CN205384553U - Electronic device - Google Patents

Abstract

The utility model provides an electronic device. By arranging modules such as a backplane, an I/O module, a power supply module, and a node module in a case in a reasonable and neat manner, more modules can be laid out in a limited space of the case. High utilization rate and low cost; and the I/O module, power module, and node module are all independently designed, and at the same time, the modules work together; each module is a snap-fit structure, which can be disassembled and assembled by hand, improving the efficiency of operation and maintenance; Moreover, the signal transmission between modules is basically completed by golden fingers or high-speed backplane connectors, so that the interior of the chassis is clean and tidy.

Description

electronic device

technical field

The utility model relates to the communication field, in particular to a high-density electronic device.

Background technique

With the development of the communication industry, there are higher requirements for the structural design of communication equipment, especially the design of high-density and high-performance equipment. In order to achieve more functions, existing communication equipment often sets a lot of Therefore, it will become a direction for the development of communication equipment to arrange more modules reasonably and neatly in a limited space to improve the cost performance of products and bring users a better experience.

Utility model content

In view of the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide an electronic device, which is used to solve the problem in the prior art that the arrangement of components inside the electronic device cannot meet the characteristics of high density and high performance. .

In order to achieve the above purpose and other related purposes, the utility model provides an electronic device, comprising: a case, including two side walls and a bottom plate connecting the two side walls, the case has a direction along the direction of the two side walls a first end, and a second end opposite to the first end, the chassis has a first accommodating space adjacent to the first end, and the first accommodating space is divided into a plurality of front-end areas; two I/O modules are respectively accommodated in a front end area in the first accommodating space, and their length direction is parallel to the direction of the side wall; the power module is flush with the I/O module Located in a front end area in the first accommodating space, its length direction is parallel to the direction of the side wall, to provide power for the electronic device;

In one embodiment of the present invention, the I/O modules include node I/O modules and shared I/O modules.

In one embodiment of the present utility model, the height of the node I/O module, the shared I/O module, and the power supply module is the same as the height of the front-end area, and they are respectively accommodated in a corresponding front-end area. in the area.

In one embodiment of the present invention, the number of the node I/O modules is an even number, and they are symmetrically arranged in the corresponding front-end area with respect to the shared I/O modules.

In one embodiment of the present utility model, there are four node I/O modules, and one shared I/O module, and the node I/O module, shared I/O module, and power supply module are The settings in the front-end area are from left to right, or from right to left: power supply module, two of the node I/O modules, the two shared I/O modules, and the two of the node I/O modules.

In one embodiment of the present invention, the power module includes two power supply units, the number of the power supply units is two, and one of the two power supply units is a power supply unit providing redundancy.

In one embodiment of the present utility model, the power supply units in the power supply module are stacked and arranged in a front end area.

In one embodiment of the present utility model, the shared I/O module includes two shared I/O units, the number of the shared I/O units is two, and one of the two shared I/O units is Shared I/O units that provide redundancy.

In one embodiment of the present invention, two shared I/O units of the shared I/O module are stacked and arranged in one of the front-end regions.

In one embodiment of the present invention, the node I/O module, the shared I/O module, and the power supply module have the same length and correspond to the length of the front-end area.

In one embodiment of the present utility model, the size of the electronic device is 2U.

As mentioned above, in the electronic device of the present invention, by arranging the I/O module and the power module reasonably and neatly in the case, specifically I make the I/O module and the power module equal in height and length in the first storage space of the case Set so that more modules can be laid out in a limited chassis space, with high utilization and low cost; and the I/O modules and power modules are all independently designed, and at the same time, the modules work together; each module is The snap-fit structure can be disassembled and assembled by hand, improving the efficiency of operation and maintenance. And the signal transmission between modules is basically completed by golden fingers or high-speed backplane connectors, so that the inside of the chassis is clean and tidy.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device in a specific embodiment of the present invention.

Figure 2 shows a rear view of Figure 1.

Figure 3 shows a front view of Figure 1 .

FIG. 4 is a schematic diagram of the overall structure of a chassis in a specific embodiment of the present invention.

FIG. 5 is a schematic structural diagram of the first end side of the chassis shown in FIG. 4 .

FIG. 6 is a schematic structural diagram of an electronic device in a specific embodiment of the present invention.

FIG. 7 is a schematic structural diagram of a node I/O module in a specific embodiment of the present invention.

FIG. 8 is a schematic disassembly diagram of the node I/O module shown in FIG. 7 .

Figure 9 shows the rear view of the node I/O module shown in Figure 7

FIG. 10 is a schematic structural diagram of a shared I/O module in a specific embodiment of the present invention.

Figure 11 shows a disassembled view of the shared I/O module shown in Figure 10.

Fig. 12 is a schematic structural view of the backboard in a specific embodiment of the present invention.

FIG. 13 is a disassembled view of the backplane shown in FIG. 12 .

FIG. 14 is a block diagram showing the circuit connection between a shared I/O module and a node module in an embodiment of the present invention.

FIG. 15 is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.

FIG. 16 is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.

FIG. 17 is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention.

FIG. 18 is a schematic structural diagram of an electronic device in a specific embodiment of the present invention.

FIG. 19 is a schematic structural diagram of an electronic device in a specific embodiment of the present invention.

FIG. 20 is a schematic structural view of the hard disk supporting part in a specific embodiment of the present invention.

FIG. 21 is a schematic diagram showing the structure of a hard disk assembled using the hard disk supporting part shown in FIG. 20 .

Component designation description

1 chassis

11 side wall

12 bottom plate

13 first end

14 second end

15 The first design space

A, B, C, D, E, F rear area

16 The second storage space

G, H front end area

G1, H1 support part

17 cover

2 backplane

21 The first plug-in part

22 The second plug-in part

23 first vent

24 second vent

3I/O modules

31-node I/O module

311 shell

3111 side wall

3112 bottom plate

3113 first end

3114 second end

3115 The first design space

3116 The second storage space

3117 top plate

312PCIE card

3121PCIE card body

3122PCIE interface

313 fan unit

3131 fan frame

3132 fan

32 shared I/O modules

321 shell

3211 side wall

3212 top plate

3213 bottom plate

3214 first end

3215 second end

322 main module

3221 first I/O interface

3222 second I/O interface

323 fan unit

3231 fan frame

3232 fan

4 power modules

5-node module

51 motherboard

52 first processor

53 second processor

54 storage modules

55 south bridge chip

56SAS hard disk expansion card

57-node backplane

58 hard drives

59 support units

591 First support part

5911 The first fixed part

592 second support part

5921 Second fixed part

5922LED light guide column

593 stopper

594 handheld

detailed description

The implementation of the present utility model is illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification.

See Figures 1 through 20. It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the utility model Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of The technical content disclosed by the utility model must be within the scope covered. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit this specification. The practicable range of the utility model, and the change or adjustment of its relative relationship, without any substantial change in the technical content, shall also be regarded as the practicable scope of the utility model.

In practical application, the electronic device of the present utility model is, for example, an OTT (OverTheTop) high-density server, which preferably adopts a 2U chassis, and the "U" of the server is a unit representing the external size of the server, which is an abbreviation of unit , The detailed dimensions are determined by the Electronic Industries Association (EIA) as an industry body. The reason for specifying the size of the server is to keep the server at the appropriate size to be placed in an iron or aluminum rack. There are screw holes for fixing the server on the rack, align it with the screw holes of the server, and fix it with screws. The specified dimensions are the width (48.26cm = 19 inches) and height (multiples of 4.445cm) of the server. Because the width is 19 inches, a rack that meets this requirement is sometimes called a "19-inch rack." The basic unit of thickness is 4.445cm. 1U is 4.445cm, 2U is 8.89cm twice as much as 1U (and so on). In other words, the so-called "1U server" is a product whose shape meets the EIA specification and has a thickness of 4.445cm. Products designed to fit into a 19-inch rack are generally referred to as rack servers. Of course, in practical applications, the size of the electronic device of the present invention is not limited thereto, and electronic devices of other sizes and specifications are also applicable to the technical solution of the present invention.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device of the present invention in a specific embodiment. The electronic device includes a chassis 1 , a backplane 2 , at least one I/O (input-output) module 3 , at least one power supply module 4 , and at least one node module 5 . FIG. 2 is a rear view of the electronic device shown in FIG. 1 , and FIG. 3 is a front view of the electronic device shown in FIG. 1 .

In conjunction with Fig. 4, it is shown as a structural schematic diagram of a cabinet of the present invention in a specific embodiment, the cabinet 1 includes two side walls 11 and a bottom plate 12 connecting the two side walls 11, the two side walls 11 and The bottom plate 12 can be fixedly connected by screws or buckles, and can also be an integral structure. The chassis 1 has a first end 13 along the direction of the two side walls 11, and a first end 13 opposite to the first end. Two ends 14 , the chassis has a first accommodating space 15 adjacent to the first end 13 , and a second accommodating space 16 is disposed adjacent to the second end 14 of the chassis. The first accommodating space 15 is used for accommodating the I/O module 3 and the power supply module 4, wherein the first accommodating space 15 is divided into a plurality of rear end areas with the same height and arranged side by side , each of the rear-end areas is used for accommodating at least one of the I/O modules 3 or at least one of the power supply modules 4 . In this embodiment, for example, as shown in Figure 5, the back-end area is divided into 6 areas, namely the back-end area A, the back-end area B, the back-end area C, the back-end area D, and the back-end area E , and the back-end area F. The second accommodating space 16 is used to accommodate the node module 5, wherein the second accommodating space 16 is also divided into a plurality of front-end areas, and at least one of the node modules is arranged in each of the front-end areas. Module 5. Referring to FIG. 4 , the second accommodating space 16 is divided into two front-end areas G and front-end area H, and the front-end area G and the front-end area H can respectively accommodate stacked two-node modules 5 .

And in actual application, the chassis 1 of the finished electronic device also includes an upper cover 17, the upper cover 17 is an integral structure, and is arranged on the top of the electronic device opposite to the bottom plate 12, or as in this embodiment In an example, the upper cover 17 includes two parts, that is, the front part of the upper cover covering the second accommodating space 16 and the rear part of the back plate 2, and the rear part of the upper cover covering the first accommodating space 15. , the two parts can be fixedly connected through the corresponding screw holes.

And, wherein, the back plate 2 is arranged between the first accommodating space 15 and the second accommodating space 16 perpendicular to the two side walls 11, referring to Fig. 6 (Fig. The structure diagram of the device after removing the upper cover), has a first plug-in part 21 facing the first accommodation space 15 and a second plug-in part 22 facing the second accommodation space 16, preferably, the The first plug-in part 21 and the second plug-in part 22 are, for example, a high-speed backplane connector, and can be, for example, a slot structure for matching with a golden finger and electrically connecting. The use of tools can also make the inside of the cabinet 1 more clean and tidy. The backplane 2 can connect the independent electrical modules (I/O module 3, power module 4, and node module 5) disposed in the first accommodating space 15 and accommodated in the second accommodating space 16. , which is equivalent to the role of a bridge, so that the electrical modules can cooperate with each other to achieve specific electrical functions.

The I/O module 3 has an I/O module assembly part, and is pluggably and electrically connected to the first plug-in part 21 of the backplane 2. The I/O module assembly part is preferably a gold The finger structure is electrically connected to the first plug-in portion 21 of the backplane of the slot structure. In another specific embodiment, the I/O module assembly part is also preferably a high-speed backplane connector.

The power module 4 has a power module assembly portion, and is pluggably and electrically connected to the first plug portion 21 of the backplane 2 for supplying power to the electronic device. In this embodiment, preferably the number of the power supply modules 4 is two, one of the two power supply modules 4 is a power supply module 4 that provides redundancy, and the two power supply modules 4 are stacked. in a said rear end region. The power supply module 4 preferably supplies power to other electrical components in the electronic device through the backplane, and more preferably, the power supply module 4 exchanges information with other electrical components through an I2C bus.

The power module assembly part is preferably a golden finger structure, which is electrically connected to the first plug-in part of the backplane of the slot structure.

In a specific embodiment of the present invention, the I/O module 3 preferably includes a node I/O module 31 and a shared I/O module 32 .

Wherein, each of the node I/O modules 31 is electrically connected to one of the node modules 5 through the backplane 2, and the structure of the node I/O modules 31 please refer to FIG. 7 , FIG. 8 , and FIG. 9 for details. , the node I/O module 31 includes:

The housing 311 includes two side walls 3111 and a bottom plate 3112 connecting the two side walls 3111, the housing 311 has a first end 3113 along the direction of the two side walls 3111, and is connected to the first end 3113 Opposite to a second end 3114, the housing 311 has a first accommodating space 3115 adjacent to the first end 3113, and the housing 311 is provided with a second accommodating space 3116 adjacent to the second end 3114; In an embodiment, the housing 311 further includes a top plate 3117 covering part of the first accommodation space 3115, the top plate 3117 mainly serves to protect the electronic components accommodated in the first accommodation space 3115, and in other In a specific embodiment, the size of the top plate 3117 can be shorter or longer, or the top plate 3117 can be omitted.

An adapter plate (not shown) is arranged in the housing 311 and fixed on the bottom plate 3112 parallel to the bottom plate 3112, including the main body of the adapter plate and the insertion part of the adapter plate. The main body of the board has a first slot and a second slot facing away from the bottom plate 3112, the adapter board inserting portion is adjacent to the second end 3114 of the housing 311 and exposed to the second end 3114, The adapter board is electrically connected to the first plug-in portion 21 of the backplane 2 through the adapter board insertion portion.

PCIE card 312, is arranged on described first accommodating space 3115, comprises PCIE card main body 3121 and PCIE interface 3122, and described PCIE interface is PCIEIO interface in specific application, and described PCIE card main body 3121 is parallel with described side wall 3111 And vertical to the bottom plate 3112, the PCIE card main body 3121 is plugged into the first slot of the adapter board through gold fingers, and the PCIE interface 3122 is located at the first end 3113 of the housing 311; In this embodiment, there are preferably three PCIE cards 312.

There are two fan units 313 disposed in the second accommodating space 3116 in this embodiment, and one of the two fan units 313 is the fan unit 313 that provides redundancy. The fan unit 313 includes a fan frame 3131 and a fan 3132, the fan 3132 is arranged in the fan frame 3131, the fan unit 313 is plugged into the second slot of the adapter board through a connector, the The connector is preferably a golden finger or a cable. The fan 3132 is a hot-swappable structure. And the modular design of the node I/O module 31, when the fan unit 313 needs to be replaced or repaired, the node I/O module 31 can be directly taken out from its accommodating space, and There is no need to disassemble the casing of the server chassis (most of the fans in the existing server chassis need to be opened for maintenance or replacement), and the operation is convenient and the maintenance efficiency is improved. The fan unit 313 can be fixed to the casing 311 by screws.

In another specific embodiment, the node I/O module can be a drawer-type structure, the two side walls can be omitted, and the fan unit 313 is directly fixed on the adapter board.

The shared I/O module 32 is selectively electrically connected to one of the node modules 5 through the backplane 2; preferably, the electronic device further includes a switching module, which is used to make the The shared I/O module 32 communicates with one of the node modules 5 . For example, the switching module is a switching button (such as a switching button controlled by a mouse or a keyboard), and the node module 5 communicating with the shared I/O module 32 can be switched by pressing the button. Or switch the node module 5 communicating with the shared I/O module 32 according to a remote network control signal. Please refer to Figure 10 and Figure 11 for the structure of the shared I/O module 32, including:

The housing 321 includes two side walls 3211 and a top plate 3212 and a bottom plate 3213 connecting the two side walls 3211. The housing 321 has a first end 3214 along the direction of the two side walls 3211, and is connected to the first end 3214. end 3214 opposite a second end 3215;

Two main modules (two shared I/O units) 322 are respectively arranged on the inner surfaces of the top plate 3212 and the bottom plate 3213 of the housing 321 and are surrounded by two side walls 3211 of the housing 321 to form a storage space That is, the thickness of one end of the main module 322 is smaller than the thickness of the other end. This design can form the accommodating space on the side with a smaller thickness to accommodate units such as fans, and can maximize the use of space. Each of the main modules 322 includes a first I/O interface 3221 connected to an external device and a second I/O interface 3222 electrically connected to one of the at least two node modules 5; the first I/O The interface 3221 includes, for example, a combination of one or more of a USB interface, a VGA interface, and a network interface, and the two main modules 322 are mutually redundant.

The fan unit 323 is accommodated in the accommodating space, and includes a fan frame 3231 and a fan 3232 , and the fan 3232 is disposed in the fan frame 3231 . The fan 3232 is a hot-swappable structure. And the modular design of the shared I/O module 32, when it is necessary to replace the fan unit 323 or maintain the fan unit 323, the shared I/O module 32 can be directly taken out from its accommodating space, and There is no need to disassemble the casing of the server chassis (most of the fans in the existing server chassis need to open the top cover when repairing or replacing them), which is convenient to operate and improves maintenance efficiency. While ensuring that the temperature of the chassis reaches the standard, the fan unit Easy loading and unloading, easy maintenance.

Moreover, the heat dissipation of the server chassis has a greater impact on ensuring its efficient operation. Here, in combination with the structural diagram of the backplane 2, Fig. 12 and Fig. 13, the backplane 2 is provided with vents, and the vents are connected to the The fan unit 313 of the node I/O module 31, the fan unit 323 of the shared I/O module 32, and the element to be dissipated correspond to each other, so that the vents are corresponding to the fan units 313 and 323 and the When the cooling elements cooperate, an air flow channel is formed. A plurality of evenly distributed first air vents 23 corresponding to the fan unit 313 of the node I/O module 31 and the fan unit of the shared I/O module 32 are opened laterally on the backplane 2 323 corresponds to the second vent 24, and the setting of the first vent 23 and the second vent 24 can make the air flow of the fan unit 313 and the fan unit 323 more flow to the node module 5 that needs heat dissipation unit (such as a processor and DDR), the socket on the backplane 2 is reasonably arranged on both sides of the first vent 23 and the second vent 24, that is, to ensure that the socket on the backplane 2 is reasonable When set, meet the heat dissipation requirements of the server chassis. The first ventilation opening 23 is preferably uniformly distributed strip holes as shown in the figure, and the second ventilation opening 24 is preferably a rectangular hole as shown in the figure.

In one embodiment of the present utility model, the height of the node I/O module 31, the shared I/O module 32, and the power supply module 4 are preferably the same as the height of the rear end area, and the length is also the same as the height of the The length of the back-end area is corresponding, so that more modules can be laid out in the limited space of the chassis, specifically, the node I/O module 31, the shared I/O module 32, and the power supply module 4 can accommodate respectively It is arranged in a corresponding back-end area, and the number of the node I/O modules 31 is an even number, and they are arranged symmetrically with respect to the shared I/O modules 32 in the corresponding back-end area. In order to accommodate all the node I/O modules 31 , shared I/O modules 32 and power supply modules 4 , the number of the back-end areas is preferably an even number greater than or equal to 4.

Specifically, for example, there are four node I/O modules 31, and one shared I/O module 32, and the node I/O module 31, shared I/O module 32, and power supply module 4 are in the The settings in the rear end area are from left to right, or from right to left: the power supply module 4, the two node I/O modules 31, the shared I/O module 32, the two The node I/O module 31 is described above. That is, with reference to Fig. 1, Fig. 2, and Fig. 3, the power supply module 4 is arranged in the rear end area F, and the power supply module 4 includes two power supply units, which are mutually redundant, and are stacked in the rear end In the area F, the shared I/O module 32 is disposed in the backend area C, and the node I/O modules 31 are respectively disposed in the backend areas A, B, D, and E. It includes four node modules 5 , each of which is stacked and arranged in the second accommodating space 16 .

The shared I/O module 32 is placed in the center, so that the distance between the signal of the node module 5 in the second storage space 16 of the electronic device and the shared I/O module 32 is basically the same, ensuring the symmetry of the signal transmission performance , and four node IO modules 31 are arranged on both sides of the shared I/O module 32, so that the signal of the node module 5 in the second accommodating space 16 of the electronic device reaches the corresponding node IO module 31 at the same distance, The symmetry of the performance of the signal transmission is guaranteed.

And in this embodiment, more preferably, the length of described power supply module 4, shared I/O module 32, node I/O module 31 is basically the same, and in terms of height, the height of power supply module 4 and shared I/O module 32 The height is basically half of the storage height of the first storage space 15, and the height of the node I/O module 31 is basically the same as the storage height of the first storage space 15, so that the first housing of the electronic device The space utilization rate in the accommodating space 15 is maximized, and the setting of the length and height can share the partition board of the front-end module as much as possible, so as to reduce the cost.

Referring to FIG. 2 again, the interface interface of the I/O module 3 and the interface interface of the power module 4 are both at the first end 13 . That is, the interface interface of the node I/O module 31, as shown in the figure, the PCIE interface of the PCIE card is at the first end 13, and the interface interface of the shared I/O module 32 includes a USB interface, a VGA interface, and a network interface. The interface is also at the first end 13 , and in another specific embodiment, the type of the interface of the shared I/O module 32 can also be set to other interfaces. More preferably, the shared I/O module 32 with different interface types is designed in advance, so that it can be replaced according to application requirements.

Referring to FIG. 6, the node module 5 has a node module assembly part, and is pluggably and electrically connected to the second plug part 22 of the backplane 2, and through the backplane 2 and the corresponding I/O Modules (node I/O modules 31 or shared I/O modules 32) communicate.

The node module 5 includes a main board 51 as shown in FIG. 6, the main board 51 includes a first electrical connection part (not shown in the figure) and a second electrical connection part (not shown in the figure), the The first electrical connection part can be electrically connected to the electrical modules (node I/O module 31 , shared I/O module 32 , and power module) in the first accommodation space 15 through the backplane 2 . The second electrical connection portion is electrically connected to a plurality of extended hard disks through a node backplane 57 of the node module 5 . The node module 5 also includes two processors (CPUs) arranged on the motherboard along the length direction of the node, which are respectively a first processor 52 and a second processor 53, and the first processor 52 and the The second processor 53 is electrically connected and arranged on the motherboard 51 to form a dual processor. The model of the first processor 52 and the second processor 53 is, for example, Skylake. Since the processor generates heat during operation It is very large, so heat sinks are arranged on the top of the first processor 52 and the second processor 53, and the first processor 52 is respectively provided with the first processor 52 and the first The storage module 54 that processor 52 is electrically connected is arranged on the mainboard. In the present embodiment, each storage module 54 is selected to include 6 DDRs (DoubleDataRate, double-rate synchronous dynamic random access memory), so the described The first processor is electrically connected to 12 DDRs. In another specific embodiment, each of the storage modules 54 can also be provided with a heat sink above it according to specific requirements, and the second processor 53 is arranged along the Both sides of the node module 5 in the width direction are respectively provided with storage modules 54 electrically connected to the second processor 23 and arranged on the main board 51. In this embodiment, each storage module 54 is selected to include There are 6 DDRs (Double Data Rate, double-rate synchronous dynamic random access memory), so the second processor 53 is electrically connected to 12 DDRs, and a heat sink is correspondingly arranged above each storage module 54 . The node module 5 is provided with a south bridge chip 55 and a BMC (not shown in the figure) (baseboard management controller, BaseboardManagementController) near the first electrical connection part on the main board 51. In this embodiment Among them, the first processor 52 directly communicates with the PCIE card of the corresponding node I/O module 31, and the number of PCIE cards of each node I/O module 31 is preferably three. And it is electrically connected with the shared I/O module 32 through the south bridge chip 55 and the BMC. The node module 5 also has a hard disk module. According to the specific configuration of the hard disk module, the second processor 53 is directly electrically connected to the hard disk module, or through the SAS hard disk expansion card 56 shown in FIG. 6 It is electrically connected with the hard disk module, and the model of the SAS hard disk expansion card 56 is SAS3008 of LSI Company in this embodiment. In a specific application, the hard disk module is composed of a plurality of hard disks 58 as shown in FIG. 6 . In this embodiment, the hard disk module includes six hard disks 58 . Preferably, the chassis 1 is provided with slide rails on the inner sides of the two side walls 11 of the second accommodating space 16, and the node module 5 is provided with slide grooves corresponding to the slide rails, so as to facilitate the The placement or removal of the node module 5 in the second accommodating space 16 .

In the utility model, the electrical connection relationship between the shared I/O module 32 and the node module 5 is as shown in Figure 14, the shared I/O module 32 is connected to the at least two node modules 5 through the switching module is configured to enable the shared I/O module 32 to communicate with one node module 5 of the at least two node modules 5 according to the switch signal when receiving the switch signal. Specifically:

In a specific embodiment, refer to FIG. 15 , which is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively include a network card interface, a USB interface, and a video interface. The first I/O interface 3221 includes a network card interface, a USB interface, and a video interface. The USB interface and the video interface are electrically connected to the node module 5 through the switching module, and are used to connect the USB interface and the video interface to a node module according to the switching signal when receiving the switching signal. 5 electrical connections. The node module 5 includes a south bridge chip and a baseboard management controller electrically connected to the south bridge chip, and each network card interface is connected to the south bridge chip 55 and the base board management controller of a corresponding node module 5 respectively. The controller (BMC) is electrically connected, the USB interface is electrically connected to the south bridge chip through the switching module, and the video interface interface is electrically connected to the baseboard management controller through the switching module. The model of the south bridge chip is, for example, Intel Lewisburg.

In another specific embodiment, refer to FIG. 16 , which is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively include a network card interface, a USB interface, a video interface, a 1G Ethernet switch, a 10G Ethernet switch, and a small pluggable optical module. The optical module is preferably a four-channel small pluggable optical module (QSFP); the network card interface is electrically connected to the 1G Ethernet switch, and the small pluggable optical module is electrically connected to the 10G Ethernet switch ; The first I/O interface 3221 includes a network card interface, a USB interface, a video interface, and an optical module interface. The node module 5 includes a south bridge chip 55 , a baseboard management controller electrically connected to the south bridge chip 55 , and a physical layer chip electrically connected to the baseboard management controller. The USB interface is electrically connected to the south bridge chip through the switching module, and the video interface is electrically connected to the baseboard management controller through the switching module. The number of physical layer chips corresponds to the number of shared I/O units; the 1G Ethernet switch of each shared I/O unit is electrically connected to a corresponding physical layer chip, The 10G Ethernet switches of the shared I/O unit are all electrically connected to the south bridge chip. The model of the south bridge chip 55 is, for example, Intel Lewisburg.

In another specific embodiment, refer to FIG. 17 , which is a schematic diagram showing the principle of circuit connection between a shared I/O module and a node module in an embodiment of the present invention. The two main modules 322 respectively include a network card interface, a USB interface, a video interface, a 1G Ethernet switch, a hard disk interface, and a hard disk expander. In a specific application, the hard disk interface is a hard disk expansion interface. The hard disk interface is preferably a MiniSAS interface, the network card interface is electrically connected to the 1G Ethernet switch, the hard disk interface is electrically connected to the hard disk expander, and the first I/O interface further includes a hard disk interface interface. The first I/O interface 3221 includes a network card interface, a USB interface, a video interface, and a hard disk interface. The node module 5 includes a south bridge chip 55, a baseboard management controller electrically connected to the south bridge chip 55, a physical layer chip, and a hard disk expansion card, and the USB interface communicates with the The south bridge chip 55 is electrically connected, and the video interface interface is electrically connected to the baseboard management controller through the switching module, and the number of the physical layer chips corresponds to the number of the shared I/O units; The 1G Ethernet switch of the shared I/O unit is electrically connected to a corresponding physical layer chip, and the hard disk expander of the shared I/O unit is electrically connected to the SAS hard disk expansion card 56. connect. The model of the south bridge chip 55 is, for example, Intel Lewisburg.

Referring to FIG. 6 again, the node module 5 includes the node backplane 57, and a hard disk 58 electrically connected to the second processor 53 through the node backplane 57. In this embodiment, each node module 5 includes six hard disks 58, which are stacked up and down (that is, in a 3*2 manner) and arranged in a cavity of the node module 5.

In one embodiment of the present utility model, referring to FIG. 4 , the second accommodating space 16 is divided into two front end areas that are bilaterally symmetrical and have the same shape, that is, the front end area G and the front end area H. The height of the node module 5 is half of the height of the second accommodation space 16, and the number of the node modules 5 is four. In the front-end area G and the front-end area H, two of the node modules are stacked up and down respectively. 5.

In a specific application, preferably, the two left-right symmetrical front end regions G and H are two cavities with the same shape, and two opposite support parts G1 and H1 are arranged inside each cavity along the direction of the side wall, wherein the The support parts G1 and H1 are located at half the height of the second accommodating space 16. In each of the front-end cavities G and H, two node modules 5 are stacked up and down, and one of them is placed on the On the bottom plate 11 , the other is placed on the support part G1 or H1 . More preferably, in another specific embodiment, the corresponding position of the bottom plate 11 and the support part G1 or H1 can be provided with a slide rail structure, and the node module 5 is preferably provided with a pulley structure, which can make the The node module 5 is slid into said front area G or H or withdrawn from said front area G or H. Or, preferably, the chassis 1 is provided with slide rails on the inner sides of the two side walls 11 of the second accommodating space 16, and the node module 5 and the hard disk module are provided with slide rails corresponding to the slide rails. chute.

In another specific embodiment, for example, as shown in FIG. 18 and FIG. 19 , two stacked node modules 5 in the electronic device are replaced with a storage module 6 to realize the function of a storage server.

And, preferably, the support unit 59 corresponding to each hard disk 58 is preferably as shown in Figure 20 and Figure 21, including:

The first supporting part 591 is a planar structure and has a first fixing part 5911;

The second support part 592 is a planar structure, is on the same plane as the first support part 591, and has a second fixing part 5921. The second support part 592 is preferably also provided with an LED light guide column 5922 in this embodiment, The installation position of the hard disk 58 can be found conveniently in a relatively dark state. Of course, in other embodiments, the LED light guide column 5922 can also be disposed on the first supporting portion 591 . And preferably, in this embodiment, a shock-absorbing material is provided around the first fixing part 5911 and the second fixing part 5921, so as to reduce the vibration frequency of the hard disk during the movement of the electronic device and protect the hard disk. safety.

The stop part 593 is connected to the first support part 591 and the second support part 592 to form a U-shaped space, and the stop part 593 and the first support part 591 and the second support The portion 592 is vertical; and preferably, the stopper portion 593 is integrated with the first support portion 591 and the second support portion 592 .

The hard disk 58 is placed on the first supporting portion 591 and the second supporting portion 592 , and is fixed to the first fixing portion 5911 and the second fixing portion 5921 by screwing or welding.

The supporting unit 59 abandons the traditional semi-enclosed method, and reduces the horizontal space after the hard disk 58 is installed in the second accommodating space 16, that is, enough hard disks can be installed in a limited space. More preferably, a plurality of heat dissipation holes may be provided on the first supporting portion 591 and the second supporting portion 592 , so as to support the hard disk 58 while increasing the power of heat dissipation.

And in this embodiment, as shown in Figures 20 and 21, a handle 594 is provided on the outside of the stopper 593, the handle 594 shown has a lock unit, and the lock unit shown in the lock unit passes through its inner The spring structure is locked in a position or unlocked from a position, so that the supporting unit 59 can be flexibly fixed in the corresponding position of the second accommodating space 16 , or can be flexibly moved from the corresponding position of the second accommodating space 16 . position unplugged.

To sum up, the electronic device of the present invention arranges the backplane, I/O module, power supply module, node module and other modules in the chassis reasonably and neatly, so that in the limited space of the chassis, more modules with high utilization rate and low cost; and the I/O module, power module, and node module are all independently designed, and at the same time, the modules work together; each module is a snap-in structure, which can be disassembled by hand, improving operation Maintenance efficiency; and the signal transmission between modules is basically completed by golden fingers or high-speed backplane connectors, making the inside of the chassis clean and tidy. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has high industrial application value.

The above-mentioned embodiments only illustrate the principles and effects of the present utility model, but are not intended to limit the present utility model. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the utility model should still be covered by the claims of the utility model.

Claims (16)

1. An electronic device, characterized in that, comprising: A case, including two side walls and a bottom plate connecting the two side walls, the case has a first end along the direction of the two side walls, and a second end opposite to the first end, the case There is a first accommodating space adjacent to the first end, and the chassis has a second accommodating space adjacent to the second end; A back plate, perpendicular to the two side walls, is arranged between the first accommodating space and the second accommodating space, and has a first plug-in portion facing the first accommodating space and a first plugging portion facing the first accommodating space. the second plug-in part of the second accommodation space; The I/O module is accommodated in the first accommodating space, has an I/O module assembly part, and is pluggably and electrically connected to the first plug-in part of the backplane; The power module is accommodated in the first accommodating space, has a power module assembly part, and is pluggably and electrically connected to the first plug part of the backplane to supply power for the electronic device ; The node module is arranged in the second accommodating space, has a node module assembly part, and is pluggably and electrically connected to the second plug-in part of the backplane, and is connected to the corresponding I/O part through the backplane. O module communication; The second accommodating space is divided into a plurality of front-end areas, each of the front-end areas is provided with at least one node module, and the first accommodating space is divided into a plurality of rear-ends with the same height and arranged side by side. Each of the rear-end areas is used to accommodate at least one of the I/O modules or at least one of the power modules. 2 . The electronic device according to claim 1 , wherein the second accommodating space is divided into two front end regions which are bilaterally symmetrical and have the same shape. 3 . 3. The electronic device according to claim 2, wherein the height of the node module is half of the height of the second accommodating space, there are four node modules, and each of the front-end cavities Set two of the node modules one above the other in a cascade. 4. The electronic device according to claim 3, wherein the two symmetrical front regions are two cavities with the same shape, and two opposite supporting parts are arranged inside each cavity along the direction of the side wall, Wherein, the support part is at half the height of the second accommodating space, and two node modules are stacked up and down in each front cavity, and one of them is placed on the bottom plate, and the other placed on the support. 5. The electronic device according to claim 1, wherein the I/O module comprises a node I/O module and a shared I/O module. 6. The electronic device according to claim 5, wherein the shared I/O module comprises two shared I/O units, and one of the two shared I/O units provides redundancy shared I/O unit. 7 . The electronic device according to claim 6 , wherein two shared I/O units of the shared I/O module are stacked and arranged in one of the rear-end regions. 8 . 8. The electronic device according to claim 7, wherein the number of the back-end regions is an even number greater than or equal to 4. 9. The electronic device according to claim 8, wherein the height of the node I/O module, the shared I/O module, and the power module is the same as the height of the rear area, each The node I/O modules are accommodated in a corresponding back-end area, and the number of the node I/O modules is an even number, and the shared I/O modules are symmetrically arranged in the corresponding back-end area in the end area. 10. The electronic device according to claim 9, wherein there are four node I/O modules, one shared I/O module, and the node I/O module, shared I/O module Modules and power modules are arranged in the rear area from left to right, or from right to left: power module, two node I/O modules, and shared I/O module , two said node I/O modules. 11. The electronic device according to claim 1, wherein the interface of the I/O module and the interface of the power module are both at the first end. 12. The electronic device according to claim 1, characterized in that: the first plug-in part and the second plug-in part of the backplane are an electrical connection between a slot and a golden finger or a backplane Connector. 13. The electronic device according to claim 5, wherein each node I/O module is electrically connected to a corresponding node module through the backplane, and the shared I/O module is connected through the The backplane is electrically connected to all the node modules respectively. 14. The electronic device according to claim 13, characterized in that: the electronic device further comprises a switching module, which is used to make a shared I/O unit in the shared I/O module and a shared I/O unit according to a switching signal One of the node modules communicates. 15. The electronic device according to claim 1, wherein the power supply module includes two power supply units, the number of the power supply units is two, and one of the two power supply units provides redundancy power supply unit. 16 . The electronic device according to claim 15 , wherein the power supply units in the power supply module are stacked and arranged in a rear end area. 17 .