WO2023125549A1

WO2023125549A1 - Server and manufacturing method therefor

Info

Publication number: WO2023125549A1
Application number: PCT/CN2022/142388
Authority: WO
Inventors: 郭海涛; 刘洪广
Original assignee: 华为技术有限公司
Priority date: 2021-12-31
Filing date: 2022-12-27
Publication date: 2023-07-06
Also published as: CN116414191A

Abstract

The present application relates to the technical field of machinery, and provides a server and a manufacturing method therefor. The server comprises a chassis and a plurality of components arranged in the chassis; the size of at least one of the plurality of components is designed on the basis of a reference size of a reference unit; and the position of the at least one component in the chassis is adjustable. The position of the at least one component in the chassis is adjustable, and thus, the flexibility of the structure of the server is improved.

Description

A server and its manufacturing method

This application claims the priority of the Chinese patent application with the application number 202111664061.4 and the title of the invention "a server and its manufacturing method" submitted to the China Patent Office on December 31, 2021. The entire content of the patent application is incorporated herein by reference. Applying.

technical field

The present application relates to the field of mechanical technology, in particular to a server and a manufacturing method thereof.

Background technique

The server uses the network as a medium to provide users with services such as computing and/or storage. The server includes a motherboard (for example, the motherboard includes memory, onboard network and management interface, etc.), a peripheral component interconnect express (PCIe) slot, a central processing unit (CPU), a power supply, a fan, a disk, etc. hardware such as boxes and various PCIe peripherals.

At present, the production server is generally customized based on user needs. For example, the hardware required by the server and the installation position of the hardware in the server are fixed, which makes the server structure better adapt to the user's needs, but also This leads to poor flexibility of the server structure.

Contents of the invention

Embodiments of the present application provide a server and a manufacturing method thereof, which are used to improve structural flexibility of the server.

In the first aspect, the embodiment of the present application provides a server, including: a chassis and a plurality of components arranged in the chassis, the size of at least one component in the plurality of components is designed based on the reference size of the reference unit, and the The position of the at least one component in the case can be adjusted.

In the embodiment of the present application, the size of at least one component in the server is uniformly designed according to the reference size, which is equivalent to uniformly planning the size of at least one component, so that the arrangement of at least one component in the chassis is more flexible. Compared with the way in which the installation positions of the hardware in the server in the prior art are all fixed, the size of at least one component in the embodiment of the present application is uniformly planned, so the size of at least one component can be uniformly designed so that at least one component can be installed in the chassis There are various arrangements of memory. Moreover, the position of at least one component in the chassis in the embodiments of the present application is adjustable, for example, the user can adjust the position of a certain component in the at least one component in the chassis, or exchange two of the at least one component The location of components in the chassis, etc., thus further improving the flexibility of the server structure.

In a possible implementation manner, the size of each component in the plurality of components is respectively determined according to the reference size.

In this embodiment, the sizes of the multiple components are uniformly planned according to the reference size, so as to provide multiple arrangements of the multiple components in the chassis, and also plan the internal space of the chassis more reasonably.

In a possible implementation manner, the projected area of the at least one component on the first surface of the chassis is an integer multiple of the projected area of the reference unit on the first surface.

In this embodiment, since the projected area of at least one component on the first surface of the chassis is an integer multiple of the projected area of the reference unit on the first surface, it is convenient to design the size of at least one component according to the reference unit, and it is also convenient Subsequently, the position of at least one component in the chassis is adjusted according to the reference size of the reference unit.

In a possible implementation manner, the hardware interfaces of some or all of the multiple components adopt the first interface standard; and/or, the software interfaces of some or all of the multiple components adopt the second interface standard.

In this embodiment, the hardware interfaces of some or all of the multiple components may adopt a unified standard, which facilitates the improvement of hardware compatibility among the multiple components. Moreover, once a certain component is damaged, it can be replaced by a component with the first interface standard, which reduces the difficulty of repairing the component. In addition, the software interfaces of some or all of the multiple components can also adopt a unified standard, which is beneficial to improve the software compatibility among some or all of the components. Moreover, if a component is damaged, it can be replaced by a component with the second interface standard, which can also reduce the difficulty of repairing the component.

In a possible implementation manner, the multiple components include any two of the following components and combinations thereof: a power supply component, a heat dissipation component, a storage component, a peripheral component, and a computing component.

This embodiment provides multiple implementation forms of multiple components, and enriches the implementation forms of multiple components. In addition, users can choose the components they need to form a server, which is beneficial to meet the requirements of different users for the components of the server.

In a possible implementation manner, the second surface of the chassis is used for human-computer interaction; the storage component is visible on the second surface; or, the power supply component is visible on the second surface Or, the storage component and the peripheral component are visible in the second plane; or, the power supply component and the peripheral component are visible in the second plane.

In this embodiment, several possible server structures are provided. A certain component is visible on the second side of the human-computer interaction, which can be understood as that the component is relatively closer to the user after the server is installed on the rack. , so that the user can quickly maintain the component, and/or increase or decrease the number of the component, etc., for example, the power supply component is visible on the second surface, which is convenient for the user to quickly maintain the power supply component.

In a possible implementation manner, the reference size is 1/N of the size of the internal space of the chassis, where N is a positive integer.

In this embodiment, the reference size can be set according to the size of the internal space of the chassis, the reference size is taken as 1/N of the size of the internal space of the chassis, and the size of at least one component is designed according to the reference size, so it is equivalent to According to the size of the internal space of the chassis, the size of at least one component is uniformly planned, which is conducive to a more reasonable design of the size of at least one component.

In a possible implementation manner, the size of the internal space of the case includes the length, width and height of the case.

In this embodiment, the internal space of the chassis is a three-dimensional body. Correspondingly, the reference unit is also a three-dimensional body, and usually components are also three-dimensional bodies. Therefore, using the reference size of the three-dimensional body can facilitate the design of the size of at least one component.

In a possible implementation manner, the at least one component is detachable.

In this embodiment, at least one component is detachable in the case, which improves the structural flexibility of the at least one component in the case to a certain extent. Moreover, when adjusting the position of the components in the chassis in the subsequent at least one component, the component can be flexibly disassembled.

In the second aspect, the embodiment of the present application provides a method for manufacturing a server, including: forming at least one component among the multiple components of the server according to the reference size of the reference unit; arranging the multiple components in the chassis to obtain the following: The server according to any one of the first aspect and possible implementation manners, wherein the position of the at least one component in the chassis is adjustable.

In a possible implementation manner, forming at least one component of the multiple components of the server according to the reference size of the reference unit includes: forming the multiple components of the server according to the reference size.

In a possible implementation manner, the method further includes: according to a first interface standard, forming hardware interfaces of some or all of the multiple components; and/or, according to a second interface standard, forming the A software interface to some or all of the plurality of components.

In a possible implementation manner, arranging the plurality of components in the case includes: respectively detachably arranging the plurality of components in the case.

In a possible implementation manner, the method further includes: performing grid processing on the chassis to obtain a plurality of grid units, wherein the size of one grid unit in the plurality of grid units is The reference size.

In a third aspect, an embodiment of the present application provides a manufacturing device for a server, including: a processing module, used to form at least one of the multiple components of the server according to a reference size, and to arrange the multiple components in the chassis In order to obtain the server according to any one of the first aspect and possible implementation manners, wherein the position of the at least one component in the chassis can be adjusted.

In a fourth aspect, the present application provides a manufacturing device for a server, the manufacturing device includes a processor, and may further include a memory, configured to implement the method described in the second aspect. The manufacturing equipment may consist of chips, or may contain chips and other discrete devices.

In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, the computer-readable storage medium is used to store a computer program, and when the computer program is run on a computer, the computer executes the computer program described in the second aspect. any one of the methods described.

In a sixth aspect, an embodiment of the present application provides a computer program product, the computer program product stores a computer program, the computer program includes program instructions, and when the program instructions are executed by a computer, the computer executes the second The method of any one of the aspects.

For the beneficial effects of the above second aspect to the sixth aspect and their implementation manners, reference may be made to the description of the beneficial effects of the first aspect and possible implementation manners thereof.

Description of drawings

FIG. 1 is a schematic diagram of an internal structure of a server provided in an embodiment of the present application;

FIG. 2A is a perspective view of a meshed chassis provided in an embodiment of the present application;

FIG. 2B is a top view of the gridded chassis in FIG. 2A provided by the embodiment of the present application;

FIG. 3A is a schematic diagram of an arrangement of a component in a chassis provided by an embodiment of the present application;

FIG. 3B is a structural schematic diagram of yet another arrangement of a component in the chassis provided by the embodiment of the present application;

FIG. 3C is a schematic diagram of another arrangement of a component in the chassis provided by the embodiment of the present application;

4A to 4D are schematic diagrams 1 of the distribution of multiple components in a server in a chassis provided by an embodiment of the present application;

Figures 5A to 5C are the second schematic diagram of the distribution of multiple components in a server in the chassis provided by the embodiment of the present application;

6A to 6C are three schematic diagrams of the distribution of multiple components in a server in the chassis provided by the embodiment of the present application;

7A to 7C are schematic diagrams 4 of the distribution of multiple components in a server in the chassis provided by the embodiment of the present application;

8A to 8C are five schematic diagrams of the distribution of multiple components in a server in a chassis according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a method for manufacturing a server provided in an embodiment of the present application;

FIG. 10 is a schematic diagram of a manufacturing server process provided by an embodiment of the present application;

FIG. 11 is a schematic structural diagram of a server manufacturing device provided in an embodiment of the present application;

FIG. 12 is a schematic structural diagram of a manufacturing device for a server provided in an embodiment of the present application.

Detailed ways

In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings. The specific operation methods in the method embodiments can also be applied to the device embodiments or system embodiments.

In the following, some terms used in the embodiments of the present application are explained, so as to facilitate the understanding of those skilled in the art.

1. The components in the embodiments of this application refer to the modules after modular design of the server, which are used to implement one or more functions of the server. A component may include one or more hardware devices in a server, for example, a component includes a motherboard and a CPU in a server. The components included in the server are, for example, one or more of a computing component, a power supply component, a cooling component, a storage component, or a peripheral component, and each component is introduced as an example below.

(1) Computing components, used to implement computing functions. For example, a computing assembly includes a motherboard and at least one CPU.

(2) The heat dissipation component is used to realize the heat dissipation function. For example, a heat dissipation assembly includes at least one fan.

(3) The storage component is used to realize the storage function. For example, a storage assembly includes disk enclosures and/or storage devices. Optionally, the storage device may be set in the server through the disk frame. The storage device includes, for example, a solid-state disk (solid-state disk, SSD) and/or a mechanical hard disk (hard disk drive, HDD).

(4) Peripheral components, used to implement functional expansion of the server. For example, a peripheral component includes a peripheral component interconnect express (PCIe) slot and/or a PCIe peripheral device and the like. Optionally, the PCIe peripheral device can be set in the server through the PCIe slot. The PCIe peripheral device includes, for example, a PCIe network card and/or a baseboard manager controller (baseboard manager controller, BMC) and the like.

It should be noted that with the continuous development of computer technology, the server may also include other components, or the server does not include the above components but includes other components, which is not limited in this embodiment of the present application. In addition, a component may have multiple names, and the names do not constitute a limitation on the characteristics of the component.

In the embodiments of the present application, for the number of nouns, unless otherwise specified, it means "singular noun or plural noun", that is, "one or more". "At least one" means one or more, and "plurality" means two or more. "And/or" describes the association relationship of associated objects, indicating that there can be three types of relationships, for example, A and/or B, which can mean: A exists alone, A and B exist at the same time, and B exists alone, where A, B can be singular or plural. The character "/" generally indicates that the contextual objects are an "or" relationship. For example, A/B means: A or B. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one item (piece) of a, b, or c means: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, c Can be single or multiple.

Unless otherwise specified, ordinal numerals such as "first" and "second" mentioned in the embodiments of this application are used to distinguish multiple objects, and are not used to limit the order, timing, priority or importance of multiple objects. For example, the "first component" and "second component" in the embodiments of the present application are used to distinguish two components, but do not limit the importance of these two components.

At present, the server includes a plurality of hardware, and the positions of the plurality of hardware in the case are fixed, that is, the server is a fixed whole machine structure, for example, the server includes a main board, and the main board can only be arranged in the case along a set direction In a specific location, the structural flexibility of the server is poor.

In view of this, an embodiment of the present application provides a server. The server includes a chassis and a plurality of components arranged in the chassis, and the size of at least one component in the plurality of components is uniformly designed according to the reference size of the reference unit, which makes it possible to flexibly plan the arrangement of at least one component in the chassis In addition, the position of at least one component in the chassis can also be flexibly adjusted, thereby improving the flexibility of the server structure. When the user's demand for the server structure changes, the user does not need to re-customize the server, and can adjust the position of at least one component in the chassis to meet the user's changed demand, which improves the utilization of multiple components in the server to a certain extent. .

The server provided by the embodiment of the present application will be introduced as an example below with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a schematic diagram of an internal structure of a server provided in an embodiment of the present application. As shown in FIG. 1 , the server 100 includes a chassis 110 and a plurality of components 120 disposed in the chassis 110 . FIG. 1 shows the structure of the server 100 that can be seen when the cover of the chassis 110 is opened. It should be noted that in FIG. 1, a plurality of components 120 includes five components 120 (the first component 121, the second component 122, the third component 123, the fourth component 124 and the fifth component 125 shown in FIG. 1 ) as an example, the number of multiple components 120 included in the server 100 is not actually limited. Among them, the plurality of components 120 are components required by the server 100 . In addition, the chassis 110 in the embodiment of the present application refers to a component for placing multiple components 120, and may also be called a server casing or the like.

In the embodiment of the present application, the size of each component 120 in at least one component 120 is designed using a reference size, the reference size is, for example, the size of a reference unit, and at least one component 120 is part or all of the multiple components included in the server 100 Components 120, which is equivalent to designing the size of at least one component 120 according to uniform rules, which facilitates the flexible arrangement of at least one component 120 in the chassis. And, the position of at least one component 120 in the chassis is also adjustable, for example, the user can adjust one component 120 in the at least one component 120 from one position in the chassis 110 to another position in the chassis 110, or at least The positions of two components 120 in one component 120 are exchanged in the chassis, thereby improving the flexibility of the structure of the server 100 .

As an example, the reference unit 130 is a three-dimensional body or a two-dimensional body, and the embodiment of the present application does not limit the shape of the reference unit 130 . For example, the reference unit 130 is a cuboid, in this case the reference size can include the length, width and height of the reference unit 130; another example, the reference unit 130 is a rectangle, in this case the reference size can include the length and width of the reference unit 130 .

The reference size of the reference unit 130 may be a fixed size, for example, one reference size is 110 millimeters (mm) in length, 50 mm in width and 40 mm in height. In the embodiment of this application, the reference size uses a fixed size, so that any server can be designed with reference to this fixed size, so that the size design standards of various servers can be unified, and when designing a server, there is no need to determine the size of the reference size separately , which simplifies the process of producing servers.

Alternatively, the reference size of the reference unit 130 may also be determined according to the size of the internal space of the chassis 110 . Optionally, the reference size of the reference unit 130 is 1/N, or approximately 1/N, of the size of the internal space of the chassis 110, where N is a positive integer. It can be understood that the internal space of the chassis 110 can be divided into N parts, and the reference size is one of them. It should be noted that when dividing the internal space of the cabinet 110, all dimensions of the size of the internal space of the cabinet 110 can be divided. For example, the dimensions of the internal space of the cabinet 110 include length, width and height. The length, width and height of the interior space are all divided. Alternatively, the dimension of the internal space of the chassis 110 is divided into some dimensions. For example, the dimension of the interior space of the chassis 110 includes length, width and height, and the length, width and height of the interior space of the chassis 110 are divided.

To divide the internal space of the chassis 110 into N parts, for example, one way of division is to perform grid processing on the internal space of the chassis 110 to obtain multiple grid units, and each grid unit is regarded as a division The obtained copy can be used as the reference unit 130 . For example, reference may be made to the schematic structural diagram of the gridded chassis 110 as shown in FIG. 2A . As shown in FIG. 2A , the gridded chassis 110 includes a plurality of grid units 200 , one grid unit 200 is used as a reference unit 130 , and the size of the reference unit 130 can be used as a reference size. Referring again to FIG. 2B , it is a top view of the meshed chassis 110 shown in FIG. 2A . As shown in FIG. 2B , the rectangle formed by the combination of endpoint A, endpoint B, endpoint C, and endpoint D can be regarded as a projection of a grid unit 200 on a certain surface of the chassis 110. Alternatively, the rectangle formed by the combination of endpoints B, D, E, and F can be regarded as a projection of a grid unit 200 on a certain surface of the chassis 110 . Wherein, both FIG. 2A and FIG. 2B represent the grid unit 200 with dotted lines.

Continuing to take Fig. 2A as an example, the length of the internal space of the cabinet 110 in Fig. 2A is 720 mm, the width is 445 mm and the height is 88 mm, and the gridded cabinet 110 includes 52 grid units 200, and one of the grids Unit 200 is 111.25mm long, 55.38mm wide and 88mm high. Correspondingly, the reference size of the reference unit 130 is 111.25 mm in length, 55.38 mm in width, and 88 mm in height.

It should be noted that the internal space of the cabinets included in different servers may have the same size, for example, the size of a standard cabinet is used, and the size of a standard cabinet is, for example, 445 mm in length, 720 mm in width, and 87 mm in height. If different servers include the same size of the inner space of the chassis, the same reference size may be used when designing different servers. Alternatively, different servers may include different dimensions of the internal space of the cabinets, and therefore different reference dimensions may be used when designing different servers.

In the embodiment of the present application, the size of each component 120 in at least one component 120 can be designed according to the reference size, which can be further understood as that there is a certain difference between the size of each component 120 in the at least one component 120 and the reference size In at least one component 120, the dimensions of different components 120 may be the same or different.

For example, the projected area of one component 120 of the at least one component 120 on the first surface inside the chassis 110 is an integer multiple of the reference size of the reference unit 130 . The first side, for example, is the side on which the components 120 are installed in the chassis 110, and it can also be understood that when the server 100 is placed on the rack, the first side is the one of the inner surfaces in the chassis 110 that is relatively closest to the rack. The inner surface. Alternatively, when the server 100 is placed on the rack, the first surface is one of the outer surfaces in the chassis 110 that is relatively closest to the rack. Alternatively, the first side may also be the other side opposite to the side inside the chassis 110 for setting the components 120 .

Please continue to refer to FIG. 1 , for example, the first surface 140 is a surface for setting the component 120 in the chassis 110 . The projected area of the second component 122 on the first surface 140 is 6 times the projected area of the reference unit 130 on the first surface 140, and the projected area of the third component 123 on the first surface 140 is 6 times that of the reference unit 130 on the first surface 140. 24 times the projected area on surface 140.

Since multiple components 120 need to be arranged in the case 110 , the size of the multiple components 120 has a certain relationship with the size of the inner space of the case 110 . For example, the total size of the plurality of components 120 is less than or equal to the size of the chassis 110. In the embodiment of the present application, if the reference size is 1/N of the internal space of the chassis 110, then the plurality of components 120 included in the server 100 are in the first The sum of the projected areas on the surfaces may be less than or equal to N times the projected area of the reference unit 130 on the first surface. For another example, the height of one or more components 120 among the plurality of components 120 may be smaller than the height of the internal space of the chassis 110 .

Since multiple components 120 need to be installed in the chassis 110, the size of a certain component 120 among the multiple components 120 can also have a certain relationship with the size of other components 120, and this relationship can be set according to user needs. This is not limited. For example, the plurality of components 120 includes a storage component and a peripheral component, the peripheral component has a length of X, a width of Y and a height of Z, and the storage component has a length of 2X, a width of Y, and a height of Z.

In the embodiment of the present application, designing the size of at least one component 120 according to the reference size is equivalent to uniformly planning the size of at least one component 120 , which is conducive to a more reasonable allocation of the size of the internal space of the chassis 110 . Moreover, it is also beneficial to more flexibly arrange at least one component 120 in the chassis 110 .

In the embodiment of the present application, the position of at least one component 120 in the chassis 110 is adjustable. In order to adjust the position of the at least one component 120 in the chassis 110 , it is also necessary to consider the arrangement of the at least one component 120 in the chassis 110 , and the following examples introduce several arrangement ways.

Setting way one, at least one component 120 is detachably set in the chassis 110 . Wherein, the following takes a detachable arrangement of a component 120 in the case 110 as an example to introduce the detachable arrangement manner.

Please refer to FIG. 3A and FIG. 3B , which show two configurations of a component 120 in the chassis 110 in the embodiment of the present application. As shown in FIG. 3A , a groove 310 is disposed in the chassis 110 , and the assembly 120 is locked in the chassis 110 through the groove 310 .

Alternatively, as shown in FIG. 3B , there are one or more mounting holes (not separately shown in FIG. 3B ) provided in the chassis 110 , and a component 120 is disposed in the chassis 110 through the mounting holes through the mounting member 320 . The installation part 320 is, for example, a copper post or the like.

Optionally, if the projected area of each component 120 in the at least one component 120 on the first surface in the chassis 110 is an integer multiple of the projected area of the reference unit 130 on the first surface, the reference size is the The size of the grid unit 200 obtained by dividing the internal space (or in other words, using the grid unit 200 as the reference unit 130), and the shape of the reference unit is a cuboid, then one or more grid units 200 that can be included in the chassis 110 Mounting holes are provided at endpoints on the first face inside the chassis 110 . In this way, on the one hand, it is convenient to locate the installation position of at least one component 120 in the chassis 110; on the other hand, one grid unit 200 can be used as a step size to move some or all of the at least one component 120 in the chassis 110 120, so that it is convenient to adjust the position of at least one component 120 in the chassis 110.

For example, continue referring to FIG. 2B. The end point A, end point B, end point C, end point D, end point E and end point F of a grid unit 200 in the chassis 110 are all provided with installation holes, and the projected area of a component 120 on the first surface is the grid unit 200 on the first surface, then the component 120 can be fixed to the grid unit corresponding to endpoint A, endpoint B, endpoint C, and endpoint D through the installation holes at endpoint A, endpoint B, endpoint C, and endpoint D 200 places. By moving, the component 120 can also be adjusted to the grid unit 200 corresponding to the endpoint B, endpoint D, endpoint E, and endpoint F, and through the installation holes provided at the endpoint B, endpoint D, endpoint E, and endpoint F, the The component 120 is fixed at the grid unit 200 corresponding to the endpoint B, the endpoint D, the endpoint E, and the endpoint F.

In configuration one, at least one component 120 is detachably disposed in the chassis 110 . Therefore, if it is necessary to adjust the position of a certain component 120 in the chassis 110 in at least one component 120, the component 120 can be directly removed from the chassis 110, and the component 120 can be reinstalled in other positions in the chassis 110, thereby Adjusting the position of the component 120 in the chassis 110 is realized.

Setting method 2, please refer to FIG. 3C , which is another structural schematic diagram of a component 120 provided in the embodiment of the present application provided in the chassis 110 . As shown in FIG. 3C , the component 120 is disposed on the slide rail 330 in the case 110 and fixed in the case 110 through a position member 340 .

For example, the shifter 340 can be arranged in the cabinet 110 and pass through the slide rail 330 to fix the assembly 120 on the slide rail 330. When the sliding assembly 120 is needed, the shifter 340 can be manually retracted to realize the assembly 120. slide. Or for example, for example, the shift member 340 is detachably fixed on the slide rail 330, and the shift member 340 can be detached to realize the movement of the assembly 120 on the slide rail 330. When the position of the assembly 120 needs to be fixed, the shift member can be used. 340 fixes assembly 120 on slide rail 330 .

Optionally, the width of the slide rail 330 may be less than or equal to the threshold, so that multiple slide rails 330 can be arranged in the cabinet 110 .

In setting mode 2, if it is necessary to adjust the position of a component 120 in the chassis 110, the gear member 340 corresponding to the component 120 can be directly retracted or removed, and the component 120 can be slid to the corresponding position, and then through the gear position The component 340 fixes the component 120, so that the position of the component 120 in the chassis 110 can be adjusted. Moreover, in this setting manner, when adjusting the position of the assembly 120 in the chassis 110 , it is not necessary to disassemble the assembly 120 , which avoids possible damage to the assembly 120 caused by the disassembly of the assembly 120 .

It should be noted that, besides the above two arrangement manners, there may be various arrangement manners of at least one component 120 in the chassis 110 , which are not limited in this embodiment of the present application.

During the use of the server 100, some components 120 may fail or be damaged, which may involve the maintenance of the components 120. Optionally, in order to reduce the difficulty of maintenance, multiple components 120 in the embodiment of the present application may be Hardware interfaces (interfaces) of some or all components 120 adopt the first interface standard. The first interface standard defines the shape of a physical connector used for communication between two components 120, and/or the way (such as a protocol) for the components 120 to send and receive signals, and the like. Wherein, a physical connector is used to realize the connection between two components 120 . The first interface standard can be an existing interface standard, for example, PCIe, general-purpose U.2, or high-speed M.2, etc., or the first interface standard can also adopt other interface standards produced by future evolving communication technologies, the present application The embodiment does not limit this.

In the embodiment of the present application, since the hardware interface standard adopted by some or all components 120 is uniform, the hardware compatibility among some or all components 120 is higher. Moreover, after a certain component 120 is damaged, it can be replaced with a component 120 having the same type of hardware interface standard, which reduces the maintenance cost of the server 100 . Moreover, when the component 120 needs to be updated, the original component 120 can also be replaced with an updated component 120 with the same type of hardware interface standard, thereby reducing the difficulty of upgrading the component 120 of the server 100 . For example, if the server 100 needs to be upgraded from a 6th-generation CPU to a 7th-generation CPU, then the 6th-generation CPU in the server can be directly replaced with a 7th-generation CPU.

It should be noted that part or all of the components 120 in the embodiment of the present application are, for example, components 120 that need to be configured with a hardware interface. If some components 120 among the plurality of components 120 do not need to set hardware interfaces, the hardware interface standards of these components 120 may not need to be considered.

Optionally, the software interface between any two components 120 among some or all of the multiple components 120 in the embodiment of the present application may adopt the second interface standard.

Exemplarily, the second interface standard defines a communication method between one or more software modules in the component 120 . The second interface standard may be an existing interface standard, for example, an intelligent platform management interface (intelligent platform management interface, IPMI), etc., or the second interface standard may also adopt other interface standards produced by future evolving communication technologies. The embodiment does not limit this.

It should be noted that some or all of the components 120 in the embodiment of the present application are components 120 that need to set software interfaces. standard.

In the embodiment of the present application, since the software interfaces of some or all components 120 are unified, communication between software modules inside the component 120 is facilitated, and incompatibility of software modules inside the component 120 is reduced. Moreover, since the communication between the two components 120 also involves the communication between the software modules inside the component 120, the communication between the software modules inside the component 120 is unified, which is also beneficial to improve the communication between the components 120 and the components 120. communication efficiency between them.

Since the position of at least one component 120 in the server 100 can be adjusted in the chassis 110 , there may be multiple ways of distributing the at least one component 120 in the chassis 110 .

The first distribution method.

Please refer to FIG. 4A, FIG. 4B, FIG. 4C and FIG. 4D, which are a schematic diagram of the distribution of multiple components 120 in the chassis 110 provided by the embodiment of the present application, wherein FIG. 4A is a schematic diagram of the multiple components 120 provided by the embodiment of the present application Front view in the chassis 110, Figure 4B is a left view of multiple components 120 in the chassis provided by the embodiment of the present application, Figure 4C is a right view of multiple components 120 in the chassis provided by the embodiment of the present application, Figure 4D A perspective view of a plurality of components 120 inside a chassis provided for the embodiment of the present application. As shown in FIGS. 4A to 4D , a plurality of components 120 including a storage component 401 , a computing component 402 , a cooling component 403 , a peripheral component 404 and a power supply component 405 are taken as an example. Wherein, the storage component 401 is visible in the second face 400 .

The second surface 400 refers to the outer surface of the chassis 110 used for human-computer interaction. The outer surface used for human-computer interaction refers to the side that is visible to the user after the server 100 is installed on the rack. For example, the outer surface is The case 100 is provided with a side of input devices such as keys. The storage component 401 is visible on the second surface 400, it can be understood that the user can see part or all of the structure of the storage component 401 through the second surface 400, and it can be further understood that the storage component 401 is relative to other components 120 , which is closer to the second face 400 . Other components 120 include, for example, one or more of a computing component 402 , a cooling component 403 , a peripheral component 404 or a power supply component 405 .

As shown in FIG. 4D , cooling holes 410 and buttons 420 are provided on the second surface 400 of the chassis 110 , and the user can see the storage component 401 disposed inside the chassis 110 through the cooling holes 410 .

In order to more clearly illustrate the structure of the server 100 shown in FIGS. 4A-4D , the following will be introduced in conjunction with the schematic distribution diagrams of multiple components 120 in the chassis 110 shown in FIGS. 5A-5C . 5A is a top view of a plurality of components 120 in the chassis 110, b in FIG. 4C is a left view of a plurality of components 120 in the chassis 110, and c in FIG.

Exemplarily, in FIGS. 5A to 5C , the storage component 401 includes a first disk frame 531 and a second disk frame 532 , the computing component 402 includes a motherboard 533 and a CPU 534 , the cooling component 403 includes a fan 535 , and the peripheral component 404 includes a second A PCIe slot 536, a second PCIe slot 537 and a BMC 539, the power supply component 405 includes a power supply 538 as an example. The first disk frame 531 and the second disk frame 532 can be used to house SSDs and/or HDDs (not shown separately in FIGS. 5A-5C ). Optionally, the peripheral component 404 may also include a PCIe network card (not shown separately in FIGS. 5A-5C ) and the like.

Users can adjust the structure in the server shown in FIG. 5A to FIG. 5C to meet the needs of different users. Examples are introduced below.

For example, user A needs a dual-socket Xeon

CPU, but SSD and HDD are not required, and a 25G network card needs to be connected, then the motherboard 533 in Figure 5A can use a Xeon motherboard, and the CPU534 can use a dual-way Xeon

CPU, peripheral component 404 selects network card and BMC539, connects these hardwares together according to certain rules, and loads required management software and basic input output system (basic input output system, BIOS), etc., thereby can obtain user A required server 100.

For another example, user B needs to use an advanced risc machine (ARM) architecture server without local storage and needs a 25G network card. Then the main board 533 and CPU 534 in FIG. 4C can be kept, the storage component 401 can be removed, and the peripheral component 404 can select the network card and BMC, and set these hardwares in the chassis 110 to obtain the server 100 required by user B.

The second distribution method.

Please refer to FIG. 6A to FIG. 6C , which are schematic diagrams of the distribution of multiple components 120 in the chassis 110 provided by the embodiment of the present application. 6A shows a front view of multiple components 120 in the chassis 110, FIG. 6B shows a left view of multiple components 120 in the chassis 110, and FIG. 6C shows a right view of multiple components 120 in the chassis 110. Different from FIG. 4A , the power supply component 405 in the embodiment of the present application is visible on the second surface 400 .

The meaning of the second surface 400 can be referred to above. The power supply component 405 is visible on the second surface 400. It can be understood that the user can see part or all of the structure of the power supply component 405 through the second surface 400. It can also be understood that the power supply component 405 is closer to the second surface than other components 120. , the other components 120 include one or more of a storage component 401 , a computing component 402 , a cooling component 403 or a peripheral component 404 .

Optionally, the specific implementation of the storage component 401 , the computing component 402 , the cooling component 403 , the peripheral component 404 and the power supply component 405 may refer to the examples shown in FIG. 5A to FIG. 5C .

The third distribution method.

Please refer to FIGS. 7A-7C , which are schematic diagrams of the distribution of multiple components 120 in the chassis 110 provided by the embodiment of the present application. 7A shows a front view of multiple components 120 in the cabinet 110, FIG. 7B shows a left view of the distribution of multiple components 120 in the cabinet 110, and FIG. 7C shows a right view of the distribution of multiple components 120 in the cabinet 110. As shown in FIGS. 7A-7C , the storage component 401 and the peripheral component 404 are visible in the second face 400 . The meaning of the second surface 400 can be referred to above. The storage component 401 and the peripheral component 404 are visible on the second surface 400. It can be understood that the user can see part or all of the structure of the storage component 401 and part or all of the structure of the peripheral component 404 through the second surface 400. It can also be understood For the storage component 401 and the peripheral component 404 to be closer to the second surface than the other component 120 , the other component 120 includes one or more of the computing component 402 , the cooling component 403 or the power supply component 405 .

The fourth distribution method.

Please refer to FIG. 8A to FIG. 8C , which are schematic diagrams of the distribution of multiple components 120 in the chassis 110 provided by the embodiment of the present application. 8A shows a front view of multiple components 120 in the chassis 110, FIG. 8B shows a left view of multiple components 120 in the chassis 110, and FIG. As shown in FIGS. 8A-8C , the power supply component 405 and the peripheral component 404 are visible in the second side 400 . The meaning of the second surface 400 can be referred to above. The power supply component 405 and the peripheral component 404 are visible on the second surface 400. It can be understood that the user can see part or all of the structure of the power supply component 405 and part or all of the structure of the peripheral component 404 through the second surface 400. It can also be understood The other components 120 include one or more of the computing component 402 , the cooling component 403 or the storage component 401 so that the power supply component 405 and the peripheral component 404 are closer to the second surface than the other components 120 .

Exemplarily, the types of components 120 included in the servers shown in Figures 4A-4D, 5A-5C, 6A-6C and 7A-7C are the same, and the main difference is that the components 120 included in the servers The location is different. In the actual application process, the user can adjust the position of the component 120 in any server in Figures 4A to 4D, Figures 5A to 5C, Figures 6A to 6C, and Figures 7A to 7C to obtain the 4D, another server in FIGS. 5A to 5C, 6A to 6C, and 7A to 7C. For example, the user can obtain the server shown in FIGS. 7A-7C by adjusting the peripheral components 404 shown in FIGS. 4A-4D to a position relatively close to the second surface 400 . Or for example, after the user swaps the positions of the storage component 401 and the power supply component 405 shown in FIGS. server. Or for example, the user can obtain the server shown in FIGS. 8A-8C by exchanging the positions of the storage component 401 and the power supply component 405 in FIGS. 6A-6C .

It should be noted that the server 100 in the embodiment of the present application may be an ARM architecture server, or an X86 architecture server. By replacing other components in the server, an X86-based server can be obtained. In addition, if a certain component of the server 100 in the embodiment of the present application needs to be updated, the updated component 120 can be directly replaced in the server 100, and it can continue to be used, which also reduces the cost of updating the server 100. difficulty.

An embodiment of the present application further provides a rack server, where the rack server includes one or more of any one of the servers discussed above.

An embodiment of the present application further provides a blade server, where the blade server includes one or more of any one of the servers discussed above.

An embodiment of the present application also provides a data center, where the data center includes one or more servers described above. Optionally, besides the server, the data center also includes devices such as switches.

The embodiment of the present application also provides a method for manufacturing a server. The manufacturing method of the server may be executed by a manufacturing device, and the manufacturing device may be realized by a device having processing capability, for example, a production device. The server manufacturing method can be used to manufacture any server as discussed above. Please refer to FIG. 9 , which is a schematic flowchart of the manufacturing method of the server. It should be noted that, in FIG. 9 , the manufacturing method of the server executed by the manufacturing equipment is taken as an example for introduction.

S91. Form at least one component among the multiple components of the server according to the reference size. Wherein, the meaning of the reference size can refer to the above.

Exemplarily, the manufacturing equipment grids the internal space of the chassis 110 to obtain multiple grid units, and the manufacturing equipment uses one grid unit as a reference unit 130 to obtain the reference size of the reference unit 130 .

The manufacturing equipment may design the size of at least one of the plurality of components according to the reference size. At least one component is formed according to the size of the at least one component.

For example, please refer to FIG. 10 , which is a schematic diagram of a manufacturing server process provided by an embodiment of the present application. As shown in FIG. 10 , the manufacturing equipment may design the size of at least one component 120 of the server with reference to the reference size of the unit 130 . In FIG. 10 , it is taken as an example that at least one component 120 includes two components 120 .

Optionally, the manufacturing equipment may form hardware interfaces of some or all of the multiple components 120 according to the first interface standard. The manufacturing equipment may also form software interfaces of some or all of the multiple components 120 according to the second interface standard, so as to realize the standardization of the software interfaces of the components.

S92, arranging a plurality of components in the case to obtain a server, the position of the at least one component in the case can be adjusted.

Continue as shown in Figure 10, the manufacturing equipment arranges multiple components 120 in the cabinet 110, and the position of at least one component 120 in the multiple components 120 in the cabinet 110 is adjustable, thereby completing the assembly of the complete machine, thereby Get a server. For the specific manner of disposing the plurality of components 120 in the chassis 110, reference may be made to the foregoing.

Since the user's requirements for the position of multiple components 120 in the chassis 110 may change, in this embodiment of the application, the manufacturing equipment can adjust the position of some components 120 in the chassis 110, for example, the manufacturing equipment can exchange two components 120 in the chassis 110, or the position of a certain component 120 in the chassis can be adjusted to meet the new user requirements of the user.

In the embodiment shown in FIG. 10 , a method for manufacturing a server is provided, which is equivalent to performing a modular design on the server to form a plurality of components 120 , and the server is generated by combining the components 120 . Moreover, the server manufacturing method in the embodiment of the present application can be used to produce servers with different architectures. By unifying the software interfaces and/or hardware interfaces of multiple components 120, components 120 of different platforms or manufacturers can be compatible with each other, reducing the The cost of production servers. Moreover, the position of the components in the chassis can be adjusted later to meet the needs of different users.

FIG. 11 shows a schematic structural diagram of a server manufacturing device 1100 . Among them, the manufacturing device 1100 of the server can be applied to the manufacturing equipment, or a device in the manufacturing equipment, which can realize the function of the manufacturing equipment in the method provided by the embodiment of this application; the manufacturing device can also be able to support the storage system to realize the embodiment of the application Provided are methods of manufacturing device functional means. The server manufacturing device 1100 may be a hardware structure, a software module, or a hardware structure plus a software module. The server manufacturing device 1100 may be realized by a chip system. In the embodiment of the present application, the system-on-a-chip may be composed of chips, or may include chips and other discrete devices.

The server manufacturing device 1100 may include a processing module 1101 . Optionally, the manufacturing device further includes a communication module 1102, which is indicated by a dashed box in FIG. 11 .

The processing module 1101 may be used to execute S91 and S92 in the embodiment shown in FIG. 9 , and may also be used to support other processes of the technology described herein. The communication module 1102 is used for the manufacturing device 1100 of the server to communicate with other modules, which may be a circuit, device, interface, bus, software module, transceiver or any other device capable of realizing communication.

Wherein, all relevant content of each step involved in the above-mentioned method embodiment can be referred to the function description of the corresponding function module, and will not be repeated here.

The division of modules in the embodiments of the present application is schematic, and is only a logical function division. There may be other division methods in actual implementation. In addition, each functional module in each embodiment of the present application can be integrated into a processing In the controller, it can also be physically present separately, or two or more modules can be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software function modules.

As shown in Figure 12, the manufacturing equipment 1200 of the server provided by the embodiment of the present application, wherein the manufacturing equipment 1200 of the server can be the manufacturing equipment in the embodiment shown in Figure 9, or the device of the manufacturing equipment, which can realize the application The function of the manufacturing device in the embodiment shown in FIG. 9; the manufacturing device 1200 of the server may also be a device capable of supporting the storage system to realize the function of the manufacturing device in the method provided in the embodiment shown in FIG. 9 of this application. Wherein, the server manufacturing equipment 1200 may be a chip system. In the embodiment of the present application, the system-on-a-chip may be composed of chips, or may include chips and other discrete devices.

The manufacturing device 1200 of the server includes at least one processor 1201 for implementing or supporting the manufacturing device 1200 of the server to implement the functions of the manufacturing device in FIG. 9 of the present application. Exemplarily, the processor 1201 may form at least one component among multiple components of the server according to a reference size. For details, refer to the detailed description in the method example, and details are not repeated here.

The server manufacturing device 1200 may further include a communication interface 1202 for communicating with other devices through a transmission medium, so that the server manufacturing device 1200 communicates with other devices. Exemplarily, the other device may be a server. The processor 1201 can use the communication interface 1202 to send and receive data.

The server manufacturing device 1200 may also include at least one memory 1203 for storing program instructions and/or data. The memory 1203 is coupled to the processor 1201. The coupling in the embodiments of the present application is an indirect coupling or a communication connection between devices, units or modules, which may be in electrical, mechanical or other forms, and is used for information exchange between devices, units or modules. The processor 1201 may cooperate with the memory 1203 . Processor 1201 may execute program instructions stored in memory 1203 . At least one of the at least one memory 1203 may be included in the processor 1201 . When the processor 1201 executes the program instructions in the memory 1203, the method for manufacturing a server in any one of the embodiments shown in FIG. 9 may be implemented.

As an example, the memory 1203 in FIG. 12 is an optional part, which is indicated by a dashed box in FIG. 12 . For example, the memory 1203 is coupled with the processor 1201.

The embodiment of the present application does not limit the specific connection medium among the communication interface 1202, the processor 1201, and the memory 1203. In the embodiment of the present application, in FIG. 12, the communication interface 1202, the processor 1201, and the memory 1203 are connected through the bus 1204. The bus is represented by a thick line in FIG. 12, and the connection between other components is only for schematic illustration. , is not limited. The bus can be divided into address bus, data bus, control bus and so on. For ease of representation, only one thick line is used in FIG. 12 , but it does not mean that there is only one bus or one type of bus.

In this embodiment of the application, the processor 1201 may be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component, and may implement Or execute the methods, steps and logic block diagrams disclosed in the embodiments of the present application. A general purpose processor may be a microprocessor or any conventional processor or the like. The steps of the methods disclosed in connection with the embodiments of the present application may be implemented by a hardware processor, or by a combination of hardware and software modules in the processor.

In the embodiment of the present application, the memory 1203 may be a non-volatile memory, such as a hard disk (hard disk drive, HDD) or a solid-state drive (solid-state drive, SSD), etc., and may also be a volatile memory (volatile memory), For example random-access memory (random-access memory, RAM). A memory is, but is not limited to, any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. The memory in the embodiment of the present application may also be a circuit or any other device capable of implementing a storage function, and is used for storing program instructions and/or data.

An embodiment of the present application also provides a computer-readable storage medium, which is used to store a computer program. When the computer program is run on a computer, the computer can execute any of the embodiments shown in FIG. 9 . A method for manufacturing a server.

An embodiment of the present application also provides a computer program product, the computer program product stores a computer program, the computer program includes program instructions, and when the program instructions are executed by a computer, the computer executes any of the embodiments shown in FIG. 9 . A method for manufacturing a server.

An embodiment of the present application provides a system-on-a-chip, where the system-on-a-chip includes a processor and may further include a memory, configured to implement the functions of the manufacturing device in the foregoing method. The system-on-a-chip may consist of chips, or may include chips and other discrete devices.

The methods provided in the embodiments of the present application may be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on the computer, the processes or functions according to the embodiments of the present application will be generated in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, network equipment, user equipment or other programmable devices. The computer instructions may be stored in or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website, computer, server or data center Transmission to another website site, computer, server, or data center by wired (such as coaxial cable, optical fiber, digital subscriber line (DSL) or wireless (such as infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. integrated with one or more available media. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a magnetic tape), optical media (for example, digital video disc (digital video disc, DVD for short)), or semiconductor media (for example, SSD).

Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

A server, characterized in that it comprises:

Chassis;

A plurality of components are arranged in the case, wherein the size of at least one component is designed based on the reference size of the reference unit, and the position of the at least one component in the case can be adjusted.
The server according to claim 1, wherein the size of each component in the plurality of components is respectively determined according to the reference size.
The server according to claim 1 or 2, wherein the projected area of the at least one component on the first surface of the chassis is an integer multiple of the projected area of the reference unit on the first surface .
The server according to any one of claims 1-3, characterized in that,

The hardware interfaces of some or all of the components adopt the first interface standard; and/or,

The software interfaces of some or all of the multiple components adopt the second interface standard.
The server according to any one of claims 1-4, wherein the multiple components include any two of the following components and combinations thereof:

Power supply components, cooling components, storage components, peripheral components and computing components.
The server according to claim 5, wherein the second side of the chassis is used for human-computer interaction;

said storage component is visible in said second face; or,

the power supply assembly is visible in the second face; or,

the storage component and the peripheral component are visible in the second face; or,

The power supply component and the peripheral component are visible in the second face.
The server according to any one of claims 1-6, wherein the reference size is 1/N of the size of the internal space of the chassis, where N is a positive integer.
The server according to claim 7, wherein the size of the internal space of the case includes the length, width and height of the case.
The server according to any one of claims 1-8, wherein the at least one component is detachable.
A method for manufacturing a server, comprising:

forming at least one of the plurality of components of the server according to the reference dimensions of the reference unit;

Arranging the plurality of components in the case to obtain the server according to any one of claims 1-8, wherein the position of the at least one component in the case can be adjusted.