TW202127994A - Electronic device with radiation structure - Google Patents

Abstract

An electronic device with radiation structure including a first machine body, a second machine body, a hinge module, and a heat conduction component is provided. The first machine body has a front cover, a back cover, a display panel, a plurality of airflow channels, a plurality of air inlet, and a plurality of air outlets. The display panel is located between the front cover and the back cover. The air inlets and the air outlets are communicated with the airflow channels. The second machine has a least one heat source. The a hinge module is connected to the first machine body and the second machine body. The first machine body and the second machine body are adapted to be folded or unfolded with each other by using the hinge module. The heat conduction component is disposed in the first machine body and the second machine body. The heat of the at least one heat source is transferred from the first machine body to second machine body, the external air is adapted to enter the airflow channels through the air inlets and discharged from the air outlets.

Description

Electronic device with heat dissipation structure

The present invention relates to an electronic device, and more particularly to an electronic device with a heat dissipation structure.

The existing notebook computers have the characteristics of small size and convenient portability, so they are widely used in daily life, work or education. Compared with desktop computers, the internal space of notebook computers is small, so the heat generated by various electronic components It is easy to accumulate inside and is not easy to dissipate heat. The high temperature will reduce the operating performance of the notebook computer, and even cause damage to the central processing unit and graphics chip.

Existing notebook computers use metal materials with high heat dissipation efficiency as the heat conduction sheet. When connected, the heat generated by the central processing unit, graphics chip and other components will be transferred to the heat dissipation fins through the heat conducting fins, and then cool air is drawn through the built-in fan to contact the heat dissipation fins to cool down, thereby achieving the purpose of heat dissipation. However, due to the thin structure of the notebook computer, the area size of the side air outlet and the heat dissipation fin is restricted, resulting in the lack of thermal convection space inside the notebook computer, which is not conducive to the inhalation of cold air and the exhaust of hot air. It will still cause overheating under time usage.

The invention provides an electronic device with a heat dissipation structure, which has high heat transfer efficiency and can utilize external cold air for heat dissipation, so as to facilitate the improvement of the overall heat dissipation effect of the electronic device.

The electronic device with a heat dissipation structure of the present invention includes a first body, a second body, a hinge module, and a heat conduction member. The first body has a front cover, a back cover, a display panel, a plurality of air flow channels, a plurality of air inlets and a plurality of air outlets. The plurality of air inlets and the plurality of air outlets communicate with a plurality of air flow channels, the display panel is located between the front cover and the back cover, and at least a part of the plurality of air flow channels is formed on the back cover. The second body has at least one heat source for processing electronic signals. The hinge module is connected to the first body and the second body. The first body and the second body are suitable for relatively unfolding or relatively folding through the hinge module. The heat conducting member is arranged in the first body and the second body. The heat of the at least one heat source is conducted from the first body to the second body through the heat conducting member. The external air is suitable for entering the plurality of airflow channels from the plurality of air inlets and being discharged from the plurality of air outlets.

Based on the above, the electronic device with a heat dissipation structure of the present invention has a heat conducting member, which is connected to the first body and the second body respectively, and contacts at least one heat source located in the second body, so as to reduce the heat generated by the heat source during operation. Conduction from the second body to the first body prevents heat from accumulating in the second body and causing overheating. Furthermore, external air can enter multiple airflow channels through multiple air inlets and be discharged from multiple air outlets. In the process of air transfer, the heat conduction member in the first body is cooled to achieve the purpose of heat dissipation.

FIG. 1A is a three-dimensional schematic diagram of an electronic device with a heat dissipation structure according to an embodiment of the present invention. FIG. 1B is a perspective schematic view of the electronic device with a heat dissipation structure of FIG. 1A in another direction.

1A and 1B, an electronic device with a heat dissipation structure of the present invention is, for example, a notebook computer, a tablet computer or a similar electronic device and includes a first body 110, a second body 120, a hinge module 130, and A heat conduction member 140.

The first body 110 is a display body and has a plurality of airflow channels AC, a plurality of air inlets IT, and a plurality of air outlets OT. The multiple air inlets IT and the multiple air outlets OT communicate with multiple airflow channels AC. The second body 120 is a system body for installing various electronic components such as arithmetic unit, storage unit, input/output unit, and power supply unit, and has at least one heat source 121, specifically including a central processing unit, a graphics chip, or a memory with electronic signals. Heating element for processing function.

The hinge module 130 is connected between the first body 110 and the second body 120. The first body 110 and the second body 120 are adapted to be relatively unfolded through the hinge module 130 to switch to the working mode or relatively folded to switch to the storage mode.

The heat conduction member 140 is disposed on the first body 110 and the second body 120 and is in surface contact with the first body 110 and the second body 120. The arrangement through the surface contact is beneficial to improve the heat conduction characteristics of the electronic device 100. The heat conducting member 140 contacts at least one heat source 121 (see FIG. 3A below). Furthermore, there is a gap between the heat conducting member 140 and the hinge module 130 between a part of the first body 110 and the second body 120, that is, the heat conducting member 140 bypasses the hinge module 130, so that the heat conducting member 140 and the hinge module 130 The modules 130 do not touch each other.

1A and 1B, the heat H of at least one heat source 121 is conducted from the second body 120 to the first body 110 through the heat conducting member 140, and the external air AR is suitable for entering the plurality of airflow channels AC from the plurality of air inlets IT and The multiple air outlets OT are discharged, and when the air AR passes through the multiple air flow channels AC, it will contact the heat conduction member 140 to achieve heat convection or heat conduction.

In this implementation, the multiple airflow channels AC are connected to each other and present as an array pattern.

In other embodiments, the multiple airflow channels AC are not connected to each other or partially connected, which depends on the heat dissipation requirement and the structural design, and the present invention is not limited thereto.

2A is a schematic cross-sectional view of the first body of FIG. 1A with a single-sided airflow channel. Fig. 2B is a partially enlarged schematic diagram of Fig. 2A. 2C is a schematic cross-sectional view of another embodiment of the first body of FIG. 1A with a single-sided air flow channel. 2D is a schematic cross-sectional view of another embodiment of the first body of FIG. 1A with double-sided airflow channels.

Referring to FIG. 2A, the first body 110 has a front cover 111, a rear cover 112 and a display panel 113. The front cover 111 is a U-shaped structure and forms a closed cavity with the back cover 112. The display panel 113 is located between the front cover 111 and the back cover 112 and in the closed cavity. At least one of the plurality of airflow channels AC Part of it is formed on the back cover 112. The second body 120 has an upper shell 122 and a lower shell 123, and at least one heat source 121 is located between the upper shell 122 and the lower shell 123.

2A and 2B, in this embodiment, a plurality of air flow channels AC are formed on an inner side IS of the back cover 112 adjacent to the display panel 113. Referring to FIG. 2C, a plurality of air flow channels AC are formed on an outer side OS of the rear cover 112 away from the display panel 113.

Referring to FIG. 2D, in this embodiment, a plurality of airflow channels AC are formed on the inner side IS of the rear cover 112 adjacent to the display panel 113 and on the outer side OS far away from the display panel 113. The heat conduction member 140 is attached to the outer side OS of the back cover 112 to cover the corresponding plurality of air flow channels AC. When the air AR passes through the air flow channel AC, it will contact the heat conduction member 140.

Furthermore, the cross-sectional shape of each air flow channel AC includes a triangle, a trapezoid, a semicircle, a polygon, a rectangle, or other shapes. Compared with the embodiment of FIGS. 2A-2B, the air flow rate of this embodiment is doubled, so it has a better heat dissipation effect.

3A is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3B is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3C is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. Fig. 3D is a schematic plan view of the heat conducting member of Figs. 3A to 3C.

1A, 1B, and 3A, in this embodiment, the heat conducting member 140 has a heat conducting plate 141, a metal block 142, and a contact outer layer 143.

Two ends of the heat conducting plate 141 are attached to the back cover 112 of the first body 110 and penetrate through the second body 120 respectively. In detail, the heat conducting plate 141 is, for example, a graphene copper sheet and is used for horizontal conduction of heat.

The metal block 142 is made of, for example, a copper material, and is disposed on a side of the heat conduction plate 141 away from the lower shell 123 and contacts at least one heat source 121 for transferring heat generated by the at least one heat source 121 to the heat conduction plate 141. The contact outer layer 143 is stacked on the other side of the thermal conductive plate 141 opposite to the metal block 142 and attached to the lower shell 123. The contact outer layer 143 is, for example, made of artificial leather, silicon, rubber, or cloth with a thermal conductive silicon film 1431 embedded in it to contact the outer layer. 143 is used to protect the heat conducting plate 141 and provide a beautiful shape.

3A, one end E1 of the heat conducting plate 141 is attached to an outer surface OS of the first body 110 and the other end E2 is penetrated through the second body 120, and the end contacting the outer layer 143 penetrates the second body 120 and is attached to An inner side surface of the lower shell 123 of the second body 120 and the other end contacting the outer layer 143 is disposed on the back cover 112 of the first body 110.

Referring to FIG. 3D, the heat conducting plate 141 includes a bent portion 1411, two heat conducting portions 1412 and a plurality of heat conducting media 1413. The bent portion 1411 is wrapped around the hinge module 130. The two heat conducting parts 1412 are connected to both sides of the curved part 1411 and contact the first body 110 and the second body 120 respectively. A plurality of heat-conducting media 1413 are respectively disposed on the two heat-conducting parts 1412 and used to contact at least one heat source 121 or metal block 142. Each heat-conducting medium 1413 is used for heat conduction in the vertical direction and uses heat-conducting silicone. In this embodiment, the bent portion 1411 and the two heat conducting portions 1412 are graphene copper sheets, and the plurality of heat conducting media 1413 are silicon films.

In short, the heat conduction member 140 exerts different material characteristics through the stacking and bonding of composite materials. The first body 110 and the second body 120 can be used as heat storage carriers. The heat conducting plate 141 in the middle is a channel for horizontal heat conduction. 1413 is the outlet for the vertical conduction of heat. The contact outer layer 143 is made of leather or cloth to produce a comfortable feel, and also provides isolation from the high heat of the first body or the second body.

3B, in this embodiment, the two ends E1, E2 of the heat conducting plate 141 are attached to the two outer sides of the rear cover 112 of the first body 110 and the lower shell 123 of the second body 120, respectively, and further includes a fixing member 150. Pass through the lower shell 123 in contact with the outer layer 143 and the heat conducting plate 141 and fixed to the second body 120.

Referring to FIG. 3C, in this embodiment, one end E1 of the heat conducting plate 141 passes through the first body 110 and is attached to an inner side IS of the back cover 112 of the first body 110. The other end E2 of the heat conducting plate 141 is attached to an outer surface OS of the lower shell 123 of the second body 120. The end contacting the outer layer 143 penetrates through the first body 110 and is partially attached to an inner side IS of the back cover 112 of the first body 110, and is partially stacked with the heat conducting plate 141. It also includes a fixing member 150, which penetrates the outer layer 143 and the heat conducting plate 141 and is fixed to the lower shell 123 of the second body 120.

4A to 4C are schematic plan views of the heat conduction members of FIG. 1A distributed on the first body and the second body.

Referring to FIGS. 4A to 4C, the area of the heat conducting member 140 distributed on the first body 110 of this embodiment is greater than, smaller than or equal to the area distributed on the second body 120, depending on the heat dissipation requirements of the user.

5A to 5F are schematic plan views of the heat conduction member adopting a variety of different shapes.

Referring to FIG. 5A, the heat conducting plate 141 of the heat conducting member 140 has a rectangular structure with equal lengths opposite to the two sides of the bent portion 1411. Referring to FIGS. 5B and 5C, the heat conducting plate 141 of the heat conducting member 140 has a trapezoidal structure with unequal lengths opposite to the two sides of the bent portion 1411. Referring to FIGS. 5D and 5E, the heat conducting member 140 further includes another heat conducting plate 141, and the two heat conducting plates 141 are separated from each other or overlap each other. Referring to FIG. 5F, the heat conduction plate 141 of the heat conduction member 140 is an integrally formed X-shaped structure.

6A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention adopting a heat conduction member with three bends. FIG. 6B is an exploded schematic view of components of the electronic device with a heat dissipation structure in FIG. 6A. 6C is a partially enlarged schematic diagram of the electronic device with a heat dissipation structure in FIG. 6A in a closed state. 6D is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention adopting a heat conduction member with two bends. 6E is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a heat conduction member with six bends.

6A to 6C, the heat conduction member 140a of this embodiment is different from the heat conduction member 140 of FIG. 3A. The difference is that the heat conduction member 140a has a heat conduction plate 141a, a metal block 142a, and a contact outer layer 143a. The heat conducting plate 141a is respectively penetrated through the first body 110a and the second body 120a. The heat conducting plate 141a is, for example, a graphene copper sheet and is used to conduct heat in a horizontal direction. The metal block 142a is disposed on one side of the heat conducting plate 141a and is fastened to the lower shell 123a of the second body 120a and contacts at least one heat source 121a. The metal block 142a is made of copper, for example, to transfer the heat generated by the at least one heat source 121a. To the heat conducting plate 141a. The contact outer layer 143a is stacked on the other side of the heat-conducting plate 141a opposite to the metal block 142a. The contact outer layer 143a is made of artificial leather, silicon, rubber or cloth, for example, to protect the heat-conducting plate 141a and provide a beautiful shape.

In addition, the thermal conductive plate 141a is made of flexible composite materials with high thermal conductivity, including silver, copper, gold, aluminum, graphite, thermally conductive plastic, silicon, ceramic or other similar materials, and is pre-bent to a specific shape.

Referring to FIGS. 3D and 6A to 6C, the heat conducting plate 141a includes a bent portion 1411a, two heat conducting portions 1412a, and a plurality of heat conducting media 1413a. The bent portion 1411a is adjacent to the hinge module 130a and has a plurality of bending sections BP. The two heat conducting portions 1412a are connected to both sides of the curved portion 1411a and respectively contact the first body 110a and the second body 120a. A plurality of heat-conducting media 1413a are respectively arranged on the two heat-conducting parts 1412a. Furthermore, the second body 120a has a groove G, in which a heat-conducting portion 1412a is disposed in the groove G, contacts the outer layer 143a and adheres to the heat-conducting portion 1412a in the groove G and is closely attached to the second body 120a. The number of the plurality of bending sections BP is three, and the other heat conducting portion 1412a is attached to the back cover 112a of the first body 110a.

Referring to FIG. 6D, in this embodiment, the number of the plurality of bending sections BP is two, which depends on the requirements of the design.

Furthermore, the curved portion 1411a can adopt a variety of shapes such as arc, zigzag, S-shape or slight bending, wherein the cross-section of the arc-shaped curved portion 1411a is single-arc, double-arc or multi-arc, zigzag-curved The section 1411a has an acute angle and is combined with an arc, and the cross section of the S-shaped curved section 1411a is a multi-arc combination. The section of the finely bent bent portion 1411a is a plurality of finely bent structures, and the above-mentioned shape composition is used to improve the recovery strength of the bent portion 1411a before and after bending.

In detail, since the heat conducting plate 141a of the present invention is made of a pre-molded composite material, it can return to its original state after being deformed by an external force. The bent portion 1411a of the heat conducting plate 141a is formed by a single or several bent sections BP. The pre-bending type can effectively protect the heat-conducting plate 141a from being damaged due to severe bending. In addition, the pre-bent heat-conducting plate 141a can avoid friction between the first body 110a and the second body 120a and cause surface wear , Which in turn affects the efficiency of heat conduction.

6E, in this embodiment, the two heat conducting portions 1412b of the heat conducting member 140b have the same length and are attached to the first body 110b and the second body 120b, respectively, and the bent portion 1411b has six bending sections BP. The heat conduction member 140b of this embodiment is suitable for multi-angle electronic devices, and can be turned over 180-360 degrees, and the six bending sections BP of the bending portion 1411b are not limited to a symmetrical shape.

In other embodiments, the heat conductive member 140a is, for example, an integrally formed member and is directly disposed on the first body 110a and the second body 120a (see FIG. 6A), or the heat conductive member 140a is, for example, a separate member and is disposed on the first body 110a. In the second body 120a, extra space can be planned to facilitate the placement of electronic components or cables.

FIG. 7A is a schematic side plan view of an electronic device with a heat dissipation structure adopting a two-piece heat conduction member of the present invention. FIG. 7B is a schematic side plan view of another two-piece heat conducting member used in the electronic device with a heat dissipation structure of the present invention. Fig. 7C is a three-dimensional schematic diagram of a two-piece heat conduction member using a connector according to an embodiment of the present invention. FIG. 7D is a schematic plan view of a two-piece heat conduction member using magnetic parts according to an embodiment of the present invention.

Referring to FIG. 7A, the heat conducting plate 141c of this embodiment is a separate structure and includes a first heat conducting portion 1411c, a second heat conducting portion 1412c, and a connecting member 1413c. The first heat conducting portion 1411c penetrates through the first body 110c, and the second heat conducting portion 1412c penetrates through the second body 120c. The connecting member 1413c is located between the first body 110c and the second body 120c and is configured to connect the first heat conducting portion 1411c and the second heat conducting portion 1412c.

Among them, the connecting member 1413c serves as a medium for connecting the first heat conduction portion 1411c and the second heat conduction portion 1412c and has the function of shielding the appearance. Ceramic or other similar materials.

Referring to FIG. 7A, the first heat conducting portion 1411c and the second heat conducting portion 1412c are attached to the two outer wall surfaces S of the connecting member 1413c, respectively. Referring to FIG. 7A, the connecting member 1413c has at least one receiving groove AG for clamping the first heat conducting portion 1411c and the second heat conducting portion 1412c.

Referring to FIG. 7C, the connecting member 1413c includes a first magnetic member M1 and a second magnetic member M2, respectively disposed on the first heat conducting portion 1411c and the second heat conducting portion 1412c and adapted to magnetically attract each other to connect the first heat conducting portion 1411c With the second heat conduction portion 1412c. Referring to FIG. 7D, the connecting member 1413c includes an adhesive member M3, which is disposed between the first heat conducting portion 1411c and the second heat conducting portion 1412c to connect the first heat conducting portion 1411c and the second heat conducting portion 1412c.

Fig. 8A is a schematic plan view of an air flow channel in a hexagonal array according to an embodiment of the present invention. Fig. 8B is a schematic plan view of a double-sided airflow channel in a hexagonal array according to an embodiment of the present invention. Fig. 8C is a schematic plan view of an airflow channel in a narrowed hexagonal array according to an embodiment of the present invention.

Referring to FIGS. 8A to 8C, a plurality of airflow channels AC are formed on the back cover 112 of the first body 110 and are arranged in a honeycomb arrangement, a compound hexagonal arrangement, a narrowed hexagonal arrangement, or a dense hexagonal arrangement. Furthermore, the air flow channel AC is formed by a variety of different unit variations, and is formed by staggering the front and back sides, so as to reduce the thickness of the back cover 112 and reduce the weight at the same time.

FIG. 9A is a schematic plan view of an airflow channel extending in an arc according to an embodiment of the present invention. FIG. 9B is a schematic plan view of an air flow channel extending in a straight line according to an embodiment of the present invention. 9C is a schematic plan view of an air flow channel extending obliquely on both sides according to an embodiment of the present invention.

9A, each airflow channel AC extends from each air inlet IT to each air outlet OT in an arc shape, and the airflow channels AC are distributed on the upper and lower sides of the first body 110, thereby increasing the longitudinal strength of the first body 110.

Referring to FIG. 9B, each airflow channel AC extends obliquely from each air inlet IT to each air outlet OT, and some of the multiple air outlets OT are formed on the left and right sides of the first body 110, which facilitates extending the air in the airflow channel AC The flow time to improve the heat dissipation efficiency.

2D and 9C, a plurality of air flow channels AC are respectively formed on the inner side IS and the outer side OS of the rear cover 112 of the first body 110, and the plurality of air flow channels AC extend diagonally and intersect each other, and some of them have multiple out The tuyere OT is formed on the left and right sides of the first body 110, which is beneficial to prolong the air flow time in the air flow channel AC and double the air flow rate, thereby improving the heat dissipation efficiency.

In summary, the electronic device with a heat dissipation structure of the present invention has a heat conduction member, which is connected to the first body and the second body respectively, and contacts at least one heat source located in the second body, so that the heat source can be generated during operation. The heat is conducted from the second body to the first body to avoid heat accumulating in the second body and causing overheating. Furthermore, the external air can enter multiple airflow channels through multiple air inlets and pass through multiple air outlets. Exhaust, in the process of air transfer, the heat conduction member in the first body will be cooled to achieve the purpose of heat dissipation.

In short, the present invention adopts heat conduction members and airflow channels. The use of heat conduction members can avoid overheating of the body, and the airflow channels can introduce external air to assist heat dissipation, thereby improving the overall heat dissipation efficiency to meet the requirements of thin and high-performance electronic devices. Use requirements to ensure a stable user experience for users.

100: Electronic device with heat dissipation structure 110, 110a, 110b, 110c: the first body 111: front cover 112, 112a: back cover 113: display panel 120, 120b, 120c: second body 121: heat source 122: upper shell 123: lower shell 130, 130a: Hinge module 140, 140a, 140b: heat conduction member 141, 141a, 141c: heat conduction plate 1411, 1411a, 1411b: curved part 1411c: The first heat conduction part 1412, 1412a, 1412b: heat conduction part 1412c: The second heat conduction part 1413, 1413a: heat conduction medium 1413c: connector 142, 142a: Metal block 143, 143a: contact the outer layer 1431: thermal silicon film G: Groove H: heat S: Outer wall AC: Airflow channel AG: holding tank AR: Air BP: bending section E1, E2: end IS: inside IT: air inlet M1: The first magnetic part M2: The second magnetic part M3: Stickers OS: Outer side OT: Outlet

FIG. 1A is a three-dimensional schematic diagram of an electronic device with a heat dissipation structure according to an embodiment of the present invention. FIG. 1B is a perspective schematic view of the electronic device with a heat dissipation structure of FIG. 1A in another direction. 2A is a schematic cross-sectional view of the first body of FIG. 1A with a single-sided airflow channel. Fig. 2B is a partially enlarged schematic diagram of Fig. 2A. 2C is a schematic cross-sectional view of another embodiment of the first body of FIG. 1A with a single-sided air flow channel. 2D is a schematic cross-sectional view of another embodiment of the first body of FIG. 1A with double-sided airflow channels. 3A is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3B is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3C is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. Fig. 3D is a schematic plan view of the heat conducting member of Figs. 3A to 3C. 4A to 4C are schematic plan views of the heat conduction members of FIG. 1A distributed on the first body and the second body. 5A to 5F are schematic plan views of the heat conduction member adopting a variety of different shapes. 6A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention adopting a heat conduction member with three bends. FIG. 6B is an exploded schematic view of components of the electronic device with a heat dissipation structure in FIG. 6A. 6C is a partially enlarged schematic diagram of the electronic device with a heat dissipation structure in FIG. 6A in a closed state. 6D is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention adopting a heat conduction member with two bends. 6E is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a heat conduction member with six bends. FIG. 7A is a schematic side plan view of an electronic device with a heat dissipation structure adopting a two-piece heat conduction member of the present invention. FIG. 7B is a schematic side plan view of another two-piece heat conducting member used in the electronic device with a heat dissipation structure of the present invention. Fig. 7C is a three-dimensional schematic diagram of a two-piece heat conduction member using a connector according to an embodiment of the present invention. FIG. 7D is a schematic plan view of a two-piece heat conduction member using magnetic parts according to an embodiment of the present invention. Fig. 8A is a schematic plan view of an air flow channel in a hexagonal array according to an embodiment of the present invention. Fig. 8B is a schematic plan view of a double-sided airflow channel in a hexagonal array according to an embodiment of the present invention. Fig. 8C is a schematic plan view of an airflow channel in a narrowed hexagonal array according to an embodiment of the present invention. FIG. 9A is a schematic plan view of an airflow channel extending in an arc according to an embodiment of the present invention. FIG. 9B is a schematic plan view of an air flow channel extending in a straight line according to an embodiment of the present invention. 9C is a schematic plan view of an air flow channel extending obliquely on both sides according to an embodiment of the present invention.

100: Electronic device with heat dissipation structure

110: First Body

120: Second Body

130: Hinge module

140: Heat conduction member

AC: Airflow channel

AR: Air

IT: air inlet

OT: Outlet

Claims (28)

An electronic device with a heat dissipation structure, including: A first body has a front cover and a back cover, a display panel, a plurality of airflow channels, a plurality of air inlets and a plurality of air outlets, the air inlets and the air outlets communicate with the airflow channels, wherein the The display panel is located between the front cover and the back cover, and at least a part of the air flow channels is formed on the back cover; A second body with at least one heat source and electronic signal processing function; A hinge module connected to the first body and the second body, the first body and the second body are suitable for relatively unfolding or relatively folding through the hinge module; and A heat conduction member disposed on the first body and the second body, Wherein, the heat conduction member contacts the at least one heat source, the heat of the at least one heat source is conducted from the second body to the first body through the heat conduction member, and external air is suitable for entering the first body through the air inlets of the first body. These air flow channels are exhausted from the air outlets. The electronic device with a heat dissipation structure according to claim 1, wherein the air flow channels are formed on an inner surface of the back cover adjacent to the display panel or formed on an outer surface of the back cover away from the display panel, The cross-sectional shape of each air flow channel includes a triangle, a trapezoid, a semicircle or a polygon. The electronic device with a heat dissipation structure according to claim 1, wherein the air flow channels are formed on an inner side surface of the back cover adjacent to the display panel and an outer side surface far away from the display panel. The cross-sectional shape includes triangle, trapezoid, semicircle or polygon. The electronic device with a heat dissipation structure according to claim 1, wherein the heat conduction member has a heat conduction plate, a metal block, and a contact outer layer, the heat conduction plate is disposed on the first body and the second body, and the metal block is disposed On one side of the heat conducting plate and contacting the at least one heat source, the contact outer layer is stacked on the other side of the heat conducting plate opposite to the metal block. The electronic device with a heat dissipation structure according to claim 4, wherein the heat conducting plate includes a bent part, two heat conducting parts and a plurality of heat conducting media, the bent part is wrapped around the hinge module, and the two heat conducting parts are connected to Two sides of the curved part contact the first body and the second body respectively, and a plurality of heat-conducting media are respectively arranged on the two heat-conducting parts. According to claim 5, the electronic device with a heat dissipation structure, wherein the bent portion and the two heat conduction portions are graphene copper sheets, and the heat conduction media are silicon films. The electronic device with a heat dissipation structure according to claim 5, wherein the heat conducting plate has a rectangular structure with equal lengths relative to the two sides of the bent portion or a trapezoidal structure with unequal lengths relative to the two sides of the bent portion . According to claim 4, the electronic device with a heat dissipation structure further includes another heat conducting plate, and the two heat conducting plates are separated from each other or overlap each other. The electronic device with a heat dissipation structure according to claim 4, wherein one end of the heat conducting plate is attached to an outer side surface of the first body and the other end passes through the second body, and the end contacting the outer layer passes through The second body is attached to an inner surface of the second body. The electronic device with a heat dissipation structure according to claim 4, wherein the two ends of the heat conducting plate are respectively attached to the two outer sides of the first body and the second body, and further include a fixing member passing through the contact The outer layer and the heat conducting plate are fixed to the second body. The electronic device with a heat dissipation structure according to claim 4, wherein one end of the heat conducting plate penetrates the first body and is attached to an inner side of the first body, and the other end of the heat conducting plate is attached to the An outer side surface of the second body, one end of the contact outer layer passes through the first body and is partially attached to an inner side surface of the first body, and also includes a fixing member that passes through the contact outer layer and the heat conduction The board is fixed to the second body. The electronic device with a heat dissipation structure according to claim 1, wherein the area of the heat conducting member distributed on the first body is greater than, smaller than or equal to the area distributed on the second body. The electronic device with a heat dissipation structure according to claim 1, wherein the heat conduction member has a heat conduction plate, a metal block and a contact outer layer, the heat conduction plate penetrates the first body and the second body respectively, and the metal The block is arranged on one side of the heat-conducting plate and is fastened to the second body and contacts the at least one heat source, and the contact outer layer is stacked on the other side of the heat-conducting plate opposite to the metal block. The electronic device with a heat dissipation structure according to claim 13, wherein the heat conduction plate includes a bent portion, two heat conduction portions, and a plurality of heat conduction media, and the bent portion is adjacent to the hinge module and has a plurality of bending sections The two heat-conducting parts are connected on both sides of the curved part and respectively contact the first body and the second body, and a plurality of heat-conducting media are respectively arranged on the two heat-conducting parts. The electronic device with a heat dissipation structure according to claim 14, wherein the second body has a groove, one of the heat-conducting parts is disposed in the groove, and the contact outer layer is attached to one of the heat-conducting parts in the groove And the second body is tightly fitted, the number of the bending sections is three, and the other heat conducting part is attached to the back cover of the first body. The electronic device with a heat dissipation structure according to claim 14, wherein the second body has a groove, one of the heat-conducting parts is disposed in the groove, and the contact outer layer is attached to one of the heat-conducting parts in the groove And the second body is tightly fitted, the number of the bending sections is two, and the other heat conducting part is attached to the front cover of the first body. The electronic device with a heat dissipation structure according to claim 14, wherein the bending portion has six bending sections, and the lengths of the two heat conducting portions are equal. The electronic device with a heat dissipation structure according to claim 1, wherein the heat conduction plate is a separate structure and includes a first heat conduction part, a second heat conduction part and a connecting member, and the first heat conduction part penetrates the first heat conduction part. A body, the second heat-conducting part penetrates the second body, and the connecting member is located between the first body and the second body and is configured to connect the first heat-conducting part and the second heat-conducting part. According to claim 18, the electronic device with a heat dissipation structure, wherein the first heat conduction portion and the second heat conduction portion are attached to two outer wall surfaces of the connecting member, respectively. The electronic device with a heat dissipation structure according to claim 18, wherein the connecting member has at least one accommodating groove for clamping the first heat conducting part and the second heat conducting part. The electronic device with a heat dissipation structure according to claim 18, wherein the connecting member includes a first magnetic member and a second magnetic member, which are respectively disposed on the first heat conducting part and the second heat conducting part and are suitable for each other Magnetic attraction to connect the first heat-conducting part and the second heat-conducting part. The electronic device with a heat dissipation structure according to claim 1, wherein the airflow channels are in a honeycomb arrangement, a compound hexagonal arrangement or a narrowed hexagonal arrangement. The electronic device with a heat dissipation structure according to any one of claims 1 to 22, wherein the air flow channels are connected to each other and appear as an array pattern. The electronic device with a heat dissipation structure according to claim 1, wherein each of the airflow channels extends from each of the air inlets to each of the air outlets in an arc shape. The electronic device with a heat dissipation structure according to claim 1, wherein each of the airflow channels extends diagonally from each of the air inlets to each of the air outlets, and some of the air outlets are formed on the left and right sides of the first body . The electronic device with heat dissipation structure according to claim 1, wherein the air flow channels are respectively formed on an inner side surface and an outer side surface of the back cover, and the air flow channels extend diagonally and intersect each other, and part of the air flow channels The air outlets are formed on the left and right sides of the first body. According to claim 1, the electronic device with a heat dissipation structure, wherein the air flow channels are partially connected. The electronic device with a heat dissipation structure according to claim 1, wherein a part of the heat conducting member located between the first body and the second body has a gap with the hinge module.

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