CN109121346B

CN109121346B - Server device

Info

Publication number: CN109121346B
Application number: CN201710480335.1A
Authority: CN
Inventors: 侯智仁; 黄进权; 蔡金翰; 黄肇湘
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Technical Steel Technology Co ltd
Priority date: 2017-06-22
Filing date: 2017-06-22
Publication date: 2020-10-30
Anticipated expiration: 2037-06-22
Also published as: CN109121346A

Abstract

A server device comprises a case and at least one group of server components. The case is provided with at least one storage space, a first surface and a second surface which are positioned on two opposite sides of the storage space and face the storage space. The case further has an opening corresponding to the storage space and an opening surface on which the opening is located. At least one group of server components can be arranged in at least one storage space through the opening in a sliding mode. The at least one set of server components includes a first node server and a second node server. The first node server is closer to the first surface than the second node server. Wherein, a reference plane is defined to be orthogonal to the first surface and the opening surface. The projection of the first node server on the reference plane partially overlaps with the projection of the second node server on the reference plane.

Description

Server device

Technical Field

The present invention relates to a server apparatus, and more particularly, to a server apparatus having a plurality of node servers.

Background

Today, the world is in an era of rapid development of information technology, and no matter whether enterprises or individuals use personal computers (such as desktop computers, notebook computers, etc.) to process transactions. However, as communication technology matures, cross-country e-commerce has replaced traditional regional business models, and thus, the trend of enterprise e-commerce is becoming a trend. Thus, the general personal computer can not meet the requirements of enterprises in the market. Therefore, computer manufacturers have developed servers with special functions (such as cloud servers and firewall servers) to solve the problem of electronic implementation of enterprises.

Taking a chassis server as an example, the chassis server is configured to improve the computation processing capability of the chassis server by stacking a plurality of server hosts inside a chassis. In a chassis with a limited height, the greater the number of stacks of server hosts, the higher the computing performance of the chassis server. However, in order to facilitate replacement or maintenance of the server host, the server host is mostly designed to be removable. In order to allow the server hosts to be smoothly pulled and pulled relative to the chassis, sufficient space must be reserved between the server hosts to prevent the highest electronic components in the server hosts from interfering with the insertion or pulling of the server hosts into or out of the chassis. Therefore, the number of stacked server hosts is limited by the highest electronic device, which is difficult to break through. Therefore, it is one of the problems to be solved by developers how to avoid increasing the stacking number of server hosts due to the limitation of the stacking number of the server hosts by the highest electronic component and further improving the operation performance of the box server.

Disclosure of Invention

In view of the above problems, the present invention discloses a server apparatus, so as to solve the problem that the number of stacked server hosts is limited by the highest electronic component, and thus the number of stacked server hosts cannot be broken through, and the operation performance of a chassis server cannot be improved.

The invention discloses a server device which comprises a case and at least one group of server components. The case is provided with at least one storage space, a first surface and a second surface which are positioned on two opposite sides of the storage space and face the storage space. The case further has an opening corresponding to the storage space and an opening surface on which the opening is located. At least one group of server components can be arranged in at least one storage space through the opening in a sliding mode. The at least one set of server components includes a first node server and a second node server. The first node server is closer to the first surface than the second node server. And defining a reference plane orthogonal to the first surface and the opening plane, wherein the projection of the first node server on the reference plane is partially overlapped with the projection of the second node server on the reference plane.

According to the server apparatus of the above embodiment, at least two node servers may be provided per storage space in the cabinet of the server apparatus, the first node server is closer to the first surface than the second node server, and a projection of the first node server on the reference surface partially overlaps with a projection of the second node server on the reference surface. That is, the first node server and the second node server are configured in a staggered manner, so that the first node server and the second node server are stacked more closely, and further the number of stacked server hosts in a chassis is increased and the operation performance of the server device is improved.

The foregoing summary of the invention and the following detailed description of the embodiments are provided to illustrate and explain the principles of the invention and to provide further explanation of the invention as claimed.

Drawings

Fig. 1 is a perspective view of a server apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic plan view of the server apparatus of fig. 1.

Fig. 3 is a perspective view of a server assembly of the server apparatus of fig. 1.

Fig. 4 is a schematic cross-sectional view of a server apparatus according to a second embodiment of the present invention.

Fig. 5 is a perspective view of a server apparatus according to a third embodiment of the present invention.

Fig. 6 is a schematic plan view of a server apparatus according to a fourth embodiment of the present invention.

Description of reference numerals:

1a, 1b, 1c, 1d server device

10 case

11 case body

111 bottom surface

12 diaphragm plate

13 vertical partition plate

14 storage space

141 first surface

142 second surface

143 third surface

144 fourth surface

145 open face

146 carrying rail

15 opening

20 server assembly

21a, 21b, 21c first node server

211a tray

211b first tray

2111a bottom plate

21111a, 2111c carrying surface

2111b first bearing surface

2112a front panel

21121a first wall part

21122a second wall part

212a Circuit Board

212b first Circuit Board

213a, 213b first electronic component

214a, 214b second electronic component

215a first side edge

22a, 22b, 22c second node server

221a tray

221b second tray

2211a baseplate

22111a, 2211c bearing surface

2211b second bearing surface

2212a front panel

22121a first wall part

22122a second wall part

2212b third bearing surface

222a circuit board

222b second circuit board

223a first electronic component

223b third circuit board

224a second electronic component

224b third electronic component

225a, 225d second skirt

225b fourth electronic component

P reference plane

Detailed Description

Please refer to fig. 1 to 3. Fig. 1 is a perspective view of a server apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic plan view of the server apparatus of fig. 1. Fig. 3 is a perspective view of a server assembly of the server apparatus of fig. 1. A server device 1a includes a housing 10 and a set of server components 20. For convenience of description and emphasis on the focus of the present invention, only one set of server 20 is illustrated in the drawings of the present embodiment, but actually, a plurality of sets of server assemblies 20 may be disposed in the chassis 10.

The cabinet 10 includes a box body 11, a plurality of transverse partitions 12 and a plurality of vertical partitions 13. The housing 11 has a bottom surface 111 on the outside. The horizontal partitions 12 and the vertical partitions 13 are located inside the cabinet 11 to divide a plurality of storage spaces 14 and openings 15 corresponding to the storage spaces 14.

For convenience of description, one of the storage spaces 14 surrounded by two adjacent horizontal partitions 12 and two adjacent vertical partitions 13 is illustrated. The casing 10 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, an open surface 145 and two loading rails 146 located in the storage space 14 and facing the storage space 14. The first surface 141 and the second surface 142 are opposite to each other, and the third surface 143 and the fourth surface 144 are opposite to each other and between the first surface 141 and the second surface 142. The first surface 141 is parallel to the bottom surface 111. The two carrier rails 146 are respectively disposed on the third surface 143 and the fourth surface 144. The opening 15 is located at the opening face 145. In the present embodiment, the distances from the two carrying rails 146 to the first surface 141 are different.

The server component 20 includes a first node server 21a and a second node server 22 a. The first node server 21a and the second node server 22a are slidably installed in the same storage space 14 through the opening 15, and the first node server 21a is closer to the first surface 141 than the second node server 22 a. For example, the first node server 21a is stacked on the first surface 141, and the second node server 22a is stacked on the first node server 21 a.

The first node server 21a includes a tray 211a, a circuit board 212a, a first electronic component 213a and a second electronic component 214 a. The tray 211a includes a bottom plate 2111a and a front plate 2112 a. The front plate 2112a includes a first wall portion 21121a and a second wall portion 21122 a. The first wall portion 21121a and the second wall portion 21122a are connected to the bottom plate 2111 a. The bottom plate 2111a of the tray 211a of the first node server 21a is stacked on the first surface 141 and has a carrying surface 21111a facing away from the first surface 141. The circuit board 212a of the first node server 21a is disposed on the carrying surface 21111a of the bottom plate 2111 a. The first electronic component 213a and the second electronic component 214a of the first node server 21a are disposed on the circuit board 212 a. The first electronic component 213a of the first node server 21a has a height greater than that of the second electronic component 214 a.

Wherein the first wall portion 21121a has a height greater than the height of the second wall portion 21122 a. And the height of the first wall portion 21121a corresponds to the height of the first electronic component 213a, and the height of the second wall portion 21122a corresponds to the height of the second electronic component 214 a.

The second node server 22a includes a tray 221a, a circuit board 222a, a first electronic component 223a, and a second electronic component 224 a. The tray 221a includes a bottom plate 2211a and a front plate 2212 a. The bottom plate 2211a has a bearing surface 22111 a. The front plate 2212a includes a first wall portion 22121a and a second wall portion 22122 a. The first wall portion 22121a and the second wall portion 22122a are connected to the bottom plate 2211 a. The tray 221a of the second node server 22a is slidably carried on the second carrier rail 146. The bearing surface 22111a of the tray 221a faces the bearing surface 21111a of the tray 211 a. That is, the bearer surface 21111a of the first node server 21a is opposite the bearer surface 22111a of the second node server 22 a. The circuit board 222a of the second node server 22a is disposed on the bearing surface 22111a of the bottom plate 2211 a. The first electronic component 223a and the second electronic component 224a of the second node server 22a are disposed on the circuit board 222 a. The first electronic component 223a of the second node server 22a has a height greater than the height of the second electronic component 224 a.

Wherein the height of the first wall portion 22121a is greater than the height of the second wall portion 22122 a. And the height of the first wall portion 22121a corresponds to the height of the first electronic component 223a, and the height of the second wall portion 22122a corresponds to the height of the second electronic component 224 a.

In detail, the first electronic component 223a higher than the second electronic component 223a of the second node server 22a is located above the second electronic component 214a lower than the first node server 21a, and the second electronic component 224a lower than the second node server 22a is located above the first electronic component 213a higher than the first node server 21 a. Therefore, the projections of the first electronic component 213a higher than the first node server 21a and the first electronic component 223a higher than the second node server 22a on a reference plane P orthogonal to the first surface 141 and the opening surface 145 overlap. In this way, by closely stacking the first node server 21a and the second node server 22a, the space above the lower electronic components is not wasted, and the number of servers that can be stacked in the chassis 10 is increased.

In addition, the first wall portion 21121a of the first node server 21a corresponds to the second wall portion 22122a of the second node server 22a, and the second wall portion 21122a of the first node server 21a corresponds to the first wall portion 22121a of the second node server 22 a. As a result, the

first wall portions

21121a and 22121a and the

second wall portions

21122a and 22122a can shield the electronic components behind, thereby improving the aesthetic appearance and the dust-proof effect of the server assembly 20.

In the present embodiment, the first node server 21a and the second node server 22a are configured in a point-to-point manner. When the first node server 21a and the second node server 22a are configured to be point-symmetric, the projection of the first node server 21a on the first surface 141 and the projection of the second node server 22a on the first surface 141 completely overlap, and the point-symmetric configuration has the advantage that only a tray of a single specification needs to be produced for the first node server 21a and the second node server 22a to share. Therefore, the cost of multiple mold opening for producing various specifications can be saved. However, the configuration of the first node server 21a and the second node server 22a may be asymmetric, but it is necessary that the projection of the first node server 21a on the first surface 141 partially overlaps with the projection of the second node server 22a on the first surface 141.

In order to more clearly express the configurations of the first node server 21a and the second node server 22a, they are further described in a front perspective. As shown in fig. 2, the first node server 21a includes a first side edge 215a adjacent to the second surface 142, and the second node server 22a includes a second side edge 225a adjacent to the first surface 141. In this embodiment, the first side edge 215a is matched with the second side edge 225a, but the invention is not limited thereto, and in other embodiments, the first side edge 215a may not be completely matched with the second side edge 225 a.

Please refer to fig. 4. Fig. 4 is a schematic cross-sectional view of a server apparatus according to a second embodiment of the present invention. This embodiment is similar to the embodiment of fig. 1, and therefore only differences will be described. In the server apparatus 1b of the present embodiment, the first node server 21b includes a first tray 211b, a first circuit board 212b, a first electronic component 213b and a second electronic component 214 b. The first tray 211b has a first carrying surface 2111 b. The first circuit board 212b is disposed on the first carrying surface 2111b of the first tray 211 b. The first electronic element 213b and the second electronic element 214b are disposed on the first circuit board 212b, and the height of the first electronic element 213b is greater than the height of the second electronic element 214 b. The second node server 22b includes a second tray 221b, a second circuit board 222b, a third circuit board 223b, a third electronic component 224b, and a fourth electronic component 225 b. The first tray 211b is closer to the first surface 141 than the second tray 221b, and the second tray 221b has a second supporting surface 2211b and a third supporting surface 2212 b. The second and

third bearing surfaces

2211b and 2212b are both oriented in the same direction as the first bearing surface 2111b, and the second bearing surface 2211b is closer to the first surface 141 than the third bearing surface 2212 b. The second circuit board 222b and the third circuit board 223b are disposed on the second supporting surface 2211b and the third supporting surface 2212b of the second tray 221b, respectively. The height of the third electronic component 224b is greater than that of the fourth electronic component 225b, and the third electronic component 224b is disposed on the second circuit board 222b and the fourth electronic component 225b is disposed on the third circuit board 223 b.

Please refer to fig. 5. Fig. 5 is a perspective view of a server apparatus according to a third embodiment of the present invention. This embodiment is similar to the embodiment of fig. 1, and therefore only differences will be described. In the embodiment of fig. 1, the first node server 21a and the second node server 22a are horizontally disposed, but not limited thereto, in the server apparatus 1c of the embodiment, the first node server 21c and the second node server 22c are vertically disposed, that is, the first surface 141 is vertical to the bearing surfaces 2111c and 2211 c.

See fig. 6. Fig. 6 is a schematic plan view of a server apparatus according to a fourth embodiment of the present invention. This embodiment is similar to the embodiment of fig. 1, and therefore only differences will be described. In the embodiment of fig. 1, the height of the second side edge 225a near the third surface 143 is different from the height near the fourth surface 144, so the distance from the second carrier rail 146 to the first surface 141 is different, but not limited thereto, in the server device 1d of the embodiment, the height of the second side edge 225d near the third surface 143 is the same as the height near the fourth surface 144, and thus the distance from the second carrier rail 146 to the first surface 141 is the same.

According to the server apparatus of the above embodiment, the projection of the high electronic component of the first node server on the third surface partially overlaps with the projection of the high electronic component of the second node server on the third surface. That is, the first electronic component of the second node server that is higher is located above the second electronic component of the first node server that is lower, and the second electronic component of the second node server that is lower is located above the first electronic component of the first node server that is higher. Therefore, the first node server and the second node server are configured in a staggered manner, so that the space above the lower electronic element is not wasted.

The first side edge of the first node server is matched with the second side edge. That is, the entire storage space is completely filled by the first node server and the second node server, and there is no wasted space. Therefore, the first node server and the second node server are closely overlapped, so that the number of the servers which can be overlapped in the case is increased, the stacking number of the servo hosts in the case is increased, and the operation efficiency of the server device is improved.

In addition, the first node server and the second node server are arranged in point symmetry, that is, the sizes of the node server trays in the server device are consistent, so that the node server trays can be manufactured at the same time during production, and the production cost can be saved.

Although the present invention has been described with respect to the above preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A server device, comprising:

the computer case is provided with at least one storage space, a first surface and a second surface, wherein the first surface and the second surface are positioned on two opposite sides of the at least one storage space and face the storage space; and

at least one group of server components which can be arranged in the at least one storage space through the opening in a sliding way,

wherein the at least one set of server components comprises a first node server and a second node server, the first node server being closer to the first surface than the second node server;

defining a reference plane orthogonal to the first surface and the opening plane, the projection of the first node server on the reference plane partially overlapping with the projection of the second node server on the reference plane,

the projection of the first node server on the first surface completely overlaps with the projection of the second node server on the first surface.

2. The server device of claim 1, wherein the first node server has a first side edge near the second surface, the second node server has a second side edge near the first surface, and the first side edge matches the second side edge.

3. The server apparatus according to claim 2, wherein the first node server and the second node server are configured to be point-symmetric.

4. A server device, comprising:

the first node server and the second node server each comprise a tray, a circuit board, a first electronic element and a second electronic element, the two trays each have a bearing surface, the two bearing surfaces face each other, the two circuit boards are respectively arranged on the two bearing surfaces of the two trays, the two first electronic elements are respectively arranged on the two circuit boards, the two second electronic elements are respectively arranged on the two circuit boards, the height of each first electronic element is larger than that of each second electronic element, and the projection of the first electronic element of the first node server on the reference surface is partially overlapped with the projection of the first electronic element of the second node server on the reference surface.

5. The server apparatus according to claim 4, wherein each of the trays further comprises a bottom plate and a front plate, the front plate comprises a first wall portion and a second wall portion, the first wall portion and the second wall portion are both connected to the bottom plate, the height of the first wall portion is greater than the height of the second wall portion, the height of the first wall portion corresponds to the height of the first electronic component, and the height of the second wall portion corresponds to the height of the second electronic component.

6. The server apparatus according to claim 4, wherein the housing further has a third surface and a fourth surface located on opposite sides of the storage space and facing the storage space, the third surface and the fourth surface being between the first surface and the second surface, the housing further comprising two loading rails respectively located on the third surface and the fourth surface, the tray of the first node server or the tray of the second node server being slidably carried on the two loading rails.

7. The server apparatus according to claim 6, wherein the two carrier rails have different distances from the first surface.

8. The server apparatus according to claim 6, wherein the two carrier rails are located at the same distance from the first surface.

9. The server apparatus according to claim 4, wherein the chassis comprises a bottom surface parallel to the bearing surface of the first node server and the bearing surface of the second node server.

10. The server apparatus according to claim 4, wherein the chassis comprises a bottom surface perpendicular to the bearing surface of the first node server and the bearing surface of the second node server.

11. A server device, comprising:

wherein the first node server comprises a first tray, a first circuit board, a first electronic element and a second electronic element, the first tray has a first carrying surface, the first circuit board is arranged on the first carrying surface of the first tray, the first electronic element and the second electronic element are arranged on the first circuit board, and the height of the first electronic element is larger than that of the second electronic element, the second node server comprises a second tray, a second circuit board, a third electronic element and a fourth electronic element, the first tray is closer to the first surface than the second tray, and the second tray has a second carrying surface and a third carrying surface, the second carrying surface and the third carrying surface are both towards the same direction as the first carrying surface, and the second carrying surface is closer to the first surface than the third carrying surface, the second circuit board and the third circuit board are respectively arranged on the second bearing surface and the third bearing surface of the second tray, the height of the third electronic element is larger than that of the fourth electronic element, and the third electronic element is arranged on the second circuit board and the fourth electronic element is arranged on the third circuit board.

12. The server apparatus according to claim 11, wherein the housing further has a third surface and a fourth surface located on opposite sides of the storage space and facing the storage space, the third surface and the fourth surface being between the first surface and the second surface, the housing further comprising two loading rails respectively located on the third surface and the fourth surface, the tray of the first node server or the tray of the second node server being slidably carried on the two loading rails.