CN105717991A - Electronic device - Google Patents
Electronic device Download PDFInfo
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- CN105717991A CN105717991A CN201610051640.4A CN201610051640A CN105717991A CN 105717991 A CN105717991 A CN 105717991A CN 201610051640 A CN201610051640 A CN 201610051640A CN 105717991 A CN105717991 A CN 105717991A
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- module
- node
- space
- electronic installation
- shared
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi Processors (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides an electronic device. Through reasonable and tidy layout of a backboard, an I/O module, a power supply module, a node module, etc. in a machine cabinet, more modules can be laid out in limited space in the machine cabinet. The utilization rate is high and the cost is low. The I/O module, the power supply module and the node module are independently designed and work cooperatively. The modules are of clamped structures, and can be dismounted by hands, so that operation maintenance efficiency can be raised. Signal transmission between the modules is dependent on golden fingers or high-speed backboard connectors, so that the internal portion of the machine cabinet is clean and tidy.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of electronic installation with high-performance, high integration.
Background technology
Development along with the communications industry, structural design to communication equipment, particularly equipment high density, high performance design also have higher requirement, existing communication equipment is in order to realize more function, in its cabinet, often it is provided with very many electronic modules, so the more module of layout reasonable and clean and tidy in limited space, to improve the cost performance of product and to bring user and better experience, a direction of communication equipment development will be become.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of electronic installation, the problem that the setting for solving in prior art the element within electronic installation is not well positioned to meet high density, high performance feature.
For achieving the above object and other relevant purposes, the present invention provides a kind of electronic installation, including: a cabinet, including two sidewalls and the base plate connecting described two sidewalls, this cabinet has one first end along the direction of described two sidewalls, and one of relative with described first end the second end, this cabinet closes on described first end to be had one first and is installed with space, and this cabinet closes on described second end and arranges one second and be installed with space；One backboard, vertically being arranged at of described two sidewalls described first is installed with space and described second and is installed with between space, has towards the described first the first plug portion being installed with space and towards the described second the second plug portion being installed with space；I/O (input and output) module, is located in described first and is installed with space, has an I/O module department of assembly pluggable the first plug portion being electrically connected at described backboard；Power module, is located in described first and is installed with space, has a power module department of assembly pluggable the first plug portion being electrically connected at described backboard, in order to supply the power node module of described electronic installation；Node module, is arranged at described second and is installed with space, has node module department of assembly pluggable the second plug portion being electrically connected at described backboard, and is communicated with corresponding I/O module by described backboard；Described second is installed with space is separated into multiple front end area, each described front end area arranges at least one described node module, described first is installed with space is separated into the back-end region that multiple height is identical and is arranged side by side, and each described back-end region is used for being installed with at least one described I/O module or at least one described power module.
In one embodiment of the present invention, described second is installed with space is divided into symmetrical and that shape is identical two front end area.
In one embodiment of the present invention, the height of described node module is the half of the described second height being installed with space, and described node module is 4, and in the cavity of each described front end, stacked on top of one another arranges two described node modules.
In one embodiment of the present invention, described symmetrical two front end area are the cavity that two shapes are identical, each inside cavities arranges two relative support portions along described sidewall direction, wherein, described support portion is in the described second position being installed with space one half height, in the cavity of each described front end stacked on top of one another two described node modules are set, and one of them is positioned on described base plate, and another is positioned on described support portion.
In one embodiment of the present invention, described I/O module includes node I/O module and shared I/O module.
In one embodiment of the present invention, described shared I/O module includes two shared I/O unit, and described two share the one of which of I/O unit for providing the shared I/O unit of redundancy redundant.
In one embodiment of the present invention, being arranged in back-end region described in of the shared I/O unit stacking of the two of described shared I/O module.
In one embodiment of the present invention, the number of described back-end region is the even number more than or equal to 4.
In one embodiment of the present invention, the height of described node I/O module is identical with the height of described back-end region, each described node I/O module is located in a corresponding back-end region, and the number of described node I/O module is even number, it is arranged in corresponding back-end region about described shared I/O module is symmetrical.
In one embodiment of the present invention, described node I/O module is four, described shared I/O module is 1, described node I/O module, share in I/O module and power module end regions in the rear be set to from left to right or dextrosinistral be followed successively by: power module, two described node I/O modules, described shared I/O module, two described node I/O modules.
In one embodiment of the present invention, the connection interface of described I/O module and the connection interface of described power module are in described first end.
In one embodiment of the present invention, the first plug portion of described backboard and the second plug portion are the electric connection of a slot and golden finger coupling or are a back panel connector.
In one embodiment of the present invention, each described node I/O module is by described backboard and corresponding described node module electrical connection, and described shared I/O module is by described backboard, electrically connects with all of described node module respectively.
In one embodiment of the present invention, described electronic installation also includes a handover module, for according to a switching signal, making in described shared I/O module one to share I/O unit and communicate with in described node module.
In one embodiment of the present invention, described power module includes two power subsystems, and the quantity of described power subsystem is two, and the one of which of described two power subsystems is for providing the power subsystem of redundancy redundant.
In one embodiment of the present invention, being arranged in back-end region described in of the described power subsystem stacking in described power module.
As it has been described above, the electronic installation of the present invention, by by layout rationally clean and tidy in the chassis for the modules such as backboard, I/O module, power module, node module, so that in limited chassis space, it is possible to the more module of layout, utilization rate is high and cost is low；And I/O module, power module and node module are all independent design, collaborative work again between each module simultaneously；Each module is snap-in structure, can Manual-disassembling, improve O&M efficiency；And the transmission of each intermodule signal relies on golden finger or High speed rear panel adapter to complete substantially, make cabinet inside neat and tidy.
Accompanying drawing explanation
Fig. 1 is shown as in a specific embodiment of the present invention structural representation of electronic installation.
Fig. 2 is shown as the rearview of Fig. 1.
Fig. 3 is shown as the front view of Fig. 1.
Fig. 4 is shown as the overall structure schematic diagram of a cabinet in a specific embodiment of the present invention.
Fig. 5 is shown as the structural representation of the first end side of cabinet shown in Fig. 4.
Fig. 6 is shown as in a specific embodiment of the present invention structural representation of electronic installation.
Fig. 7 is shown as the structural representation of a specific embodiment interior joint I/O module of the present invention.
What Fig. 8 was shown as the node I/O module shown in Fig. 7 disassembles schematic diagram.
Fig. 9 is shown as the rearview of the node I/O module shown in Fig. 7
Figure 10 be shown as in a specific embodiment of the present invention share I/O module structural representation.
Figure 11 is shown as the disassembly diagram of the shared I/O module shown in Figure 10.
Figure 12 is shown as the structural representation of a specific embodiment dorsulum of the present invention.
Figure 13 is shown as the disassembly diagram of the backboard shown in Figure 12.
Figure 14 is shown as in one embodiment of the invention to share the module diagram that I/O module is connected with the circuit of a node module.
Figure 15 is shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.
Figure 16 is shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.
Figure 17 is shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.
Figure 18 is shown as in a specific embodiment of the present invention structural representation of electronic installation.
Figure 19 is shown as in a specific embodiment of the present invention structural representation of electronic installation.
Figure 20 is shown as in a specific embodiment of the present invention structural representation of hard disk support portion.
Figure 21 is shown as the structural representation of application assembling hard disk in hard disk support portion shown in Figure 20.
Element numbers explanation
1 cabinet
11 sidewalls
12 base plates
13 first ends
14 second ends
15 first are installed with space
A, B, C, D, E, F back-end region
16 second are installed with space
G, H front end area
G1, H1 support portion
17 upper covers
2 backboards
21 first plug portions
22 second plug portions
23 first vents
24 second vents
3I/O module
31 node I/O modules
311 housings
3111 sidewalls
3112 base plates
3113 first ends
3114 second ends
3115 first are installed with space
3116 second are installed with space
3117 top boards
312PCIE card
3121PCIE card main body
3122PCIE interface
313 fan units
3131 fan frames
3132 fans
32 share I/O module
321 housings
3211 sidewalls
3212 top boards
3213 base plates
3214 first ends
3215 second ends
322 main modules
3221 the oneth I/O interfaces
3222 the 2nd I/O interfaces
323 fan units
3231 fan frames
3232 fans
4 power modules
5 node modules
51 mainboards
52 first processors
53 second processors
54 storage modules
55 South Bridge chips
56SAS hard disk expansion card
57 node backboards
58 hard disks
59 support units
591 first support portions
5911 first fixed parts
592 second support portions
5921 second fixed parts
5922LED light-guiding pillar
593 stopper sections
594 Handheld Divisions
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention being described below, those skilled in the art the content disclosed by this specification can understand other advantages and effect of the present invention easily.
Refer to Fig. 1 to Figure 20.Notice, the structure of this specification institute accompanying drawings depicted, ratio, size etc., all only in order to coordinate the disclosed content of description, understand for those skilled in the art and read, it is not limited to the enforceable qualifications of the present invention, therefore do not have technical essential meaning, the adjustment of the modification of any structure, the change of proportionate relationship or size, under not affecting effect that the present invention can be generated by and the purpose that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification cited as " on ", D score, "left", "right", " centre " and " one " etc. term, it is merely convenient to understanding of narration, and it is not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, changing under technology contents without essence, when being also considered as the enforceable category of the present invention.
The described electronic installation of the present invention is in actual applications, it it is such as an OTT (OverTheTop) high density server, it preferably employs 2U cabinet, " U " of server is a kind of unit representing server external dimensions, being the abbreviation of unit, detailed dimensions is determined by the EIA (EIA) as industry group.Why want the size of predetermined server, be to make server keep suitable size to be placed in irony or aluminum matter frame.Frame has the screw of fixed server, by its screw with server to good, is fixed with screw.The size of regulation is the width (48.26cm=19 inch) of server and high (multiple of 4.445cm).Due to wide be 19 inches, so sometimes also the frame meeting this regulation being called " 19 inch rack ".Thickness is with 4.445cm for ultimate unit.1U is exactly 4.445cm, 2U be then 2 times of 1U for 8.89cm (and so on).That is so-called " server of 1U ", it is simply that profile meets EIA specification, thickness is the product of 4.445cm.The product being designed to be placed into 19 inches of racks is commonly referred to as rack server.In certain practical application, the size of the electronic installation of the present invention is not limited thereto, and the electronic installation of other dimensions is equally applicable to technical scheme.
Refer to Fig. 1, be shown as the electronic installation of present invention structural representation in one embodiment.Described electronic installation includes cabinet 1, backboard 2, at least one I/O (input and output) module 3, at least one power module 4 and at least one node module 5.Fig. 2 is the rearview of electronic installation shown in Fig. 1, and Fig. 3 is the front view of electronic installation shown in Fig. 1.
In conjunction with Fig. 4, it is shown as the cabinet of present invention structural representation in one embodiment, described cabinet 1 includes two sidewalls 11 and connects a base plate 12 of described two sidewalls 11, described two sidewalls 11 and described base plate 12 can be fixedly connected by screw or buckle, it is alternatively integrative-structure, this cabinet 1 has one first end 13 along the direction of described two sidewalls 11, and one of relative with described first end the second end 14, this cabinet closes on described first end 13 to be had one first and is installed with space 15, and this cabinet closes on described second end 14 and arranges one second and be installed with space 16.Described first is installed with space 15 for being installed with described I/O module 3 and described power module 4, wherein, described first is installed with space 15 is separated into the back-end region that multiple height is identical and is arranged side by side, and each described back-end region is used for being installed with at least one described I/O module 3 or at least one described power module 4.In the present embodiment, for instance combining such as Fig. 5, described back-end region is separated into 6 regions, respectively back-end region A, back-end region B, back-end region C, back-end region D, back-end region E and back-end region F.Described second is installed with space 16 for being installed with described node module 5, and wherein, described second is installed with space 16 is also separated into multiple front end area, arranges at least one described node module 5 in each described front end area.And in conjunction with Fig. 4, described second be installed with space 16 be separated into two front end area G and front end area H, described front end area G and front end area H all can hold respectively stacking arrange two node modules 5.
And time in actual applications, the cabinet 1 of the described electronic installation of finished product also includes a upper cover 17, described upper cover 17 is structure as a whole, the top that be arranged at electronic installation relative with described base plate 12, or in the present embodiment, described upper cover 17 includes two parts, the upper cover namely covering the described second rear portion being installed with space 16 and backboard 2 is anterior, and covering the described first upper postoperculum being installed with space 15, two parts can pass through the fixing connection of corresponding screw hole.
And, wherein, being arranged at of described backboard 2 vertically described two sidewalls 11 described first is installed with space 15 and described second and is installed with between space 16, in conjunction with Fig. 6 (Fig. 6 is the structural representation after the electronic installation of Fig. 1 removes upper cover), have towards the described first the first plug portion 21 being installed with space 15 and towards the described second the second plug portion 22 being installed with space 16, preferably, described first plug portion 21 and the second plug portion 22 are such as a High speed rear panel adapter, or can be such as an inserting slot construction, for mating with a golden finger and being electrically connected, such design, the use of instrument can be exempted, also more neat and tidy can be made in cabinet 1.Described backboard 2 can be installed with space 15 by being arranged at first and be located in the second independent electric module being installed with in space 16 (I/O module 3, power module 4 and node module 5) and be connected, be equivalent to a bridge beam action, make can cooperate between each electric module, to realize specific electrical functionality.
Described I/O module 3 has an I/O module department of assembly pluggable the first plug portion 21 being electrically connected at described backboard 2, and described I/O module department of assembly is preferably a golden finger structure, electrically connects with the first plug portion 21 of the described backboard of inserting slot construction.Described I/O module department of assembly is preferably also a High speed rear panel adapter in another specific embodiment.
Described power module 4 has a power module department of assembly pluggable the first plug portion 21 being electrically connected at described backboard 2, in order to supply the electric power of described electronic installation.In the present embodiment, it is preferable that the quantity of described power module 4 is two, the one of which of described two power modules 4 is provide the power module 4 of redundancy redundant, and being arranged in back-end region described in of said two power module 4 stacking.Described power module 4 is that other electrical components in described electronic installation provides electric power preferably by described backboard, and it is furthermore preferred that described power module 4 to carry out information by I2C bus and other electrical components mutual.
Described power module department of assembly is preferably a golden finger structure, electrically connects with the first plug portion of the described backboard of inserting slot construction.
In one specific embodiment of the present invention, described I/O module 3 preferably includes node I/O module 31 and shared I/O module 32.
Wherein, each described node I/O module 31 is electrically connected with node module described in one 5 by described backboard 2, and the structure of described node I/O module 31 is please referring particularly to Fig. 7, Fig. 8 and Fig. 9, and described node I/O module 31 includes:
Housing 311, including two sidewalls 3111 and the base plate 3112 connecting described two sidewalls 3111, this housing 311 has one first end 3113 along the direction of described two sidewalls 3111, and one of relative with described first end 3,113 second end 3114, this housing 311 closes on described first end 3113 to be had one first and is installed with space 3115, and this housing 311 closes on described second end 3114 and arranges one second and be installed with space 3116；In the present embodiment; described housing 311 also includes covering part described first and is installed with the top board 3117 in space 3115; described top board 3117 primarily serves protection first and is installed with in space 3115 effect of the electronic component being installed with; in other specific embodiments; the size of described top board 3117 can be shorter or longer, or can omit described top board 3117.
Keyset (not shown), it is arranged in described housing 311, parallel with described base plate 3112 is fixed on described base plate 3112, including keyset main body and keyset Plug Division, described keyset main body faces away from the direction of described base plate 3112 and has the first slot and the second slot, described keyset Plug Division is closed on the second end 3114 of described housing 311 and exposes to described second end 3114, and described keyset is electrically connected with the first plug portion 21 of described backboard 2 by described keyset Plug Division.
PCIe card 312, it is arranged at described first and is installed with space 3115, including PCIe card main body 3121 and PCIE interface 3122, described PCIE interface is PCIEIO interface in concrete application, the setting that described PCIe card main body 3121 is parallel with described sidewall 3111 and vertical with described base plate 3112, described PCIe card main body 3121 is plugged in the first slot of described keyset by golden finger, and described PCIE interface 3122 is positioned at the first end 3113 of described housing 311；In the present embodiment, described PCIe card 312 is preferably 3.
Fan unit 313, is arranged at described second and is installed with space 3116, in the present embodiment, has two, and the one of which of described two fan units 313 is for providing the fan unit 313 of redundancy redundant.Described fan unit 313 includes fan frame 3131 and fan 3132, described fan 3132 is arranged in described fan frame 3131, described fan unit 313 is plugged in the second slot of described keyset by adapter, and described adapter is preferably a golden finger or a cable.Described fan 3132 is hot-plug construction.And the modularized design of described node I/O module 31, when needs are changed described fan unit 313 or keep in repair described fan unit 313, directly node I/O module 31 is taken out from its accommodation space, without dismounting machine box for server housing (in existing machine box for server fan maintenance or change time, major part is required for opening top cover), easy to operate and raising maintenance efficiency.Described fan unit 313 can be screwed in described housing 311.
In another specific embodiment, described node I/O module can be the structure of drawer type, can omit described two sidewalls, and described fan unit 313 is directly fixed on described keyset.
Described shared I/O module 32 passes through described backboard 2 optionally to electrically connect with node module described in one 5；Preferably, described electronic installation also includes a handover module, for according to a switching signal, making described shared I/O module 32 communicate with in described node module 5.Such as described handover module is a switching push button (switching push button of such as mouse or Keyboard Control), by the pressing to button, with the node module 5 that switching communicates with described shared I/O module 32.Or according to a long-range network control signal, with the node module 5 that switching communicates with described shared I/O module 32.The structure of described shared I/O module 32 please referring particularly to Figure 10 and Figure 11, including:
Housing 321, including two sidewalls 3211 and the top board 3212 and the base plate 3213 that connect described two sidewalls 3211, this housing 321 has one first end 3214 along the direction of described two sidewalls 3211, and one of relative with described first end 3,214 second end 3215；
Two main modules (two share I/O unit) 322, it is respectively arranged at the top board 3212 of described housing 321 and the medial surface of base plate 3213 and two sidewalls 3211 with described housing 321 enclose and are set as one and are installed with space, namely the thickness of one end of main module 322 is less than the thickness of the other end, this design is installed with space described in can being formed in the side that thickness is less, in order to hold the unit such as fan, it is possible to maximized utilize space.Respectively this main module 322 includes the I/O interface 3221 that is connected with external equipment and the 2nd I/O interface 3222 electrically connected with one of in described at least two node module 5；A described I/O interface 3221 such as includes one or more the combination in USB interface interface, USB interface interface and network interface interface, and described two main modules 322 are the design being mutually redundant.
Fan unit 323, is installed with space described in being located in, including fan frame 3231 and fan 3232, described fan 3232 is arranged in described fan frame 3231.Described fan 3232 is hot-plug construction.And the modularized design of described shared I/O module 32, when needs are changed described fan unit 323 or keep in repair described fan unit 323, directly shared I/O module 32 is taken out from its accommodation space, without dismounting machine box for server housing (in existing machine box for server fan maintenance or change time, major part is required for opening top cover), easy to operate and raising maintenance efficiency, while ensureing that housing temperature is up to standard, also make fan unit easy to loading and unloading, it is easy to safeguard.
And, the heat radiation of machine box for server is for ensureing that its Effec-tive Function has large effect, at this in conjunction with backboard 2 structural representation, Figure 12 and Figure 13, described backboard 2 is provided with vent, described vent and the fan unit 313 of described node I/O module 31, described shared I/O module 32 fan unit 323 and described in treat that heat dissipation element is corresponding, with make described vent and described fan unit 313 and 323 and described in treat that heat dissipation element matches, form an airflow channel.The first vent 23 that the fan unit 313 offering multiple equally distributed and described node I/O module 31 horizontal on described backboard 2 is corresponding, and second vent 24 corresponding with the fan unit 323 of described shared I/O module 32, and the setting of described first vent 23 and the second vent 24, distinguished and admirable more the flowing to that can make fan unit 313 and fan unit 323 needs the unit (such as processor and DDR) of heat radiation on described node module 5, interface on described backboard 2 is reasonably arranged at the both sides of described first vent 23 and the second vent 24, namely when the interface ensured on backboard 2 is rationally arranged, meet the radiating requirements of machine box for server.Described first vent 23 is preferably equally distributed bar hole as depicted, and described second vent 24 is preferably rectangular opening as depicted.
In one embodiment of the present invention, described node I/O module 31, share I/O module 32, and the height of power module 4 is all preferably identical with the height of described back-end region, and length is also all corresponding with the length of described back-end region, so that in limited chassis space, can the more module of layout, it is specially, described node I/O module 31, share I/O module 32, and power module 4, it is located in a corresponding back-end region respectively, and the number of described node I/O module 31 is even number, it is arranged in corresponding back-end region about described shared I/O module 32 is symmetrical.In order to hold all described node I/O modules 31, share I/O module 32, power module 4, the number of described back-end region is preferably greater than or equal to the even number of 4.
It is such as specifically, described node I/O module 31 is four, described shared I/O module 32 is 1, described node I/O module 31, share in I/O module 32 and power module 4 end regions in the rear be set to from left to right or dextrosinistral be followed successively by: the described node I/O module 31 of power module 4, two, 32, two described node I/O modules 31 of described shared I/O module.Namely in conjunction with Fig. 1, Fig. 2 and Fig. 3, described power module 4 is arranged in back-end region F, described power module 4 includes two power subsystems, and be mutually redundant, stacking be arranged in described back-end region F, described shared I/O module 32 is arranged in described back-end region C, and described node I/O module 31 is respectively arranged in back-end region A, B, D and E.Including four described node modules 5, being arranged at of each two stacking described second is installed with space 16 respectively.
Share putting between two parties of I/O module 32, the distance that the signal making the node module 5 that the second of electronic installation is installed with in space 16 arrives described shared I/O module 32 is essentially identical, ensure the symmetry of the performance of signal transmission, and four node I/O module 31 are arranged in the both sides of described shared I/O module 32, the distance that the signal making the node module 5 that the second of electronic installation is installed with in space 16 arrives corresponding node I/O module 31 is equal, it is ensured that the symmetry of the performance of signal transmission.
And in the present embodiment, preferred, described power module 4, share I/O module 32, the same length of node I/O module 31, and height aspect, the height of power module 4 and shared I/O module 32 essentially first is installed with the half being installed with height in space 15, and the height of node I/O module 31 is basic with described first to be installed with being installed with of space 15 highly identical, the first space availability ratio being installed with in space 15 making the cabinet of described electronic installation reaches maximum, and the setting of this length and height, the compatible front-end module dividing plate of maximum possible, reduce effect of cost.
Shown in Fig. 2, the connection interface of described I/O module 3 and the connection interface of described power module 4 are in described first end 13.The i.e. connection interface of described node I/O module 31, PCIE interface if figure is PCIe card be in as described in the first end 13, and the connection interface of described shared I/O module 32 includes USB interface, USB interface and network interface, it is also at described first end 13, and in another specific embodiment, the kind of the interface of described shared I/O module 32 may be arranged as other interfaces.It is furthermore preferred that designed in advance has the shared I/O module 32 of different interface type collocation, it is possible to make, according to application needs, to be replaced.
Consulting Fig. 6, described node module 5 has node module department of assembly pluggable the second plug portion 22 being electrically connected at described backboard 2, and is communicated with corresponding I/O module (node I/O module 31 or shared I/O module 32) by described backboard 2.
Described node module 5 includes mainboard 51 as shown in Figure 6, described mainboard 51 includes the first electrical junction (not shown) and the second electrical junction (not shown), and described first electrical junction can be electrically connected by the electrical module (node I/O module 31, shared I/O module 32 and power module) that described backboard 2 is installed with in space 15 with described first.Described second electrical junction is electrically connected with multiple expanding hard disks by a node backboard 57 of described node module 5.Described node module 5 also includes the two processor (CPU) being arranged at described mainboard along described node ' s length direction, respectively first processor 52 and the second processor 53, described first processor 52 and described second processor 53 electrically connect, it is arranged on described mainboard 51, composition dual processor, the model of described first processor 52 and the second processor 53 is such as Skylake, owing to processor is in running, caloric value is very big, so arranging fin at the top of described first processor 52 and the second processor 53, described first processor 52 is respectively arranged with, along the both sides of described node module 5 width, the storage module 54 electrically connected with described first processor 52, it is arranged on described mainboard, in the present embodiment, each storage module 54 is selected to include 6 DDR (DoubleDataRate, Double Data Rate synchronous DRAM), so described first processor and 12 DDR electrical connections, in another specific embodiment, each described storage module 54 also can be correspondingly arranged a fin above it according to real needs, described second processor 53 is respectively arranged with, along the both sides of described node module 5 width, the storage module 54 electrically connected with described second processor 23, it is arranged on described mainboard 51, in the present embodiment, each storage module 54 is selected to include 6 DDR (DoubleDataRate, Double Data Rate synchronous DRAM), so described second processor 53 electrically connects with 12 DDR, the top of each storage module 54 is correspondingly arranged a fin.Described node module 5 is provided with South Bridge chip 55 and a BMC (not shown) (baseboard management controller near described first electrical junction place on described mainboard 51, BaseboardManagementController), in the present embodiment, the described direct PCIe card communication with corresponding node I/O module 31 of first processor 52, the number of the PCIe card of each described node I/O module 31 is preferably 3.And electrically connected with described shared I/O module 32 by described South Bridge chip 55 and described BMC.Described node module 5 also has hard disc module, concrete configuration situation according to described hard disc module, described second processor 53 electrically connects with direct and described hard disc module, or being electrically connected with described hard disc module by the SAS hard disk expansion card 56 shown in Fig. 6, the model of SAS hard disk expansion card 56 is the SAS3008 of Infineon Technologies Corp. in the present embodiment.Described hard disc module is made up of multiple hard disks 58 as shown in Figure 6 in concrete application, and in the present embodiment, described hard disc module includes six described hard disks 58.Preferably, described cabinet 1 is positioned at the inner side of the described second two sidewalls 11 being installed with space 16 and is provided with slide rail, described node module 5 is provided with the chute corresponding with described slide rail, with facilitate described node module 5 in the described second placement being installed with in space 16 or extraction.
In the present invention, electrical connection between described shared I/O module 32 and node module 5 is as shown in figure 14, share I/O module 32 and connect described at least two node module 5 by described handover module, according to described switching signal during for receiving switching signal, make that described shared I/O module 32 is logical to communicate with a node module 5 in described at least two node module 5.Particularly as follows:
In one embodiment, consult Figure 15, be shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.Described two main modules 322 include network card interface, USB interface and video interface respectively.A described I/O interface 3221 includes network card interface interface, USB interface interface and video interface interface.Described USB interface and described video interface are electrically connected with described node module 5 by described handover module, according to described switching signal when being used for receiving switching signal, make described USB interface and described video interface and a node module 5 electrically connect.Described node module 5 includes a South Bridge chip and a baseboard management controller electrically connected with described South Bridge chip, the described South Bridge chip 55 of each described network card interface node module 5 corresponding with respectively and baseboard management controller (BMC) electrical connection, described USB interface is electrically connected with described South Bridge chip by described handover module, and described video interface interface is electrically connected with described baseboard management controller by described handover module.The model of described South Bridge chip is such as IntelLewisburg.
In another specific embodiment, consult Figure 16, be shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.Described two main modules 322 include network card interface, USB interface, video interface, 1G Ethernet switch, 10G Ethernet switch and SFP optical module respectively.Described optical module is preferably the SFP optical module (QSFP) of four-way；Described network card interface and described 1G Ethernet exchanging mechatronics, described SFP optical module and described 10G Ethernet exchanging mechatronics；A described I/O interface 3221 includes network card interface interface, USB interface interface, video interface interface and optical module connection interface.Described node module 5 includes the baseboard management controller that a South Bridge chip 55, electrically connects and the physical chip electrically connected with described baseboard management controller with described South Bridge chip 55.Described USB interface is electrically connected with described South Bridge chip by described handover module, and described video interface interface is electrically connected with described baseboard management controller by described handover module.The number of described physical chip is corresponding with the number of described shared I/O unit；The described 1G Ethernet switch of each described shared I/O unit and corresponding described physical chip electrical connection, the described 10G Ethernet switch of described shared I/O unit all electrically connects with described South Bridge chip.The model of described South Bridge chip 55 is such as IntelLewisburg.
In another specific embodiment, consult Figure 17, be shown as in one embodiment of the invention sharing the circuit catenation principle schematic diagram of I/O module and a node module.Described two main modules 322 include network card interface, USB interface, video interface, 1G Ethernet switch, hard-disk interface and hard disk expander respectively.In concrete application, described hard-disk interface is a hard disk expansion interface.Described hard-disk interface is preferably MiniSAS interface, described network card interface and described 1G Ethernet exchanging mechatronics, and described hard-disk interface electrically connects with described hard disk expander, and a described I/O interface also includes hard disk interface.A described I/O interface 3221 includes network card interface interface, USB interface interface, video interface interface and hard disk interface.Described node module 5 includes baseboard management controller, physical chip and the hard disk expansion card that a South Bridge chip 55, electrically connects with described South Bridge chip 55, described USB interface is electrically connected with described South Bridge chip 55 by described handover module, described video interface interface is electrically connected with described baseboard management controller by described handover module, and the number of described physical chip is corresponding with the number of described shared I/O unit；The described 1G Ethernet switch of each described shared I/O unit and corresponding described physical chip electrical connection, the described hard disk expander of described shared I/O unit all electrically connects with described SAS hard disk expansion card 56.The model of described South Bridge chip 55 is such as IntelLewisburg.
Referring again to Fig. 6, described node module 5 includes described node backboard 57, and pass through the hard disk 58 that described node backboard 57 electrically connects with described second processor 53, in the present embodiment, each node module 5 includes 6 hard disks 58, and in the cavity being arranged at described node module 5 of stacked on top of one another (i.e. the mode of 3*2).
In one embodiment of the present invention, in conjunction with Fig. 4, described second is installed with space 16 is divided into symmetrical and that shape is identical two front end area, i.e. front end area G and front end area H.The height of described node module 5 is the half of the described second height being installed with space 16, and described node module 5 is 4, front end area G and in front end area H, respectively stacked on top of one another two described node modules 5 are set.
In concrete application, preferably, described symmetrical two front end area G, H are the cavity that two shapes are identical, each inside cavities arranges two relative support portion G1 and H1 along described sidewall direction, and wherein, described support portion G1 and H1 is in the described second position being installed with space 16 1 half height, in each described front end cavity G and H, respectively stacked on top of one another two described node modules 5 are set, and one of them is positioned on described base plate 11, and another is positioned on described support portion G1 or H1.Preferred, in another specific embodiment, the relevant position of described base plate 11 and described support portion G1 or H1 can arrange the structure of slide rail, described node module 5 is preferably arranged to have pulley structure, described node module 5 can be made to slip in described front end area G or H, or extract out from described front end area G or H.Or, it is preferred that described cabinet 1 is positioned at the inner side of the described second two sidewalls 11 being installed with space 16 and is provided with slide rail, and described node module 5 and described hard disc module are provided with the chute corresponding with described slide rail.
In another detailed description of the invention, for instance with reference to, shown in Figure 18 and Figure 19, the node module 5 that two stacked on top of one another in described electronic installation are arranged being replaced with a memory module 6, to realize the function of storage server.
And, it is preferred that the support unit 59 corresponding with each hard disk 58 is preferably as shown in Figure 20 and Figure 21, including:
First support portion 591, for planar structure, has the first fixed part 5911；
Second support portion 592, for planar structure, is in same plane with described first support portion 591, there is the second fixed part 5921, described second support portion 592 is preferable in the present embodiment and is additionally provided with a LED light-guiding pillar 5922, it is possible to when darker, conveniently find the installation site of hard disk 58.Certainly in other embodiments, described LED light-guiding pillar 5922 can also be arranged at described first support portion 591.And preferred, in the present embodiment, it is provided around vibration-absorptive material at described first fixed part 5911 and described second fixed part 5921, to reduce electronic installation vibration frequency of hard disk in the process of movement, protects the safety of hard disk.
Stopper section 593, connects described first support portion 591 and described second support portion 592, and to form a U-shaped space, and described stopper section 593 is vertical with described first support portion 591 and described second support portion 592；And preferred described stopper section 593 is structure as a whole with described first support portion 591 and described second support portion 592.
Described hard disk 58 is positioned over described first support portion 591 and described second support portion 592, and is screwed or the mode such as welding is fixed with described first fixed part 5911 and the second fixed part 5921.
Support unit 59 has abandoned traditional semi-surrounding mode, reduce hard disk 58 be installed on described second be installed with in space 16 after horizontal space, namely in the confined space, abundant hard disk can be installed.It is furthermore preferred that multiple louvre can be provided with on described first support portion 591 and described second support portion 592, while the described hard disk 58 of satisfied support, to strengthen the dynamics of heat radiation.
And in the present embodiment, as shown in figs 20 and 21, the outside of described stopper section 593 is additionally provided with a Handheld Division 594, shown Handheld Division 594 has a lock catch unit, shown lock catch unit is locked in a position by its internal spring structure or unlocks from a position, to make described support unit 59 can be fixed on the described second relevant position being installed with space 16 flexibly, or extract from described second relevant position being installed with space 16 flexibly.
In sum, the electronic installation of the present invention, by by layout rationally clean and tidy in the chassis for the modules such as backboard, I/O module, power module, node module, so that in limited chassis space, it is possible to the more module of layout, utilization rate is high and cost is low；And I/O module, power module and node module are all independent design, collaborative work again between each module simultaneously；Each module is snap-in structure, can Manual-disassembling, improve O&M efficiency；And the transmission of each intermodule signal relies on golden finger or High speed rear panel adapter to complete substantially, make cabinet inside neat and tidy.So, the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
Above-described embodiment is illustrative principles of the invention and effect thereof only, not for the restriction present invention.Above-described embodiment all under the spirit and category of the present invention, can be modified or change by any those skilled in the art.Therefore, art has usually intellectual such as modifying without departing from all equivalences completed under disclosed spirit and technological thought or change, must be contained by the claim of the present invention.
Claims (16)
1. an electronic installation, it is characterised in that including:
One cabinet, including two sidewalls and the base plate connecting described two sidewalls, this cabinet has one first end along the direction of described two sidewalls, and one of relative with described first end the second end, this cabinet closes on described first end to be had one first and is installed with space, and this cabinet closes on described second end to be had one second and be installed with space；
One backboard, vertically being arranged at of described two sidewalls described first is installed with space and described second and is installed with between space, has towards the described first the first plug portion being installed with space and towards the described second the second plug portion being installed with space；
I/O module, is located in described first and is installed with space, has an I/O module department of assembly pluggable the first plug portion being electrically connected at described backboard；
Power module, is located in described first and is installed with space, has a power module department of assembly pluggable the first plug portion being electrically connected at described backboard, in order to supply the electric power of described electronic installation；
Node module, is arranged at described second and is installed with space, has node module department of assembly pluggable the second plug portion being electrically connected at described backboard, and is communicated with corresponding I/O module by described backboard；
Described second is installed with space is separated into multiple front end area, each described front end area arranges at least one described node module, described first is installed with space is separated into the back-end region that multiple height is identical and is arranged side by side, and each described back-end region is used for being installed with at least one described I/O module or at least one described power module.
2. electronic installation according to claim 1, it is characterised in that: described second is installed with space is divided into symmetrical and that shape is identical two front end area.
3. electronic installation according to claim 2, it is characterised in that: the height of described node module is the half of the described second height being installed with space, and described node module is 4, and in the cavity of each described front end, stacked on top of one another arranges two described node modules.
4. electronic installation according to claim 3, it is characterized in that: described symmetrical two front end area are the cavity that two shapes are identical, each inside cavities arranges two relative support portions along described sidewall direction, wherein, described support portion is in the described second position being installed with space one half height, in the cavity of each described front end stacked on top of one another two described node modules are set, and one of them is positioned on described base plate, and another is positioned on described support portion.
5. electronic installation according to claim 1, it is characterised in that: described I/O module includes node I/O module and shared I/O module.
6. electronic installation according to claim 5, it is characterised in that: described shared I/O module includes two shared I/O unit, and described two share the one of which of I/O unit for providing the shared I/O unit of redundancy redundant.
7. electronic installation according to claim 6, it is characterised in that: being arranged in back-end region described in of the shared I/O unit stacking of the two of described shared I/O module.
8. electronic installation according to claim 7, it is characterised in that: the number of described back-end region is the even number more than or equal to 4.
9. electronic installation according to claim 8, it is characterized in that: the height of described node I/O module, described shared I/O module and described power module is identical with the height of described back-end region, each described node I/O module is located in a corresponding back-end region, and the number of described node I/O module is even number, it is arranged in corresponding back-end region about described shared I/O module is symmetrical.
10. electronic installation according to claim 9, it is characterized in that: described node I/O module is four, described shared I/O module is 1, described node I/O module, share in I/O module and power module end regions in the rear be set to from left to right or dextrosinistral be followed successively by: power module, two described node I/O modules, described shared I/O module, two described node I/O modules.
11. electronic installation according to claim 1, it is characterised in that: the connection interface of described I/O module and the connection interface of described power module are in described first end.
12. electronic installation according to claim 1, it is characterised in that: the first plug portion of described backboard and the second plug portion are the electric connection of a slot and golden finger coupling or are a back panel connector.
13. electronic installation according to claim 5, it is characterized in that: each described node I/O module is by described backboard and corresponding described node module electrical connection, and described shared I/O module is by described backboard, electrically connects with all of described node module respectively.
14. electronic installation according to claim 13, it is characterised in that: described electronic installation also includes a handover module, for according to a switching signal, making in described shared I/O module one to share I/O unit and communicate with in described node module.
15. electronic installation according to claim 1, it is characterised in that: described power module includes two power subsystems, and the quantity of described power subsystem is two, and the one of which of described two power subsystems is for providing the power subsystem of redundancy redundant.
16. electronic installation according to claim 15, it is characterised in that: being arranged in back-end region described in of the described power subsystem stacking in described power module.
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Also Published As
| Publication number | Publication date |
|---|---|
| CN205540469U (en) | 2016-08-31 |
| CN205540412U (en) | 2016-08-31 |
| CN105676972A (en) | 2016-06-15 |
| CN205540411U (en) | 2016-08-31 |
| CN205384553U (en) | 2016-07-13 |
| CN205540470U (en) | 2016-08-31 |
| CN205540471U (en) | 2016-08-31 |
| CN105676971A (en) | 2016-06-15 |
| CN105676971B (en) | 2021-03-23 |
| CN205540468U (en) | 2016-08-31 |
| CN105607709B (en) | 2019-10-01 |
| CN205540410U (en) | 2016-08-31 |
| CN105676972B (en) | 2020-11-13 |
| CN105717991B (en) | 2020-05-12 |
| CN105607709A (en) | 2016-05-25 |
| CN205384554U (en) | 2016-07-13 |
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