CN205540411U - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN205540411U CN205540411U CN201620075233.2U CN201620075233U CN205540411U CN 205540411 U CN205540411 U CN 205540411U CN 201620075233 U CN201620075233 U CN 201620075233U CN 205540411 U CN205540411 U CN 205540411U
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- Prior art keywords
- module
- space
- node
- electronic installation
- interface
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
Abstract
The utility model provides an intact electronic device, including a quick -witted case two lateral walls and connect a bottom plate of two lateral walls, this machine case has a first end along the direction of two lateral walls to and one of relative with first end second end, this machine case closes on first end to have a first appearance and establishes the space, and this machine case closes on the second end and sets up second appearance and establish the space, the fan module sets up and establishes the space in first appearance, node modules sets up to hold in the second and establishes the space, has a plurality of radiator part of treating, a backplate, be fixed in the bottom plate on, and the setting of two perpendicular lateral walls establishes the space in first appearance and holds with the second and establish between the space, has seted up the vent on the backplate, vent and fan module and treat that radiator part is corresponding to make vent and fan module and treat that radiator part cooperatees, form a distinguished and admirable passageway. In reasonable layout machine incasement electronic component, utilize the heat dissipation scheme of backplate, help electronic device's heat dissipation, density is high and heat dispersion is good.
Description
Technical field
The utility model relates to a kind of electronic installation, particularly relates to a kind of have high integration and superior heat radiation performance
Electronic installation.
Background technology
Along with the development of the communications industry, the structure of communication equipment is designed, particularly equipment high density, high performance design
Also having higher requirement, existing communication equipment, in order to realize more function, is often provided with very many electricity in its cabinet
Submodule, so the more module of layout reasonable and clean and tidy in limited space, to improve the cost performance of product and to bring
User preferably experiences, and will become a direction of communication equipment development.And the design of high integration, server is dissipated simultaneously
Heat it is also proposed higher requirement.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of electronic installation, is used for
Solve in prior art the setting of the element within electronic installation and can not meet high density, high-performance and excellent the most simultaneously
The problem of the features such as heat radiation.
For achieving the above object and other relevant purposes, the utility model provides a kind of electronic installation, including: a cabinet,
Including two sidewalls and the base plate that connects described two sidewalls, this cabinet has one first end along the direction of described two sidewalls, and
One of relative with described first end the second end, this cabinet closes on described first end to be had one first and is installed with space, and this cabinet closes on
Described second end arranges one second and is installed with space；Blower module, is arranged at described first and is installed with space；Node module, is arranged at
Described second is installed with space, has and multiple treats heat dissipation element；One backboard, is fixed on described base plate, and the most described two sidewalls
Be arranged at and described first be installed with space and described second and be installed with between space, described backboard offers ventilating opening, described logical
Air port and described blower module and described in treat that heat dissipation element is corresponding, to make described ventilating opening and described blower module and institute
State and treat that heat dissipation element matches, form an airflow channel.
In one embodiment of the utility model, the height of described ventilating opening and described first is installed with fan mould in space
Height and the height treating heat dissipation element of the described second described node module being installed with in space that block is arranged are corresponding.
In one embodiment of the utility model, described first is installed with in space and is provided with multiple I/O module, described wind
Fan module is arranged in described I/O module, and described I/O module includes node I/O module and shared I/O module.
In one embodiment of the utility model, described ventilating opening includes multiple bar hole laterally offered and a square
Shape hole.
In one embodiment of the utility model, described bar hole is horizontal being uniformly distributed on described backboard, and with
Blower module in described node I/O module is corresponding.
In one embodiment of the utility model, described rectangular opening and the blower module phase in described shared I/O module
Corresponding.
In one embodiment of the utility model, described node I/O module is divided about described shared I/O module symmetry
Cloth.
In one embodiment of the utility model, described backboard is provided with multiple Plug Division, in order to described node
Module or described first is installed with the I/O module electrical connection in space.
In one embodiment of the utility model, described Plug Division is distributed in the both sides of described bar hole.
As it has been described above, more electronics unit reasonably arranged in limited chassis space by electronic installation of the present utility model
Part, and according to the layout of electronic component, described backboard arranges multiple interface, and according to described electronic component, interface
Setting, described backboard is offered multiple louvre, distinguished and admirable to form one, help the heat radiation of described electronic installation.This practicality
Novel electronic installation, density height and perfect heat-dissipating.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of electronic installation in a specific embodiment of the present utility model.
Fig. 2 is shown as the rearview of Fig. 1.
Fig. 3 is shown as the front view of Fig. 1.
Fig. 4 is shown as the overall structure schematic diagram of a cabinet in a specific embodiment of the present utility model.
Fig. 5 is shown as the structural representation of the first end side of cabinet shown in Fig. 4.
Fig. 6 is shown as the structural representation of electronic installation in a specific embodiment of the present utility model.
Fig. 7 is shown as the structural representation of a specific embodiment interior joint I/O module of the present utility model.
What Fig. 8 was shown as the node I/O module shown in Fig. 7 disassembles schematic diagram.
Fig. 9 is shown as the rearview of the node I/O module shown in Fig. 7
Figure 10 is shown as in a specific embodiment of the present utility model sharing the structural representation of I/O module.
Figure 11 is shown as the disassembly diagram of the shared I/O module shown in Figure 10.
Figure 12 is shown as the structural representation of a specific embodiment dorsulum of the present utility model.
Figure 13 is shown as the disassembly diagram of the backboard shown in Figure 12.
Figure 14 is shown as in an embodiment of the present utility model sharing the mould that I/O module is connected with the circuit of a node module
Block schematic diagram.
Figure 15 is shown as in an embodiment of the present utility model the circuit catenation principle sharing I/O module with a node module
Schematic diagram.
Figure 16 is shown as in an embodiment of the present utility model the circuit catenation principle sharing I/O module with a node module
Schematic diagram.
Figure 17 is shown as in an embodiment of the present utility model the circuit catenation principle sharing I/O module with a node module
Schematic diagram.
Figure 18 is shown as the structural representation of electronic installation in a specific embodiment of the present utility model.
Figure 19 is shown as the structural representation of electronic installation in a specific embodiment of the present utility model.
Figure 20 is shown as the structural representation of hard disk supporting part in a specific embodiment of the present utility model.
Figure 21 is shown as the structural representation of application hard disk supporting part assembling hard disk shown in Figure 20.
Element numbers explanation
1 cabinet
11 sidewalls
12 base plates
13 first ends
14 second ends
15 first are installed with space
A, B, C, D, E, F back-end region
16 second are installed with space
G, H front end area
G1, H1 supporting part
17 upper covers
2 backboards
21 first plug portions
22 second plug portions
23 first ventilating openings
24 second ventilating openings
3 I/O modules
31 node I/O modules
311 housings
3111 sidewalls
3112 base plates
3113 first ends
3114 second ends
3115 first are installed with space
3116 second are installed with space
3117 top boards
312 PCIe card
3121 PCIe card main bodys
3122 PCIE interfaces
313 fan units
3131 fan frames
3132 fans
32 share I/O module
321 housings
3211 sidewalls
3212 top boards
3213 base plates
3214 first ends
3215 second ends
322 main modules
3221 the oneth I/O interfaces
3222 the 2nd I/O interfaces
323 fan units
3231 fan frames
3232 fans
4 power modules
5 node modules
51 mainboards
52 first processors
53 second processors
54 storage modules
55 South Bridge chips
56 SAS hard disk expansion cards
57 node backboards
58 hard disks
59 support units
591 first supporting parts
5911 first fixed parts
592 second supporting parts
5921 second fixed parts
5922 LED light-guiding pillars
593 stopper sections
594 Handheld Divisions
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model being described below, those skilled in the art can be by this
Content disclosed by specification understands other advantages of the present utility model and effect easily.
Refer to Fig. 1 to Figure 20.It should be clear that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only use
To coordinate the content disclosed in specification, understand for those skilled in the art and read, being not limited to this practicality new
The enforceable qualifications of type, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, under not affecting effect that the utility model can be generated by and the purpose that can reach, all should still fall new in this practicality
In the range of technology contents disclosed in type obtains and can contain.Meanwhile, in this specification cited as " on ", D score, " left ",
The term of " right ", " middle " and " one " etc., is merely convenient to understanding of narration, and it is enforceable to be not used to limit the utility model
Scope, being altered or modified of its relativeness, changing under technology contents without essence, enforceable when being also considered as the utility model
Category.
Described electronic installation of the present utility model in actual applications, for example, one OTT (Over The Top) high density
Server, it preferably employs 2U cabinet, and " U " of server is a kind of unit representing server external dimensions, is the contracting of unit
Abbreviation, detailed dimensions is determined by the EIA (EIA) as industry group.Why want the chi of predetermined server
Very little, it is to make server keep suitable size to be placed in irony or aluminium matter frame.Fixed server is had in frame
Screw, by its screw with server to good, is fixed with screw.The size of regulation is the width (48.26cm=19 of server
Inch) and high (multiple of 4.445cm).Due to a width of 19 inches, so the most also the frame meeting this regulation being referred to as " 19
Inch rack ".Thickness is with 4.445cm as base unit.1U is exactly 4.445cm, 2U be then 2 times of 1U for 8.89cm (such as this type of
Push away).That is so-called " server of 1U ", it is simply that profile meets EIA specification, thickness is the product of 4.445cm.It is designed to
The product being placed into 19 inches of racks is commonly referred to as rack server.In actual application, electronics of the present utility model fills
The size put is not limited thereto, and the electronic installation of other dimensions is equally applicable to the technical solution of the utility model.
Refer to Fig. 1, be shown as electronic installation of the present utility model structural representation in one embodiment.Described
Electronic installation includes cabinet 1, backboard 2, an at least I/O (input and output) module 3, an at least power module 4 and at least
One node module 5.Fig. 2 is the rearview of electronic installation shown in Fig. 1, and Fig. 3 is the front view of electronic installation shown in Fig. 1.
In conjunction with Fig. 4, it is shown as cabinet of the present utility model structural representation in one embodiment, described cabinet 1
Including two sidewalls 11 and the base plate 12 that connects described two sidewalls 11, described two sidewalls 11 and described base plate 12 can pass through screw
Or buckle is fixedly connected, it is possible to be structure as a whole, this cabinet 1 has one first end along the direction of described two sidewalls 11
13, and one of relative with described first end the second end 14, this cabinet closes on described first end 13 to be had one first and is installed with space
15, this cabinet closes on described second end 14 and arranges one second and be installed with space 16.Described first to be installed with space 15 described for being installed with
I/O module 3 and described power module 4, wherein, described first is installed with space 15, and to be separated into multiple height identical and set side by side
The back-end region put, each described back-end region is used for being installed with power module 4 described in I/O module 3 or at least described at least.
In the present embodiment, such as, combining such as Fig. 5, described back-end region is separated into 6 regions, respectively back-end region A, rear end region
Territory B, back-end region C, back-end region D, back-end region E and back-end region F.Described second is installed with space 16 for being installed with
Stating node module 5, wherein, described second is installed with space 16 is also separated into multiple front end area, in each described front end area
Node module 5 described at least one is set.And combine Fig. 4, described second is installed with space 16 is separated into two front end area G and front
End regions H, described front end area G and front end area H all can accommodate two node modules 5 that stacking is arranged respectively.
And time in actual applications, the cabinet 1 of the described electronic installation of finished product also includes that a upper cover 17, described upper cover 17 are
Integrative-structure, the top that be arranged at electronic installation relative with described base plate 12, or as in the present embodiment, described upper cover 17 wraps
Including two parts, the upper cover i.e. covering the described second rear portion being installed with space 16 and backboard 2 is anterior, and covers described first and be installed with
The upper postoperculum in space 15, two parts can connect by corresponding screw hole is fixing.
And, wherein, being arranged at of the most described two sidewalls 11 of described backboard 2 described first is installed with space 15 and described second
It is installed with between space 16, in conjunction with Fig. 6 (Fig. 6 is the structural representation after the electronic installation of Fig. 1 removes upper cover), has towards described
First the first plug portion 21 being installed with space 15 and towards the described second the second plug portion 22 being installed with space 16, it is preferred that
Described first plug portion 21 and the second plug portion 22 for example, High speed rear panel connector, and can be such as an inserting slot construction,
For mating with a golden finger and being electrically connected with, such design, the use of instrument can be exempted, in also can making cabinet 1
More neat and tidy.Described backboard 2 can be installed with space 15 by being arranged at first and be located in second and be installed with in space 16
Independent electric module (I/O module 3, power module 4 and node module 5) be connected, be equivalent to the work of a bridge
With so that can cooperate between each electric module, to realize specific electrical functionality.
Described I/O module 3 has an I/O module department of assembly, and pluggable the first of the described backboard 2 that is electrically connected at is inserted
Pulling out portion 21, described I/O module department of assembly is preferably a golden finger structure, with the first plug portion 21 of the described backboard of inserting slot construction
Electrical connection.
Described power module 4 has a power module department of assembly, and pluggable is electrically connected at the first of described backboard 2
Plug portion 21, in order to supply the electric power of described electronic installation.In the present embodiment, the quantity of the most described power module 4 is two
Individual, the one of which of described two power modules 4 is for providing the power module 4 of redundancy redundant, and said two power module 4 stacking
Be arranged in back-end region described in.Described power module 4 is preferably other in described electronic installation by described backboard
Electrical components provides electric power, and it is furthermore preferred that described power module 4 carries out information friendship by I2C bus and other electrical components
Mutually.
Described power module department of assembly is preferably a golden finger structure, with the first plug portion of the described backboard of inserting slot construction
Electrical connection.
In one specific embodiment of the utility model, described I/O module 3 preferably includes node I/O module 31 and is total to
Enjoy I/O module 32.
Wherein, each described node I/O module 31 is electrically connected with node module described in one 5 by described backboard 2, described joint
The structure of some I/O module 31 is please referring particularly to Fig. 7, Fig. 8 and Fig. 9, and described node I/O module 31 includes:
Housing 311, including two sidewalls 3111 and the base plate 3112 that connects described two sidewalls 3111, this housing 311 is along institute
State the direction of two sidewalls 3111 and there is one first end 3113, and one of relative with described first end 3,113 second end 3114, should
Housing 311 closes on described first end 3113 to be had one first and is installed with space 3115, and this housing 311 closes on described second end 3114 and sets
Put one second and be installed with space 3116；In the present embodiment, described housing 311 also includes described in covering part that first is installed with space
The top board 3117 of 3115, described top board 3117 primarily serves protection first and is installed with in space 3115 work of the electronic component being installed with
With, in other specific embodiments, the size of described top board 3117 can be shorter or longer, or can omit described top board
3117。
Keyset (not shown), is arranged in described housing 311, and parallel with described base plate 3112 is fixed on described base plate
On 3112, including keyset main body and keyset Plug Division, described keyset main body faces away from the side of described base plate 3112
To having the first slot and the second slot, described keyset Plug Division is closed on the second end 3114 of described housing 311 and exposes
In described second end 3114, described keyset is electrically connected by the first plug portion 21 of described keyset Plug Division with described backboard 2
Connect.
PCIe card 312, is arranged at described first and is installed with space 3115, including PCIe card main body 3121 and PCIE interface
3122, described PCIE interface is PCIE I/O interface in concrete application, and described PCIe card main body 3121 is flat with described sidewall 3111
Row and the setting vertical with described base plate 3112, described PCIe card main body 3121 is plugged in the of described keyset by golden finger
One slot, described PCIE interface 3122 is positioned at the first end 3113 of described housing 311；In the present embodiment, described PCIe card 312
It is preferably 3.
Fan unit 313, is arranged at described second and is installed with space 3116, in the present embodiment, has two, described two wind
The one of which of fan unit 313 is for providing the fan unit 313 of redundancy redundant.Described fan unit 313 includes fan frame
3131 and fan 3132, described fan 3132 is arranged in described fan frame 3131, and described fan unit 313 is by connecting
Device is plugged in the second slot of described keyset, and described connector is preferably a golden finger or a cable.Described fan 3132 is
Hot-plug construction.And the modularized design of described node I/O module 31, when needs change described fan unit 313 or maintenance institute
When stating fan unit 313, directly node I/O module 31 is taken out from its accommodation space, and server machine need not be dismantled
The housing (when the fan in existing machine box for server keeps in repair or changes, major part is required for opening top cover) of case, operation side
Just and improve maintenance efficiency.Described fan unit 313 can be screwed in described housing 311.
In another specific embodiment, described node I/O module can be the structure of drawer type, can omit described two sidewalls,
And described fan unit 313 is directly fixed on described keyset.
Described shared I/O module 32 passes through described backboard 2 optionally to electrically connect with node module described in one 5；Preferably
, described electronic installation also includes a handover module, for according to a switching signal, makes described shared I/O module 32 with described
One in node module 5 communicates.The most described handover module be a switching push button (such as mouse or Keyboard Control
Switching push button), by the pressing to button, the node module 5 communicated with described shared I/O module 32 with switching.Or according to
One long-range network control signal, the node module 5 communicated with described shared I/O module 32 with switching.Described shared I/O mould
The structure of block 32 please referring particularly to Figure 10 and Figure 11, including:
Housing 321, the top board 3212 including two sidewalls 3211 and connecting described two sidewalls 3211 and base plate 3213, this housing
321 have one first end 3214 along the direction of described two sidewalls 3211, and one of relative with described first end 3,214 second end
3215；
Two main modules (two share I/O unit) 322, are respectively arranged at top board 3212 and the base plate 3213 of described housing 321
Medial surface and enclose with two sidewalls 3211 of described housing 321 and be set as one and be installed with space, the thickness of one end of the most main module 322 is little
In the thickness of the other end, this design can be formed in the side that thickness is less described in be installed with space, single in order to accommodate fan etc.
Unit, maximized can utilize space.Respectively this main module 322 include the I/O interface 3221 that is connected with external equipment and
The 2nd I/O interface 3222 electrically connected with one of described at least two node module 5；A described I/O interface 3221 is such as
Including the combination of one or more in USB interface interface, USB interface interface and network interface interface, described two main modules
322 is the design being mutually redundant.
Fan unit 323, be located in described in be installed with space, including fan frame 3231 and fan 3232, described fan
3232 are arranged in described fan frame 3231.Described fan 3232 is hot-plug construction.And the mould of described shared I/O module 32
Blockization designs, when needs are changed described fan unit 323 or keep in repair described fan unit 323, directly by shared I/O module 32
Take out from its accommodation space, and housing (the fan dimension in existing machine box for server of machine box for server need not be dismantled
When repairing or change, major part is required for opening top cover), easy to operate and raising maintenance efficiency, ensureing that housing temperature is up to standard
While, also make fan unit easy to loading and unloading, it is easy to safeguard.
And, the heat radiation of machine box for server, for ensureing that its Effec-tive Function has large effect, combines backboard 2 structure at this
Schematic diagram, Figure 12 and Figure 13, described backboard 2 is provided with the fan of ventilating opening, described ventilating opening and described node I/O module 31
Unit 313, the fan unit 323 of described shared I/O module 32 and described in treat that heat dissipation element is corresponding, to make described ventilation
Mouthful with described fan unit 313 and 323 and described in treat that heat dissipation element matches, form an airflow channel.On described backboard 2
The first ventilating opening 23 that the horizontal fan unit 313 offering multiple equally distributed and described node I/O module 31 is corresponding,
And second ventilating opening 24 corresponding with the fan unit 323 of described shared I/O module 32, and described first ventilating opening 23 and
The setting of the second ventilating opening 24, can make the distinguished and admirable more of fan unit 313 and fan unit 323 flow to described node mould
Needing the unit (such as processor and DDR) of heat radiation on block 5, the interface on described backboard 2 is reasonably arranged at described the
One ventilating opening 23 and the both sides of the second ventilating opening 24, i.e. in the case of the interface ensured on backboard 2 is rationally arranged, meet
The radiating requirements of machine box for server.Described first ventilating opening 23 is preferably equally distributed bar hole as depicted, and described the
Two ventilating openings 24 are preferably rectangular opening as depicted.
In one embodiment of the utility model, described node I/O module 31, shared I/O module 32 and power supply mould
The height of block 4 is preferably the most identical with the height of described back-end region, and length is all the most corresponding with the length of described back-end region,
So that in limited chassis space, can be with the more module of layout, specifically, described node I/O module 31, share I/O mould
Block 32 and power module 4, be located in a corresponding back-end region respectively, and the number of described node I/O module 31 is even
Several, it is arranged in corresponding back-end region about described shared I/O module 32 is symmetrical.In order to accommodate all described joints
Point I/O module 31, shared I/O module 32, power module 4, the number of described back-end region is preferably greater than or equal to the idol of 4
Several.
The most for example, described node I/O module 31 is four, and described shared I/O module 32 is 1, described node I/O
Module 31, share in I/O module 32 and power module 4 end regions in the rear be set to from left to right or from the right side to
Left is followed successively by: the described node I/O module 31 of power module 4, two, described 32, two described node I/O of shared I/O module
Module 31.I.e. combining Fig. 1, Fig. 2 and Fig. 3, described power module 4 is arranged in back-end region F, and described power module 4 includes two
Power subsystem, and be mutually redundant, being arranged in described back-end region F of stacking, described shared I/O module 32 is arranged at described
In back-end region C, described node I/O module 31 is respectively arranged in back-end region A, B, D and E.Including four described nodes
Module 5, being arranged at of each two stacking described second is installed with space 16 respectively.
Share the putting between two parties of I/O module 32, make the signal of the node module 5 that the second of electronic installation is installed with in space 16
The distance arriving described shared I/O module 32 is essentially identical, it is ensured that the symmetry of the performance of signal transmission, and four node IO moulds
Block 31 is arranged in the both sides of described shared I/O module 32, makes the letter of the node module 5 that the second of electronic installation is installed with in space 16
The distance number arriving corresponding node I/O module 31 is equal, it is ensured that the symmetry of performance of signal transmission.
And in the present embodiment, it is furthermore preferred that described power module 4, shared I/O module 32, the length of node I/O module 31
Spend essentially identical, and height aspect, the height of power module 4 and shared I/O module 32 essentially first is installed with the appearance in space 15
If the half of height, and the height of node I/O module 31 to be substantially installed with being installed with of space 15 with described first the most identical, make institute
First space availability ratio being installed with in space 15 of the cabinet stating electronic installation reaches maximum, and the setting of this length and height
Put, the compatible front-end module dividing plate of maximum possible, reduce effect of cost.
Referring again to shown in Fig. 2, the connection interface of described I/O module 3 and the connection interface of described power module 4 are in
Described first end 13.The connection interface of the most described node I/O module 31, as described in PCIE interface that figure is PCIe card is in first
Hold 13, and the connection interface of described shared I/O module 32 includes USB interface, USB interface and network interface, be also at described
First end 13, and in another specific embodiment, the kind of the interface of described shared I/O module 32 may be arranged as other
Interface.It is furthermore preferred that designed in advance has the shared I/O module 32 of different interface type collocation, can make according to application need
Want, be replaced.
Refering to Fig. 6, described node module 5 has a node module department of assembly, and pluggable is electrically connected at described backboard 2
The second plug portion 22, and led to by described backboard 2 and corresponding I/O module (node I/O module 31 or shared I/O module 32)
Letter.
Described node module 5 includes that mainboard 51 as shown in Figure 6, described mainboard 51 include that the first electrical junction is (in figure
Not shown) and the second electrical junction (not shown), described first electrical junction can be by described backboard 2 with described
The first electrical module being installed with in space 15 (node I/O module 31, shared I/O module 32 and power module) electrical connection.Institute
State the second electrical junction to be electrically connected with multiple expanding hard disks by a node backboard 57 of described node module 5.Described node
Module 5 also includes the two processor (CPU) being arranged at described mainboard along described node's length direction, respectively first processor 52
And second processor 53, described first processor 52 and described second processor 53 electrically connect, and are arranged at described mainboard 51
On, forming dual processor, described first processor 52 and the model for example, Skylake of the second processor 53, due to processor
In running, caloric value is very big, so arranging fin at the top of described first processor 52 and the second processor 53,
Described first processor 52 is respectively arranged with along the both sides of described node module 5 width and is electrically connected with described first processor 52
The storage module 54 connect, is arranged on described mainboard, in the present embodiment, selects each storage module 54 to include 6 DDR
(Double Data Rate, Double Data Rate synchronous DRAM), so described first processor and 12 DDR are electrically connected
Connecing, in another specific embodiment, each described storage module 54 also can be correspondingly arranged one above it and dissipate according to real needs
Backing, described second processor 53 is respectively arranged with and described second processor along the both sides of described node module 5 width
The storage module 54 of 23 electrical connections, is arranged on described mainboard 51, in the present embodiment, selects each storage module 54 to include 6
Individual DDR (Double Data Rate, Double Data Rate synchronous DRAM), so described second processor 53 and 12
DDR electrically connects, and the top of each storage module 54 is correspondingly arranged a fin.Described node module 5 is on described mainboard 51
A South Bridge chip 55 and a BMC (not shown) (substrate management control it is provided with at described first electrical junction
Device, Baseboard Management Controller), in the present embodiment, described first processor 52 is direct with corresponding
The PCIe card communication of node I/O module 31, the number of the PCIe card of each described node I/O module 31 is preferably 3.And pass through
Described South Bridge chip 55 and described BMC electrically connect with described shared I/O module 32.Described node module 5 also has hard disk mould
Block, according to the concrete configuration situation of described hard disc module, described second processor 53 electrically connects with direct and described hard disc module,
Or electrically connected with described hard disc module by the SAS hard disk expansion card 56 shown in Fig. 6, the model of SAS hard disk expansion card 56
It is the SAS3008 of Infineon Technologies Corp. in the present embodiment.Described hard disc module in concrete application by multiple hard disks as shown in Figure 6
58 compositions, in the present embodiment, described hard disc module includes six described hard disks 58.Preferably, described cabinet 1 is positioned at described
The inner side of two two sidewalls 11 being installed with space 16 is provided with slide rail, and described node module 5 is provided with corresponding with described slide rail
Chute, is installed with the placement in space 16 or extraction with facilitate described node module 5 described second.
In the utility model, the electrical connection between described shared I/O module 32 and node module 5 is for such as Figure 14 institute
Show, share I/O module 32 and connect described at least two node module 5 by described handover module, be used for receiving switching signal
Time according to described switching signal, make described shared I/O module 32 logical with a node mould in described at least two node module 5
Block 5 communicates.Particularly as follows:
In one embodiment, refering to Figure 15, it is shown as in an embodiment of the present utility model sharing I/O module and
The circuit catenation principle schematic diagram of node module.Described two main modules 322 include network card interface, USB interface and video respectively
Interface.A described I/O interface 3221 includes network card interface interface, USB interface interface and video interface interface.Described USB
Interface and described video interface are electrically connected with described node module 5 by described handover module, are used for receiving switching signal
Time according to described switching signal, make described USB interface and described video interface and a node module 5 electrically connect.Described node
Module 5 includes a South Bridge chip and a baseboard management controller electrically connected with described South Bridge chip, and each described network interface card connects
The described South Bridge chip 55 of mouth node module 5 corresponding with respectively and baseboard management controller (BMC) electrical connection, described
USB interface is electrically connected with described South Bridge chip by described handover module, and described handover module is passed through at described video interface interface
Electrically connect with described baseboard management controller.The model of described South Bridge chip for example, Intel Lewisburg.
In another specific embodiment, refering to Figure 16, be shown as in an embodiment of the present utility model share I/O module with
The circuit catenation principle schematic diagram of one node module.Described two main modules 322 include that network card interface, USB interface, video connect respectively
Mouth, 1G Ethernet switch, 10G Ethernet switch and SFP optical module.Described optical module is preferably four-way
SFP optical module (QSFP)；Described network card interface and described 1G Ethernet exchanging mechatronics, described small-sized insert
Pull out optical module and described 10G Ethernet exchanging mechatronics；A described I/O interface 3221 includes that network card interface interface, USB connect
Mouth interface, video interface interface and optical module connection interface.Described node module 5 includes that a South Bridge chip 55, is with described
The baseboard management controller of South Bridge chip 55 electrical connection and the physical chip that electrically connects with described baseboard management controller.
Described USB interface is electrically connected with described South Bridge chip by described handover module, and described video interface interface is by described switching
Module electrically connects with described baseboard management controller.The number phase of the number of described physical chip and described shared I/O unit
Corresponding；The described 1G Ethernet switch of each described shared I/O unit and corresponding described physical chip electrical connection, institute
The described 10G Ethernet switch stating shared I/O unit all electrically connects with described South Bridge chip.The model of described South Bridge chip 55
For example, Intel Lewisburg.
In another specific embodiment, refering to Figure 17, be shown as in an embodiment of the present utility model share I/O module with
The circuit catenation principle schematic diagram of one node module.Described two main modules 322 include that network card interface, USB interface, video connect respectively
Mouth, 1G Ethernet switch, hard-disk interface and hard disk expander.In concrete application, described hard-disk interface is that a hard disk expands
Exhibition interface.Described hard-disk interface is preferably MiniSAS interface, described network card interface and described 1G Ethernet exchanging mechatronics,
Described hard-disk interface electrically connects with described hard disk expander, and a described I/O interface also includes hard disk interface.Described first
I/O interface 3221 includes network card interface interface, USB interface interface, video interface interface and hard disk interface.Described joint
Point module 5 include baseboard management controller that a South Bridge chip 55, electrically connects with described South Bridge chip 55, physical chip,
And a hard disk expansion card, described USB interface is electrically connected with described South Bridge chip 55 by described handover module, and described video connects
Mouth interface is electrically connected with described baseboard management controller by described handover module, and the number of described physical chip is common with described
The number enjoying I/O unit is corresponding；The described 1G Ethernet switch of each described shared I/O unit and a corresponding described thing
Reason layer chip electrical connection, the described hard disk expander of described shared I/O unit all electrically connects with described SAS hard disk expansion card 56.
The model for example, Intel Lewisburg of described South Bridge chip 55.
Referring again to Fig. 6, described node module 5 includes described node backboard 57, and by described node backboard 57 with
The hard disk 58 of described second processor 53 electrical connection, in the present embodiment, each node module 5 includes 6 hard disks 58, and is upper
In the cavity being arranged at described node module 5 of lower stacking (i.e. the mode of 3*2).
In one embodiment of the utility model, in conjunction with Fig. 4, described second is installed with space 16 is divided into symmetrical
And two front end area that shape is identical, i.e. front end area G and front end area H.The height of described node module 5 is described second appearance
If the half of the height in space 16, described node module 5 is 4, in front end area G and front end area H, difference stacked on top of one another
Two described node modules 5 are set.
In concrete application, it is preferred that described symmetrical two front end area G, H are the cavity that two shapes are identical, each
Inside cavities arranges two relative supporting part G1 and H1 along described sidewall direction, and wherein, described supporting part G1 and H1 is in described
Second position being installed with space 16 1 half height, in each described front end cavity G and H, respectively stacked on top of one another two institutes are set
Stating node module 5, and one of them is positioned on described base plate 11, another is positioned on described supporting part G1 or H1.More excellent
Choosing, in another specific embodiment, the relevant position of described base plate 11 and described supporting part G1 or H1 can arrange slide rail
Structure, described node module 5 is preferably arranged to have pulley structure, and described node module 5 can be made to slip into described front end region
In G or H of territory, or extract out from described front end area G or H.Or, it is preferred that described cabinet 1 is positioned at described second and is installed with space 16
The inner side of two sidewalls 11 be provided with slide rail, described node module 5 and described hard disc module are provided with relative with described slide rail
The chute answered.
In another detailed description of the invention, such as with reference to shown in Figure 18 and Figure 19, by about two in described electronic installation
The node module 5 that stacking is arranged replaces with a memory module 6, to realize the function of storage server.
And, it is preferred that the support unit 59 corresponding with each hard disk 58 is preferably as shown in Figure 20 and Figure 21, including:
First supporting part 591, for planar structure, has the first fixed part 5911；
Second supporting part 592, for planar structure, is in same plane with described first supporting part 591, has second and fixes
Portion 5921, described second supporting part 592 is preferable in the present embodiment and is additionally provided with a LED light-guiding pillar 5922, can be darker
State under, conveniently find the installation site of hard disk 58.The most in other embodiments, described LED light-guiding pillar 5922 is all right
It is arranged at described first supporting part 591.And preferably, in the present embodiment, at described first fixed part 5911 and described the
Two fixed parts 5921 be provided around vibration-absorptive material, to reduce electronic installation vibration frequency of hard disk during movement,
The safety of protection hard disk.
Stopper section 593, connects described first supporting part 591 and described second supporting part 592, to form a U-shaped space,
And described stopper section 593 is vertical with described first supporting part 591 and described second supporting part 592；And preferred described stopper section
593 are structure as a whole with described first supporting part 591 and described second supporting part 592.
Described hard disk 58 is positioned over described first supporting part 591 and described second supporting part 592, and be screwed or
The modes such as person's welding are fixed with described first fixed part 5911 and the second fixed part 5921.
Support unit 59 has abandoned traditional semi-surrounding mode, reduces hard disk 58 and is installed on described second and is installed with space 16
Horizontal space after in, i.e. can install abundant hard disk in the confined space.It is furthermore preferred that at described first supporting part
591 and described second supporting part 592 on can be provided with multiple louvre, with while the described hard disk of satisfied support 58,
Strengthen the dynamics of heat radiation.
And in the present embodiment, as shown in figs 20 and 21, the outside of described stopper section 593 is additionally provided with a Handheld Division 594,
Shown in Handheld Division 594 there is a lock catch unit, shown lock catch unit by the spring structure inside it be locked in a position or
Unlock from a position, to make described support unit 59 can be fixed on the described second relevant position being installed with space 16 flexibly, or
Person extracts from described second relevant position being installed with space 16 flexibly.
In sum, more electronics unit reasonably arranged in limited chassis space by electronic installation of the present utility model
Part, and according to the layout of electronic component, described backboard arranges multiple interface, and according to described electronic component, interface
Setting, described backboard is offered multiple louvre, distinguished and admirable to form one, help the heat radiation of described electronic installation.This practicality
Novel electronic installation, density height and perfect heat-dissipating.So, the utility model effectively overcomes of the prior art all scarce
Put and have high industrial utilization.
Above-described embodiment only illustrative principle of the present utility model and effect thereof are new not for limiting this practicality
Type.Above-described embodiment all can be carried out by any person skilled in the art under spirit and the scope of the present utility model
Modify or change.Therefore, art has usually intellectual such as without departing from the essence disclosed in the utility model
All equivalences completed under god and technological thought are modified or change, and must be contained by claim of the present utility model.
Claims (9)
1. an electronic installation, it is characterised in that including:
One cabinet, including two sidewalls and the base plate that connects described two sidewalls, this cabinet has one along the direction of described two sidewalls
First end, and one of relative with described first end the second end, this cabinet closes on described first end to be had one first and is installed with space,
This cabinet closes on described second end and arranges one second and be installed with space；
Blower module, is arranged at described first and is installed with space；
Node module, is arranged at described second and is installed with space, has and multiple treats heat dissipation element；
One backboard, is fixed on described base plate, and being arranged at of the most described two sidewalls described first is installed with space and described
Two are installed with between space, and described backboard offers ventilating opening, described ventilating opening and described blower module and described in wait to dispel the heat
Element is corresponding, with make described ventilating opening and described blower module and described in treat that heat dissipation element matches, form a wind circulation
Road.
Electronic installation the most according to claim 1, it is characterised in that: the height of described ventilating opening and described first is installed with sky
Between in blower module arrange height and the height treating heat dissipation element of the described second described node module being installed with in space
Corresponding.
Electronic installation the most according to claim 1, it is characterised in that: described first is installed with in space and is provided with multiple I/O
Module, described blower module is arranged in described I/O module, and described I/O module includes node I/O module and shared I/O mould
Block.
Electronic installation the most according to claim 3, it is characterised in that: described ventilating opening includes multiple bar shaped laterally offered
Hole and a rectangular opening.
Electronic installation the most according to claim 4, it is characterised in that: described bar hole is horizontal uniform on described backboard
Distribution, and corresponding with the blower module in described node I/O module.
Electronic installation the most according to claim 5, it is characterised in that: in described rectangular opening and described shared I/O module
Blower module is corresponding.
Electronic installation the most according to claim 6, it is characterised in that: described node I/O module is about described shared I/O mould
Block is symmetrical.
Electronic installation the most according to claim 4, it is characterised in that: it is provided with multiple Plug Division on described backboard, in order to
Electrically connect with described node module or the described first I/O module being installed with space.
Electronic installation the most according to claim 8, it is characterised in that: described Plug Division is distributed in the two of described bar hole
Side.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562195767P | 2015-07-22 | 2015-07-22 | |
| US62/195,767 | 2015-07-22 | ||
| US15/000,711 | 2016-01-19 | ||
| US15/000,711 US9817450B2 (en) | 2015-07-22 | 2016-01-19 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205540411U true CN205540411U (en) | 2016-08-31 |
Family
ID=55987700
Family Applications (13)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620075343.9U Active CN205384553U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075371.0U Active CN205540412U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051640.4A Active CN105717991B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051327.0A Active CN105607709B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075388.6U Active CN205384554U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074922.1U Active CN205540410U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074912.8U Active CN205540469U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074901.XU Active CN205540468U (en) | 2015-07-22 | 2016-01-26 | Electron device and auxiliary device who uses thereof |
| CN201620075390.3U Active CN205540471U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075324.6U Active CN205540470U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075233.2U Active CN205540411U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051633.4A Active CN105676971B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051636.8A Active CN105676972B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
Family Applications Before (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620075343.9U Active CN205384553U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075371.0U Active CN205540412U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051640.4A Active CN105717991B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051327.0A Active CN105607709B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075388.6U Active CN205384554U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074922.1U Active CN205540410U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074912.8U Active CN205540469U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620074901.XU Active CN205540468U (en) | 2015-07-22 | 2016-01-26 | Electron device and auxiliary device who uses thereof |
| CN201620075390.3U Active CN205540471U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201620075324.6U Active CN205540470U (en) | 2015-07-22 | 2016-01-26 | Electronic device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610051633.4A Active CN105676971B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
| CN201610051636.8A Active CN105676972B (en) | 2015-07-22 | 2016-01-26 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (13) | CN205384553U (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN205540471U (en) | 2016-08-31 |
| CN205540469U (en) | 2016-08-31 |
| CN105717991B (en) | 2020-05-12 |
| CN205540410U (en) | 2016-08-31 |
| CN205384554U (en) | 2016-07-13 |
| CN105607709B (en) | 2019-10-01 |
| CN205540470U (en) | 2016-08-31 |
| CN205384553U (en) | 2016-07-13 |
| CN105717991A (en) | 2016-06-29 |
| CN105676971B (en) | 2021-03-23 |
| CN105676971A (en) | 2016-06-15 |
| CN205540468U (en) | 2016-08-31 |
| CN105607709A (en) | 2016-05-25 |
| CN205540412U (en) | 2016-08-31 |
| CN105676972A (en) | 2016-06-15 |
| CN105676972B (en) | 2020-11-13 |
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