface of the first oblique side Θ01 and the second oblique side 602 of the fin 60 is inclined in a tapered manner or stepped downward in the middle, but the fin 60 may also be designed in a plane or other form. . The heat conducting member 61 is attached to the bottom of the fins 6〇, and one end of each of the heat registers 62 extends through the fins 60, and the heat conducting tube 62 is connected to the heat conducting member 61. In fact, the heat conducting member η is directly attached to the surface of the integrated circuit 2 on the circuit board 2, and the heat conducting member 61 absorbs the heat energy of the integrated circuit 2, and the fins 60 and the The heat conducting tubes 62 of the heat conducting member 61 dissipate the thermal energy to the outside of the 201120625 to enhance the heat dissipation performance. In this embodiment, a support member 7 is disposed between the heat dissipation module 6 and the hood 3 against the bottom of the heat dissipation module 6 , and the support member 7 and the hood 3 are locked by screws 70 . The screw hole (not shown) is not limited to this. However, the fixing method of the heat dissipation module 6 and the windshield 3 can also be achieved by the buckle design. The fifth figure shows a schematic diagram of a preferred application example of the dual fan heat sink 1 of the present invention. When the first fan 4 and the second fan 5 are relatively tilted, the first fan 4 generates a wind flow. After the air outside the hood 3 enters the heat dissipation module 6 through the air inlet of the heat dissipation module 6, the first fan 4 is discharged from the cover 30 of the hood 3, and the second fan also generates another a wind flow, leading to the air blower 3, the air blown by the first fan 4 (4) outside the cover 3 is discharged into the heat dissipation module 6, and the air outlet of the heat dissipation module #6 is discharged to the air outlet Windshield 3 outside. However, since the fins 60 of the ecstasy module 6 are arranged in the direction of the airflow direction, the dual fan heat sink j of the present invention allows the airflow in the fins to flow quickly and smoothly to reduce The ineffective heat dissipation area between the two fans increases the heat dissipation effect of the circuit board 2. However, the dual fan heat sink of the present invention can also use a two-blowing fan to guide external air from the first through hole 3〇2 and the second through hole 303 of the cover 3 of the windshield 3 The heat dissipation module 11 I si 201120625 排出 causes the hot air in the thermal module 6 to be discharged, so the opposite inclined fan design of the present invention can be applied to various heat dissipation mechanisms. According to the color, the dual fan heat dissipating device of the present invention uses the two fans to be relatively inclined to reduce the interference flow generated between the two fans, thereby improving the integrated power of the dual fan heat sink on the circuit board. Cooling efficiency. In addition, the spacer can also block the generation of interference airflow between the dual fans and reduce the noise during the operation of the dual fans. In any case, 'Everyone can get enough teaching from the description of the above examples, and it is understood that the present invention does have industrial applicability and progress, and the present invention does not have the same or similar in the same field. The technology is disclosed first and has a new dependence. The invention has indeed met the requirements of the invention patent, and the application is filed according to law. 12 201120625 [Simplified description of the drawings] The diagram is a schematic diagram of a dual fan heat sink according to one of the preferred embodiments of the present invention. The second picture is the explosion diagram of the windshield and the first fan and the second fan of the green display. The third figure shows a schematic diagram of the heat dissipation module of the first figure. The fourth picture shows the explosion diagram of the dual fan heat sink of the first figure ^ ^ ^ ® . ^ The five-figure system will show the application of this dual-fan heat sink on the 4th. [Main component symbol description] 1 dual fan heat sink 20 integrated circuit 2 circuit board 3 hood 30 cover 300 lower wall 301 upper wall 3 0 2 first through hole 303 second through hole 31 partition 310 side wall 32 first Fixing frame 33 second fixing frame 34 side plate LI, L2 virtual axis 0 1 first angle 0 2 second angle 4 first fan 5 second fan 6 heat dissipation module 60 fin 1 S1 201120625 61 heat conductive member 601 first oblique side 7 support member 62 heat pipe 602 second oblique side 70 screw