CN116414191A

CN116414191A - Server and manufacturing method thereof

Info

Publication number: CN116414191A
Application number: CN202111664061.4A
Authority: CN
Inventors: 郭海涛; 刘洪广
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2023-07-11
Also published as: WO2023125549A1

Abstract

The application provides a server and a manufacturing method thereof, and relates to the technical field of machinery. The server comprises a chassis and a plurality of components arranged in the chassis, wherein the size of at least one component in the plurality of components is designed based on the reference size of the reference unit, and the position of at least one component in the chassis is adjustable.

Description

Server and manufacturing method thereof

Technical Field

The present disclosure relates to the field of mechanical technologies, and in particular, to a server and a method for manufacturing the same.

Background

The server is used for providing computing and/or storage services for users through the network as medium. The servers include hardware such as a motherboard (e.g., motherboard includes memory, on-board network and management interfaces, etc.), peripheral component interconnect (peripheral component interconnect express, PCIe) slots, a central processing unit (central processing unit, CPU), power supplies, fans, disk frames, and various PCIe peripherals.

Currently, a production server is generally customized based on user requirements, for example, hardware required by the server and an installation position of the hardware in the server are fixed, which enables a structure of the server to better adapt to the user requirements, but also results in poor flexibility of the structure of the server.

Disclosure of Invention

The embodiment of the application provides a server and a manufacturing method thereof, which are used for improving the structural flexibility of the server.

In a first aspect, an embodiment of the present application provides a server, including: the device comprises a chassis and a plurality of components arranged in the chassis, wherein the size of at least one component in the plurality of components is designed based on the reference size of the reference unit, and the position of the at least one component in the chassis is adjustable.

In this embodiment of the present application, the size of at least one component in the server is designed uniformly according to the reference size, which is equivalent to uniformly planning the size of at least one component, so that the arrangement of at least one component in the chassis is more flexible. In addition, the position of at least one component in the chassis is adjustable, for example, a user can adjust the position of a certain component in the at least one component in the chassis, or interchange the positions of two components in the at least one component in the chassis, etc., so that the flexibility of the server structure is further improved.

In a possible embodiment, the dimensions of each of the plurality of components are determined separately from the reference dimensions.

In this embodiment, the dimensions of the plurality of components are uniformly planned according to the reference dimensions, so as to provide various arrangements of the plurality of components in the chassis, and also more reasonably plan the internal space of the chassis.

In one possible embodiment, the projected area of the at least one component on the first face of the chassis is an integer multiple of the projected area of the reference unit on the first face.

In this embodiment, since the projected area of the at least one component on the first surface of the chassis is an integer multiple of the projected area of the reference unit on the first surface, it is convenient to design the size of the at least one component according to the reference unit, and it is convenient to adjust the position of the at least one component in the chassis according to the reference size of the reference unit.

In one possible implementation, the hardware interfaces of some or all of the plurality of components employ a first interface standard; and/or software interfaces of some or all of the plurality of components employ a second interface standard.

In this embodiment, the hardware interfaces of some or all of the plurality of components may employ a unified standard, which facilitates improving hardware compatibility between the plurality of components. And once a certain component is damaged, the component with the first interface standard can be used for replacement, so that the difficulty in maintaining the component is reduced. In addition, the software interfaces of some or all of the components can also adopt unified standards, which is beneficial to improving the software compatibility among some or all of the components. And, if one component is damaged, the component with the second interface standard can be used for replacement, and the difficulty of maintaining the component can be reduced.

In one possible embodiment, the plurality of components includes any two of the following components and combinations thereof: the device comprises a power supply component, a heat dissipation component, a storage component, a peripheral component and a computing component.

The embodiment provides various implementation forms of a plurality of components, and enriches the implementation forms of the plurality of components. And the user can select the required components to form the server, so that the requirements of different users on the components of the server can be met.

In one possible implementation manner, the second surface of the case is used for man-machine interaction; the storage component is visible in the second face; or, the power supply assembly is visible in the second face; or, the storage component and the peripheral component are visible in the second face; or, the power supply component and the peripheral component are visible in the second face.

In this embodiment, several possible configurations of the server are provided, a certain component being visible in the second side of the man-machine interaction, it being understood that after the server is arranged on the rack, the component is relatively closer to the user, which facilitates a quick maintenance of the component by the user, and/or increasing or decreasing the number of components, etc., e.g. the power supply component being visible in the second side, facilitating a quick maintenance of the power supply component by the user, etc.

In one possible implementation, the reference size is 1/N of the size of the internal space of the chassis, and N is a positive integer.

In this embodiment, the reference size may be set according to the size of the internal space of the cabinet, the reference size is taken as 1/N of the size of the internal space of the cabinet, and the size of the at least one component is designed according to the reference size, so that the size of the at least one component is uniformly planned according to the size of the internal space of the cabinet, which is advantageous for more reasonably designing the size of the at least one component.

In one possible embodiment, the dimensions of the interior space of the chassis include the length, width, and height of the chassis.

In this embodiment, the internal space of the cabinet is a three-dimensional body, and accordingly, the reference unit is also a three-dimensional body, and the component is also a three-dimensional body in general, so that the size of at least one component can be easily designed by adopting the reference size of the three-dimensional body.

In one possible embodiment, the at least one component is detachable.

In this embodiment, at least one component is removable within the chassis, which increases the structural flexibility of the at least one component within the chassis to some extent. And, when the position of the component in at least one component in the machine case is adjusted later, the component can be flexibly disassembled.

In a second aspect, an embodiment of the present application provides a method for manufacturing a server, including: forming at least one component of a plurality of components of the server according to a reference size of the reference unit; the plurality of components are disposed within a chassis to obtain the server according to any one of the first aspect and possible implementation manners, wherein a position of the at least one component within the chassis is adjustable.

In one possible embodiment, forming at least one component of the plurality of components of the server according to the reference size of the reference unit includes: the plurality of components of the server are formed according to the reference size.

In one possible embodiment, the method further comprises: forming hardware interfaces of some or all of the plurality of components according to a first interface standard; and/or, according to a second interface standard, forming a software interface of some or all of the plurality of components.

In one possible implementation, the disposing the plurality of components within the chassis includes: the plurality of components are respectively and detachably arranged in the chassis.

In one possible embodiment, the method further comprises: and carrying out gridding processing on the chassis to obtain a plurality of grid cells, wherein the size of one grid cell in the plurality of grid cells is the reference size.

In a third aspect, an embodiment of the present application provides a manufacturing apparatus for a server, including: a processing module for forming at least one component of a plurality of components of a server according to a reference size, and for arranging the plurality of components within a chassis to obtain the server according to any one of the first aspect and possible implementation manners, wherein a position of the at least one component within the chassis is adjustable.

In a fourth aspect, the present application provides a manufacturing apparatus for a server, where the manufacturing apparatus includes a processor and may further include a memory, to implement the method of the second aspect. The fabrication facility may be comprised of chips, or may include chips and other discrete devices.

In a fifth aspect, embodiments of the present application provide a computer-readable storage medium for storing a computer program which, when run on a computer, causes the computer to perform the method of any one of the second aspects.

In a sixth aspect, embodiments of the present application provide a computer program product storing a computer program comprising program instructions which, when executed by a computer, cause the computer to perform the method of any of the second aspects.

Advantageous effects of the above second to sixth aspects and implementations thereof reference may be made to the description of the advantageous effects of the first aspect and possible implementations thereof.

Drawings

Fig. 1 is a schematic diagram of an internal structure of a server according to an embodiment of the present application;

fig. 2A is a perspective view of a meshed chassis according to an embodiment of the present disclosure;

fig. 2B is a top view of the meshed chassis in fig. 2A according to an embodiment of the present disclosure;

fig. 3A is a schematic view of an arrangement structure of a component in a chassis according to an embodiment of the present application;

FIG. 3B is a schematic diagram of another arrangement of components in a chassis according to an embodiment of the present disclosure;

FIG. 3C is a schematic view of another arrangement of components in a chassis according to an embodiment of the present disclosure;

fig. 4A to fig. 4D are schematic diagrams illustrating distribution of multiple components in a chassis in a server according to an embodiment of the present application;

Fig. 5A to fig. 5C are second schematic diagrams of distribution of multiple components in a chassis in a server according to an embodiment of the present application;

fig. 6A to fig. 6C are a third schematic diagram of distribution of multiple components in a chassis in a server according to an embodiment of the present application;

fig. 7A to 7C are schematic diagrams showing distribution of multiple components in a chassis in a server according to an embodiment of the present application;

fig. 8A to 8C are schematic diagrams showing distribution of multiple components in a server in a chassis according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a method for manufacturing a server according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram of a process for manufacturing a server according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a manufacturing apparatus of a server according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a manufacturing apparatus of a server according to an embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings. The specific method of operation in the method embodiment may also be applied to the device embodiment or the system embodiment.

In the following, some terms in the embodiments of the present application are explained for easy understanding by those skilled in the art.

1. The components in the embodiments of the present application refer to modules after a server is modularly designed, which are used to implement one or more functions of the server. One component may include one or more hardware devices in the server, e.g., one component includes a motherboard and a CPU in the server. The server includes components such as one or more of a computing component, a power supply component, a heat dissipation component, a storage component, or a peripheral component, each of which is described below by way of example.

(1) And the computing component is used for realizing the computing function. For example, a computing component includes a motherboard and at least one CPU.

(2) And the heat dissipation assembly is used for realizing a heat dissipation function. For example, a heat dissipating assembly includes at least one fan.

(3) And the storage component is used for realizing the storage function. For example, a storage component includes a disk frame and/or a storage device. Alternatively, the storage device may be provided in the server through a disk frame. Storage devices include, for example, solid-state disks (SSDs) and/or mechanical hard disks (HDDs).

(4) And the peripheral component is used for realizing the function expansion of the server. For example, one type of peripheral component includes a peripheral component interconnect (peripheral component interconnect express, PCIe) slot and/or PCIe peripheral device, etc. Alternatively, the PCIe peripheral device may be disposed in the server through a PCIe slot. PCIe peripherals include, for example, PCIe network cards and/or baseboard management controllers (baseboard manager controller, BMC), and the like.

It should be noted that, with the development of computer technology, the server may further include other more components, or the server does not include the above components, but includes other components, which are not limited in the embodiments of the present application. In addition, a component may have multiple names, and the names do not constitute limitations on the characteristics of the component.

In the embodiments of the present application, the number of nouns, unless otherwise indicated, means "a singular noun or a plural noun", i.e. "one or more". "at least one" means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. For example, A/B, means: a or B. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b, or c, represents: a, b, c, a and b, a and c, b and c, or a and b and c, wherein a, b, c may be single or plural.

Unless specifically stated otherwise, ordinal terms such as "first," "second," and the like in the embodiments of the present application are used for distinguishing a plurality of objects, and are not used for defining the order, timing, priority, or importance of a plurality of objects, for example, "first component" and "second component" in the embodiments of the present application are used for distinguishing two components, but are not limited to the importance of the two components.

Currently, a server includes a plurality of pieces of hardware, and the positions of the plurality of pieces of hardware in a chassis are fixed, that is, the server is a fixed overall structure, for example, the server includes a motherboard, and the motherboard can only be disposed at a specific position in the chassis along a set direction, which results in poor structural flexibility of the server.

In view of this, the embodiment of the application provides a server. The server comprises a chassis and a plurality of components arranged in the chassis, wherein the size of at least one component in the plurality of components is uniformly designed according to the reference size of the reference unit, so that the arrangement mode of the at least one component in the chassis can be flexibly planned, and the position of the at least one component in the chassis can be flexibly adjusted, thereby improving the flexibility of the structure of the server. When the structural requirement of the user on the server is changed, the user does not need to customize the server again, the requirement of the user after the change can be met by adjusting the position of at least one component in the chassis, and the utilization rate of a plurality of components in the server is improved to a certain extent.

The server provided in the embodiments of the present application is described below by way of example with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of an internal structure of a server according to an embodiment of the present application. As shown in fig. 1, the server 100 includes a chassis 110 and a plurality of components 120 disposed within the chassis 110. Fig. 1 shows a structure of a server 100 that can be seen when a cover of a chassis 110 is opened. It should be noted that, in fig. 1, the number of the plurality of components 120 included in the server 100 is not limited in practice, by taking the example that the plurality of components 120 includes five components 120 (the first component 121, the second component 122, the third component 123, the fourth component 124, and the fifth component 125 shown in fig. 1). Wherein the plurality of components 120 are components required by the server 100. In addition, the chassis 110 in the embodiment of the present application refers to a component for placing the plurality of components 120, and may also be referred to as a server housing or the like.

In this embodiment, the dimensions of each component 120 in the at least one component 120 are designed by adopting a reference dimension, for example, the dimensions of a reference unit, where the at least one component 120 is part or all of the components 120 in the plurality of components included in the server 100, which is equivalent to designing the dimensions of the at least one component 120 according to a unified rule, and is beneficial to flexible arrangement of the at least one component 120 in the chassis. Also, the location of at least one component 120 within the chassis may be adjustable, e.g., a user may adjust one component 120 of at least one component 120 from one location within the chassis 110 to another location within the chassis 110, or interchange the locations of two components 120 of at least one component 120 within the chassis, thereby increasing the flexibility of the architecture of the server 100.

As an example, the reference unit 130 is a three-dimensional body or a two-dimensional body, and the embodiment of the present application does not limit the shape of the reference unit 130. For example, the reference cell 130 is a rectangular parallelepiped, in which case the reference dimensions may include the length, width, and height of the reference cell 130; for another example, the reference cell 130 is rectangular, in which case the reference dimensions may include the length and width of the reference cell 130.

The reference dimensions of the reference unit 130 may be fixed dimensions, for example, one reference dimension is 110 millimeters (mm) long, 50mm wide, and 40mm high. In the embodiment of the application, the reference dimension is a fixed dimension, so that any server can be designed according to the fixed dimension, the dimension design standards of various servers can be unified, and the size of the reference dimension does not need to be independently determined when the server is designed, so that the process of producing the server can be simplified.

Alternatively, the reference size of the reference unit 130 may be determined according to the size of the inner space of the cabinet 110. Optionally, the reference size of the reference unit 130 is 1/N of the size of the internal space of the cabinet 110, or approximately 1/N, N being a positive integer. It is understood that the internal space of the cabinet 110 may be divided into N parts, and the reference size is one of the N parts. When dividing the internal space of the chassis 110, all dimensions of the internal space of the chassis 110 may be divided, for example, the dimensions of the internal space of the chassis 110 include length, width, and height, and the length, width, and height of the internal space of the chassis 110 are divided. Alternatively, the dimensions of the interior space of the cabinet 110 may be divided by a portion of the dimensions, for example, the dimensions of the interior space of the cabinet 110 may include a length, a width, and a height, and the dimensions of the interior space of the cabinet 110 may be divided by a length, a width, and a height.

To divide the internal space of the casing 110 into N parts, for example, one way to divide the internal space of the casing 110 into N parts is to perform gridding processing, so that a plurality of grid cells can be obtained, where each grid cell is regarded as a part of the division, and this part can be used as the reference unit 130. For example, reference may be made to the structural schematic diagram of the meshed chassis 110 shown in fig. 2A. As shown in fig. 2A, the gridded chassis 110 includes a plurality of grid cells 200, and one grid cell 200 is used as a reference cell 130, and the size of the reference cell 130 can be used as a reference size. Referring again to fig. 2B, a top view of the gridded chassis 110 shown in fig. 2A is shown. As shown in fig. 2B, the rectangle of the combination of endpoint a, endpoint B, endpoint C, and endpoint D may be considered as the projection of one grid cell 200 onto a certain face of the chassis 110. Alternatively, the rectangle of the combination of endpoint B, endpoint D, endpoint E, and endpoint F may be considered the projection of one grid cell 200 onto a certain face of chassis 110. Wherein both fig. 2A and fig. 2B show the grid cell 200 in dashed lines.

Continuing with the example of fig. 2A, the internal space of the chassis 110 in fig. 2A is 720mm long, 445mm wide and 88mm high, and the meshed chassis 110 includes 52 grid cells 200, and one of the grid cells 200 is 111.25mm long, 55.38mm wide and 88mm high. Accordingly, the reference dimensions of the reference cell 130 are 111.25mm long, 55.38mm wide, and 88mm high.

It should be noted that the dimensions of the internal spaces of the chassis included in different servers may be the same, for example, the dimensions of standard chassis are used, and the dimensions of a standard chassis are 445mm long, 720mm wide, and 87mm high, for example. If the internal space of the chassis included in different servers is the same size, the reference size used may be the same when designing different servers. Alternatively, the size of the internal space of the chassis included in different servers may be different, and thus the reference size used may be different when designing different servers.

In the embodiment of the present application, the dimensions of each component 120 of the at least one component 120 may be designed according to the reference dimensions, which may be further understood that the dimensions of each component 120 of the at least one component 120 have a certain relationship with the reference dimensions, and the dimensions of different components 120 may be the same or different in the at least one component 120.

For example, a projected area of one component 120 of the at least one component 120 on the first face within the chassis 110 is an integer multiple of a reference size of the reference unit 130. The first side, e.g., the side of the chassis 110 on which the components 120 are disposed, is also understood to be the one of the interior surfaces of the chassis 110 that is relatively closest to the rack when the server 100 is placed on the rack. Alternatively, when the server 100 is placed on a rack, the first side is one of the exterior surfaces within the chassis 110 that is relatively closest to the rack. Alternatively, the first surface may be the surface opposite to the surface for disposing the component 120 in the casing 110.

With continued reference to fig. 1, for example, the first surface 140 is a surface of the chassis 110 for setting the component 120. The projected area of the second component 122 on the first surface 140 is 6 times the projected area of the reference unit 130 on the first surface 140, and the projected area of the third component 123 on the first surface 140 is 24 times the projected area of the reference unit 130 on the first surface 140.

Since the plurality of components 120 are disposed in the cabinet 110, the size of the plurality of components 120 has a certain relationship with the size of the internal space of the cabinet 110. For example, the total size of the plurality of components 120 is less than or equal to the size of the chassis 110, and in the embodiment of the present application, if the reference size is 1/N of the internal space of the chassis 110, the sum of the projected areas of the plurality of components 120 included in the server 100 on the first surface may be less than or equal to N times the projected area of the reference unit 130 on the first surface. As another example, the height of one or more components 120 of the plurality of components 120 may be less than the height of the interior space of the chassis 110.

Since the plurality of components 120 are all installed in the chassis 110, the size of one component 120 of the plurality of components 120 may also have a certain relationship with the size of other components 120, and the relationship may be set according to the requirements of the user, which is not limited in this application. For example, the plurality of components 120 include a memory component and a peripheral component, the peripheral component having a length X, a width Y and a height Z, the memory component having a length of 2X, a width Y and a height Z.

In this embodiment of the present application, the size of the at least one component 120 is designed according to the reference size, which is equivalent to uniformly planning the size of the at least one component 120, so as to be beneficial to more reasonably distributing the size of the internal space of the chassis 110. And, it is also advantageous to more flexibly arrange at least one component 120 within the chassis 110.

In an embodiment of the present application, the position of at least one component 120 within chassis 110 is adjustable. In order to facilitate adjusting the position of the at least one component 120 in the chassis 110, a number of arrangements of the at least one component 120 in the chassis 110 are considered, and are described below by way of example.

In one arrangement, at least one component 120 is removably disposed within the chassis 110. In the following, a detachable setting mode will be described by taking an example that one component 120 is detachably set in the casing 110.

Please refer to fig. 3A and fig. 3B, which illustrate two ways of disposing a component 120 in a chassis 110 according to an embodiment of the present application. As shown in fig. 3A, a groove 310 is provided in the chassis 110, and the component 120 is clamped in the chassis 110 by the groove 310.

Alternatively, as shown in FIG. 3B, one or more mounting holes (not separately illustrated in FIG. 3B) are provided in the chassis 110, and one component 120 is provided in the chassis 110 through the mounting holes by the mounting members 320. The mount 320 is, for example, a copper post or the like.

Alternatively, if the projected area of each of the at least one component 120 on the first side of the chassis 110 is an integer multiple of the projected area of the reference unit 130 on the first side, the reference size is the size of the grid unit 200 (or, the grid unit 200 is taken as the reference unit 130) obtained by dividing the internal space of the chassis 110, and the reference unit is rectangular parallelepiped, then mounting holes may be provided at the end points of one or more grid units 200 included in the chassis 110 on the first side of the chassis 110. In this manner, in one aspect, the mounting location of at least one component 120 within the chassis 110 is facilitated; alternatively, the position of at least one component 120 within the chassis 110 may be adjusted by subsequently moving some or all of the at least one component 120 within the chassis 110 in steps of one grid cell 200.

For example, with continued reference to FIG. 2B. Mounting holes are formed at the positions of the end points a, B, C, D, E and F of one grid unit 200 in the chassis 110, and the projected area of one component 120 on the first surface is the projected area of the grid unit 200 on the first surface, so that the component 120 can be fixed to the grid unit 200 corresponding to the end points a, B, C and D through the mounting holes at the positions of the end points a, B, C and D. The component 120 can be adjusted to the grid cell 200 corresponding to the endpoint B, the endpoint D, the endpoint E and the endpoint F by moving, and the component 120 is fixed to the grid cell 200 corresponding to the endpoint B, the endpoint D, the endpoint E and the endpoint F by mounting holes arranged at the endpoint B, the endpoint D, the endpoint E and the endpoint F.

In one arrangement, at least one component 120 is removably disposed within the chassis 110. Thus, if it is desired to adjust the position of a component 120 of the at least one component 120 within the chassis 110, the component 120 may be removed directly from the chassis 110 and the component 120 reinstalled in another location within the chassis 110, thereby allowing the position of the component 120 within the chassis 110 to be adjusted.

Referring to fig. 3C, a schematic structural diagram of an assembly 120 provided in the embodiment of the present application is provided in the chassis 110. As shown in fig. 3C, the assembly 120 is disposed on a sliding rail 330 in the case 110 and is fixed in the case 110 by a gear 340.

For example, the gear 340 may be disposed in the chassis 110 and pass through the sliding rail 330 to fix the assembly 120 on the sliding rail 330, and when the assembly 120 needs to be slid, the gear 340 may be manually retracted to slide the assembly 120. Or, for example, the gear member 340 may be removably secured to the slide rail 330, the gear member 340 may be removed to effect movement of the assembly 120 on the slide rail 330, and the gear member 340 may be utilized to secure the assembly 120 on the slide rail 330 when it is desired to secure the position of the assembly 120.

Alternatively, the width of the sliding rail 330 may be less than or equal to a threshold value, which facilitates the placement of multiple sliding rails 330 within the chassis 110.

In the second setting mode, if the position of one component 120 in the chassis 110 needs to be adjusted, the corresponding gear 340 of the component 120 can be directly contracted or disassembled, the component 120 is slid to the corresponding position, and then the component 120 is fixed by the gear 340, so that the position of the component 120 in the chassis 110 can be adjusted. In addition, in the setting mode, when the position of the component 120 in the case 110 is adjusted, the component 120 does not need to be disassembled, so that the damage to the component 120 possibly caused by disassembling the component 120 is avoided.

It should be noted that, in addition to the above two arrangements, at least one component 120 may be disposed in the chassis 110 in a plurality of ways, which is not limited in the embodiment of the present application.

In the process of using the server 100, a part of the components 120 may malfunction or be damaged, which may involve a repair process on the components 120, or may, in order to reduce the repair difficulty, in this embodiment, enable hardware interfaces (interfaces) of some or all of the components 120 in the multiple components 120 to use the first interface standard. The first interface standard defines the shape of the physical connector used for communication between the two components 120, and/or the manner in which the components 120 transceive signals (e.g., protocols), etc. Wherein a physical connector is used to effect a connection between the two components 120. The first interface standard may be an existing interface standard, such as PCIe, general U.2, or high speed m.2, or the like, or the first interface standard may also employ other interface standards generated by future evolution of communication technologies, which is not limited in the embodiments of the present application.

In the embodiment of the present application, since the hardware interface standard adopted by some or all of the components 120 is uniform, the hardware compatibility between some or all of the components 120 is higher. Also, after damage occurs to a certain component 120, the component 120 having the same type of hardware interface standard may be replaced, reducing the cost of maintaining the server 100. In addition, in the case that the component 120 needs to be updated, the updated component 120 with the same type of hardware interface standard may be used to replace the original component 120, so as to reduce the difficulty of updating the component 120 of the server 100. For example, if the server 100 needs to be upgraded from the 6 th generation CPU to the 7 th generation CPU, the 6 th generation CPU in the server may be directly replaced with the 7 th generation CPU.

It should be noted that, some or all of the components 120 in the embodiments of the present application are, for example, components 120 that need to be provided with a hardware interface. If some of the plurality of components 120 do not require a hardware interface, then the hardware interface standard of these components 120 may not be considered.

Alternatively, the second interface standard may be used for a software interface between any two components 120 of some or all components 120 of the plurality of components 120 in the embodiments of the present application.

Illustratively, the second interface standard defines the manner of communication between one or more software modules in the assembly 120. The second interface standard may be an existing interface standard, for example, an intelligent platform management interface (intelligent platformmanagement interface, IPMI) or the like, or the second interface standard may also be another interface standard generated by a future evolution communication technology, which is not limited in the embodiments of the present application.

It should be noted that, some or all of the components 120 in the embodiments of the present application are components 120 that need to be configured with a software interface, and if some of the components 120 do not need to be configured with a software interface, the software interface standard of these components 120 need not be considered.

In the embodiment of the application, the software interfaces of part or all of the components 120 are unified, so that communication between software modules inside the components 120 is facilitated, and the situation that the software modules inside the components 120 are not compatible is reduced. Moreover, since communication between the two components 120 also involves communication between software modules within the components 120, communication between software modules within the components 120 is unified, which is also beneficial to improving communication efficiency between the components 120 and the components 120.

Since the location of at least one component 120 in the server 100 is adjustable within the chassis 110, there may be multiple ways in which at least one component 120 may be distributed within the chassis 110.

The first distribution mode.

Referring to fig. 4A, fig. 4B, fig. 4C, and fig. 4D, which are schematic diagrams illustrating a distribution of the plurality of components 120 in the chassis 110 according to the embodiments of the present application, wherein fig. 4A is a front view of the plurality of components 120 in the chassis 110, fig. 4B is a left view of the plurality of components 120 in the chassis according to the embodiments of the present application, and fig. 4C is a right view of the plurality of components 120 in the chassis according to the embodiments of the present application, and fig. 4D is a perspective view of the plurality of components 120 in the chassis according to the embodiments of the present application. As shown in fig. 4A to 4D, the plurality of components 120 includes a storage component 401, a computing component 402, a heat dissipating component 403, a peripheral component 404, and a power supplying component 405 as an example. Wherein the storage component 401 is visible in the second side 400.

The second surface 400 refers to an external surface of the chassis 110 for man-machine interaction, and the external surface for man-machine interaction refers to a surface visible to a user after the server 100 is disposed on the rack, for example, the external surface is a surface of the chassis 100 on which an input device such as a key is disposed. The storage component 401 is visible in the second side 400, which may be understood as a portion or all of the structure of the storage component 401 being visible to a user through the second side 400, and may be further understood as the storage component 401 being closer to the second side 400 than the other components 120. Other components 120 include, for example, one or more of a computing component 402, a heat dissipating component 403, a peripheral component 404, or a power supplying component 405.

As shown in fig. 4D, the second side 400 of the chassis 110 is provided with heat dissipation holes 410 and keys 420, and a user can see the storage assembly 401 disposed inside the chassis 110 through the heat dissipation holes 410.

To more clearly illustrate the structure of the server 100 shown in fig. 4A-4D, the following description is presented in connection with the schematic distribution of the plurality of components 120 in the chassis 110 shown in fig. 5A-5C. Fig. 5A is a top view of the plurality of components 120 in the chassis 110, fig. 4C is a left side view of the plurality of components 120 in the chassis 110, and fig. 4C is a right side view of the plurality of components 120 in the chassis 110.

In fig. 5A-5C, by way of example, the storage component 401 includes a first disk frame 531 and a second disk frame 532, the computing component 402 includes a motherboard 533 and a CPU534, the heat sink component 403 includes a fan 535, the peripheral component 404 includes a first PCIe slot 536, a second PCIe slot 537, and a BMC539, and the power supply component 405 includes a power supply 538. The first tray 531 and the second tray 532 may be used to place SSDs and/or HDDs (not separately illustrated in fig. 5A to 5C). Optionally, the peripheral component 404 may also include a PCIe network card (not separately illustrated in fig. 5A-5C), and the like.

The structure in the server shown in fig. 5A to 5C may be adjusted by the user to meet different user requirements, and examples are described below.

For example, user A needs to be two-way to strong

CPU, but not SSD and HDD, and 1 25G network card is required to be connected, then motherboard 533 in FIG. 5A may be taken to the strong motherboard, and CPU534 taken two-way to the strong +.>

The CPU, peripheral component 404 selects the network card and BMC539, which are then usedThe hardware is connected together according to a certain rule, and required management software, a basic input output system (basic input output system, BIOS) and the like are loaded, so that the server 100 required by the user a can be obtained.

As another example, user B needs to use a server of advanced reduced instruction set machine (advanced risc machine, ARM) architecture, without local storage, requiring a 25G network card. The motherboard 533 and CPU534 of fig. 4C may be retained, the storage component 401 removed, and the peripheral component 404 selects the network card and BMC and places these hardware in the chassis 110 to obtain the server 100 desired by user B.

The second distribution mode.

Fig. 6A to fig. 6C are schematic diagrams illustrating distribution of the plurality of components 120 in the chassis 110 according to the embodiments of the present application. Wherein fig. 6A shows a front view of the plurality of components 120 in the chassis 110, fig. 6B shows a left side view of the plurality of components 120 in the chassis 110, and fig. 6C shows a right side view of the plurality of components 120 in the chassis 110. Unlike in fig. 4A, the power supply assembly 405 in the embodiments of the present application is visible in the second face 400.

The meaning of the second face 400 may be referred to above. The power component 405 is visible in the second side 400, which may be understood as a user may view some or all of the structure of the power component 405 through the second side 400, and may be understood as the power component 405 being closer to the second side than the other components 120, the other components 120 including one or more of the storage component 401, the computing component 402, the heat sink component 403, or the peripheral component 404.

Alternatively, the storage component 401, the computing component 402, the heat dissipation component 403, the peripheral component 404, and the power supply component 405 can be implemented as examples illustrated with reference to fig. 5A-5C.

And a third distribution mode.

Referring to fig. 7A to 7C, a distribution diagram of a plurality of components 120 in a chassis 110 according to an embodiment of the present application is provided. Wherein fig. 7A shows a front view of the plurality of components 120 in the chassis 110, fig. 7B shows a left view of the distribution of the plurality of components 120 in the chassis 110, and fig. 7C shows a right view of the distribution of the plurality of components 120 in the chassis 110. As shown in fig. 7A-7C, the storage component 401 and the peripheral component 404 are visible in the second side 400. The meaning of the second face 400 may be referred to above. The storage component 401 and the peripheral component 404 are visible in the second side 400, it being understood that a user may view some or all of the structure of the storage component 401 and some or all of the structure of the peripheral component 404 through the second side 400, and it being understood that the storage component 401 and the peripheral component 404 are closer to the second side than the other components 120, the other components 120 including one or more of the computing component 402, the heat dissipating component 403, or the power supplying component 405.

And a fourth distribution mode.

Fig. 8A to 8C are schematic diagrams illustrating distribution of the plurality of components 120 in the chassis 110 according to the embodiments of the present application. Wherein fig. 8A shows a front view of the plurality of components 120 within the chassis 110, fig. 8B shows a left view of the plurality of components 120 within the chassis 110, and fig. 8C shows a right view of the plurality of components 120 within the chassis 110. As shown in fig. 8A-8C, the power supply component 405 and the peripheral component 404 are visible in the second face 400. The meaning of the second face 400 may be referred to above. The power component 405 and the peripheral component 404 are visible in the second side 400, it being understood that a user may view some or all of the structure of the power component 405 and some or all of the structure of the peripheral component 404 through the second side 400, and it being understood that the power component 405 and the peripheral component 404 are closer to the second side than the other components 120, the other components 120 including one or more of the computing component 402, the heat sink component 403, or the storage component 401.

For example, the types of components 120 included in the servers shown in fig. 4A to 4D, 5A to 5C, 6A to 6C, and 7A to 7C are the same, and the main difference is the difference in the positions of the components 120 included in the servers. In actual practice, the user may adjust the position of the component 120 in any one of the servers of fig. 4A-4D, 5A-5C, 6A-6C, and 7A-7C to obtain another one of the servers of fig. 4A-4D, 5A-5C, 6A-6C, and 7A-7C. For example, a user may adjust the peripheral component 404 in fig. 4A-4D to a position relatively close to the second side 400 to obtain a server as shown in fig. 7A-7C. Alternatively, for example, after the user exchanges the positions of the storage component 401 and the power supply component 405 shown in fig. 4A to 4D, the positions of the power supply component 405 and the peripheral component 404 are exchanged, so that the server shown in fig. 6A to 6C can be obtained. Or, for example, the user may exchange the locations of the storage component 401 and the power supply component 405 in fig. 6A-6C, thereby obtaining the servers shown in fig. 8A-8C.

It should be noted that, in the embodiment of the present application, the server 100 may be an ARM architecture server, or an X86 architecture server, for example, a user may replace the computing component 402 in the ARM architecture server with the computing component 402 in the X86 architecture server, and may obtain the X86 architecture server without replacing other components in the server. In addition, if a certain component of the server 100 in the embodiment of the present application needs to be updated, the updated component 120 may be directly replaced into the server 100, so that the server 100 may be used continuously, and the difficulty in updating the server 100 is also reduced.

Embodiments of the present application also provide a rack server comprising one or more of any of the servers discussed above.

Embodiments of the present application also provide a blade server comprising one or more servers of any of the foregoing discussion.

Embodiments of the present application also provide a data center including one or more servers of any of the foregoing discussion. Optionally, the data center includes a device such as a switch in addition to the server.

The embodiment of the application also provides a manufacturing method of the server. The method of manufacturing the server may be performed by a manufacturing apparatus, which may be implemented by an apparatus having processing capabilities, such as a production apparatus. The method of manufacturing a server may be used to manufacture a server as any of the previously discussed. Fig. 9 is a flow chart of a method for manufacturing the server. In fig. 9, a method of manufacturing the server by the manufacturing apparatus is described as an example.

S91, forming at least one component in a plurality of components of the server according to the reference size. Wherein the meaning of the reference dimensions may be referred to above.

Illustratively, the manufacturing apparatus performs gridding on the internal space of the cabinet 110 to obtain a plurality of grid cells, and the manufacturing apparatus uses one grid cell as one reference cell 130 to obtain a reference size of the reference cell 130.

The manufacturing apparatus may design a size of at least one of the plurality of components according to the reference size. At least one component is formed based on the size of the at least one component.

For example, referring to fig. 10, a schematic process diagram of manufacturing a server according to an embodiment of the present application is provided. As shown in fig. 10, the manufacturing apparatus may design the size of at least one component 120 of the server with reference to the reference size of the unit 130. In fig. 10, at least one component 120 is illustrated as including two components 120.

Alternatively, the manufacturing facility may form hardware interfaces for some or all of the plurality of components 120 in accordance with the first interface standard. The manufacturing apparatus may also form software interfaces for some or all of the plurality of components 120 in accordance with the second interface standard, thereby enabling software interface standardization of the components.

S92, arranging a plurality of components in the chassis to obtain a server, wherein the position of at least one component in the chassis is adjustable.

As further shown in fig. 10, the manufacturing apparatus sets the plurality of components 120 in the chassis 110, and a position of at least one component 120 of the plurality of components 120 in the chassis 110 is adjustable, thereby completing assembly of the whole machine, thereby obtaining the server. For a specific manner in which the plurality of components 120 are disposed in the chassis 110, reference is made to the foregoing.

Because the user's need for the location of multiple components 120 within the chassis 110 may vary, in embodiments of the present application, the manufacturing device may adjust the location of a portion of the components 120 within the chassis 110, e.g., the manufacturing device may interchange the locations of two components 120 within the chassis 110, or may adjust the location of a component 120 within the chassis to meet the user's new user needs.

In the embodiment shown in fig. 10, a method of manufacturing a server is provided, which corresponds to modularly designing the server, forming a plurality of components 120, and generating the server by combining the components 120. In addition, the method for manufacturing the server in the embodiment of the application can be used for producing servers with different architectures, and components 120 of different platforms or manufacturers can be mutually compatible by unifying software interfaces and/or hardware interfaces of a plurality of components 120, so that the cost for producing the server is reduced. And the position of the component in the chassis can be adjusted subsequently so as to meet different user requirements.

Fig. 11 shows a schematic configuration diagram of a server manufacturing apparatus 1100. The manufacturing apparatus 1100 of the server may be applied to a manufacturing apparatus, or an apparatus in the manufacturing apparatus, and may implement a function of the manufacturing apparatus in the method provided in the embodiment of the present application; the manufacturing apparatus may also be an apparatus capable of supporting the storage system to implement the functions of the manufacturing device in the method provided in the embodiment of the present application. The server manufacturing apparatus 1100 may be a hardware structure, a software module, or a hardware structure plus a software module. The server manufacturing apparatus 1100 may be implemented by a chip system. In the embodiment of the application, the chip system may be formed by a chip, and may also include a chip and other discrete devices.

The server manufacturing apparatus 1100 may include a processing module 1101. Optionally, the manufacturing apparatus further comprises a communication module 1102, illustrated in fig. 11 as a dashed box.

The processing module 1101 may be used to perform S91 and S92 in the embodiment shown in fig. 9, and may also be used to support other processes of the techniques described herein. The communication module 1102 is used to communicate with the server manufacturing apparatus 1100 and other modules, which may be circuits, devices, interfaces, buses, software modules, transceivers, or any other means by which communication may be achieved.

All relevant contents of each step related to the above method embodiment may be cited to the functional description of the corresponding functional module, which is not described herein.

The division of the modules in the embodiments of the present application is schematically only one logic function division, and there may be another division manner in actual implementation, and in addition, each functional module in each embodiment of the present application may be integrated in one processor, or may exist separately and physically, or two or more modules may be integrated in one module. The integrated modules may be implemented in hardware or in software functional modules.

As shown in fig. 12, a manufacturing apparatus 1200 of a server provided in the embodiment of the present application, where the manufacturing apparatus 1200 of the server may be the manufacturing apparatus in the embodiment shown in fig. 9, or a device of the manufacturing apparatus, and may implement the function of the manufacturing apparatus in the embodiment shown in fig. 9 of the present application; the manufacturing apparatus 1200 of the server may also be a device capable of supporting a storage system to implement the functions of the manufacturing apparatus in the method provided in the embodiment shown in fig. 9 of the present application. Wherein the manufacturing apparatus 1200 of the server may be a chip system. In the embodiment of the application, the chip system may be formed by a chip, and may also include a chip and other discrete devices.

The server manufacturing apparatus 1200 includes at least one processor 1201 for implementing or for supporting the server manufacturing apparatus 1200 to implement the functionality of the manufacturing apparatus of fig. 9 of the present application. For example, the processor 1201 may form at least one component of the plurality of components of the server according to the reference size, and detailed description in the method example is specifically referred to, and will not be repeated herein.

The server manufacturing device 1200 may also include a communication interface 1202 for communicating with other devices over a transmission medium, such that the manufacturing device 1200 for a server communicates with other devices. The other device may be a server, for example. The processor 1201 may transmit and receive data using the communication interface 1202.

The server manufacturing device 1200 may also include at least one memory 1203 for storing program instructions and/or data. The memory 1203 is coupled to the processor 1201. The coupling in the embodiments of the present application is an indirect coupling or communication connection between devices, units, or modules, which may be in electrical, mechanical, or other forms for information interaction between the devices, units, or modules. The processor 1201 may cooperate with the memory 1203. The processor 1201 may execute program instructions stored in the memory 1203. At least one of the at least one memory 1203 may be included in the processor 1201. When the processor 1201 executes the program instructions in the memory 1203, the method of manufacturing a server of any of the embodiments shown in fig. 9 may be implemented.

As an example, memory 1203 in fig. 12 is an optional part, and is illustrated with a dashed box in fig. 12. For example, a memory 1203 is coupled to the processor 1201.

The specific connection medium between the communication interface 1202, the processor 1201 and the memory 1203 is not limited in the embodiments of the present application. In the embodiment of the present application, the communication interface 1202, the processor 1201 and the memory 1203 are connected through the bus 1204 in fig. 12, and the bus is shown by a thick line in fig. 12, and the connection manner between other components is only schematically illustrated, but not limited to. The buses may be classified as address buses, data buses, control buses, etc. For ease of illustration, only one thick line is shown in fig. 12, but not only one bus or one type of bus.

In the embodiments of the present application, the processor 1201 may be a general purpose processor, a digital signal processor, an application specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component, and may implement or execute the methods, steps, and logic blocks disclosed in the embodiments of the present application. The general purpose processor may be a microprocessor or any conventional processor or the like. The steps of a method disclosed in connection with the embodiments of the present application may be embodied as a hardware processor executing, or as a combination of hardware and software modules executing, in a processor.

In the embodiment of the present application, the memory 1203 may be a nonvolatile memory, such as a hard disk (HDD) or a Solid State Drive (SSD), or may be a volatile memory (volatile memory), for example, a random-access memory (RAM). The memory is any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to such. The memory in the embodiments of the present application may also be circuitry or any other device capable of implementing a memory function for storing program instructions and/or data.

There is also provided in an embodiment of the present application a computer-readable storage medium storing a computer program that, when run on a computer, causes the computer to perform the method of manufacturing a server of any one of the embodiments shown in fig. 9.

There is also provided in an embodiment of the present application a computer program product storing a computer program comprising program instructions that, when executed by a computer, cause the computer to perform the method of manufacturing a server of any of the embodiments shown in fig. 9.

The embodiment of the application provides a chip system, which comprises a processor and can also comprise a memory, wherein the memory is used for realizing the functions of manufacturing equipment in the method. The chip system may be formed of a chip or may include a chip and other discrete devices.

The method provided in the embodiments of the present application may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, a network device, a user device, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (digital subscriber line, DSL), or wireless (e.g., infrared, wireless, microwave, etc.) means, the computer-readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc., that contains an integration of one or more available media, the available media may be magnetic media (e.g., floppy disk, hard disk, tape), optical media (e.g., digital video disc (digital video disc, DVD)), or semiconductor media (e.g., SSD), etc.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims

1. A server, comprising:

a chassis;

the chassis is provided with a plurality of components, wherein a size of at least one component is designed based on a reference size of a reference unit, and a position of the at least one component within the chassis is adjustable.

2. The server of claim 1, wherein the size of each of the plurality of components is determined based on the reference size.

3. The server according to claim 1 or 2, wherein the projected area of the at least one component on the first face of the chassis is an integer multiple of the projected area of the reference unit on the first face.

4. A server according to any one of the claims 1-3, wherein,

hardware interfaces of some or all of the plurality of components adopt a first interface standard; and/or the number of the groups of groups,

The software interfaces of some or all of the plurality of components employ a second interface standard.

5. The server of any of claims 1-4, wherein the plurality of components comprises any two of the following components and combinations thereof:

the device comprises a power supply component, a heat dissipation component, a storage component, a peripheral component and a computing component.

6. The server of claim 5, wherein the second side of the chassis is configured for human-machine interaction;

the storage component is visible in the second face; or alternatively, the first and second heat exchangers may be,

the power supply assembly is visible in the second face; or alternatively, the first and second heat exchangers may be,

the storage component and the peripheral component are visible in the second face; or alternatively, the first and second heat exchangers may be,

the power supply assembly and the peripheral assembly are visible in the second face.

7. The server according to any one of claims 1-6, wherein the reference size is 1/N of the size of the internal space of the chassis, N being a positive integer.

8. The server of claim 7, wherein the dimensions of the interior space of the chassis include a length, a width, and a height of the chassis.

9. The server according to any of claims 1-8, wherein the at least one component is detachable.

10. A method of manufacturing a server, comprising:

forming at least one component of a plurality of components of the server according to a reference size of the reference unit;

the plurality of components are disposed within a chassis to obtain the server of any of claims 1-8, wherein a position of the at least one component within the chassis is adjustable.