CN105607709A - lectronic device - Google Patents
lectronic device Download PDFInfo
- Publication number
- CN105607709A CN105607709A CN201610051327.0A CN201610051327A CN105607709A CN 105607709 A CN105607709 A CN 105607709A CN 201610051327 A CN201610051327 A CN 201610051327A CN 105607709 A CN105607709 A CN 105607709A
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- Prior art keywords
- module
- interface
- share
- node
- electrically connected
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
Abstract
The present invention provides an electronic device. The electronic device comprises at least two node modules, a shared I/O module and a switching module, wherein the shared I/O module is provided with a first I/O interface which is connected with an external device and a second I/0 interface which is electrically connected with the at least two node modules; the switching module is connected with the at least node modules and the shared I/O module, and is used for enabling the shared I/O module to communicate with one of the at least two node modules through the second I/O interface when a selection signal is received, according to the selection signal; the shared I/O module integrates a plurality of communication interfaces, and switches the node module which is communicated with the shared I/O module according to the selection signal; the shared I/O module can be designed a shared I/O modules with a plurality of different interface combinations in advance so that the corresponding replacement, according to the user requirement, can be performed. The electronic device satisfies highly integrated modulized design and can guarantee the stability and high efficiency of communication among each module.
Description
Technical field
The present invention relates to communication technical field, particularly relate to high density, high performance electronic installation.
Background technology
Along with the development of the communications industry, to the structural design of communication equipment, particularly equipment high density, high performance designAlso have higher requirement, existing communication equipment, in order to realize more function, is often provided with very many electricity in its cabinetSubmodule, thus in limited space the reasonable and clean and tidy more module of layout, to improve the cost performance of product and to bringUser better experiences, and will become a direction of communication equipment development. The physics setting of high integrated communication equipment need to be withThe electrical design matching, to ensure the dynamical operation of communication equipment.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of electronic installation, for solvingAsking of the high performance electrical collocation that in prior art, the element of the high density setting of electronic installation inside does not match with itTopic.
For achieving the above object and other relevant objects, the invention provides a kind of electronic installation, comprising: at least two nodesModule; Share I/O module, have the I/O interface that is connected with external equipment and with described at least two node module electricityThe 2nd I/O interface connecting; Handover module, at least two node modules and share I/O module described in connection, for receivingSelect when signal according to described selection signal, make described share I/O module by described the 2nd I/O interface and described at least twoA node module communication in node module.
In one embodiment of the present invention, described share I/O module comprises at least one share I/O unit.
In one embodiment of the present invention, described share I/O unit comprises that network interface card interface, USB interface and video connectMouthful.
In one embodiment of the present invention, a described I/O interface comprise network interface card connection interface, USB interface interface, withAnd video interface interface.
In one embodiment of the present invention, the number of described network interface card interface is identical with the number of described node module, andBe electrically connected with a node module respectively.
In one embodiment of the present invention, described USB interface and described video interface by described handover module withThe electrical connection of described node module, while selecting signal for receiving according to described selection signal, make described USB interface and described inVideo interface is electrically connected with a node module.
In one embodiment of the present invention, described selection signal is manually to generate or foundation one remote control commands lifeBecome.
In one embodiment of the present invention, described node module comprises a South Bridge chip and one and described South Bridge chipThe baseboard management controller of electrical connection, described in each network interface card interface respectively with the described South Bridge chip of a corresponding node module withAnd baseboard management controller electrical connection, described USB interface is electrically connected with described South Bridge chip by described handover module, described in lookFrequently connection interface is electrically connected with described baseboard management controller by described handover module.
In one embodiment of the present invention, described share I/O unit also comprises 1G Ethernet switch, 10G EthernetSwitch and SFP optical module; Described network interface card interface and described 1G Ethernet exchanging mechatronics, described small-sized canPlug optical module and described 10G Ethernet exchanging mechatronics; A described I/O interface also comprises optical module connection interface.
In one embodiment of the present invention, described node module comprises a South Bridge chip, one and described South Bridge chip electricityThe baseboard management controller connecting and the physical chip being electrically connected with described baseboard management controller, described physical layer coreThe number of sheet is corresponding with the number of described share I/O unit; The described 1G Ethernet switch of share I/O unit described in eachBe electrically connected with a corresponding described physical chip, the described 10G Ethernet switch of described share I/O unit all with described southBridge chip electrical connection.
In one embodiment of the present invention, described share I/O unit also comprise 1G Ethernet switch, hard-disk interface,Hard disk expander; Described network interface card interface and described 1G Ethernet exchanging mechatronics, described hard-disk interface and the expansion of described hard diskDevice electrical connection; A described I/O interface also comprises hard-disk interface interface.
In one embodiment of the present invention, described node module comprises a South Bridge chip, one and described South Bridge chip electricityThe baseboard management controller, physical chip and the hard disk expansion card that connect, the number of described physical chip and described commonThe number of enjoying I/O unit is corresponding; The described 1G Ethernet switch of share I/O unit and a corresponding described thing described in eachThe electrical connection of reason layer chip, the described hard disk expander of described share I/O unit is all electrically connected with described hard disk expansion card.
In one embodiment of the present invention, the quantity of described share I/O unit is two, described two share I/O unitWherein one for share I/O unit of redundancy redundant is provided.
As mentioned above, electronic installation of the present invention, comprises at least two node modules; Share I/O module, has and outsideThe one I/O interface of equipment connection and the 2nd I/O interface being electrically connected with described at least two node modules; Handover module,At least two node modules and share I/O module described in connection, while selecting signal for receiving according to described selection signal,Make described share I/O module logical by a node module in described the 2nd I/O interface and described at least two node modulesLetter. Share I/O module is carried out multiple communication interfaces integrated, and can be according to selection signal, switching and shared I/O module communicationNode module, described share I/O module can design share I/O module with the combination of multiple distinct interfaces in advance, with according to useFamily need to be replaced accordingly, and the present invention meets the modularized design of the high integration of electronic installation, and ensures each intermoduleThe stability of communication and high-effect.
Brief description of the drawings
Fig. 1 is shown as the structural representation of electronic installation in a specific embodiment of the present invention.
Fig. 2 is shown as the rearview of Fig. 1.
Fig. 3 is shown as the front view of Fig. 1.
Fig. 4 is shown as the overall structure schematic diagram of a cabinet in a specific embodiment of the present invention.
Fig. 5 is shown as the structural representation of the first end side of cabinet shown in Fig. 4.
Fig. 6 is shown as the structural representation of electronic installation in a specific embodiment of the present invention.
Fig. 7 is shown as the structural representation of node I/O module in a specific embodiment of the present invention.
Fig. 8 is shown as the schematic diagram of disassembling of the node I/O module shown in Fig. 7.
Fig. 9 is shown as the rearview of the node I/O module shown in Fig. 7
Figure 10 is shown as the structural representation of share I/O module in a specific embodiment of the present invention.
Figure 11 is shown as the disassembly diagram of the share I/O module shown in Figure 10.
Figure 12 is shown as the structural representation of a specific embodiment dorsulum of the present invention.
Figure 13 is shown as the disassembly diagram of the backboard shown in Figure 12.
Figure 14 is shown as share I/O module in one embodiment of the invention and shows with the module that the circuit of a node module is connectedIntention.
Figure 15 is shown as the circuit catenation principle signal of share I/O module and a node module in one embodiment of the inventionFigure.
Figure 16 is shown as the circuit catenation principle signal of share I/O module and a node module in one embodiment of the inventionFigure.
Figure 17 is shown as the circuit catenation principle signal of share I/O module and a node module in one embodiment of the inventionFigure.
Figure 18 is shown as the structural representation of electronic installation in a specific embodiment of the present invention.
Figure 19 is shown as the structural representation of electronic installation in a specific embodiment of the present invention.
Figure 20 is shown as the structural representation of hard disk support portion in a specific embodiment of the present invention.
Figure 21 is shown as the structural representation of the hard disk support portion assembling hard disk shown in application Figure 20.
Element numbers explanation
1 cabinet
11 sidewalls
12 base plates
13 first ends
14 second ends
15 first are installed with space
A, B, C, D, E, F back-end region
16 second are installed with space
G, H front end area
G1, H1 support portion
17 upper covers
2 backboards
21 first plug portions
22 second plug portions
23 first ventilating openings
24 second ventilating openings
3I/O module
31 node I/O modules
311 housings
3111 sidewalls
3112 base plates
3113 first ends
3114 second ends
3115 first are installed with space
3116 second are installed with space
3117 top boards
312PCIE card
3121PCIE card main body
3122PCIE interface
313 fan units
3131 fan frames
3132 fans
32 share I/O module
321 housings
3211 sidewalls
3212 top boards
3213 base plates
3214 first ends
3215 second ends
322 main modules
3221 the one I/O interfaces
3222 the 2nd I/O interfaces
323 fan units
3231 fan frames
3232 fans
4 power modules
5 node modules
51 mainboards
52 first processors
53 second processors
54 storage modules
55 South Bridge chips
56SAS hard disk expansion card
57 node backboards
58 hard disks
59 support units
591 first support portions
5911 first fixed parts
592 second support portions
5921 second fixed parts
5922LED light-guiding pillar
593 stopper sections
594 Handheld Divisions
Detailed description of the invention
By particular specific embodiment explanation embodiments of the present invention, person skilled in the art scholar can be illustrated by this belowThe disclosed content of book is understood other advantages of the present invention and effect easily.
Refer to Fig. 1 to Figure 20. Notice, appended graphic the illustrated structure of this description, ratio, size etc., all only useTo coordinate the content that description was disclosed, understand and read for person skilled in the art scholar, not can in order to limit the present inventionThe qualifications of implementing, thus the technical essential meaning of tool not, the tune of the modification of any structure, the change of proportionate relationship or sizeWhole, not affecting under effect that the present invention can produce and the object that can reach, all should still drop on disclosed skillArt content obtains in the scope that can contain. Meanwhile, in this description, quote as " on ", D score, " left side ", " right side ", " centre " andThe term of " one " etc., also only for ease of the understanding of narration, but not in order to limit the enforceable scope of the present invention, its relativenessChange or adjust, changing under technology contents, when being also considered as the enforceable category of the present invention without essence.
Described electronic installation of the present invention in actual applications, for example, is the service of an OTT (OverTheTop) high densityDevice, it preferably adopts 2U cabinet, and " U " of server is a kind of unit that represents server external dimensions, is the abbreviation of unit,Detailed dimensions is determined by the EIA as industry group (EIA). The size of why wanting predetermined server, isIn order to make server keep suitable size so as to be placed on irony or aluminium matter frame on. In frame, there is the screw of fixed server,The screw of it and server, to good, is fixed with screw. The size of regulation is wide (the 48.26cm=19 inch) of serverWith high (multiple of 4.445cm). Due to wide be 19 inches, so sometimes also the frame that meets this regulation is called to " 19 inchesFrame ". Thickness is taking 4.445cm as base unit. 1U is exactly 4.445cm, and 2U is that 2 times of 1U are 8.89cm (so analogizing).That is to say what is called " server of 1U ", is exactly that profile meets the product that EIA specification, thickness are 4.445cm. Be designed to placeProduct to 19 inches of racks is commonly referred to as rack server. In certain practical application, the size of electronic installation of the present inventionBe not limited to this, the electronic installation of other dimensions is equally applicable to technical scheme of the present invention.
Refer to Fig. 1, be shown as electronic installation of the present invention structural representation in one embodiment. Described electronicsDevice comprises a cabinet 1, a backboard 2, at least one I/O (input and output) module 3, at least one power module 4 and at least one jointPoint module 5. Fig. 2 is the rearview of electronic installation shown in Fig. 1, and Fig. 3 is the front view of electronic installation shown in Fig. 1.
In conjunction with Fig. 4, be shown as cabinet of the present invention structural representation in one embodiment, described cabinet 1 comprisesTwo sidewalls 11 and connect a base plate 12 of described two sidewalls 11, described two sidewalls 11 and described base plate 12 can be by screw orBuckle is fixed connection, also can be structure as a whole, and this cabinet 1 has a first end 13 along the direction of described two sidewalls 11, withAnd one of relative with described first end the second end 14, this cabinet closes on described first end 13 to be had one first and is installed with space 15, shouldCabinet closes on described the second end 14 and arranges one second and be installed with space 16. Described first is installed with space 15 for being installed with described I/O mouldPiece 3 and described power module 4, wherein, described first is installed with space 15, and to be separated into multiple height identical and be arranged side by sideBack-end region, each described back-end region is used for being installed with at least one described I/O module 3 or at least one described power module 4. Yu BenIn embodiment, for example, in conjunction with as Fig. 5, described back-end region is separated into 6 regions, be respectively back-end region A, back-end region B,Back-end region C, back-end region D, back-end region E and back-end region F. Described second is installed with space 16 for being installed with described jointPoint module 5, wherein, described second is installed with space 16 is also separated into multiple front end area, in each described front end area, arrangesAt least one described node module 5. And in conjunction with Fig. 4, described second is installed with space 16 is separated into two front end area G and front end regionTerritory H, described front end area G and front end area H all can hold respectively two node modules 5 of stacked setting.
And in actual applications time, the cabinet 1 of the described electronic installation of finished product also comprises a upper cover 17, described upper cover 17 isIntegrative-structure, the top that be arranged at electronic installation relative with described base plate 12, or as in the present embodiment, described upper cover 17 wrapsDraw together two parts, cover described second and be installed with the upper cover front portion at the rear portion of space 16 and backboard 2, and cover described first and be installed withThe upper postoperculum in space 15, two parts can be fixedly connected with by corresponding screw hole.
And wherein, being arranged at of described backboard 2 vertical described two sidewalls 11 described first is installed with space 15 and described secondBe installed with between space 16, in conjunction with Fig. 6 (electronic installation that Fig. 6 is Fig. 1 removes the structural representation after upper cover), have towards describedFirst is installed with the first plug portion 21 in space 15 and towards the described second the second plug portion 22 that is installed with space 16, preferred,Described the first plug portion 21 and the second plug portion 22 are for example a High speed rear panel connector, and for example can be an inserting slot construction,For mating and be electrically connected with a golden finger, such design, can exempt the use of instrument, also can make in cabinet 1More neat and tidy. Described backboard 2 can be installed with space 15 and be located in second and be installed with in space 16 being arranged at firstIndependently electric module (I/O module 3, power module 4 and node module 5) be connected, be equivalent to the work of a bridgeWith, make can mutually cooperate between each electric module, to realize specific electrical functionality.
Described I/O module 3 has an I/O module assembly portion, and pluggable first of the described backboard 2 that is electrically connected at is insertedPull out portion 21, described I/O module assembly quality award from the ministry is elected a golden finger structure as, with the first plug portion 21 of the described backboard of inserting slot constructionElectrical connection.
Described power module 4 has a power module department of assembly, and pluggable first of the described backboard 2 that is electrically connected atPlug portion 21, in order to supply the electric power of described electronic installation. In the present embodiment, the quantity of preferred described power module 4 is twoIndividual, the wherein one of described two power modules 4 is for the power module 4 of redundancy redundant is provided, and described two power modules 4 are stackedBe arranged at one described in back-end region. Described power module 4 is preferably other in described electronic installation by described backboardElectrical components provides electric power, and preferred, and described power module 4 carries out information friendship by I2C bus and other electrical componentsMutually.
Described power module department of assembly is preferably a golden finger structure, with the first plug portion of the described backboard of inserting slot constructionElectrical connection.
In specific embodiment of the present invention, described I/O module 3 preferably includes node I/O module 31 and share I/OModule 32.
Wherein, each described node I/O module 31 is electrically connected with node module described in one 5 by described backboard 2, described jointThe structure of some I/O module 31 is please specifically consulted Fig. 7, Fig. 8 and Fig. 9, and described node I/O module 31 comprises:
Housing 311, comprises two sidewalls 3111 and connects a base plate 3112 of described two sidewalls 3111, this housing 311 is along instituteThe direction of stating two sidewalls 3111 has a first end 3113, and one of relative with described first end 3113 the second end 3114, shouldHousing 311 closes on described first end 3113 to be had one first and is installed with space 3115, and this housing 311 closes on described the second end 3114 and establishesPut one second and be installed with space 3116; In the present embodiment, described housing 311 also comprises described in cover part that first is installed with space3115 top board 3117, described top board 3117 mainly plays the work that protection first is installed with the electronic component being installed with in space 3115With, in other specific embodiments, the size of described top board 3117 can be shorter or longer, or can omit described top board3117。
Keyset (not shown), is arranged in described housing 311, parallel with described base plate 3112 is fixed on described base plateOn 3112, comprise keyset main body and keyset Plug Division, described keyset main body is towards the side that deviates from described base plate 3112To having the first slot and the second slot, described keyset Plug Division is closed on the second end 3114 of described housing 311 and is exposedIn described the second end 3114, described keyset is electrically connected by the first plug portion 21 of described keyset Plug Division and described backboard 2Connect.
PCIE card 312, is arranged at described first and is installed with space 3115, comprises PCIE card main body 3121 and PCIE interface3122, described PCIE interface is PCIEIO interface in concrete application, and described PCIE card main body 3121 is flat with described sidewall 3111Row and the setting vertical with described base plate 3112, described PCIE card main body 3121 is plugged in the of described keyset by golden fingerOne slot, described PCIE interface 3122 is positioned at the first end 3113 of described housing 311; In the present embodiment, described PCIE card 312Be preferably 3.
Fan unit 313, is arranged at described second and is installed with space 3116, in the present embodiment, has two, described two windThe wherein one of fan unit 313 is for providing the fan unit 313 of redundancy redundant. Described fan unit 313 comprises fan frame3131 and fan 3132, described fan 3132 is arranged in described fan frame 3131, and described fan unit 313 is by connectingDevice is plugged in the second slot of described keyset, and described connector is preferably a golden finger or a cable. Described fan 3132 isHot-plug construction. And the modularized design of described node I/O module 31, when needs are changed described fan unit 313 or maintenance instituteWhile stating fan unit 313, directly node I/O module 31 is taken out from its accommodation space, and need not dismantle server machineThe housing (when the fan maintenance in existing machine box for server or replacing, major part all needs top cover to open) of case, operation sideJust and improve maintenance efficiency. Described fan unit 313 can be screwed in described housing 311.
In another specific embodiment, described node I/O module can be the structure of drawer type, can omit described two sidewalls,And described fan unit 313 is directly fixed on described keyset.
Described share I/O module 32 by described backboard 2 to be optionally electrically connected with node module described in one 5; Preferably, described electronic installation also comprises a handover module, for according to a switching signal, make described share I/O module 32 with described inOne in node module 5 communicates. For example described handover module be a switching push button (for example mouse or Keyboard ControlSwitching push button), by the pressing of button, to switch the node module 5 of communicating by letter with described share I/O module 32. Or according toA long-range network control signal, to switch the node module 5 of communicating by letter with described share I/O module 32. Described share I/O mouldThe structure of piece 32 is please specifically consulted Figure 10 and Figure 11, comprising:
Housing 321, comprises two sidewalls 3211 and connects top board 3212 and the base plate 3213 of described two sidewalls 3211, this housing321 have a first end 3214 along the direction of described two sidewalls 3211, and one of relative with described first end 3214 the second end3215；
Two main modules (two share I/O unit) 322, are arranged at respectively top board 3212 and the base plate 3213 of described housing 321Medial surface and be enclosed to form one with two sidewalls 3211 of described housing 321 and be installed with space, the thickness of one end of main module 322 is littleIn the thickness of the other end, this design can be installed with space described in forming in the less side of thickness, single in order to hold fan etc.Unit, can maximizedly utilize space. Respectively this main module 322 comprise the I/O interface 3221 that is connected with external equipment andWith the 2nd I/O interface 3222 being electrically connected one of in described at least two node modules 5; A described I/O interface 3221 for exampleComprise one or more the combination in USB interface interface, VGA connection interface and network interface interface, described two main modules322 is the design of redundancy each other.
Fan unit 323, is installed with space described in being located in, and comprises fan frame 3231 and fan 3232, described fan3232 are arranged in described fan frame 3231. Described fan 3232 is hot-plug construction. And the mould of described share I/O module 32Blocking design, in the time that needs are changed described fan unit 323 or are keeped in repair described fan unit 323, directly by share I/O module 32From its accommodation space, take out, and need not dismantle the housing of machine box for server, (fan in existing machine box for server is tieed upWhen repairing or changing, major part all needs top cover to open), easy to operate and raising maintenance efficiency, is ensureing that housing temperature is up to standardTime, also make fan unit easy to loading and unloading, be easy to safeguard.
And the heat radiation of machine box for server is for ensureing that its efficient operation has larger impact, at this in conjunction with backboard 2 structuresSchematic diagram, Figure 12 and Figure 13, be provided with ventilating opening on described backboard 2, the fan of described ventilating opening and described node I/O module 31The fan unit 323 of unit 313, described share I/O module 32 and described in treat that heat dissipation element is corresponding, to make described ventilationMouthful with described fan unit 313 and 323 and described in treat that heat dissipation element matches, formation one airflow channel. On described backboard 2Horizontal the first ventilating opening 23 corresponding to the fan unit 313 that offers multiple equally distributed and described node I/O modules 31,And second ventilating opening 24 corresponding with the fan unit 323 of described share I/O module 32, and described the first ventilating opening 23 andThe setting of the second ventilating opening 24, what can make fan unit 313 and fan unit 323 distinguished and admirable more flows to described node mouldOn piece 5, need the unit (for example processor and DDR) of heat radiation, the interface on described backboard 2 is reasonably arranged at described theThe both sides of one ventilating opening 23 and the second ventilating opening 24,, meet the rationally setting of interface on backboard 2 in the case of ensureingThe radiating requirements of machine box for server. Described the first ventilating opening 23 is preferably equally distributed bar hole as shown in the figure, and describedTwo ventilating openings 24 are preferably rectangular opening as shown in the figure.
In one embodiment of the present invention, described node I/O module 31, share I/O module 32 and power module 4Height all preferably identical with the height of described back-end region, and length is also all corresponding with the length of described back-end region, withMake in limited chassis space, can the more module of layout, be specially described node I/O module 31, share I/O module32 and power module 4, be located in respectively in a corresponding back-end region, and the number of described node I/O module 31 is even numberIndividual, about symmetrical being arranged in corresponding back-end region of described share I/O module 32. In order to hold all described nodesI/O module 31, share I/O module 32, power module 4, the number of described back-end region is preferably more than or equals the even number of 4Individual.
Concrete example is as being, described node I/O module 31 is four, and described share I/O module 32 is 1, described node I/OModule 31, share I/O module 32 and power module 4 in described back-end region be set to from left to right or from the right side extremelyLeft is followed successively by: power module 4, two described node I/O modules 31, described share I/O module 32, two described node I/OModule 31. In conjunction with Fig. 1, Fig. 2 and Fig. 3, described power module 4 is arranged in back-end region F, and described power module 4 comprises twoPower subsystem, and redundancy each other, stacked is arranged in described back-end region F, described in described share I/O module 32 is arranged atIn back-end region C, described node I/O module 31 is arranged at respectively in back-end region A, B, D and E. Comprise four described nodesModule 5, every two stacked be arranged at described second and be installed with space 16 respectively.
Putting between two parties of share I/O module 32, makes second of electronic installation be installed with the signal of the node module 5 in space 16The distance that arrives described share I/O module 32 is basic identical, ensures the symmetry of the performance of signal transmission, and four node IO mouldsPiece 31 arranges in the both sides of described share I/O module 32, makes second of electronic installation be installed with the letter of the node module 5 in space 16The distance that number arrives corresponding node IO module 31 equates, ensures the symmetry of the performance of signal transmission.
And in the present embodiment, preferred, the length of described power module 4, share I/O module 32, node I/O module 31Spend basic identical, and height aspect, the height of power module 4 and share I/O module 32 is first to be installed with the appearance in space 15 substantiallyIf the half of height, and the height of node I/O module 31 is substantially with described first to be installed with being installed with of space 15 highly identical, makes instituteState first being installed with space availability ratio in space 15 and reaching maximum of cabinet of electronic installation, and the establishing of this length and heightPut, the compatible front-end module dividing plate of maximum possible, reaches the effect reducing costs.
Consult again shown in Fig. 2, the connection interface of the connection interface of described I/O module 3 and described power module 4 all inDescribed first end 13. Be the connection interface of described node I/O module 31, as figure be PCIE card PCIE interface in as described in firstEnd 13, and the connection interface of described share I/O module 32 comprises USB interface, VGA interface and network interface, also in describedFirst end 13, and in another specific embodiment, the kind of the interface of described share I/O module 32 can also be set to otherInterface. Preferred, design in advance has share I/O module 32 of different interface type collocation, can make according to application needWant, replace.
Consult Fig. 6, described node module 5 has node module department of assembly, and is pluggablely electrically connected at described backboard 2The second plug portion 22, and logical with corresponding I/O module (node I/O module 31 or share I/O module 32) by described backboard 2Letter.
Described node module 5 comprises mainboard 51 as shown in Figure 6, and described mainboard 51 comprises that the first electrical junction is (in figureNot shown) and the second electrical junction (not shown), described the first electrical junction can by described backboard 2 with described inFirst is installed with electrical module (node I/O module 31, share I/O module 32 and the power module) electrical connection in space 15. InstituteStating the second electrical junction is electrically connected with multiple expanding hard disks by a node backboard 57 of described node module 5. Described nodeModule 5 also comprises the two processor (CPU) that is arranged at described mainboard along described node ' s length direction, is respectively first processor 52And second processor 53, described first processor 52 and described the second processor 53 are electrically connected, and are arranged at described mainboard 51Upper, composition dual processor, the model of described first processor 52 and the second processor 53 is for example Skylake, due to processorIn running, caloric value is very large, thus at the top of described first processor 52 and the second processor 53, fin is set,Described first processor 52 is respectively arranged with described first processor 52 and is electrically connected along the both sides of described node module 5 widthsThe storage module 54 connecing, is arranged on described mainboard, in the present embodiment, selects each storage module 54 to comprise 6 DDR(DoubleDataRate, Double Data Rate synchronous DRAM), so described first processor and 12 DDR are electrically connectedConnect, in another specific embodiment, each described storage module 54 also can according to real needs above it correspondence arrange one looseBacking, described the second processor 53 is respectively arranged with and described the second processor along the both sides of described node module 5 widthsThe storage module 54 of 23 electrical connections, is arranged on described mainboard 51, in the present embodiment, selects each storage module 54 to comprise 6Individual DDR (DoubleDataRate, Double Data Rate synchronous DRAM), so 53 and 12 of described the second processorsDDR electrical connection, the top correspondence of each storage module 54 arranges a fin. Described node module 5 is on described mainboard 51Be provided with a South Bridge chip 55 and a BMC (not shown) (substrate management control near described the first electrical junction placeDevice, BaseboardManagementController), in the present embodiment, described first processor 52 is directly with correspondingThe PCIE cartoon letters of node I/O module 31, described in each, the number of the PCIE card of node I/O module 31 is preferably 3. And pass throughDescribed South Bridge chip 55 and described BMC are electrically connected with described share I/O module 32. Described node module 5 also has hard disk mouldPiece, according to the concrete configuration situation of described hard disc module, described the second processor 53 to be to be directly electrically connected with described hard disc module,Or be electrically connected the model of SAS hard disk expansion card 56 with described hard disc module by the SAS hard disk expansion card 56 shown in Fig. 6In the present embodiment, be the SAS3008 of Infineon Technologies Corp.. Described hard disc module in concrete application by multiple hard disks as shown in Figure 658 compositions, in the present embodiment, described hard disc module comprises six described hard disks 58. Preferably, described cabinet 1 is positioned at describedTwo inner sides that are installed with two sidewalls 11 in space 16 are provided with slide rail, and described node module 5 is provided with corresponding with described slide railChute, with facilitate described node module 5 in the described second placement or extraction being installed with in space 16.
In the present invention, the electrical connection between described share I/O module 32 and node module 5, for as shown in figure 14, is total toEnjoy I/O module 32 connect by described handover module described at least two node modules 5, foundation when receiving switching signalDescribed switching signal, make described share I/O module 32 logical with described at least two node modules 5 in a node module 5 logicalLetter. Be specially:
In one embodiment, consult Figure 15, be shown as share I/O module and a node in one embodiment of the inventionThe circuit catenation principle schematic diagram of module. Described two main modules 322 comprise that respectively network interface card interface, USB interface and video connectMouthful. A described I/O interface 3221 comprises network interface card connection interface, USB interface interface and video interface interface. Described USB connectsMouthful and described video interface be electrically connected with described node module 5 by described handover module, when receiving switching signalAccording to described switching signal, make described USB interface and described video interface be electrically connected with a node module 5. Described node mouldPiece 5 comprises a South Bridge chip and a baseboard management controller being electrically connected with described South Bridge chip, network interface card interface described in eachBe electrically connected respectively described USB with described South Bridge chip 55 and the baseboard management controller (BMC) of a corresponding node module 5Interface is electrically connected with described South Bridge chip by described handover module, and described video interface interface is by described handover module and instituteState baseboard management controller electrical connection. The model of described South Bridge chip is for example IntelLewisburg.
In another specific embodiment, consult Figure 16, be shown as share I/O module and a joint in one embodiment of the inventionThe circuit catenation principle schematic diagram of point module. Described two main modules 322 comprise respectively network interface card interface, USB interface, video interface,1G Ethernet switch, 10G Ethernet switch and SFP optical module. Described optical module is preferably four-waySFP optical module (QSFP); Described network interface card interface and described 1G Ethernet exchanging mechatronics, described SFPOptical module and described 10G Ethernet exchanging mechatronics; A described I/O interface 3221 comprises network interface card connection interface, USB interfaceInterface, video interface interface and optical module connection interface. Described node module 5 comprises a South Bridge chip 55, one and described southThe baseboard management controller that bridge chip 55 is electrically connected and the physical chip being electrically connected with described baseboard management controller. InstituteState USB interface and be electrically connected with described South Bridge chip by described handover module, described video interface interface is by described switching mouldPiece is electrically connected with described baseboard management controller. The number of described physical chip is relative with the number of described share I/O unitShould; Described in each, the described 1G Ethernet switch of share I/O unit is electrically connected with a corresponding described physical chip, described inThe described 10G Ethernet switch of share I/O unit is all electrically connected with described South Bridge chip. The model example of described South Bridge chip 55As be IntelLewisburg.
In another specific embodiment, consult Figure 17, be shown as share I/O module and a joint in one embodiment of the inventionThe circuit catenation principle schematic diagram of point module. Described two main modules 322 comprise respectively network interface card interface, USB interface, video interface,1G Ethernet switch, hard-disk interface and hard disk expander. In concrete application, described hard-disk interface is a hard disk expansionInterface. Described hard-disk interface is preferably MiniSAS interface, described network interface card interface and described 1G Ethernet exchanging mechatronics, instituteState hard-disk interface and be electrically connected with described hard disk expander, a described I/O interface also comprises hard-disk interface interface. A described I/O interface 3221 comprises network interface card connection interface, USB interface interface, video interface interface and hard-disk interface interface. Described nodeModule 5 comprise a South Bridge chip 55, a baseboard management controller being electrically connected with described South Bridge chip 55, physical chip, withAnd a hard disk expansion card, described USB interface is electrically connected with described South Bridge chip 55 by described handover module, described video interfaceInterface is electrically connected with described baseboard management controller by described handover module, the number of described physical chip and described sharingThe number of I/O unit is corresponding; The described 1G Ethernet switch of share I/O unit and a corresponding described physics described in eachLayer chip electrical connection, the described hard disk expander of described share I/O unit all with described inSASHard disk expansion card56Electrical connection. InstituteThe model of stating South Bridge chip 55 is for example IntelLewisburg.
Again consult Fig. 6, described node module 5 comprises described node backboard 57, and by described node backboard 57 withThe hard disk 58 that described the second processor 53 is electrically connected, in the present embodiment, each node module 5 comprises 6 hard disks 58, and is upperIn a cavity that is arranged at described node module 5 of lower stacked (being the mode of 3*2).
In one embodiment of the present invention, in conjunction with Fig. 4, described second is installed with space 16 is split into symmetrical and shapeTwo front end area that shape is identical, i.e. front end area G and front end area H. The height of described node module 5 is described second to be installed with skyBetween the half of 16 height, described node module 5 is 4, in front end area G and front end area H, the setting of stacked on top of one another respectivelyTwo described node modules 5.
In concrete application, preferred, described symmetrical two front end area G, H are the cavity that two shapes are identical, eachCavity inner side arranges two relative support portion G1 and H1 along described sidewall direction, and wherein, described support portion G1 and H1 are in describedSecond is installed with the position of space 16 half height, in each described front end cavity G and H, respectively stacked on top of one another two institutes are setState node module 5, and one of them is positioned on described base plate 11, another is positioned on described support portion G1 or H1. More excellentChoosing, in another specific embodiment, the relevant position of described base plate 11 and described support portion G1 or H1 can arrange slide railStructure, described node module 5 is preferably set to have pulley structure, can make described node module 5 slip into described front end regionIn territory G or H, or extract out from described front end area G or H. Or preferred, described cabinet 1 is positioned at described second and is installed with space 16The inner side of two sidewalls 11 be provided with slide rail, described node module 5 and described hard disc module are provided with relative with described slide railThe chute of answering.
In another detailed description of the invention, for example, with reference to shown in Figure 18 and Figure 19, two upper and lower by described electronic installationThe node module 5 of stacked setting replaces with a memory module 6, to realize the function of storage server.
And preferred, the support unit 59 corresponding with each hard disk 58 is preferably as shown in Figure 20 and Figure 21, comprising:
The first support portion 591, is planar structure, has the first fixed part 5911;
The second support portion 592, is planar structure,, has second and fixes in same plane with described the first support portion 591Portion 5921, described the second support portion 592 is preferable in the present embodiment and is also provided with a LED light-guiding pillar 5922, can be darkerState under, conveniently find the installation site of hard disk 58. Certainly in other embodiments, described LED light-guiding pillar 5922 is all rightBe arranged at described the first support portion 591. And preferred, in the present embodiment, described the first fixed part 5911 and described theThe surrounding of two fixed parts 5921 is provided with vibration-absorptive material, to reduce the vibration frequency of electronic installation hard disk in mobile process,The safety of protection hard disk.
Stopper section 593, connects described the first support portion 591 and described the second support portion 592, to form a U-shaped space,And described stopper section 593 is vertical with described the second support portion 592 with described the first support portion 591; And preferred described stopper section593 are structure as a whole with described the first support portion 591 and described the second support portion 592.
Described hard disk 58 is positioned over described the first support portion 591 and described the second support portion 592, and be screwed orThe modes such as person's welding and described the first fixed part 5911 and the second fixed part 5921 are fixing.
Support unit 59 has been abandoned traditional semi-surrounding mode, has reduced hard disk 58 and has been installed on described second and is installed with space 16In after horizontal space, can be in the confined space, abundant hard disk is installed. Preferred, in described the first support portion591 and described the second support portion 592 on can be provided with multiple louvres, to support in described hard disk 58 meeting,Strengthen the dynamics of heat radiation.
And in the present embodiment, as shown in Figure 20 and 21, the outside of described stopper section 593 is also provided with a Handheld Division 594,Shown in Handheld Division 594 there is a lock catch unit, shown in lock catch unit by its inner spring structure be locked in a position orFrom a position release, to make described support unit 59 can be fixed on flexibly the described second relevant position that is installed with space 16, orPerson extracts from described the second relevant position that is installed with space 16 flexibly.
In sum, electronic installation of the present invention, comprises at least two node modules; Share I/O module, has and outsideThe one I/O interface of equipment connection and the 2nd I/O interface being electrically connected with described at least two node modules; Handover module,At least two node modules and share I/O module described in connection, while selecting signal for receiving according to described selection signal,Make described share I/O module logical by a node module in described the 2nd I/O interface and described at least two node modulesLetter. Share I/O module is carried out multiple communication interfaces integrated, and can be according to selection signal, switching and shared I/O module communicationNode module, described share I/O module can design share I/O module with the combination of multiple distinct interfaces in advance, with according to useFamily need to be replaced accordingly, and the present invention meets the modularized design of the high integration of electronic installation, and ensures each intermoduleThe stability of communication and high-effect. So the present invention has effectively overcome various shortcoming of the prior art and tool high industrialValue.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention. Any ripeThe personage who knows this technology all can, under spirit of the present invention and category, modify or change above-described embodiment. CauseThis, have in technical field under such as conventionally know the knowledgeable do not depart under disclosed spirit and technological thought completeAll equivalences that become are modified or change, and must be contained by claim of the present invention.
Claims (13)
1. an electronic installation, is characterized in that, comprising:
At least two node modules;
Share I/O module, has the I/O interface being connected with external equipment and is electrically connected with described at least two node modulesThe 2nd I/O interface connecing,
Handover module, at least two node modules and share I/O module described in connection, foundation while selecting signal for receivingDescribed selection signal, makes described share I/O module by one in described the 2nd I/O interface and described at least two node modulesIndividual node module communication.
2. electronic installation according to claim 1, is characterized in that: described share I/O module comprises at least one share I/OUnit.
3. electronic installation according to claim 2, is characterized in that: described share I/O unit comprises network interface card interface, USBInterface and video interface.
4. electronic installation according to claim 3, is characterized in that: a described I/O interface comprise network interface card connection interface,USB interface interface and video interface interface.
5. electronic installation according to claim 3, is characterized in that: the number of described network interface card interface and described node moduleNumber identical, and be electrically connected with a node module respectively.
6. electronic installation according to claim 3, is characterized in that: described USB interface and described video interface pass throughDescribed handover module is electrically connected with described node module, selects when signal according to described selection signal, described in order for receivingUSB interface and described video interface are electrically connected with a node module.
7. electronic installation according to claim 6, is characterized in that: described selection signal is manually generation or far away according toProcess control instruction generates.
8. electronic installation according to claim 5, is characterized in that: described node module comprises a South Bridge chip and oneThe baseboard management controller being electrically connected with described South Bridge chip, described in each, network interface card interface is respectively with a corresponding node moduleDescribed South Bridge chip and baseboard management controller electrical connection, described USB interface is by described handover module and described south bridge coreSheet electrical connection, described video interface interface is electrically connected with described baseboard management controller by described handover module.
9. electronic installation according to claim 3, is characterized in that: described share I/O unit also comprises the friendship of 1G EthernetChange planes, 10G Ethernet switch and SFP optical module; Described network interface card interface and described 1G Ethernet exchanging electromechanicsConnect described SFP optical module and described 10G Ethernet exchanging mechatronics; A described I/O interface also comprises lightModule interface interface.
10. electronic installation according to claim 9, is characterized in that: described node module comprise a South Bridge chip, one andThe baseboard management controller of described South Bridge chip electrical connection and the physical layer core being electrically connected with described baseboard management controllerSheet, the number of described physical chip is corresponding with the number of described share I/O unit; The institute of share I/O unit described in eachState 1G Ethernet switch and be electrically connected with a corresponding described physical chip, the described 10G Ethernet of described share I/O unitSwitch is all electrically connected with described South Bridge chip.
11. electronic installations according to claim 3, is characterized in that: described share I/O unit also comprises the friendship of 1G EthernetChange planes, hard-disk interface, hard disk expander; Described network interface card interface and described 1G Ethernet exchanging mechatronics, described hard-disk interfaceBe electrically connected with described hard disk expander, a described I/O interface also comprises hard-disk interface interface.
12. electronic installations according to claim 11, is characterized in that: described node module comprises a South Bridge chip,The baseboard management controller, physical chip and the hard disk expansion card that are electrically connected with described South Bridge chip, described physical layer coreThe number of sheet is corresponding with the number of described share I/O unit; The described 1G Ethernet switch of share I/O unit described in eachBe electrically connected with a corresponding described physical chip, the described hard disk expander of described share I/O unit all expands with described hard diskThe electrical connection of exhibition card.
13. electronic installations according to claim 2, is characterized in that: the quantity of described share I/O unit is two, instituteState the wherein one of two share I/O unit for share I/O unit of redundancy redundant is provided.
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| CN112988659A (en) * | 2021-05-07 | 2021-06-18 | 湖南华自信息技术有限公司 | PCIE bridge chip redundant mainboard, design method and computer storage medium |
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| WO2024041077A1 (en) * | 2022-08-24 | 2024-02-29 | 超聚变数字技术有限公司 | Server and data center |
Also Published As
| Publication number | Publication date |
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| CN105676971B (en) | 2021-03-23 |
| CN205384553U (en) | 2016-07-13 |
| CN105676972A (en) | 2016-06-15 |
| CN205384554U (en) | 2016-07-13 |
| CN205540410U (en) | 2016-08-31 |
| CN205540412U (en) | 2016-08-31 |
| CN205540411U (en) | 2016-08-31 |
| CN205540469U (en) | 2016-08-31 |
| CN105717991B (en) | 2020-05-12 |
| CN205540471U (en) | 2016-08-31 |
| CN205540470U (en) | 2016-08-31 |
| CN105676972B (en) | 2020-11-13 |
| CN205540468U (en) | 2016-08-31 |
| CN105676971A (en) | 2016-06-15 |
| CN105717991A (en) | 2016-06-29 |
| CN105607709B (en) | 2019-10-01 |
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