1269628 九、發明說明·· 【發明所屬之技術領域】 本發明係有關於一種「散熱模組之機構」，其尤指一種風扇流道大 於散熱器對接面面積之風扇模組結構。 【先前技術】 按，近年來半導體產業發展迅速，電子設備元件朝著小型化及高 頻化的趨勢發展’在產生功能更為強大的電子元件同時，也隨著因高 功率所產生的高發熱量問題，這些電子元件單位面積所散發出的高熱 量已成為不容忽視的熱源，若無法快速且有效的將電子元件所散發出 的熱里移除’將會導致元件本身溫度過局’影響電子元件的正常運作， 進而ie成系統的不穩定，為了散去電子元件過多的熱量，因此必須有 效的冷卻系統，解決系統中不同層次上熱量的問題。 而為了使電子元件及機器能發揮最大的功能，充分散熱是十分重 要的，因此在有效的設計冷卻系統上，需考慮的因素有：丨·元件發熱 量的大小；2·空間大小及重量限制；3·工作環境溫度；4•冷卻系統成 本；5·冷卻系統使用流體；隨著工業技術與半導體製程的快速進步， 電子7L件及晶片的作時脈不_往上提升，.般電腦主機而言， 主要熱源來自於微處理機、域板±的南北橋晶片、顯示卡上的高效 月b曰曰片、硬碟機、辆機及電源供應器料，而越高頻的微處理器， 其發熱的瓦數甚至快接近於百瓦的高熱量，而其所產生的高熱量，相 當於-塊灼熱的金屬板，如此驚人的熱量，在往後技術發展曰新月異 1269628 的日子’情形可能更為嚴重，當然，除了微處理機外， 橋晶片、機或是現在功能日益狀_義的顯示轉，都可能 有將熱域高許多，進而影響到整個祕的運作效能，因此，如何求 仔個好的散熱方法，將是一個非常重要的問題。然而對散熱問題而 言’空間是—個非常大的考慮因素，因在-個發熱量極高的系統中， 右熱篁無法散逸出去，則系統的溫度將會—直升高，而如何利用在有 限的空間内，驗又有效率的將缝做，將是—門更加娜的作業。 而目前市面上的電腦由於其空間上的限制，因此多半利用小型風 扇架於散鋪片上，而再將此機齡於發熱社，以_散熱的效果。 但如何有效提高散熱的方法及技術，使得系統驗速又有效的運 作’這正是現在產業界及學術界所共騎究的課題，而目前冷卻的方 式主要有自然對流冷卻、強制對流冷卻、液體間接歧接冷卻或相變 化冷卻等。 而其中又以強制對流冷卻，為一般最常見的冷卻方法，其中的原 因在於空氣是-種不會缺少也是最容祕到_流體，不需成本及動 力就能擁有，而通常又_風祕配散無為機構，以用來驅散高發 熱量機構的熱量，通常風顧作用在_動空氣流體，以達到強制對 流’而散熱n則是以高熱料率，及與空氣接_表_ 1散熱效 果加強，因此散熱器的材質通常選贿傳導率_合金或銅，而與空 氣接觸的表面積也越大越好。 風扇也因構造簡單、成本絲、不易損壞及驅動能源低的優點， 1269628 因此常拿來廣泛使用’以轴流式風扇而言，其係利㈣導氣流沿葉片 中心軸平行吹出，特點是靜壓小、風量大，多用於低阻力場所，而— 般的散熱系統，由於阻力不大，加上設計上的問題，因此多利用轴流 式的風扇，因轴流式風扇適用於大空氣流體及低壓力的環境。 再者如中華民國專利公報公告號第527089號之「散熱裝置及散熱 裝置之導流裝置」新型-案所揭示之技術，其包含#_導流管該導流 管係具有開口及-後開口，導流管内形成設有多個導流片，其中 該前開口面積係大於後開口面積，且該制口係連接—風扇之出風 口’該後開〇係連接該散熱片，以藉由風扇轉動時般氣由該導流管 之前開〇進人導流管中，並經過該多個導流片由後開〇送出，以對該 散熱片進行散熱。 惟上述習知結構在實施上有其問題存在，由於風扇與散熱片之間需 藉由該導流裝置得以將該風扇組設於該散熱片上，即該風扇與散熱片 之間隔著該導流裝置，進而加大風扇與散熱片下方的發熱源的距離， 而影響散熱效果’又因鱗流裝置的縱向高度成錢扇.流出之流 體所需經過的轉’進而造成趙_能的消耗，另外由於流體的溫 度在出風π處最低，在通過該導流f時該流體的溫度會遞增，而到散 熱片時流體的溫度不如出風口的溫度低反餅錢體與散熱片之間的 熱交換率’由於騎__存在實對散触果大打折扣。 實 緣是，有鑑於上述獅品雌钱各項缺點，本案之發明人為择 ί本案善’遂竭其心智’以從事該行業多年之經驗’潛； 九加以創新改良’終於成功研發完成本件「散熱模組之機構」案研 1269628 為一具功效增進之發明。 【發明内容】 -因此，本發明之主要目的乃係在提供—㈣絲係套合於該傳導 70件外緣，猎以承接導？丨該大於且直接接設於該散傳導元件受接面之 風扇所帶動之流體。 本發明之「散熱模組之機構」’至少包含有至少—風扇、一傳導 70件及-導流罩’其中該傳導树係具有—受接面以供該風扇連接， 且該侓導元件係_導料局縣合，該風轉有—雜，且該扇輪 之直徑面積係大於該傳導树之受接面面積，進而凸岐受接面外 緣’該導流罩係具—入°及—出口，且該入口係設有至少-承接部以 受接由該凸出扇輪帶動之流體，該出口係套設於該傳導元件上，藉由 該導机罩財x雜設於料元件受接面之風扇之凸㈣輪帶動之 流體，進稱該凸出扇輪帶動之龍導服向傳導元件。 本發明之上述目其結構與捕上的雜，將轉所附圖式之 較佳實施例予以說明。 【實施方式】 本U係提i、種「散熱模組之機構」，圖示係為本發明之較佳 實施例’請參閱第-、二圖所示係至少包含有至少—風扇U、一傳導 元件12及-導流㈣，其找傳導元件12在核佳實施例中係為散 熱器，其係設有複數呈平型顯之散熱鰭片121，而該散麟片⑵ 與散熱鰭>| 121之_成有流道122，該錢122錢通料元件12 1269628 之兩邊，而該複數散熱鰭片121及流道122係界定成一四對等邊行之 文接面A，該風扇η係具一基座ill及一樞設於該基座Hi上之扇輪 112，該基座m之面積及形狀係小於或等於上述之傳導元件12之受 接面A之面積及形狀，且該基座111的中央係開設一透孔113及該基 座ill之四隅開設有貫穿孔114以供固定元件115貫穿，而該扇輪112 之直徑面積係大於該傳導元件之受接面A面積；該導流罩13係具有 入口 131及一出口 132 ’且其入口 131側係設有至少一向外擴散之 承接部133以承接該風扇11之流體。 於組裝時，將該導流罩13套設於該傳導元件12之外周圍上半部 且令該導流罩13之出口 132係平齊於該傳導元件12之外周緣，即該 傳導元件12係被導流罩13局部套合，再令該固定元件115貫穿絲 座111之貫穿孔114並組設於該傳導元件12之受接面A，以令風扇 11接設於該傳導元件12之受接面a上，且由於該扇輪112直徑大於 該傳導元件12之受接面A面積，進而於受接面A外緣呈凸出狀，而 該所述之導鮮13之人d 131 #丨之承接部133之内㈣呈傾斜狀且 對應該傳導件12兩邊之流道122,換言之該承接部133係成雙且對 稱的設於導流罩13之入口側131的相對兩邊，且當導流罩13局部套 合於该傳導讀12後’該承接部133係侧對應鄰觀傳導元件12 雙邊之流道122 〇 請再參閱第…二®所示，係、為本發明較佳實施例應用於發熱元 件之剖視示意圖，如圖所示該傳導树12係貼合設於一發熱元件14 1269628 上以傳遞遠發熱元件14之熱量，直接幫助該發熱元件14散熱，而 田風扇11之扇輪U2轉動帶動流體朝傳導元件12流動時，該流體 通過該基座m之透孔113流向餅元件12之舰122，將傳導元件 2所傳遞之熱1由料元件12兩側流出帶走，而凸出於該傳導元件 2之又接面A外緣之扇輪112所帶動之流體係流向該導淀^ u之入 口 131及承接部133，即該入口 131及承接部133承受凸出於受接面 A外緣之扇輪112所帶動之流體，並藉由該承接部133内壁呈傾斜狀 以導引顧體流向傳導元件12之流道122後，再由傳導元件η的兩 側⑽流出，以帶走傳導元件12所傳遞之熱量，藉由該承接部133 承受凸出於受接面A外緣之賴112解動之趙，俾增加作用於傳 導轉12之錢’進而增加熱對流的效率，以提升整體之散熱效果， 且改善了習知風扇距離發熱源太遠的問題。 月再參閱第四、五、六、七圖所不係為本發明第二較佳實施例其 整體結構與魏她_纽與前—，在此即不再贅述 相同構造及其標號，而其不同處為賴扇21係具有—框體犯，且該 框!!11在本較佳實施例中係呈獅體，在該框體211上開設有複數 個貫穿孔212以供固接元件115貫穿接至該傳導元件12之受接面a 上1該框體211之_、構成—流道213，該流道2i3係大於辦 導轉12之受接面A面積，而於該受接面A外緣形成凸出區域财 且於扇㈣丨之流糊咖有—扇輪215，輪215之直徑3 積係略小於該流細面積，而大於該受接面A之面積，進而凸㈣ 1269628 受接面A之周圍外緣，而該導流罩 出區域2H流出之流體，以達上述之作用接部133係可收容該由凸[Technical Field] The present invention relates to a "heat dissipation module mechanism", and more particularly to a fan module structure in which a fan flow path is larger than a heat sink abutment surface area. [Prior Art] According to recent years, the semiconductor industry has developed rapidly, and electronic device components are developing toward miniaturization and high-frequency. 'In the production of more powerful electronic components, it also has high heat generation due to high power. The problem is that the high heat emitted by the unit area of these electronic components has become a heat source that cannot be ignored. If the heat emitted by the electronic components cannot be removed quickly and effectively, the temperature of the components themselves will be passed through. The normal operation, and then the instability of the system, in order to dissipate too much heat of the electronic components, it is necessary to effectively cool the system to solve the problem of heat at different levels in the system. In order to maximize the function of electronic components and machines, it is very important to fully dissipate heat. Therefore, in the effective design of the cooling system, the factors to be considered are: 丨·the amount of heat generated by the component; 2. Space size and weight limit 3·Working environment temperature; 4•Cooling system cost; 5·Cooling system using fluid; With the rapid advancement of industrial technology and semiconductor manufacturing process, the timing of electronic 7L parts and wafers is not improved, such as computer host In terms of frequency, the main heat source comes from the microprocessor, the north-south bridge chip of the domain board, the high-efficiency monthly b-chip on the display card, the hard disk drive, the vehicle and the power supply, and the higher frequency microprocessor. The wattage of the heat is even close to the high heat of 100 watts, and the high heat generated by it is equivalent to a piece of hot metal plate, such amazing heat, in the days when the technology developed rapidly, 1269628 'The situation may be more serious. Of course, in addition to the microprocessor, the bridge chip, the machine or the function that is now functioning more and more, may have a much higher thermal range, which in turn affects the entire secret. For performance, therefore, how to find a good cooling method will be a very important issue. However, for the heat dissipation problem, 'space is a very big consideration. Because in a system with extremely high heat, the right enthalpy cannot escape, the temperature of the system will rise straight, and how to use it. In a limited space, the inspection will be done efficiently, and it will be the work of the door. However, due to the space limitations of the computers on the market, most of them use small fan racks on the spread sheets, and then the machine is older than the heat club, with the effect of heat dissipation. However, how to effectively improve the heat dissipation method and technology makes the system speed and effective operation. This is the subject of riding in the industry and academia. The current cooling methods mainly include natural convection cooling and forced convection cooling. Liquid indirect junction cooling or phase change cooling, etc. Among them, forced convection cooling is the most common cooling method. The reason is that the air is not missing and is the most secretive. It can be owned without cost and power, and usually _ wind secret Distributing the inactive mechanism to dissipate the heat of the high-calorie mechanism, usually acting in the _moving air fluid to achieve forced convection, while the heat dissipation n is based on the high hot material rate, and the air is connected to the air _ 1 Therefore, the material of the radiator is usually chosen to pass the conductivity _ alloy or copper, and the surface area in contact with air is as large as possible. Fans are also widely used because of their simple structure, cost, damage, and low driving energy. 1269628 is therefore widely used. In the case of axial fans, the airflow is blown in parallel along the central axis of the blade. The pressure is small, the air volume is large, and it is mostly used in low-resistance places. However, due to the small resistance and design problems, the axial flow type fan is often used, because the axial flow fan is suitable for large air fluids. And a low pressure environment. In addition, the technology disclosed in the "New Type of Heat Dissipating Device and Heat Dissipating Device" of the Republic of China Patent Publication No. 527089 includes a #_drain tube having an opening and a rear opening. a plurality of baffles are formed in the draft tube, wherein the front opening area is larger than the rear opening area, and the mouth opening is connected to the fan air outlet 'the rear opening is connected to the heat sink to be driven by the fan When the rotation is started, the gas is opened into the human draft tube before the draft tube, and is sent out by the rear opening through the plurality of baffles to dissipate heat from the heat sink. However, the above-mentioned conventional structure has a problem in implementation. The fan and the heat sink are required to be disposed on the heat sink by the flow guiding device, that is, the fan and the heat sink are spaced apart from each other. The device, in turn, increases the distance between the fan and the heat source under the heat sink, and affects the heat dissipation effect, and because the longitudinal height of the scale device becomes a money fan, the flow that needs to pass through the fluid flows, thereby causing the consumption of Zhao energy. In addition, since the temperature of the fluid is the lowest at the outlet π, the temperature of the fluid increases as it passes through the deflector f, and the temperature of the fluid to the fin is not as low as the temperature of the outlet is opposite between the cake and the fin. The heat exchange rate is greatly reduced due to the existence of the ride. The real reason is that, in view of the shortcomings of the above-mentioned lion's female money, the inventor of this case has chosen to “exhaust his mind” in order to engage in the industry's many years of experience's potential; nine innovations and improvements have finally succeeded in the development of this piece. The research institute of the thermal module "1269628" is an invention with enhanced efficiency. SUMMARY OF THE INVENTION - Therefore, the main purpose of the present invention is to provide - (4) silk system fit over the outer edge of the conductive 70 pieces, hunting to guide the guide?丨 The fluid that is larger than and directly connected to the fan of the receiving surface of the diffuse conducting element. The "mechanism of the heat dissipation module" of the present invention includes at least a fan, a conductive 70, and a shroud, wherein the conductive tree has a receiving surface for the fan to be connected, and the guiding element is _ Guide Bureau, the wind is turned into a miscellaneous, and the diameter of the fan wheel is larger than the area of the joint of the conductive tree, and then the outer edge of the joint is 'the shroud' And the outlet, and the inlet is provided with at least a receiving portion for receiving the fluid driven by the protruding fan wheel, the outlet is sleeved on the conductive element, and the guide is covered by the material The component is driven by the convex (four) wheel of the fan of the connecting surface, and the dragon is guided to the conductive element by the protruding fan wheel. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION The structure and the trapped impurities of the present invention will be described with reference to preferred embodiments of the drawings. [Embodiment] This U is a "mechanism of a heat dissipation module", which is a preferred embodiment of the present invention. Please refer to the first and second figures to include at least a fan U and a The conducting element 12 and the conducting current (4), the finding conducting element 12 is a heat sink in the preferred embodiment of the core, and is provided with a plurality of flat fins 121, and the radiating fins (2) and the heat sink fins ; 121 _ has a flow channel 122, the money 122 money pass element 12 1269628 on both sides, and the plurality of heat sink fins 121 and the flow channel 122 is defined as a four-to-equal line of text interface A, The fan η has a base ill and a fan wheel 112 pivoted on the base Hi. The area and shape of the base m are less than or equal to the area and shape of the receiving surface A of the conductive element 12, A through hole 113 is defined in the center of the base 111, and a through hole 114 is defined in the center of the base ill for the fixing member 115 to penetrate. The diameter of the fan wheel 112 is larger than the receiving surface A of the conductive element. The shroud 13 has an inlet 131 and an outlet 132' and has at least one outwardly diffusing bearing on the side of the inlet 131. The joint 133 receives the fluid of the fan 11. During assembly, the shroud 13 is sleeved on the outer upper half of the conductive element 12 and the outlet 132 of the shroud 13 is flush with the outer periphery of the conductive element 12, that is, the conductive element 12 The cover member 13 is partially sleeved, and the fixing member 115 is inserted through the through hole 114 of the wire holder 111 and assembled on the receiving surface A of the conductive member 12 to connect the fan 11 to the conductive member 12. The receiving surface a, and because the diameter of the fan wheel 112 is larger than the area of the receiving surface A of the conducting element 12, and then the outer edge of the receiving surface A is convex, and the person of the guiding 13 is 131 The inside of the receiving portion 133 is slanted and corresponds to the flow passages 122 on both sides of the conductive member 12, in other words, the receiving portion 133 is double and symmetrically disposed on opposite sides of the inlet side 131 of the shroud 13, and When the shroud 13 is partially fitted to the conductive read 12, the side of the receiving portion 133 corresponds to the flow path 122 of the adjacent conductive element 12. Please refer to the second ..., which is preferred for the present invention. The embodiment is applied to a cross-sectional view of a heating element. As shown, the conductive tree 12 is attached to a heating element 14 1269628. The heat of the far heating element 14 is directly transmitted to help the heat generating element 14 to dissipate heat. When the fan wheel U2 of the field fan 11 rotates to drive the fluid toward the conducting element 12, the fluid flows to the cake element 12 through the through hole 113 of the base m. The ship 122 transmits the heat 1 transmitted by the conducting element 2 away from both sides of the material element 12, and the flow system driven by the fan wheel 112 protruding from the outer edge of the connecting surface A of the conducting element 2 flows to the guide The inlet 131 and the receiving portion 133 of the receiving portion 133, that is, the inlet 131 and the receiving portion 133 receive the fluid carried by the fan wheel 112 protruding from the outer edge of the receiving surface A, and the inner wall of the receiving portion 133 is inclined. After the guide body flows to the flow path 122 of the conductive element 12, it flows out from both sides (10) of the conductive element η to take away the heat transferred by the conductive element 12, and the receiving portion 133 is received by the receiving portion 133. The outer edge of the 12-resolved Zhao, 俾 increased the effect on the conduction of 12 money' and thus increased the efficiency of heat convection, in order to improve the overall heat dissipation effect, and improved the problem that the conventional fan is too far away from the heat source. Referring to the fourth, fifth, sixth and seventh figures, the overall structure of the second preferred embodiment of the present invention is not related to the same structure and its label, and the same structure and its reference are not repeated here. In the preferred embodiment, the frame is a lion body, and the frame body 211 is provided with a plurality of through holes 212 for fixing the component 115. Passing through to the receiving surface a of the conducting element 12, the frame 211 is formed, and the flow path 2i3 is larger than the area of the receiving surface A of the turn 12, and the receiving surface is The outer edge of A forms a convex area and the fan of the fan (four) 有 has a fan wheel 215. The diameter of the wheel 215 is slightly smaller than the area of the flow, and is larger than the area of the contact surface A, and thus convex (four) 1269628 The surrounding outer edge of the receiving surface A, and the fluid flowing out of the flow guiding area 2H, so as to reach the above-mentioned working joint 133 can accommodate the convex
請再參閱第八、九、十、十-圖所示係為本發明第三較佳實施例 其整體結構與功能及實施態樣大致與前一· A 述相同構造及其標號，而其不同處為：例相同’在此即不再贅 …風扇51係具有一框體511， = 心内壁係 咖，該流糊係大於該傳導元件^受接面Α面積’ =該雜面A外緣形成凸出區域514 (如軒騎示），且於扇框Please refer to the eighth, ninth, tenth, and tenth drawings for the third preferred embodiment of the present invention. The overall structure, function, and implementation of the present invention are substantially the same as those of the previous embodiment, and the same. The case is the same as the example 'here is no longer 赘...the fan 51 has a frame 511, = the inner wall of the heart, the flow is larger than the conductive element ^ the area of the interface ' = the outer edge of the face A Forming a convex area 514 (such as Xuanqi), and in the fan frame
=UWW*515，W5i5之錄面積係略小 =^513面積，而大於該受接面A之面積，進而凸出該受接面A 和3之她卩⑶㈣姆纖細 机出之机體，以達上述之作用。 又如第十二圖所示，該風扇51係具有—兩長邊兩短邊之長方形 框細，其亦不脫本發明之原創變化，而達上述之作用及功能。 —請再觸十三、切、十五、十六騎示縣本發明第喊佳 貫關其整體結構與功能及實施態樣大致與第二較佳實施例相同，在 。P不再％述相同構造及其標號，而其不同處為該傳導元件32係呈 囫柱狀’係具有呈放射狀向外延伸之複數散細請，且散熱鱗片 321與散熱鰭片如之間形成有流道322，而該複數鰭請係構成 圓形之受接面β，而該_ 33係具有呈圓形之人口观及出口微， 且其入口如側設_斜狀之承接糊，崎綱3套設於該 1269628 1269628 即该導流罩33之出口 332係套設貼合=UWW*515, the recording area of W5i5 is slightly smaller = ^ 513 area, and larger than the area of the receiving surface A, and then protrudes from the body of the receiving surface A and 3 (3) (four) m thin machine out, Achieve the above role. Further, as shown in Fig. 12, the fan 51 has a rectangular frame with two long sides and two short sides, which does not deviate from the original changes of the present invention, and achieves the above functions and functions. - Please touch the thirteenth, cut, fifteen, and sixteenth rides. The overall structure, function, and implementation of the invention are roughly the same as the second preferred embodiment. P is no longer said to have the same structure and its reference numerals, but the difference is that the conductive element 32 is in the form of a columnar column having a plurality of thin portions extending radially outward, and the heat radiating fins 321 and the heat radiating fins are as A flow channel 322 is formed between the plurality of fins, and the plurality of fins are formed into a circular receiving surface β, and the _33 series has a circular population view and an exit micro, and the inlet thereof is provided with a _ oblique shape. , Setaki 3 sets are set at 1269628 1269628, that is, the outlet 332 of the shroud 33 is sleeved and fitted.
312，而大於該傳導元件32之受接面B 傳導元件32周圍外緣上半部，即象 於該傳導元件32之散熱轉片321 31係具有一圓環形之框體311，該 件32之受接面B面積之流道312， 口檟係略小於框體311之流道 面積，並於支撐元件314上開 設有貫穿孔⑽以供固定元件m貫穿接設於該傳導元件32之受接籲 面B上，進而令該風扇31接固於該受接面6上，而該框體311係於 傳導元件32周圍外緣形成凸出區域317(如第十五圖所示），而該扇 且該導流罩33之入口 331及 輪315係凸出該傳導元件32周圍外緣， 其承接部333係對應該凸出區域317及凸出之扇輪315。 明再參閱第十二、十五、十六圖所示，如圖所示該傳導元件32 係貼合設於-發熱it件14上，以傳遞該發熱耕14之熱量，直接幫 助該發熱元件Η散熱，而當該風扇幻之扇輪犯轉動帶動流體朝傳# 導元件32流動時，該流體係流向傳導元件32之流道，將傳導元 件32所傳遞之熱量由傳導元件32四周流出帶走，而凸出於該傳導元 -件32之受接面Β外緣之凸出區域317之扇輪315所帶動之流體係流 “ 向該導流罩33之入口 331，並藉由該承接部333内壁呈傾斜狀以導引 該流體流向傳導元件32之流道322後，再由傳導元件32的四周向外 流出以帶走傳導元件32所傳遞之熱量，俾增加作用於傳導元件32之 12 1269628 流體，進而增加熱對流的效率，以提升整體之散熱效果。 請再參閱第十七、十八、十九、二十a、二十b、二十C、二十· d圖所示，係為本發明第五較佳實施例，其整體結構與功能及實施態 樣大致與第-較佳實關相同，在此即*再_相_造及其標號， 而其不同處為該導流罩13之承接部133内壁設有複數間隔排列之凸 部434 ’該各個凸部434係對應鄰接該傳導元件12之複數散熱鰭片 121，以令該承接部133所接受之流體由各個凸部434間之間隔流向‘ 傳導元件12之流道122。 且所述之凸部434之縱剖面係為任意形狀構成其包含有三角形 (如二十a圖所示）、長方形（如二十b圖所示）、半擴圓形（如二十 c圖所示）或梯形（如三十d圖戶斤示）等，且該凸部434的材質可為 良導熱材如：鋁、銅、金、銀等形成。 凊再相第二十-、二十二、二十三、二切_示，係為本發 明第六較佳實施例，其整體結構與功能及實施態樣大致與第一較佳實 施例相同，在此即不再贅勒_造及其概，而其不鳴賴傳導鲁 元件72在本較佳實施射其係設有複數柱狀且呈紅間隔排列之散 熱鰭片721，而該散熱鰭片721與散熱籍片721之間形成有流道似，. 且該流道722係連通該傳導元件72的四側，以令流體流經該流道肥-可向傳導元件72的四織出，而該導流罩73具有—人口 731及一出 口 732 ’且其入口 731側係設有承接部733以承接該風扇u之流體。 於組裝時該所述之導流罩73之入口 73H則之承接部733之内壁 1269628 ㈣ΖΓ 件72咖μ 722,㈣風扇11之扇 t轉動時，細承接部㈣壁呈傾斜狀以導纖體流向傳 ^件72之邮22後，再嚷綱触_輸，以帶走 牛72所傳遞之熱篁’俾達到第一較佳實施例所述之作用及功 效0 明再參閱第二十五、二十六圖所示係為本發明第七較佳實施例， 其整體結構與功能及實施態樣大致與第一較佳實施例相同，在此即不 再贅述相同構造及其標號，而其不同處係為該導流罩83係具有一入 口撕及-出嗜，且其入口側係設有一承接部咖以承接該風扇 11之流體，且所述之承接部833之内壁係呈傾斜狀，當導流罩抑局 部套合該傳導元件12後，該承接部833係鄰接該傳導元件12單邊之 流道122。 再者上述之承接部883亦可如第二十七圖所示，在一可行之實施 例中構設舰對應鄰接部分流道122，如此可減_組之設置環 境’在能夠銜接風扇11之扇輪112的範圍内做彈性的變化，以適八 使用者所需。 另外上述各較佳實施例中之導流罩13、33、73亦可為良導熱材 如鋁、銅、金、銀等形成，且其套合於該傳導元件12、32、72之外 周圍並不僅侷限於上半部，可視傳導元件12、32、72之縱向長声而 套合於縱向位置如：上半部1/2或1/3或2/3的位置，只要令傳導元 件12、32、72之流道122、322、722未被導流罩13、33、73套合的 14 1269628 部分露出以使該流體流出。 綜上所述，本剌職供之-種「賴额之顧」，確符合准 予專利之要件，練法提料辦請，祈請奸專利，實為感禱。 本發僅係本發明之較佳可行之實施例而已，舉凡利用 之權利範_。 ^《置所叙籠，皆觀含於本案 【圖式簡單說明】 第-圖係為本發明第—較佳實施例之立體分解示意圖； 第二圖係為本發明第—較佳實施例之立體組合示意圖； 第三圖係為本發明第—較佳實施例顧於發熱元件之剖視示意圖； 第四圖係為本發明第二較佳實施例之立體分解示意圖； 第五圖係為本發㈣二概實_之立合示意圖； 第六圖係為第五圖之俯視示意圖； 第七圖係為本發明第二難實施例應驗發熱元件之剖視示意圖； 第八圖係為本發明第三較佳實施例之立體分解示意圖； 第九圖係為本㈣第三難實關之立體組合示意圖； 第十圖係為第九圖之俯視示意圖； 第十®係為本發明第三較佳實施例應用於發熱元件之剖視示亦圖； 第十-圖係為本發三較佳實施例之框體另—種態樣之俯視示意 圖； 第十一圖係為本發明第喊佳實施例之立體分解示意圖； 第十四圖鱗本㈣第四較佳實施例之立體組合示意圖·， 1269628 二圖之俯视示意圖 第十五圖係為第十 第十六_林翻第四健實關細於發熱树之概示意圖； 十七圖係為本發明第五較佳實施例之立體分解示意圖； 第十八_為本發明第五難實關之立體組合示意圖； 第十九_為本㈣第五難實酬應胁發熱元件之顺示意圖； 第二十a關為她第五較佳實施例之凸部實施態樣之剖視示意圖; 第二十b _為本發明第五較佳實施例之凸部另—實施態樣之剖視示 意圖；t 第二十C關為本翻第五錄實施例之凸部另—實_樣之剖視示 意圖； 第二十d關為本翻第五較佳實施例之凸部另—實施態樣之剖視示 意圖； 第-十®係為本發明第六較佳實施例之立體分解示意圖； 第-十一圖係為本翻第六較佳實施例之讀組合示意圖； 第-十二@係為本發明第六較佳實施例之組合俯視示意圖； 第一十四關為本發明第讀佳實關應麟發熱元件之剖視示意 第二十五圖係為本發明第七較佳實施例之組合俯視示意圖； 第-十六®係為本發明S七較佳實關之顧於發熱元件之剖視示意 Γ51 · 園， 第二十七圖係為本發明第讀佳實施例之導流罩另_實施態樣之俯視 1269628 示意圖。 【主要元件符號說明】 11 · · · 風扇 311 · · •框體 111 · · •基座 312· · •流道 112 · · •扇輪 313 · · •扇輪座 113· · •透孔 314· · •支撐元件 114· · •貫穿孔 315 · · •扇輪 115 · · •固定元件 316 · · •貫穿孔 12· · · 傳導元件 317· · •凸出區域 121 · · •散熱鰭片 32 · · · 傳導元件 122 · · •流道 321 · · •散熱鰭片 13· · · 導流罩 322 · · •流道 131 · · •入π 33· · · 導流罩 132· · •出口 331 · · •入口 133· · •承接部 332 · · •出口 14 · · · 發熱元件 333 · · •承接部 21 · · · 風扇 434· · •凸部 2H · · •框體 51 · · · 風扇 212· · •貫穿孔 511 · · •框體 213· · •流道 513 · · •流道 214· · •凸出區域 514 · · •凸出區域312, and larger than the upper surface of the outer peripheral edge of the conductive member 32 of the conductive member 32, that is, the heat radiating fin 321 31 of the conductive member 32 has a circular frame 311, the member 32 The flow path 312 of the receiving surface B area is slightly smaller than the flow channel area of the frame 311, and a through hole (10) is formed in the supporting member 314 for the fixing element m to be connected to the conducting element 32. Adjacent to the face B, the fan 31 is fixed to the receiving surface 6, and the frame 311 is formed on the outer edge of the conductive member 32 to form a convex region 317 (as shown in FIG. 15). The fan 331 and the wheel 315 protrude from the outer periphery of the conductive member 32, and the receiving portion 333 corresponds to the protruding portion 317 and the protruding fan wheel 315. Referring to the twelfth, fifteenth, and sixteenth drawings, as shown in the figure, the conductive member 32 is attached to the heat generating member 14 to transmit the heat of the heat generating plough 14 to directly assist the heating element. The heat is dissipated, and when the fan fan wheel rotates to drive the fluid to flow toward the conduction member 32, the flow system flows to the flow path of the conduction member 32, and the heat transferred from the conduction member 32 flows out from the conduction member 32. And the flow of the fan 315 that protrudes from the convex portion 317 of the outer edge of the receiving surface of the conductive element 32 is "flowed toward the inlet 331 of the shroud 33, and is received by the The inner wall of the portion 333 is inclined to guide the fluid to the flow channel 322 of the conductive member 32, and then flows out from the periphery of the conductive member 32 to take away the heat transferred by the conductive member 32, and the heat is applied to the conductive member 32. 12 1269628 Fluid, which in turn increases the efficiency of heat convection to improve overall heat dissipation. Please refer to the seventeenth, eighteenth, nineteenth, twenty-first, twenty-two, twenty-two, twenty-two, twenty-two, d, d Is a fifth preferred embodiment of the present invention, the overall structure and function thereof The embodiment is substantially the same as the first-best real-off, which is a re-phase and a label, and the difference is that the inner wall of the receiving portion 133 of the shroud 13 is provided with a plurality of convex portions 434 arranged at intervals. The respective convex portions 434 correspond to the plurality of heat dissipation fins 121 adjacent to the conductive element 12, so that the fluid received by the receiving portion 133 flows from the space between the respective convex portions 434 to the flow path 122 of the conductive element 12. The longitudinal section of the convex portion 434 is arbitrarily shaped to include a triangle (as shown in FIG. 20a), a rectangle (as shown in FIG. 22b), and a semi-expanded circle (as shown in FIG. Or a trapezoid (such as 30 d), and the material of the convex portion 434 can be formed of a good heat conductive material such as aluminum, copper, gold, silver, etc. 凊 凊 二十 二十 二十 二十 二十 二十The present invention is a sixth preferred embodiment of the present invention, and its overall structure, function and implementation are substantially the same as those of the first preferred embodiment. The heat-dissipating fins 7 are arranged in a plurality of columns and arranged in a red interval. 21, and the heat dissipation fins 721 and the heat dissipation fins 721 are formed with a flow path, and the flow passages 722 are connected to the four sides of the conductive member 72 to allow fluid to flow through the flow passages. The four elements of the element 72 are woven, and the shroud 73 has a population 731 and an outlet 732' and a receiving portion 733 is provided on the side of the inlet 731 to receive the fluid of the fan u. The diversion is performed during assembly. The inlet 73H of the cover 73 is the inner wall 1269628 of the receiving portion 733. (4) The member 72 is 722. (4) When the fan t of the fan 11 rotates, the wall of the thin receiving portion (4) is inclined to flow the guide body to the post 22 of the transmission member 72. And then 嚷 触 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The overall structure, function and implementation of the seventh preferred embodiment of the present invention are substantially the same as those of the first preferred embodiment. The same configuration and its reference numerals will not be repeated herein, and the difference is the shroud. The 83 series has an inlet tearing and a hoisting, and the inlet side is provided with a receiving portion for receiving the fluid of the fan 11, and The inner wall of the receiving portion 833 is inclined. When the shroud restraint portion fits the conductive member 12, the receiving portion 833 abuts the flow passage 122 of the conductive element 12 on one side. Furthermore, the receiving portion 883 can also be configured as shown in the twenty-seventh embodiment. In a feasible embodiment, the ship corresponds to the adjacent portion of the flow channel 122, so that the setting environment of the group can be reduced. The elastic variation of the range of the fan wheel 112 is made to suit the needs of the user. In addition, the flow guides 13, 33, 73 of the above preferred embodiments may also be formed of a good heat conductive material such as aluminum, copper, gold, silver, etc., and are fitted around the conductive elements 12, 32, 72. It is not limited to the upper half, and the longitudinal direction of the conductive elements 12, 32, 72 is long and fits in a longitudinal position such as 1/2 or 1/3 or 2/3 of the upper half, as long as the conductive element 12 is The channels 122, 322, and 722 of 32, 72 are not partially exposed by the 14 1269628 sleeves of the shrouds 13, 33, 73 to allow the fluid to flow out. In summary, the stipulations of the stipulations of the stipulations of the stipulations of the stipulations are in line with the requirements for granting patents. The present invention is only a preferred embodiment of the present invention, and the scope of use is _. ^ " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " 3 is a schematic cross-sectional view of a heating element according to a first preferred embodiment of the present invention; and a fourth perspective view of the second preferred embodiment of the present invention; The fourth figure is a top view of the fifth figure; the seventh figure is a cross-sectional view of the second difficult embodiment of the present invention; the eighth figure is the first 3 is a schematic perspective view of the third embodiment of the present invention; the ninth diagram is a schematic view of the third embodiment of the third difficulty; the tenth diagram is a top view of the ninth diagram; FIG. 10 is a top plan view showing another embodiment of the frame of the present invention; FIG. 11 is a schematic diagram of the present invention. Schematic diagram of the three-dimensional decomposition; fourteenth scale (4) The three-dimensional combination diagram of the fourth preferred embodiment·, 1269628 The top view of the second figure is the schematic diagram of the tenth sixteenth _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A perspective exploded view of a fifth preferred embodiment of the present invention; an eighteenth embodiment of the present invention is a schematic diagram of a three-dimensional combination of the fifth difficult-to-actually closed; 20th is a schematic cross-sectional view of a convex portion of a fifth preferred embodiment of the present invention; and 20th is a cross-sectional view of a convex portion according to a fifth preferred embodiment of the present invention. ;t Twenty-sixth C is a schematic cross-sectional view of the convex portion of the fifth embodiment; the twenty-secondth aspect is the convex portion of the fifth preferred embodiment. FIG. 10 is a perspective exploded view of a sixth preferred embodiment of the present invention; FIG. 11 is a schematic view of a read combination of the sixth preferred embodiment; The top view of the combination of the sixth preferred embodiment of the present invention; the first fourteenth level is the first reading of the present invention BRIEF DESCRIPTION OF THE DRAWINGS The twenty-fifth diagram is a schematic top view of a combination of the seventh preferred embodiment of the present invention; the sixteenth embodiment is a cross-sectional view of the heating element of the seventh embodiment of the present invention. Illustrated in Figure 51, the twenty-seventh figure is a schematic view of the shroud of the first preferred embodiment of the present invention. [Description of main component symbols] 11 · · · Fan 311 · · • Frame 111 · · • Base 312 · · • Flow path 112 · · • Fan wheel 313 · · • Fan wheel seat 113 · · • Through hole 314 · · Support member 114 · · • Through hole 315 · · • Fan wheel 115 · · • Fixing element 316 · · • Through hole 12 · · · Conductive element 317 · · • Protrusion area 121 · · • Heat sink fin 32 · · Conductive element 122 · · • Flow path 321 · · • Heat sink fin 13 · · · Flow hood 322 · · • Flow path 131 · · • π 33 · · · Shroud 132 · · • Exit 331 · • • Entrance 133 · · • Receiving part 332 · · • Outlet 14 · · · Heating element 333 · · • Receiving part 21 · · · Fan 434 · · • Protrusion 2H · · • Frame 51 · · · Fan 212· · • Through hole 511 · · • Frame 213 · · • Flow path 513 · · • Flow path 214 · · • Projection area 514 · · • Projection area
17 1269628 215 · ••扇輪 31 · ••風扇 72 · ••傳導元件 721 · ••散熱鰭片 722 · ••流道 73 · ••導流罩 731 · • •入口 732 · ，·出口 733 · ••承接部 515 · · ·扇輪 611 · · ·長方形框體 83 · · ·導流罩 831 · · ·入口 832 · · ·出口 833 · · ·承接部 A···受接面 B···受接面17 1269628 215 · •• Fan wheel 31 · ••Fan 72 ·••Conducting element 721 ·••Fixed fin 722 ·••Flow path 73 · •• Shroud 731 · • • Entrance 732 · , ·Exit 733 ·•• receiving unit 515 · · · fan wheel 611 · · · rectangular frame 83 · · · flow hood 831 · · · entrance 832 · · · outlet 833 · · · receiving part A · · · receiving surface B · ··Connected
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