五、新型說明： 【新型所屬之技術領域】 本創作係、提供-種賴打，尤财供㈣職組裝以 進行輔助絲之散齡置，_二麵式錄㈣散熱部分 =有複數解形之散_片、v形之通風槽，可供氣流順 W通進而_預設發_'快速散熱，制提升散熱功效之 【先前技術】 知’現今«難以日新月異的速度絲，使得電腦之 發展趨勢亦朝運算魏強、速度快之方㈣進，额著電腦 相關領域也趨向於高速、高頻發展，而直接導致電腦主機内 部電子零組件及記憶贿組，f會械產生許多熱能，若以 記憶體模_取縣來讀、比較可知，從早期P c i⑽ 的頻寬為8Q0MBA，拓展至現今DDR 5〇〇頻寬 以達4 . 〇GB/S，甚至是到多通道之平台則可將頻寬 大幅擴增至二倍以上，使其無論是工作時脈或是傳輸頻寬， 明顯都是朝高速、高頻的發展，以配合主機板中央處理器能 維持高速度的運算處理。 Qb 且電職品的獨進步與觸、魏亦獨提升，則電 腦主機内部之主機板上，亦必須增加更多的處理、運算用之 中央處理器，近年來坊間陸續推出雙核 熱問題亦必綱時解決’則在主機板上設置多組風扇與散熱 .鰭片組等，藉哺助主機板進行快速的散熱，但也在電腦主 機内部械多數氣流進出、交換的循環現象，即造成氣流在 電腦主機内部產生亂流的情況，亦存在諸多的缺失與困擾， 如： (1)電細主機内部配合主機板的各中央處理器等發熱源， 分別設置複數不同方向、不同位置的散熱風扇、散熱 鰭片，則導致電腦主機内部空間，形成多道氣流的流 竄’即形成各氣流間的相互干擾而產生亂流，影響熱 空氣與外界冷空氣交換、傳送的流通，造成散熱效果 差、亂流易發出tl喿音等情況。 (2 )電齡機畴主機板上所插設之記賴、介面卡等， 雖設有散熱片，但因内部空氣形成禽匕流的影響，導致 冷空氣與熱空氣的亂竄，即造成記憶體、介面卡上之 散熱片的散熱效果變差，無法快速絲，易影響記憶 體的運作。 是以，如娜料目敎賴、細轉散熱效果變差 之問4，導致記憶體運作受縛的缺失，即為從事 相關廠商所亟欲研究改善之方向所在者。 ” 【新型内容】 故’創作人有聽上述之問題與缺失， ，經由多方評估及考量，並以從事於此行業累積:多13 =不斷試作及修改，始設計出此種可供氣流順暢流通、 快速散熱之散熱裝置_設補誕生者。 八方=作之主要目的乃在於該：相對式散熱片於相對内側 二t魏合面一齡贴設有散_，各縣部分別設 =數鮮形之散細、Μ之通風槽及位於二外側之對 =早几，而各散解的二姆相乃分顺有減體，則利 =式散熱片相對内側之貼合面分別抵貼於預姻 古再糟由二散熱部外側之抵麵抵持於預設發熱源之側緣， 2推預設發熱源進行安裝或拆卸，同時藉由二散熱片之 複數散熱韓片、V形之通風槽供空氣流通順暢，以 補助預设發熱源進行快速散熱。 伽本創作之★要目的乃在於二相對式散熱片於散熱部二外 =之對接單元’係分別設有可相對嵌扣、卡持、固定之 ==及=’且二散熱片係分別於二側對接單元分別設有 =及扣孔；亦猶—贿^麵單元分別設有 凸扣體、另-嶋㈣物㈣職扣孔，以供 -相對式散糾可以對接單元被嵌扣、结合。 【實施方式】 構皮為^上述目的及魏，本創作所_之技術手段及其 本創作之較佳實施例_明其特徵、功能 兴實轭方法如下，俾利完全瞭解。 睛參閱第一、二'三、四同_ 13斤不’係為本創作之立體外 觀圖立體分解圖、組裝前之侧視剖面圖、組裝後之側視剖 面圖蝴中所示可以清楚看出，本創作之散熱裝置係包括 二相對式散熱Μ、2所組成，其中： "亥一相式散熱片1、2係於相對内側面分別凸設有貼合 面 1 1、2 1 且各貼合面1 1、21外部即形成氣流交換 空間 1 1 0、9 1 ηV. New description: 【New technology field】 This creation department provides the kind of Lai, Yu Cai (4) assembly for the auxiliary silk, _ two-sided recording (four) heat dissipation part = complex complex The venting _ film, v-shaped ventilation slot, can be used for airflow and then _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The trend is also toward the operation of Wei Qiang, the fast side (four), the amount of computer related fields tends to high-speed, high-frequency development, and directly lead to the internal electronic components and memory bribes of the computer host, f will generate a lot of heat, if According to the memory model _ take the county to read, compare, from the early P c i (10) bandwidth of 8Q0MBA, expand to the current DDR 5 〇〇 bandwidth to reach 4. 〇 GB / S, even to multi-channel platform The bandwidth can be greatly expanded by more than two times, so that whether it is the working clock or the transmission bandwidth, it is obviously a development of high speed and high frequency, so as to cope with the high-speed arithmetic processing of the central processing unit of the motherboard. . Qb and the advancement of the electric service and the improvement of Wei and Wei are the only ones on the motherboard of the computer mainframe. It is necessary to add more CPUs for processing and computing. In recent years, the dual-core heat problem has been introduced. The solution is to set up multiple sets of fans and heat sinks on the motherboard. The fins are used to facilitate the rapid cooling of the motherboard, but also the circulation of most airflows in and out of the mainframe of the computer. In the case of turbulent flow inside the computer host, there are also many shortcomings and problems, such as: (1) The internal heat exchangers of the central computer and the central processing unit of the motherboard are equipped with a plurality of heat-dissipating fans in different directions and different positions. The heat sink fins cause the internal space of the computer mainframe to form a flow of multiple airflows, which form mutual interference between the airflows, causing turbulence, affecting the exchange of hot air with the outside cold air, and causing the heat dissipation effect to be poor. The turbulent flow is easy to issue tl sounds and so on. (2) The memory, interface card, etc. inserted in the motherboard of the electric age machine are provided with heat sinks, but the influence of the internal air forming the bird turbulence causes the chaos of cold air and hot air, which causes The heat dissipation effect of the heat sink on the memory and the interface card is deteriorated, and the wire cannot be fast, which easily affects the operation of the memory. Therefore, if Na Na's material blame and fine heat transfer effect worsen, the lack of memory operation is bound to be the direction in which the relevant manufacturers are eager to study and improve. [New content] Therefore, the creators have listened to the above problems and deficiencies, and through multiple assessments and considerations, and accumulated in this industry: more 13 = continuous trial and modification, designed to provide such a smooth flow of air The heat sink for rapid heat dissipation _ set the birth of the occupant. The main purpose of the octagon = the main purpose is to: the relative heat sink on the opposite side of the two t-wet surface one-year-old stickers _, each county separately set = number fresh The shape of the fine, ventilated groove and the pair on the outer side of the two = a few early, and the disperse of the two-phase phase is divided and reduced, then the opposite side of the heat sink is attached to the inner side of the heat sink The pre-marriage is further resisted by the outer surface of the two heat dissipating parts against the side edge of the preset heat source, 2 pushes the preset heat source for installation or disassembly, and at the same time, the heat sink of the two heat sinks, the V-shaped The ventilation slot provides air circulation smoothly, and the preset heat source is used to accelerate the heat dissipation. The purpose of the Gabon creation is that the two opposite heat sinks are respectively disposed on the heat dissipation part = the docking unit is respectively capable of being relatively inserted, Hold, fix == and =' and two heat sinks Different from the two side docking units, there are = and buttonholes; and the july-brieze-face units are respectively provided with a convex button body and another - (four) object (four) job button holes, so that the opposite unit can be embedded in the docking unit. [Description] The structure is the above-mentioned purpose and Wei, the technical means of the present invention and the preferred embodiment of the present invention _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ See the first, second 'three, four, _ 13 jin not' is the three-dimensional exploded view of the creation of the original, the side view of the profile before assembly, the side view of the assembled side view can be clearly seen The heat sink of the present invention comprises two opposite heat sinks and two components, wherein: "Hai-phase heat sinks 1, 2 are respectively convexly disposed on the opposite inner sides with the bonding faces 1 1 , 2 1 and An airflow exchange space 1 1 0, 9 1 η is formed outside each of the bonding surfaces 1 1 and 21
d丄◦，並於各貼合面工丄、2工一側分別凸 設有散熱部]9、0 0 A c J J，而各散熱部12、2 2係分別設有 ^數呈倒V形之散熱則1 2 1、2 2 χ，且相鄰之各散熱 〜片121、221間再設有通風槽12Q、22〇,則於 複數散熱鰭片1? 丄、2 21及複數通風槽12 0、2 2 0 由Ϊ外側’即分別設有呈倒L形之對接單元i 3、2 3，其 體=熱片1於二側邊之對接單^13，為分別設有凸扣 扣孔13 0 ’另側散熱片2之二側邊對接單元2 ，γ刀別設有扣孔23〇 散熱片1、？的_熟 篮，再於-相對式 單元1 3 ' 2 3之相對外侧，分別凸 s 又有倒L形之抵壓體14、24。 13=對她M，吻，輸二對接單元 對接單元ΓΠΓ1131、231以傾斜狀嵌入另側 1、2轉成相對平行0、1 3 0 ’並將二散熱片 、卡持，在二 、2之二外侧_14，，則_二：二 片1、2之散熱部12、22 亦呈相對抵持狀，各散熱則121:'22 =、221 ;;2=部，狀，設計，各^ ㈣成中空狀的散熱空間1〇 與各V形之通邪】9η ” U10 之通風槽12Ω20形成貫舰，則供ν· ★、2⑽散細1、2向外部呈擴散狀之 …十·硬數倒V形之散熱鰭片121、221、複數v 2 0、2 2 Q呈相鄰間隔狀的制設計，並可導 引散熱片1、2所吸收之熱空氣向外排散，則於二散熱片丄 、f的相對内側貼合面U、21間，形成容置空間3 〇， 二散熱片1、2的組裝、結合相當簡易、方便，並不需利用 其他^具組裝’具有树、省工、省力等實質功效。 月多閱第五、，、、七圖所示，係為本創作較佳實施例組 裝&之側視。彳面圖、較佳實施例崎後之侧視剖面圖、另一 實施例插接前之側視剖關，由圖+所示可以清楚看出，本 創作之二相對式散熱片i、2於實際組裝、使用時，係利用 側政熱片1内側之貼合面i i，抵貼於預設發熱源4 (記 憶體或介面卡等）的—側，而職發熱源4，再供另一 散熱片2藉由對接單元2 3之凸扣體2 3工喪入另側散熱片 1之扣孔13 0内，並將另一散熱片2旋轉後利用貼合面2 1抵貼於預設麵源4的另側表面，以供預設發熱源4被爽 持收β &位於一散熱片i、2所形成之容置空間3 ο内 ’並藉由二散熱片1、2之抵壓體14、24分別抵持在預 設發熱源4_部側緣4 i，即快速又簡㈣完成相對式散 熱片1、2組裝、夹固於預設發熱源4之作業。 則將組裝後之二散熱片1、2及預設發熱源4，透過預 設發熱源4 (電_記憶體或介面卡等）之對接部42，予 以插接在姆型式之職連翻5内（設置設電腦主機 内部之主機板上），為可利用二散熱片1、2於散熱部工2 、2 2-外側之抵壓則4、2 4供施力按壓，以輔助預設 發熱源4方便、快速組裝於預設連接ϋ 5 ;則當預設發熱源 4進行運作而發熱時，可以藉由二散熱片】、2之各貼合面 1 1、2 1吸收預設發減4之減，再雜能傳送至散熱 # 1 2、2 2的散熱空間1〇 ’透過散熱空間i Q外側的複 數散熱鰭片121、2 21及複數V形之通風槽i 2 〇、2 2 〇 ’導引空氣流通順暢，並辅助冷空氣與熱空氣的快速交 換避免空氣四處流竄而產生亂流、噪音，進而完成快速散 熱之效用’而將二散熱片1、2所吸收預設發熱源4之熱能 向外排散，進而輔助預設發熱源4快速散熱；而二散熱片工 2於貼合面1 1、21外側之氣流交換空間11〇、2丄 〇即可輔助預設發熱源4之熱能，由周邊散出二散熱片工、 2外部，進而提升散熱之效用。 疋以，以上所述僅為本創作之較佳實施例而已，非因此 侷限本創作之專利範g ’本創作之相對式散熱y 12 ,為 藉由相對内側之貼合面！ i、2!於—側所設之散執部j 2 、2 2，透過各散熱部1 2、2 2二外觸設之對接單元丄 3、23,以散熱片i、2之凸扣⑴卜叫嵌入另 側相對之扣孔2 3 0、130，並將购^、2固設於預 設發熱源4外側，俾可達到藉由二散熱片i、2吸收預， 之熱能後’透過各散熱部1 2、22之複數散熱二 221與複數V形之通風槽120、22〇輔助氣 流順暢流通、快速散熱之目的，並利用二散熱片^ ^ 散熱部12、22的二外侧所設之抵壓體14、24，輔助 ^又發熱源4與預設連接器5進行快速插接、拆卸等， 散熱快速及組裝枝之實用 ，、 特徵、目的等及構造、裝置，^=:輪述效果之 易修飾及等效結構變化 2 所/函蓋’此種簡 内，合予陳明。 勺應_包含於本創作之專利範圍 上述本創作之散熱裝置，於實際實施製 具有下列各項優點，如： 乍業時，為可 (一二姆式贱M、2於貼合 分別設有散熱部12 21—側， 2之複數散熱,^12 2 ’可彻散熱部12、2 槽1 2 〇、2 2 0， 2、221及複數V形之通風 產生亂流或噪音供氣流的流通順暢、不I竄、不 到辅助預設發熱源4快速散熱之 目的。 (二）該二相對式散熱片卜2於各散熱部12、22的外 側分別設有對接單元i3、23,即藉由一側散熱片 1的對接單元13之凸扣體131、扣孔，與 另側散熱片2的對接單元2 3之扣孔2 3 〇、凸扣體 2 2 1 ’相互嵌扣、卡持而固定，可將二散熱片卜 2組裝'夹固於預設發熱源4外部。 (二）該二散熱片1、2於各散熱部丄2、2 2的外側所設 之抵频1 4、2 4，係抵持在預設發熱源4的頂部 側緣4 1，而將預設發熱源4組裝於預設連接器㈣ ，柯透過二側抵壓體14、24處，形成辅助施力 按壓的施力位置，而方便將預設發熱源4組裝於預設 連接器5内。 (四）該二散熱月1、2組襄於預設發熱源4外側，而預設 發熱源4設置於電腦主機内的主機板上，可以辅助電 細主機内部的空氣流通、不會形成遮蔽或阻擋，而能 輔助預設發熱源4進行快速散熱。 故，本創作為主要針對散熱裝置的散熱片之設計，係於 一相對式散熱片的貼合面一側，分別設有散熱部，藉由散熱 邛之複數散熱鰭片、通風槽等，導引氣流的流通順暢，而可 輔助散熱片進行快速散熱，再利用各散熱部二外側之對接單 70呈相互嵌扣、卡持固定，供二散熱片組裝於預設發熱源外 10 ’以達到透過二散熱片吸收預設發熱源之熱能，並藉由二 散熱片之散熱部導引氣流順贼通、輔助快速散熱為主要保 /董重點’且二散熱片為分別利用散熱部二外侧之對接單元進 仃2對嵌扣、組裝，具有組裝簡易、散熱效能良好等實用之 功月b ’惟’以上所述僅為本發明之較佳實施例而已，非因此 即2限本發明之專利軸，故舉凡運用本發明綱書及圖式 内各所為之簡易修飾、替換及等效顧變化，均應同理包含 於本發明之專利範圍内’合予陳明。 =上所述’本創作上述散熱裝置於實際應用、實施時， 為確實此達到其功效及目的，故本創作誠為—實用性優異之 創設，為符合新型專利之申請要件，麦依法提出申請，盼 審委早日賜准本案’以保障創作人之辛苦研發，倘若釣局 審委有任何概，請不絲純示，創作人定當竭力配合， 實感德便。 M378422 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作組裝前之侧視剖面圖。 第四圖係為本創作組裝後之側視剖面圖。 第五圖係為本創作較佳實施例組裝前之側視剖面圖。 第六圖係為本創作較佳實施例組裝後之側視剖面圖。 第七圖係為本創作另一實施例插接前之側視剖面圖。 件符號說明】 121、散熱鰭片 1 3、對接單元 1 3 0、扣孔 1 3 1、凸扣體 1 4、抵壓體 2 3、對接單元 2 3 0、扣孔 【主要元 1、 散熱片 10、散熱空間 1 1、貼合面 1 10、氣流交換空間 12、散熱部 12 0、通風槽 2、 散熱片 21、貼合面 210、氣流交換空間 2 2、散熱部 2 2 0、通風槽 2 31、凸扣體 2 4、抵壓體 12 M378422 2 21、散熱鰭片 3 0、容置空間 4、 發熱源 4 1、側緣 4 2、對接部 5、 連接器d丄◦, and a heat dissipating portion 9, 0 0 A c JJ is respectively protruded on each of the bonding surface and the 2 working side, and each of the heat dissipating portions 12 and 2 2 is provided with an inverted V shape. The heat dissipation is 1 2 1 and 2 2 χ, and the adjacent heat dissipation sheets 121 and 221 are further provided with ventilation slots 12Q and 22〇, and the plurality of heat dissipation fins 1? 丄, 2 21 and the plurality of ventilation slots 12 0, 2 2 0 Ϊ Ϊ ' ' 即 ' ' ' ' ' ' ' ' ' ' ' ' ' ' 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对Hole 13 0 'The other side of the heat sink 2 of the two sides of the docking unit 2, the γ knife is provided with a button hole 23 〇 heat sink 1,? The _ mature basket, and then the opposite side of the relative unit 1 3 ' 2 3 , respectively, has an inverted L-shaped pressing body 14, 24 . 13=For her M, kiss, and the two docking unit docking unit ΓΠΓ 1131, 231 are embedded in the inclined side, the other side is turned into a parallel parallel 0, 1 3 0 ' and the two heat sinks are held, in the second and second Two outer sides _14, then _ two: two pieces 1, 2 of the heat dissipating parts 12, 22 are also relatively resistive, each heat dissipation 121: '22 =, 221;; 2 = part, shape, design, each ^ (4) The hollow space of the heat dissipation space 1〇 and the V-shaped evil spirits] 9η ” U10 ventilation groove 12Ω20 formed into a ship, then ν· ★, 2 (10) scattered fine 1, 2 diffused to the outside... The number of inverted V-shaped fins 121, 221, and the plurality of v 2 0, 2 2 Q are adjacently spaced and designed to guide the hot air absorbed by the fins 1, 2 to be outwardly dispersed. Between the two inner fins 丄, f and the inner side of the bonding surfaces U and 21, the accommodating space 3 〇 is formed, and the assembly and the combination of the two heat dissipating fins 1 and 2 are relatively simple and convenient, and do not need to be assembled by using other tools. The practical effects of labor saving, labor saving, etc. The monthly reading of the fifth, the, and the seven figures is the side view of the assembly and the preferred embodiment of the creation. The side view, the side of the preferred embodiment The cross-sectional view of the cross-sectional view and the other embodiment before the plug-in is inserted, as can be clearly seen from the figure +, the second heat sinks i and 2 of the present invention are used in actual assembly and use. The bonding surface ii on the inner side of the sheet 1 is attached to the side of the preset heat source 4 (memory or interface card, etc.), and the heat source 4 is provided, and the other heat sink 2 is convex by the docking unit 2 3 . The button body 2 is immersed in the button hole 130 of the other side heat sink 1 , and the other heat sink 2 is rotated and then abutted against the other side surface of the preset surface source 4 by the bonding surface 2 1 for The heat source 4 is held in the receiving space 3 ο formed by a heat sink i, 2 and is held by the pressing bodies 14 and 24 of the two heat sinks 1 and 2 respectively. The heat source 4_ side edge 4 i, that is, fast and simple (four) complete the relative heat sink 1, 2 assembly, clamped to the preset heat source 4. Then the assembled two heat sink 1, 2 and preset The heat source 4 is inserted into the mating portion 42 of the preset heat source 4 (electricity_memory or interface card, etc.), and is connected in the type 5 of the type of work (set on the motherboard inside the computer main body). The two heat sinks 1 and 2 can be pressed on the outer sides of the heat dissipating parts 2 and 2 2 to apply pressure to the auxiliary heat source 4 to facilitate the quick assembly of the heat source 4 to the preset connection ϋ 5; When the preset heat source 4 is operated to generate heat, the reduction of the preset reduction 4 can be absorbed by the two heat sinks, 2, and the bonding surfaces 1 1 and 2 1 , and the noise can be transmitted to the heat dissipation # 1 2 . 2 2 heat dissipation space 1〇' through the heat dissipation space i Q outside the plurality of heat dissipation fins 121, 2 21 and a plurality of V-shaped ventilation slots i 2 〇, 2 2 〇 'guide air flow smoothly, and assist cold air and heat The rapid exchange of air avoids the turbulence and noise generated by the air flowing around, thereby completing the effect of rapid heat dissipation, and dissipates the heat energy of the preset heat source 4 absorbed by the two heat sinks 1, 2 to assist the preset heat source. 4 rapid heat dissipation; and the two heat sinks 2 on the outer side of the bonding surface 1 1 , 21 air exchange space 11 〇, 2 丄〇 can assist the preset heat source 4 heat energy, two heat sinks are scattered from the periphery, 2 External, which enhances the effectiveness of heat dissipation. As described above, the above description is only a preferred embodiment of the present invention, and thus does not limit the relative heat dissipation y 12 of the present patent, which is the opposite side of the inner surface! i, 2! The dissipating parts j 2 and 2 2 provided on the side are through the docking units 丄 3 and 23 which are respectively disposed outside the heat dissipating parts 1 2 and 2 2 , and the protruding tabs of the fins i and 2 (1) Bu is embedded in the opposite side of the button hole 2 3 0, 130, and the purchase of ^, 2 is fixed on the outside of the preset heat source 4, the 俾 can be absorbed by the two heat sinks i, 2, after the heat energy 'through The plurality of heat dissipating portions 221 and 22 of the heat dissipating portions 1 2, 22 and the plurality of V-shaped ventilation grooves 120 and 22 〇 assist the airflow to smoothly flow and rapidly dissipate the heat, and use the two fins to provide the two outer sides of the heat dissipating portions 12 and 22 The pressing body 14 and 24, the auxiliary heat source 4 and the preset connector 5 are quickly inserted and disassembled, and the heat dissipation is quick and the utility of the assembly branch, characteristics, purpose, etc. and structure and device, ^=: wheel The easy-to-modify effect and the equivalent structural change of the effect 2 are covered by the letter, and the combination is given to Chen Ming. The spoon should be included in the scope of the patent. The heat sink of the above-mentioned creation has the following advantages in the actual implementation system, such as: When the industry is in operation, it can be used (one or two types of 贱M, 2 are respectively provided for the fit) The heat dissipating portion 12 21 - side, 2 of the plurality of heat dissipation, ^ 12 2 ' can be completely radiated 12, 2 slots 1 2 〇, 2 2 0, 2, 221 and a plurality of V-shaped ventilation to generate turbulent flow or noise supply airflow Smooth, not 窜, can not assist the preset heat source 4 for rapid heat dissipation. (2) The two opposite heat sinks 2 are respectively provided with docking units i3, 23 on the outer sides of the heat radiating portions 12, 22, that is, The male button body 131 and the button hole of the docking unit 13 of the one side heat sink 1 and the button hole 2 3 〇 and the male button body 2 2 1 ' of the docking unit 2 3 of the other side heat sink 2 are interlocked and latched. And fixed, the two heat sinks 2 can be assembled and clamped to the outside of the preset heat source 4. (2) The two heat sinks 1 and 2 are offset from the outer sides of the heat dissipating portions 2, 2 2 And 24, resisting the top side edge 4 1 of the preset heat source 4, and assembling the preset heat source 4 to the preset connector (4), and passing through the two side pressing bodies 14, 24, It is convenient to apply the pressing force to the pressing position, and it is convenient to assemble the preset heat source 4 into the preset connector 5. (4) The two heat-dissipating months 1 and 2 are outside the preset heat source 4, and the preset The heat source 4 is disposed on the motherboard of the computer main body, which can assist the air circulation inside the electric host, does not form a shadow or block, and can assist the preset heat source 4 to perform rapid heat dissipation. Therefore, the creation is mainly for heat dissipation. The heat sink of the device is designed on the side of the bonding surface of a pair of opposite heat sinks, and is respectively provided with a heat dissipating portion. The heat radiating fins and the ventilation slots are used to guide the flow of the airflow smoothly. The auxiliary heat sink is used for rapid heat dissipation, and the butting unit 70 on the outer side of each of the heat dissipating portions is mutually interlocked and clamped, and the two heat sinks are assembled outside the preset heat source 10' to achieve absorption through the two heat sinks. The heat energy of the heat source, and the heat dissipation part of the two heat sinks guides the airflow to the thief, and the auxiliary heat dissipation is the main protection/dong key', and the two heat sinks are respectively used for the docking unit of the outer side of the heat radiating part. Buckle, assembly The utility model has the advantages of simple assembly, good heat dissipation performance, and the like. However, the above description is only a preferred embodiment of the present invention, and therefore, it is not limited to the patent axis of the present invention, so the application of the present invention and The simple modifications, substitutions, and equivalent changes in the drawings are all included in the scope of the patent of the present invention as 'combined with Chen Ming. 'In the above description, the above-mentioned heat sink of the present invention is actually applied and implemented. In order to achieve its efficacy and purpose, the creation of this creation is excellent-practical, in order to meet the application requirements of the new patent, Mai applied for it in accordance with the law, and hoped that the trial committee will grant the case as soon as possible to protect the hard work of the creator. If there is any generality of the fishing bureau's review committee, please do not show it purely. The creator will try his best to cooperate with him. M378422 [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The third figure is a side cross-sectional view of the original assembly. The fourth figure is a side cross-sectional view of the original assembly. The fifth drawing is a side cross-sectional view of the preferred embodiment of the present invention prior to assembly. Figure 6 is a side cross-sectional view of the preferred embodiment of the present invention assembled. Figure 7 is a side cross-sectional view of another embodiment of the present invention before being inserted. Description of the symbols] 121, heat sink fins 1 3, docking unit 1 3 0, button hole 1 3 1 , male button body 1 4, pressing body 2 3, docking unit 2 3 0, button hole [main element 1, heat dissipation Sheet 10, heat dissipation space 1 1 , bonding surface 1 10, air flow exchange space 12, heat dissipation portion 120, ventilation slot 2, heat sink 21, bonding surface 210, air flow exchange space 2, heat dissipation portion 2 2 0, ventilation Slot 2 31, male body 2 4, pressing body 12 M378422 2 21, heat sink fin 30, accommodating space 4, heat source 4 1 , side edge 4 2, butt joint 5, connector
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