五 新型說明： 【新型所屬之技術領域】 進行辅助敝繼姆她⑽熱部分 側緣的複數呈__认贿，吨熱频複=發熱源 ί創義提供Γ概熱裝置，尤指可供㈣對接組裝以 別設有複數呈__之通風槽，以及供抵持於預= 熱部分 發熱源 所形成之散舰道，可供氣_流通，進間 源快速散熱，達到提升散細效之目的。 m又發熱 【先前技術】 按，現今電腦科技以日新月異的速度成長，使得電腦之 =:Γ朝運算功能強、速度快之方向邁進，且隨著電腦 _也趨向於高速、高紐展，吨接導致電腦主機内 柯子零組件及記憶體，时相應產生許多熱能，若以 記憶體模組存取頻寬來分析、比較可知，從早期p c ^ 的頻寬為800MB/S，減至現今DDR 5〇〇頻寬 以H· Q GB/S ’甚至是到錢道之平台，射將頻寬 大巾田擴增至m，使其無論是功時脈或是傳輸頻寬， 明顯都是減速、高蘭發展，魏合主機板巾央處理器能 維持高速度的運算處理。 且電腦產品的不斷進步與綱、功能亦不斷提升，則電 知主機内部之主機板上，亦必須增加更多的處理、運算用之 中央處理器’近年來坊間陸續推出雙核心（雙中央處理器） 、四核心（四個中央處理器）的主機板，所以主機板上的散 熱問題亦必須同時解決，則在主機板上設置多組風扇與散熱 鰭片組等，藉以輔助主機板進行快速的散熱，但也在電腦主 機内部形成錄氣流進出、交換_環縣，即造成氣流在 電腦主機㈣產生H的情況，亦存在諸彡的缺失與困擾， 如： (1)電腦主機内部配合主機板的各令央處理器等發熱源， 分別設置複數不同方向、不同位置的散熱風扇、散熱 鰭片’則導致電腦主機内部空間，形成多道氣流的流 寬即形成各氣流間的相互干擾而產生亂流，影響熱 空氣與外界冷空氣交換、傳送的流通，造成散熱效果 差、亂流易發出噪音等情況。 (2 )電齡機内部城板上職設之記倾、介面卡等， 雖設有散熱片，但因内部空氣形成亂流的影響，導致 冷空乳與熱空氣的亂g，即造成記龍、介面卡上之 散熱片的散熱效果變差，無法快速散熱，易影響記憶 體的運作。 疋、如何解決S目月“己憶體、介面卡等散熱效果變差 之問題’導致記憶體運作受影響的缺失，即為從事此行業之 相關廠商所亟欲研究改善之方向所在者 【新型内容】 故創作人有鐘於上述之問題與缺失，乃搜集相關資料 ’經由多謂估及考量’並峨事於此行㈣積之多年經驗 ’經由不斷試作及修改，始設計出此種可供氣流順暢流通、 快速散熱之散熱裝置的創設專利誕生者。 本創作之主要目的乃在於該二相對式散熱片之散熱部分 別設有複數個供氣流順暢流通之通風槽’並相對各通風槽朝 相對内侧分別凸設有複數個呈間隔排列之抵屋體，則利用曰二 相對式散熱片相助側之貼合面分別抵貼於預設_源，再 藉由二散熱部姆應之複數減體婦設發熱源之側緣 ’方便抵推預設發熱源進行安裝或拆卸，同時藉由二散熱片 之散熱部的各通風槽供空氣流通順暢，並有由抵合面與複數 抵_間形叙散紐道以懸預設發麵進行快速散熱。 本幻作之-人要目的乃在於二相對式散熱片分別於散熱部 間’利用賴戦加強肋，以此提高結顧度，防止因受外 力過大而造成散熱片之彎折或損壞。 【實施方式】 為達成上述目的及姐，糊作所採狀技術手段及其 冓k %相林創作之較佳實施懈加說明其特徵、功能 與實施方法如下，翻完全瞭解。 請參閱第―、二圖所示，係為本創作之立體外觀圖、立 體/刀解圖’由圖巾所示可以清楚看出，本創作之散熱裂置係 包括二相對式散熱片1、2，其中： 5對式散熱片1、2係於相對内侧分別凸設有貼合 JO / / 面11 21，則於二貼合面^工、2工間，形成容置空間 3 〇 *各貼合面11、21外部即形成氣流交換空間11 〇、21〇 ’亚於各貼合面11、21向外一側分別延伸設 有散熱邛12、2 2，而各散熱部丄2、2 2係分別設有複 數:呈相鄰間隔狀排列之通風槽！2〇、220,且於遠離 ' 1的散熱$12另側’形成朝相對内側彎折後可互 相貼。之抵口面121、221，並於散熱部工2、2 2各 22，2,再相對於散熱部12之二抵合 面1 2 1、2 21的另側，為相對複數通風槽12 0、2 2 0朝相對内侧分別凸伸設有複數個呈相賴隔狀排列之抵壓 體1 3 2 3再於一相對式散熱片1、2的二外側邊，各 設有防止因對接而產生碰撞、抵觸之缺槽14、2 4。 月 > 閱第、一、二、四、五圖所示，係為本創作之立 體外觀圖、立體分解圖、較佳實施例之立體分解圖、較佳實 施例之側視圖，較佳實施例插接後之前視圖，由圖中所示可 以，月楚看出，二散熱片1、2相對内側之貼合面工工、2工 間’形成容置空間3 〇 ’可供預設發熱源4與二貼合面Η 、21黏合’而本創作之二相對式散熱片χ、2於實際組裝 、使用時’係利用一側散熱片！_之貼合面工i，抵貼= 預設發熱源4 (記憶體或介面卡等）的—側，再藉由一侧散 熱部2 2上抵合面2 21之高低落差與另一側散熱部丄2之 抵合面1 2 1互娜合，並將二散㈣！、2轉成相對平行 6 M443877 綜上所述，摘作上職減私實際相、實施時， 為確實能朗其功效及目的，故摘作誠為—實雜優旦之 創設，為符合新型專利之申請要件，爰依法提出申請，盼 審委早日賜准本案’以保障創作人之辛苦研發倘若鈞局 審委有任何稽疑，請不吝來函指示，創作人定當竭力配合， 實感德便。 M443877 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作較佳實施例之立體分解圖。 第四圖係為本創作較佳實施例之側視圖。 第五圖係為本創作較佳實施例插接後之前視圖。 【主要元件符號說明】 1、 散熱片 1 21、抵合面 1 2 2、加強肋 13、抵壓體 1 4、缺槽 2 21、抵合面 2 2 2、加強肋 2 3、抵壓體 2 4、缺槽 31、散熱通道 1 1、貼合面 1 10、氣流交換空間 12、散熱部 12 0、通風槽 2、 散熱片 21、貼合面 2 1 0、氣流交換空間 2 2、散熱部 2 2 0、通風槽 3 0、容置空間 12 M443877 4、 發熱源 4 1、側緣 4 2、對接部 5、 連接器Five new descriptions: [New technology field] The auxiliary number of the 敝 姆 姆 姆 (10) hot part of the side of the plural is __ bribery, ton heat frequency = heat source ί Chuangyi provides Γ heat device, especially available (4) Docking and assembling, there shall be a ventilation trough with __ in plural, and a loose ship channel formed by the heat source of the pre-heating part, which can be used for gas circulation and rapid heat dissipation into the source, so as to improve the efficiency. The purpose. m is hot [previous technology] Press, today's computer technology is growing at an ever-changing speed, making the computer =: Sui Dynasty computing function is strong, fast speed, and with the computer _ also tends to high-speed, high-new exhibition, ton When the computer components and memory are connected to the computer, a lot of thermal energy is generated. If the memory module access bandwidth is used for analysis and comparison, the bandwidth from the early pc ^ is 800MB/S, which is reduced to the present. DDR 5〇〇 bandwidth is H·Q GB/S' even on the platform of the money channel, the shot is widened to the m-field, so that it is obviously decelerated regardless of the clock or transmission bandwidth. , Gaolan development, Weihe host board towel central processor can maintain high-speed computing processing. Moreover, the continuous improvement of the computer products and the improvement of the functions and functions are also known. On the motherboard of the mainframe, it is necessary to add more CPUs for processing and computing. In recent years, dual cores have been introduced. The four-core (four central processing units) motherboards, so the heat dissipation problem on the motherboard must also be solved at the same time. Set multiple sets of fans and heat sink fins on the motherboard to assist the motherboard to perform fast. The heat dissipation, but also in the computer host to form the recording airflow in and out, exchange _ ring county, that is, the airflow in the computer host (four) to generate H, there are also the lack of problems and troubles, such as: (1) computer host with the host The heat source of each of the board's central processing units, such as a plurality of heat dissipating fans in different directions and at different positions, and the heat dissipating fins respectively cause the internal space of the computer main body to form a multi-channel airflow to form mutual interference between the air streams. The turbulent flow is generated, which affects the exchange of hot air with the outside cold air and transmission, resulting in poor heat dissipation, turbulent flow and easy noise. (2) The internal tilting and interface cards of the internal board of the electric machine are provided with heat sinks. However, due to the turbulent flow of internal air, the cold air and the hot air are disordered. The heat dissipation effect of the heat sink on the dragon and the interface card is deteriorated, and the heat dissipation cannot be quickly performed, which easily affects the operation of the memory. Hey, how to solve the problem of S-month "the problem of poor heat dissipation effect such as memory and interface card" leads to the lack of memory operation, which is the direction of the relevant manufacturers engaged in this industry. Contents] Therefore, the creator has the problems and deficiencies mentioned above. It is the collection of relevant information 'multi-prediction and considerations' and the many years of experience in this business (four). Through continuous trial and modification, this design can be designed. The birth of the patent for the creation of a heat sink for the smooth flow of airflow and rapid heat dissipation. The main purpose of this creation is that the heat dissipation sections of the two opposing heat sinks are respectively provided with a plurality of ventilation slots for the smooth flow of the airflow and relative to the ventilation slots. A plurality of spaced-apart housings are respectively arranged on the opposite sides of the inner side, and the bonding surfaces of the opposite sides of the opposite heat sinks are respectively adhered to the preset source, and then the plurality of heat radiating portions The side edge of the body of the heat-reducing body is convenient to push the preset heat source for installation or disassembly, and the air circulation of the heat-dissipating part of the two heat-dissipating parts is provided for smooth air circulation, and From the abutment surface and the complex number _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In order to improve the degree of attention and prevent the bending or damage of the heat sink due to excessive external force. [Embodiment] In order to achieve the above purpose and sister, the technical means of using the paste and the creation of it The preferred implementation of the preferred features, functions and implementation methods are as follows, fully understand. Please refer to the first and second figures, which is the three-dimensional appearance of the creation, the stereo/knife solution diagram can be shown by the towel It is clear that the heat sinking of the present invention includes two opposite heat sinks 1, 2, wherein: the five pairs of heat sinks 1, 2 are respectively convexly disposed on the opposite inner side with a JO/ / face 11 21, then Two bonding surfaces, two working rooms, two working rooms, forming an accommodating space 3 〇 * The outer surfaces of the respective bonding surfaces 11, 21 form an air exchange space 11 〇, 21 〇 'the outer side of each of the bonding surfaces 11, 21 The heat dissipation ports 12 and 22 are respectively extended, and the heat dissipation portions 丄2 and 2 2 are respectively provided with plural numbers: Ventilation slots arranged adjacent to each other! 2〇, 220, and the other side of the heat dissipation away from '1 $12' are formed to be bent toward the opposite sides and can be attached to each other. The opposing faces 121, 221 are disposed in the heat dissipation portion. 2, 2 2 each 22, 2, and with respect to the other side of the heat-receiving portion 12, the other side of the abutting surface 1 2 1 , 2 21 is a plurality of ventilation slots 12 0, 2 2 0 protruding toward the inner side respectively The pressing bodies 1 3 2 3 which are arranged in a spaced apart manner are further provided on the outer side edges of the opposite heat sinks 1 and 2, and are provided with the notches 14 and 24 which are prevented from colliding and colliding due to the butting. </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> For example, the front view after plugging in can be seen from the figure. It can be seen from the moon that the two heat sinks 1 and 2 are opposite to the inner side of the work surface, and the two work spaces are 'formed into the accommodating space 3 〇' for preset heating. The source 4 is bonded to the two bonding surfaces 、 and 21, and the second type of the opposite heat sink χ, 2 is used in the actual assembly and use. _ affixing work i, affixed = the side of the preset heat source 4 (memory or interface card, etc.), and then the height difference of the abutting surface 2 21 on one side of the heat sink 2 2 and the other side The abutting surface of the heat dissipating part 丄2 is 1 2 1 and will be separated (four)! 2, relatively parallel 6 M443877 In summary, as the actual phase of the lower-level personal reduction, the implementation, in order to really be able to achieve its efficacy and purpose, it is selected as a sincere-------------- The application requirements of the patent, 提出 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the hard work of the creator. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creator will try his best to cooperate, and feel really good. M443877 [Simple description of the drawing] The first picture is the three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The third figure is an exploded perspective view of a preferred embodiment of the present invention. The fourth drawing is a side view of the preferred embodiment of the present invention. The fifth drawing is a front view of the preferred embodiment of the present invention after being inserted. [Description of main component symbols] 1. Heat sink 1 21, abutting surface 1 2 2, reinforcing rib 13, pressing body 1 4, notch 2 21, abutting surface 2 2 2, reinforcing rib 2 3, pressing body 2 4, the missing slot 31, the heat dissipation channel 1 1, the bonding surface 1 10, the airflow exchange space 12, the heat dissipating portion 12 0, the ventilation slot 2, the heat sink 21, the bonding surface 2 1 0, the airflow exchange space 2 2, the heat dissipation Part 2 2 0, ventilation slot 30, accommodation space 12 M443877 4, heat source 4 1 , side edge 4 2, butt joint 5, connector
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