TW201421191A - Server - Google Patents

Abstract

A server including a chassis, a power supply module and a plurality of motherboard modules is provided. The chassis has an accommodating space. The power supply module is disposed in the accommodating space and located to a second opening of the chassis. The power supply module includes a power distribution board (PDB) and a plurality of power supplies, and the power distribution board is connected to the power supplies and has a plurality of inserting nodes. The motherboard modules are disposed in the accommodating space side by side and located to a first opening of the chassis. The motherboard modules are connected to the inserting nodes correspondingly to connect with the power supply module, and the power supplies provide power to the motherboard modules through the power distribution board. A front side of the motherboard modules has a plurality of input-output ports exposed to the first opening.

Description

server

The present invention relates to an electronic device, and more particularly to a server.

The server is the core computer that serves each computer in the network system. It can provide the functions of the disk and printing services required by the network users, and also allows each client to share resources in the network environment with each other. The basic structure of the server is roughly the same as that of a general personal computer. It consists of a central processing unit (CPU), a memory, and an input/output (I/O) device, and is connected by a bus. It is connected internally, connected to the central processing unit and memory through the north bridge chip, and connected to the input/output device through the south bridge chip. The server has undergone three evolutions in terms of chassis architecture: from early tower chassis to rack servers that emphasize centralized performance to high-density computing.

Taking the rack server as an example, the rack server is a server designed to have a uniform appearance and is used in conjunction with the cabinet. It can be said that the rack type is an optimized structure of the tower server, and its design purpose is mainly to minimize the occupation of the server space. Many professional network devices are rack-mounted, mostly flat, just like drawers. Such as switches, routers, hardware firewalls. The rack server has a width of 19 inches and a height in U (1U = 1.75 inches = 44.45 mm). There are usually 1U, 2U, 3U, 4U, 5U, 7U standard servers.

The dimensions of the cabinet are also based on common industry standards, usually from 22U to 42U Not waiting. The height of the U in the cabinet has a detachable sliding trailer. Users can flexibly adjust the height according to the elevation of their own servers to store network devices such as servers, hubs, and disk array cabinets. After the server is placed, all its I/O lines are taken out from the rear of the cabinet (all interfaces of the rack server are also at the rear), and are uniformly placed in the trunking of the cabinet, generally labeled with labels for easy management.

With the development of information technology, the cost of the energy consumed by the server and the heat required to maintain the normal operation of the server equipment have risen sharply. In addition, how to achieve high-density arrangement of the server to save configuration space is an important issue at present.

The invention provides a server with high calculation density and cost saving.

The invention provides a server, which comprises a chassis, a power supply module and a plurality of motherboard modules. The chassis has a receiving space, a first opening and a second opening relative to the first opening. The power supply module is disposed in the receiving space and located at the second opening. The power supply module includes a power backplane and a plurality of power supplies, and the power backplane is connected to the power supply and has a plurality of plug points. The motherboard modules are arranged side by side in the receiving space and located at the first opening. The motherboard module is connected to the plug-in point and connected to the power supply module, and the power supply provides power to the motherboard module via the power backplane. A front end of the motherboard module has a plurality of input and output interfaces, and the input and output interfaces are exposed at the first opening.

In an embodiment of the present invention, each of the motherboard modules includes a first tray and a motherboard, and the motherboard is disposed on the first tray and can be first The tray is inserted into or withdrawn from the chassis from the first opening.

In an embodiment of the invention, the motherboard has a plug portion, and the motherboard module is connected to one of the plug points via the plug portion. When the motherboard is in the inserted state, the motherboard is electrically connected to the power backplane. When the motherboard is in the extracted state, the motherboard is disconnected from the power backplane.

In an embodiment of the present invention, each of the motherboard modules further includes a first component disposed at a front end of the motherboard module and electrically connected to the motherboard.

In an embodiment of the present invention, each of the motherboard modules further includes a second component disposed at a rear end of the motherboard module relative to the front end to be electrically connected to the motherboard. When the motherboard modules are connected to the power supply module via one of the plug-in points, the first component and the second component are respectively located on opposite sides of the power backplane.

In an embodiment of the invention, the motherboard has an extension portion located at a rear end of the motherboard module and extending from the insertion portion, and the second component is located at the extension portion and is respectively located on the power backplane with the first component The opposite sides.

In one embodiment of the invention, the first component comprises a hard disk or an expansion card and the second component comprises a hard disk.

In an embodiment of the present invention, the first component includes a hard disk and an expansion card, and the hard disk and the expansion card are disposed side by side at a front end of the motherboard module or stacked on the front end of the motherboard module.

In an embodiment of the present invention, the server further includes a plurality of fan modules disposed on two sides of the power supply, and the fan module is electrically connected to the power supply and corresponds to the motherboard module.

In an embodiment of the invention, the server further includes a second The tray, the second tray carries a power supply and a fan module adapted to be inserted into or withdrawn from the chassis from the second opening.

Based on the above, the present invention provides a server in which a power supply module is located at a second opening of the chassis, and a plurality of motherboard modules are located at a first opening of the chassis. The power supply module of the power supply module is connected to the power supply and has a plurality of plug-in points. The motherboard module is connected to the plug-in point and connected to the power supply module, and the power supply provides power to the motherboard via the power backplane. Module. Therefore, multiple motherboard modules can be set in the server, and the server can transfer power to each motherboard module without using additional cables. Accordingly, the server has a higher computational density and can save costs.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of a server in accordance with an embodiment of the present invention. 2 is a top plan view of the server of FIG. 1. Referring to FIG. 1 and FIG. 2 , in the embodiment, the server 100 includes a chassis 110 , a power supply module 120 , and a plurality of motherboard modules 130 . The server 100 shown in FIG. 1 and FIG. 2 is a 1U rack server, and the chassis 110 of the server 100 can be configured with two motherboard modules 130. However, the server 100 illustrated in FIG. 1 and FIG. 2 is only used to describe the manner in which the motherboard module 130 is applied to the server 100. The motherboard module 130 that is not limited to the present invention can only be used for the 1U machine. The rack server and the server 100 are not limited to only two motherboard modules 130.

Specifically, referring to FIG. 2, the chassis 110 has a receiving space 112, The first opening 114 and the second opening 116 are opposite to the first opening 114. In this embodiment, the motherboard module 130 is disposed side by side in the receiving space 112 and located at the first opening 114 of the chassis 110 , and the power supply module 120 is disposed in the receiving space 112 and located in the second opening 116 of the chassis 110 . At the office.

Referring to FIG. 2, the power supply module 120 includes a plurality of power supplies 122 (shown as one representative) and a power backplane 124. The power backplane 124 is connected to the power supply 122 and has a plurality of plug points 124a. The motherboard module 130 is connected to the power supply module 120 by connecting the plug points 124a. In this embodiment, the power supply backplane 124 has two plug-in points 124a, so that the power supply module 120 can connect the two sets of the motherboard modules 130 correspondingly. However, the power backplane 124 can adjust the number of the plug points 124a according to requirements, and the present invention is not limited thereto.

When the motherboard module 130 is connected to the power connection module 120 correspondingly to the plug-in point 124a, the power supply 122 located in the second opening 116 provides power to the motherboard modules located in the first opening 114 via the power backplane 124. Group 130. Accordingly, the server 100 can transfer the power of the power supply module 120 to each of the motherboard modules 130 without using an additional cable, so that the server 100 can save the cost required to set the cable.

In addition, the motherboard module 130 can be detachably disposed in the chassis 110 and connected to the power supply module 120. Therefore, the motherboard module 130 can be removed from the power supply module 120 and removed from the chassis 110 for replacement or maintenance. Accordingly, the assembly and replacement of the motherboard module 130 is more convenient.

On the other hand, referring to FIG. 2, in the embodiment, the server 100 further includes a plurality of fan modules 140. Each fan module 140 includes a plurality of fans 142. The fan module 140 is disposed on both sides of the power supply 122 and electrically connected to the power supply 122 , and the fan module 140 corresponds to the motherboard module 130 . Therefore, in the embodiment, the number of the fan modules 140 is two, and each fan module 140 has three fans 142, but the present invention does not limit the number of the fan modules 140 and the fans 142. The fan module 140 is grounded to the motherboard module 130 one-to-one, so that the fan module 140 can effectively dissipate the heat generated by the motherboard module 130.

3 is a schematic view of the motherboard module of FIG. 1. Referring to FIG. 2 and FIG. 3 , in the embodiment, each motherboard module 130 includes a first tray 132 and a motherboard 134 . The motherboard 134 is disposed on the first tray 132 and can be inserted into or withdrawn from the chassis 110 from the first opening 114 along with the first tray 132. Further, the motherboard module 130 is formed as a separate component through the first tray 132, and the remaining components of the motherboard module 130 are disposed on the first tray 132, so that the motherboard module 130 can be integrated. Assembly into or removal from the chassis 110.

In addition, in the embodiment, the server 50 further includes a second tray 150, and the second tray 150 carries a power supply 122 and a fan module 140. The second tray 150 is adapted to be inserted into or withdrawn from the chassis 110 from the second opening 116. In other words, the power supply 122 and the fan module 140 can be detachably disposed in the receiving space 112 of the chassis 110 via the second tray 150, so that the assembly and replacement of the power supply 122 and the fan module 140 are more convenient. However, in other embodiments, the power supply unit 122 and the fan module 140 can be directly fixed in the receiving space 112 of the chassis 110, which is not limited by the present invention.

On the other hand, the motherboard 134 of the motherboard module 130 is electrically connected to the power supply 122 via the power backplane 124. In this embodiment, the motherboard module 130 can be divided into a front end F and a rear end B opposite to the front end F. The front end F of the motherboard module 130 has a plurality of input and output interfaces 136a, and the input and output interface 136a is exposed at the first opening 114, so that the server 100 can connect other external devices via the input and output interface 136a. In addition, when the motherboard module 130 is disposed in the chassis 110 and connected to the power supply module 120, the motherboard module 130 is connected to the power backplane 124 with the rear end B facing the power backplane 124.

Specifically, in the present embodiment, the motherboard 134 has a plug portion 134a, and the plug portion 134a is located at the rear end B of the motherboard module 130. As described above, the motherboard module 130 is connected to the power backplane 124 with the rear end B facing the power backplane 124. Furthermore, the motherboard module 130 is connected to the power supply backplane 124 by connecting the plug portion 134a of the motherboard 134 to one of the plug points 124a.

Therefore, when the motherboard 134 is in the inserted state, the motherboard 134 is electrically connected to the power backplane 124, and the power supply 122 provides power to the motherboard 134 of the motherboard module 130 via the power backplane 124. In other words, when the motherboard 134 is connected to the power supply module 120, the motherboard 134 is electrically connected to the power backplane 124 and the power supply 122. In addition, when the motherboard 134 is in the extracted state, the motherboard 134 is disconnected from the electrical backplane 124.

On the other hand, in the embodiment, the motherboard module 130 includes a first component 136, and the first component 136 is located at the front end F of the motherboard module 130. The motherboard 134 is electrically connected. The first element 136 has a storage space. When the motherboard 134 is electrically connected to the power backplane 124, the server 100 can store data and perform functions corresponding to the first component 136.

On the other hand, in the embodiment, the motherboard module 130 further includes a second component 138. The second component 138 is located at the rear end B of the motherboard module 130 and is electrically connected to the motherboard 134. It should be noted that, when each motherboard module 130 is connected to the power supply module 120 via one of the plug-in portions 124a correspondingly connected to the plug-in portion 134a, the first component 136 and the second component 138 respectively Located on opposite sides of the power backplane 124.

Specifically, in the present embodiment, the motherboard 134 also has an extension 134b. The extension portion 134b is located at the rear end B of the motherboard module 130 and extends from the insertion portion 134a, and the second component 138 is electrically connected to the motherboard 134 via the extension portion 134b. Therefore, the motherboard module 130 is configured to connect the first component 136 and the second component 138 on opposite sides of the power supply backplane 124 by connecting the plugging portions 134a correspondingly to the plugging points 124a.

Accordingly, the second component 138 can be considered as an element disposed to fill the space between the motherboard module 130 and the power supply module 120 to properly utilize the space within the server 100, and the extension 134b can be considered to be The second component 138 is coupled to the motherboard 134 for additional extension. Therefore, the server 100 has a relatively compact system layout to reduce the overall cost of the server 100.

Therefore, in the embodiment, the extension portion 134b protrudes outside the first tray 132, and the second member 138 is assembled to the extension portion 134b after the motherboard module 130 is disposed in the chassis 110. However, in other embodiments, The extension portion 134b and the second member 138 may be simultaneously disposed in the first tray 132, and the shape of the first tray 132 does not interfere with the power supply 122, so that the motherboard module 130 can be placed in the chassis 110 and the motherboard 134 The plug portion 134a is connected to the power backplane 124, and the present invention is not limited thereto.

In this embodiment, the second component 138 also has a storage space. When the motherboard 134 is electrically connected to the power backplane 124, the server 100 can store data and perform functions corresponding to the second component 138. Therefore, by providing the first component 136 and the second component 138 on the motherboard 134, the storage space of the motherboard module 130 can be improved. However, the present invention does not limit the arrangement of the second component 138, and the motherboard module 130 can be adjusted according to the needs of use. Here, only a preferred embodiment of the present invention is described.

In addition, in the embodiment, the motherboard module 130 further has a plurality of electronic components 139, such as a central processing unit or a memory. The electronic component 139 is disposed on the motherboard 134 and located between the first component 136 and the second component 138. However, the present invention does not limit the type, number, and setting of the electronic components 139, and the motherboard module 130 can be adjusted according to the use requirements.

Referring to FIG. 3, in the embodiment, the first component 136 and the second component 138 are hard disks, such as a 2.5-inch solid state drive (SSD) of a small form factor (SFF). ), but the invention does not limit the type of hard disk. In other embodiments, the first component 136 and the second component 138 can also be 3.5-inch solid state hard disks or other types of hard disks.

The number of the first element 136 and the second element 138 are respectively two, and the first elements 136 are disposed side by side on the main board 134 and located at the front end F of the main board module 130 and the second elements 138 are arranged side by side on the main board. 134 is located at the rear end B of the motherboard module 130, but the present invention does not limit the number and arrangement of the first component 136 and the second component 138.

4 is a schematic diagram of a motherboard module according to another embodiment of the present invention. Referring to FIG. 4, in the embodiment, the first component 136 of the motherboard module 130a is an expansion card, such as a low profile (LP) display card. The number of the first members 136 is two, and is disposed side by side on the main board 134 and located at the front end F of the main board module 130. However, the present invention does not limit the type of expansion card. In other embodiments, the first component 136 is also a display card of other kinds. At this point, the second component 138 can be a 2.5 inch, 3.5 inch solid state hard disk or other type of hard disk.

Moreover, in other embodiments not shown, the first component 136 includes a hard disk and an expansion card. In other words, when the number of first elements 136 is greater than one, the first elements 136 are not necessarily limited to the same category. For example, the number of the first elements 136 is two, one of which is a hard disk, such as a 2.5 inch, 3.5 inch solid state hard disk or other kind of hard disk, and the other is an expansion card, such as a short version. Display card or other kind of display card. At this time, the hard disk and the expansion card can be disposed side by side at the front end F of the main board module 130 or the front end F of the main board module 130. The present invention is not limited thereto, and the present invention does not limit the first component 136. Type and arrangement.

Therefore, different motherboard modules can have different usage functions by providing different kinds of first components 136. Accordingly, the server 100 can select the type of the motherboard module according to the usage requirements. Briefly, the motherboard module 130 can select the type of the first component 136 located at the front end F to adjust the function of the motherboard module 130, and the server 100 can select and replace different The motherboard module 130. In addition, a plurality of motherboard modules 130 can be disposed in the server 100, so that the server 100 has a higher computing density.

In summary, the present invention provides a server in which a power supply module is located at a second opening of the chassis, and a plurality of motherboard modules are located at a first opening of the chassis. The power supply backplane of the power supply module has a plurality of plug points, and the motherboard module is connected to the power supply module by correspondingly connecting the plug points. The motherboard module can be detachably connected to the power supply module via the plug-in point, and the power provided by the power supply can be directly transmitted to the motherboard module via the power backplane. Therefore, multiple motherboard modules can be set in the server, and the server can transfer power to each motherboard module without using additional cables. Accordingly, the server has a higher computational density and can save costs.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Server

110‧‧‧Chassis

112‧‧‧Containing space

114‧‧‧First opening

116‧‧‧second opening

120‧‧‧Power supply module

122‧‧‧Power supply

124‧‧‧Power backplane

124a‧‧‧ Plugging points

130, 130a‧‧‧ motherboard module

132‧‧‧First tray

134‧‧‧ motherboard

134a‧‧‧Interface

134b‧‧‧Extension

136‧‧‧ first component

136a‧‧‧Input and output interface

138‧‧‧ second component

139‧‧‧Electronic components

140‧‧‧Fan module

142‧‧‧Fan

150‧‧‧second tray

B‧‧‧ Backend

F‧‧‧ front end

1 is a schematic diagram of a server in accordance with an embodiment of the present invention.

2 is a top plan view of the server of FIG. 1.

3 is a schematic view of the motherboard module of FIG. 1.

4 is a schematic diagram of a motherboard module according to another embodiment of the present invention.

100‧‧‧Server

110‧‧‧Chassis

112‧‧‧Containing space

114‧‧‧First opening

116‧‧‧second opening

120‧‧‧Power supply module

122‧‧‧Power supply

124‧‧‧Power backplane

124a‧‧‧ Plugging points

130‧‧‧ motherboard module

132‧‧‧Tray

134‧‧‧ motherboard

134a‧‧‧Interface

134b‧‧‧Extension

136‧‧‧ first component

136a‧‧‧Input and output interface

138‧‧‧ second component

139‧‧‧Electronic components

140‧‧‧Fan module

142‧‧‧Fan

B‧‧‧ Backend

F‧‧‧ front end

Claims (10)

A server includes: a chassis having a receiving space, a first opening, and a second opening opposite to the first opening; a power supply module disposed in the receiving space and located in the second opening The power supply module includes a power backplane and a plurality of power supplies, the power backplane is connected to the power supplies and has a plurality of plug points; and a plurality of motherboard modules are disposed side by side The power supply space is located at the first opening, and the motherboard modules are connected to the sockets to connect the power supply modules, and the power supplies provide power to the motherboard modules via the power backplane. The front end of the motherboard module has a plurality of input and output interfaces, and the input and output interfaces are exposed to the first opening. The server of claim 1, wherein each of the motherboard modules includes a first tray and a motherboard, the motherboard is disposed on the first tray and can be from the first tray The opening is inserted into or withdrawn from the chassis. The server of claim 2, wherein the motherboard has a plug portion, and the motherboard module connects one of the plug points via the plug portion, when the motherboard is inserted In the state, the motherboard is electrically connected to the power backplane, and when the motherboard is in the extracted state, the motherboard is disconnected from the power backplane. The server of claim 1, wherein each of the motherboard modules further includes a first component located at the front end of the motherboard module It is electrically connected to the motherboard. The server of claim 4, wherein each of the motherboard modules further includes a second component, and the motherboard module is electrically connected to the motherboard with respect to a rear end of the front end. When the motherboard module is connected to the power supply module by connecting the plug portion to one of the plug points, the first component and the second component are respectively located on the power backplane. Relative sides. The server of claim 5, wherein the motherboard has an extension portion located at the rear end of the motherboard module and extending from the insertion portion, the second component is located at the extension portion and The first components are respectively located on opposite sides of the power backplane. The server of claim 5, wherein the first component comprises a hard disk or an expansion card, and the second component comprises a hard disk. The server of claim 5, wherein the first component comprises a hard disk and an expansion card, and the hard disk and the expansion card are disposed side by side at the front end of the motherboard module or stacked on the motherboard module. The front end of the group. The server of claim 1, further comprising a plurality of fan modules disposed on opposite sides of the power supply, the fan modules being electrically connected to the power supplies and corresponding to the These motherboard modules. The server of claim 9, further comprising a second tray, the second tray carrying the power supply and the fan modules, adapted to be inserted into the chassis or from the second opening The chassis is pulled out.