US20090283246A1 - Cooling fin structure and heat-dissipating module thereof - Google Patents
Cooling fin structure and heat-dissipating module thereof Download PDFInfo
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- US20090283246A1 US20090283246A1 US12/288,523 US28852308A US2009283246A1 US 20090283246 A1 US20090283246 A1 US 20090283246A1 US 28852308 A US28852308 A US 28852308A US 2009283246 A1 US2009283246 A1 US 2009283246A1
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- Prior art keywords
- heat
- guiding portion
- plate
- cooling fin
- dissipating
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to cooling fin structures and heat-dissipating modules thereof, and more particularly, to a cooling fin structure capable of guiding and concentrating a heat-dissipating fluid and a heat-dissipating module thereof.
- the central processing unit (CPU) installed therein accounts for most of the heat generated by the host computer. Accumulation of heat inside the host computer usually accompanies deteriorating CPU performance, causes the host computer to hang as soon as the accumulated heat goes beyond a limit, and even damage the host computer in a serious scenario. More badly, to address the issue of electromagnetic radiation, the host computer is usually enclosed by a casing in an airtight manner. Hence, an important issue facing the information-related electronic industry involves rapid removal of heat from the CPU and heat-generating components.
- a conventional CPU is installed with a heat sink thereon, and the heat sink has one side equipped with some fins and the other side (not equipped with fins) in immediate contact with the CPU, so as to transfer heat to the end of each of the fins and then dissipate the heat rapidly by radiation or an additional fan capable of blowing air.
- a cooling fin 1 a is a plate bilaterally bent to form bends 11 .
- the cooling fins 1 a are stacked up to form a cooling fin set 1 .
- Between two adjacent ones of the cooling fins 1 a is a heat-dissipating space 11 a .
- the cooling fin set 1 , a heat-dissipating base 2 , and at least a heat pipe 3 together form a heat-dissipating module 4 .
- the heat-dissipating module 4 comes into contact with a heat-generating unit (not shown) via a lower end surface 21 of the heat-dissipating base 2 which, in turn, transfers heat to the heat pipe 3 , and then the heat pipe 3 transfers the heat to the cooling fin set 1 , and in consequence the heat is released to the air by radiation.
- the heat-dissipating module 4 is provided with a cooling fan (not shown) to blow air and boost heat dissipation.
- Each of the cooling fins 1 a is flat and plate-shaped and is merely provided with an upper surface and a lower surface whereby heat dissipation takes place, and thus heat dissipation is inefficient due to small dissipation area.
- the heat-dissipating space 11 a between the cooling fins 1 a is small and incapable of guiding a heat-dissipating air stream 5 generated by the cooling fan (not shown) along a course of a smooth flow.
- the heat-dissipating air stream 5 that pours into the heat-dissipating space 11 a overwhelmingly is likely to flow within the heat-dissipating space 11 a disorderly or even spread to the bilaterally-positioned bends 11 and eventually seep through cracks.
- the conventional heat-dissipating module has the following drawbacks:
- the inventor of the present invention endeavored to improve the prior art and eventually devised a cooling fin structure and a heat-dissipating module thereof that overcomes the drawbacks of the prior art.
- Another objective of the present invention is to provide a cooling fin structure and a heat-dissipating module thereof so as to guide a running fluid from two peripheral sides of the cooling fin structure to the center of the cooling fin structure and stop the running fluid from spreading to the two peripheral sides of the cooling fin structure.
- Yet another objective of the present invention is to provide a cooling fin structure and a heat-dissipating module thereof capable of guiding a heat-dissipating fluid.
- the present invention provides a cooling fin structure and a heat-dissipating module thereof.
- the cooling fin structure comprises a plate, a first guiding portion, and a second guiding portion.
- the first guiding portion and the second guiding portion extend from and form integrally with the plate bilaterally with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate.
- the cooling fins are stacked up and coupled to a heat pipe, a base, and a fan to form a heat-dissipating module.
- the first guiding portion and the second guiding portion of the cooling fin structure guide a fluid generated by the fan to the plate and concentrate the fluid therein, so as to allow the fluid to flow smoothly and greatly enhance heat dissipation. Accordingly, the present invention has the following advantages:
- FIG. 1 a is a perspective view of a conventional cooling fin
- FIG. 1 b is an exploded view of a conventional cooling fin set
- FIG. 1 c is a perspective view of a conventional heat-dissipating module
- FIG. 1 d is a schematic view of a conventional state according to the prior art
- FIG. 2 a is a perspective view of a cooling fin according to an embodiment of the present invention.
- FIG. 2 b is a front elevational view of a cooling fin according to the embodiment of the present invention.
- FIG. 3 is a perspective view of a cooling fin set according to the embodiment of the present invention.
- FIG. 4 a is a front elevational view of a cooling fin according to another embodiment of the present invention.
- FIG. 4 b is a front elevational view of a cooling fin according to yet another embodiment of the present invention.
- FIG. 5 is an exploded view of a heat-dissipating module according to an embodiment of the present invention.
- FIG. 6 is a perspective view of a heat-dissipating module according to an embodiment of the present invention.
- FIG. 7 is a perspective view of a heat-dissipating module according to another embodiment of the present invention.
- FIG. 8 is a perspective view showing a state of a heat-dissipating module according to the other embodiment of the present invention.
- FIG. 9 is a schematic view showing a state of a heat-dissipating module according to the other embodiment of the present invention.
- FIG. 10 is an exploded view of a cooling fin set according to yet another embodiment of the present invention.
- a cooling fin 6 a comprises a plate 61 , a first guiding portion 62 , and a second guiding portion 63 .
- the first guiding portion 62 and the second guiding portion 63 extend from and form integrally with the plate 61 bilaterally.
- the first guiding portion 62 and the second guiding portion 63 are opposite.
- the first guiding portion 62 angles upwardly relative to the plate 61 with a first included angle 621 therebetween.
- the second guiding portion 63 angles upwardly relative to the plate 61 with a second included angle 631 therebetween.
- the plate 61 , the first guiding portion 62 , and the second guiding portion 63 together define a trough 65 .
- the first guiding portion 62 extends in the direction opposite to the plate 61 to form a first heat-dissipating portion 622 .
- the second guiding portion 63 extends in the direction opposite to the plate 61 to form a second heat-dissipating portion 632 .
- the first and second heat-dissipating portions 622 , 632 are formed with a first bend 623 and a second bend 633 respectively, and are formed with at least a through hole 64 penetratable by a heat pipe (not shown).
- the cooling fins 6 a are stacked up to form a cooling fin set 6 , and the first and second bends 623 , 633 of each of the cooling fans 6 a are in contact with a corresponding one of the cooling fins 6 a , thus allowing a channel 66 to be formed between two adjacent ones of the cooling fins 6 a.
- the first included angle 621 between the plate 61 and the first guiding portion 62 of the cooling fin 6 a is greater than 90 degrees (as shown in FIG. 2 b ), equal to 90 degrees (as shown in FIG. 4 a ), or less than 90 degrees (as shown in FIG. 4 b ), and the second included angle 631 between the plate 61 and the second guiding portion 63 of the cooling fin 6 a is greater than 90 degrees (as shown in FIG. 2 b ), equal to 90 degrees (as shown in FIG. 4 a ), or less than 90 degrees (as shown in FIG. 4 b ).
- the cooling fin set 6 , at least a heat pipe 8 , and a base 9 a combine to form a heat sink 9 .
- a pad 91 is disposed on the base 9 a .
- At least a hole 911 is formed on a side surface 91 a of the pad 91 .
- the hole 911 penetrates the pad 91 .
- a groove 912 is formed in the base 9 a in such a manner that the groove 912 corresponds in position to and extends from the hole 911 .
- the base 9 a has a lower end surface 91 b .
- the lower end surface 91 b is in contact with at least a heat-generating unit (not shown) so as to enable heat transfer.
- the heat pipe 8 comprises at least a heat absorption portion 81 and at least a heat transfer portion 82 .
- the heat absorption portion 81 penetrates the hole 911 of the base 9 a and is received in the groove 912 .
- the first heat-dissipating portion 622 and the second heat-dissipating portion 632 of each of the cooling fins 6 a are formed with at least one of a plurality of through holes 64 .
- the through holes 64 are oppositely sequentially disposed with the heat transfer portion 82 of the heat pipe 8 and thereby coupled to the heat pipe 8 .
- heat is transferred from the base 9 to the heat absorption portion 81 of the heat pipe 8 , and then from the heat transfer portion 82 of the heat pipe 8 to the cooling fin set 6 penetrated by the heat transfer portion 82 of the heat pipe 8 , thereby allowing the cooling fin set 6 to release the heat to the air.
- the heat sink 9 and a fan 7 are coupled together to form a heat-dissipating module 10 , and the fan 7 is coupled to the cooling fin set 6 sideward.
- the fan 7 faces the plate 61 , the first and second guiding portions 62 , 63 , and the first and second heat-dissipating portions 622 , 632 of the cooling fin 6 a .
- a heat-dissipating fluid 71 blown into the channels 66 by the fan 7 is always guided to the plates 61 by the first guiding portions 62 and the second guiding portions 63 , and in consequence the heat-dissipating fluid 71 concentrates on the plates 61 .
- the heat-dissipating fluid 71 which plays an auxiliary role in enhancement of heat dissipation taught by the present invention, flows in the channels 66 smoothly, orderly, and regularly. Furthermore, the heat-dissipating fluid 71 in the channels 66 concentrates and therefore does not spread to the first and second bends 623 , 633 , thereby enhancing heat dissipation of the heat-dissipating module 10 greatly.
- At least a first engaging portion 624 and at least a second engaging portion 634 are provided on opposing sides of the first heat-dissipating portion 622 and the second heat-dissipating portion 632 of the cooling fin 6 a respectively.
- Each of the first engaging portions 624 and each of the second engaging portions 634 are adapted for engagement with a corresponding one of the first engaging portions 624 and a corresponding one of the second engaging portions 634 , so as to facilitate stacking the cooling fins 6 a and forming the cooling fin set 6 .
- the modification stays within the scope of the claims of the present invention and serves to increase heat dissipation area, guide a fluid to the center of the cooling fin 6 a , and concentrate the outgoing fluid as taught in the preceding embodiments.
- the trough 65 of the cooling fin set 6 not only contributes to an increased heat dissipation area of the cooling fin set 6 , but also guides and concentrates the heat-dissipating fluid 71 generated by the fan 7 for heat dissipation. Accordingly, the heat-dissipating module 10 is rendered efficient in heat dissipation, and thus the drawbacks of the prior art are overcome.
- the cooling fin structure and the heat-dissipating module thereof provided by the present invention are capable of accomplishing the effect thereof and achieving the objectives thereof, and thus the present invention is novel, non-obvious, and useful, and meets all the conditions for filing an invention patent application.
- the applicant hereby files the invention patent application in hopes of receiving allowance of the invention patent application and securing patent protection.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A cooling fin structure and a heat-dissipating module thereof are provided. The cooling fin structure includes a plate. The plate extends bilaterally to form a first guiding portion and a second guiding portion with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate. The plate and the first and second guiding portions together define a trough. The cooling fins are stacked up and coupled to a heat pipe, a base, and a fan so as to form a heat-dissipating module. The first guiding portion and the second guiding portion of the cooling fin structure guide a heat-dissipating fluid generated by the fan to the plate and concentrate the fluid so as to enhance heat dissipation greatly.
Description
- 1. Field of the Invention
- The present invention relates to cooling fin structures and heat-dissipating modules thereof, and more particularly, to a cooling fin structure capable of guiding and concentrating a heat-dissipating fluid and a heat-dissipating module thereof.
- 2. Description of the Prior Art
- With information-related electronic products (for example, computers) becoming more popular and versatile and the development of demand-led information-related electronic industry/technology becoming faster, there is a trend toward increasingly high capacity access and increasingly fast computation of electronic information. As a result, parts and components of information-related electronic products always generate a tremendous amount of heat during high-speed operation.
- Take a host computer as example, the central processing unit (CPU) installed therein accounts for most of the heat generated by the host computer. Accumulation of heat inside the host computer usually accompanies deteriorating CPU performance, causes the host computer to hang as soon as the accumulated heat goes beyond a limit, and even damage the host computer in a serious scenario. More badly, to address the issue of electromagnetic radiation, the host computer is usually enclosed by a casing in an airtight manner. Hence, an important issue facing the information-related electronic industry involves rapid removal of heat from the CPU and heat-generating components.
- To facilitate heat dissipation, a conventional CPU is installed with a heat sink thereon, and the heat sink has one side equipped with some fins and the other side (not equipped with fins) in immediate contact with the CPU, so as to transfer heat to the end of each of the fins and then dissipate the heat rapidly by radiation or an additional fan capable of blowing air.
- Referring to
FIGS. 1 a, 1 b, and 1 c, which illustrate a conventional cooling fin structure, a cooling fin 1 a is a plate bilaterally bent to formbends 11. The cooling fins 1 a are stacked up to form a cooling fin set 1. Between two adjacent ones of the cooling fins 1 a is a heat-dissipatingspace 11 a. The cooling fin set 1, a heat-dissipatingbase 2, and at least aheat pipe 3 together form a heat-dissipating module 4. According to the prior art, the heat-dissipating module 4 comes into contact with a heat-generating unit (not shown) via alower end surface 21 of the heat-dissipating base 2 which, in turn, transfers heat to theheat pipe 3, and then theheat pipe 3 transfers the heat to the cooling fin set 1, and in consequence the heat is released to the air by radiation. Optionally, the heat-dissipating module 4 is provided with a cooling fan (not shown) to blow air and boost heat dissipation. Each of the cooling fins 1 a is flat and plate-shaped and is merely provided with an upper surface and a lower surface whereby heat dissipation takes place, and thus heat dissipation is inefficient due to small dissipation area. The heat-dissipating space 11 a between the cooling fins 1 a is small and incapable of guiding a heat-dissipating air stream 5 generated by the cooling fan (not shown) along a course of a smooth flow. Hence, the heat-dissipatingair stream 5 that pours into the heat-dissipatingspace 11 a overwhelmingly is likely to flow within the heat-dissipatingspace 11 a disorderly or even spread to the bilaterally-positionedbends 11 and eventually seep through cracks. As a result, it is infeasible to concentrate the heat-dissipatingair stream 5, and thus the intended heat dissipation function of the cooling fan (not shown) turns out to be feeble and even unfavorable. In conclusion, the conventional heat-dissipating module has the following drawbacks: - 1. inefficient heat dissipation
- 2. failure to guide a heat-dissipating air stream
- 3. failure to concentrate a heat-dissipating air stream
- 4. small heat dissipation area
- In view of the drawbacks of the prior art, the inventor of the present invention endeavored to improve the prior art and eventually devised a cooling fin structure and a heat-dissipating module thereof that overcomes the drawbacks of the prior art.
- In light of the aforesaid drawbacks of the prior art, it is a primary objective of the present invention to provide a cooling fin structure favorable for an increased heat dissipation area.
- Another objective of the present invention is to provide a cooling fin structure and a heat-dissipating module thereof so as to guide a running fluid from two peripheral sides of the cooling fin structure to the center of the cooling fin structure and stop the running fluid from spreading to the two peripheral sides of the cooling fin structure.
- Yet another objective of the present invention is to provide a cooling fin structure and a heat-dissipating module thereof capable of guiding a heat-dissipating fluid.
- To achieve the aforesaid objectives, the present invention provides a cooling fin structure and a heat-dissipating module thereof. The cooling fin structure comprises a plate, a first guiding portion, and a second guiding portion. The first guiding portion and the second guiding portion extend from and form integrally with the plate bilaterally with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate. The cooling fins are stacked up and coupled to a heat pipe, a base, and a fan to form a heat-dissipating module. The first guiding portion and the second guiding portion of the cooling fin structure guide a fluid generated by the fan to the plate and concentrate the fluid therein, so as to allow the fluid to flow smoothly and greatly enhance heat dissipation. Accordingly, the present invention has the following advantages:
- 1. air stream guidance and enhanced heat dissipation
- 2. large heat dissipation area and heat-dissipating space
- 3. smooth flow of a fluid in heat-dissipating space
- 4. concentrating a heat-dissipating fluid
- 5. efficient heat exchange
-
FIG. 1 a (PRIOR ART) is a perspective view of a conventional cooling fin; -
FIG. 1 b (PRIOR ART) is an exploded view of a conventional cooling fin set; -
FIG. 1 c (PRIOR ART) is a perspective view of a conventional heat-dissipating module; -
FIG. 1 d (PRIOR ART) is a schematic view of a conventional state according to the prior art; -
FIG. 2 a is a perspective view of a cooling fin according to an embodiment of the present invention; -
FIG. 2 b is a front elevational view of a cooling fin according to the embodiment of the present invention; -
FIG. 3 is a perspective view of a cooling fin set according to the embodiment of the present invention; -
FIG. 4 a is a front elevational view of a cooling fin according to another embodiment of the present invention; -
FIG. 4 b is a front elevational view of a cooling fin according to yet another embodiment of the present invention; -
FIG. 5 is an exploded view of a heat-dissipating module according to an embodiment of the present invention; -
FIG. 6 is a perspective view of a heat-dissipating module according to an embodiment of the present invention; -
FIG. 7 is a perspective view of a heat-dissipating module according to another embodiment of the present invention; -
FIG. 8 is a perspective view showing a state of a heat-dissipating module according to the other embodiment of the present invention; -
FIG. 9 is a schematic view showing a state of a heat-dissipating module according to the other embodiment of the present invention; and -
FIG. 10 is an exploded view of a cooling fin set according to yet another embodiment of the present invention. - The present invention is herein illustrated with specific embodiments and the accompanying drawings, so that one skilled in the pertinent art can easily understand the aforesaid objectives, structural features, functional features, other advantages and effects of the present invention from the disclosure of the invention.
- Referring to
FIGS. 2 a and 2 b, a coolingfin 6 a comprises aplate 61, a first guidingportion 62, and asecond guiding portion 63. Thefirst guiding portion 62 and the second guidingportion 63 extend from and form integrally with theplate 61 bilaterally. Thefirst guiding portion 62 and the second guidingportion 63 are opposite. Thefirst guiding portion 62 angles upwardly relative to theplate 61 with a first includedangle 621 therebetween. Thesecond guiding portion 63 angles upwardly relative to theplate 61 with a second includedangle 631 therebetween. Theplate 61, the first guidingportion 62, and the second guidingportion 63 together define atrough 65. - The
first guiding portion 62 extends in the direction opposite to theplate 61 to form a first heat-dissipatingportion 622. Thesecond guiding portion 63 extends in the direction opposite to theplate 61 to form a second heat-dissipatingportion 632. The first and second heat-dissipatingportions first bend 623 and asecond bend 633 respectively, and are formed with at least a throughhole 64 penetratable by a heat pipe (not shown). - Referring to
FIG. 3 , the coolingfins 6 a are stacked up to form a cooling fin set 6, and the first andsecond bends fans 6 a are in contact with a corresponding one of thecooling fins 6 a, thus allowing achannel 66 to be formed between two adjacent ones of thecooling fins 6 a. - Referring to
FIGS. 2 b, 4 a and 4 b, the first includedangle 621 between theplate 61 and the first guidingportion 62 of the coolingfin 6 a is greater than 90 degrees (as shown inFIG. 2 b), equal to 90 degrees (as shown inFIG. 4 a), or less than 90 degrees (as shown inFIG. 4 b), and the second includedangle 631 between theplate 61 and the second guidingportion 63 of the coolingfin 6 a is greater than 90 degrees (as shown inFIG. 2 b), equal to 90 degrees (as shown inFIG. 4 a), or less than 90 degrees (as shown inFIG. 4 b). - Referring to
FIGS. 5 and 6 , the cooling fin set 6, at least aheat pipe 8, and abase 9 a combine to form aheat sink 9. Apad 91 is disposed on thebase 9 a. At least ahole 911 is formed on aside surface 91 a of thepad 91. Thehole 911 penetrates thepad 91. Agroove 912 is formed in thebase 9 a in such a manner that thegroove 912 corresponds in position to and extends from thehole 911. Thebase 9 a has alower end surface 91 b. Thelower end surface 91 b is in contact with at least a heat-generating unit (not shown) so as to enable heat transfer. - The
heat pipe 8 comprises at least aheat absorption portion 81 and at least aheat transfer portion 82. Theheat absorption portion 81 penetrates thehole 911 of thebase 9 a and is received in thegroove 912. - The first heat-dissipating
portion 622 and the second heat-dissipatingportion 632 of each of thecooling fins 6 a are formed with at least one of a plurality of throughholes 64. The through holes 64 are oppositely sequentially disposed with theheat transfer portion 82 of theheat pipe 8 and thereby coupled to theheat pipe 8. Hence, heat is transferred from thebase 9 to theheat absorption portion 81 of theheat pipe 8, and then from theheat transfer portion 82 of theheat pipe 8 to the cooling fin set 6 penetrated by theheat transfer portion 82 of theheat pipe 8, thereby allowing the cooling fin set 6 to release the heat to the air. - Referring to
FIGS. 7 , 8 and 9, theheat sink 9 and afan 7 are coupled together to form a heat-dissipatingmodule 10, and thefan 7 is coupled to the cooling fin set 6 sideward. Specifically speaking, thefan 7 faces theplate 61, the first andsecond guiding portions portions fin 6 a. Hence, a heat-dissipatingfluid 71 blown into thechannels 66 by thefan 7 is always guided to theplates 61 by thefirst guiding portions 62 and thesecond guiding portions 63, and in consequence the heat-dissipatingfluid 71 concentrates on theplates 61. As a result, the heat-dissipatingfluid 71, which plays an auxiliary role in enhancement of heat dissipation taught by the present invention, flows in thechannels 66 smoothly, orderly, and regularly. Furthermore, the heat-dissipatingfluid 71 in thechannels 66 concentrates and therefore does not spread to the first andsecond bends module 10 greatly. - Referring to
FIG. 10 , at least a firstengaging portion 624 and at least a secondengaging portion 634 are provided on opposing sides of the first heat-dissipatingportion 622 and the second heat-dissipatingportion 632 of the coolingfin 6a respectively. Each of the first engagingportions 624 and each of the secondengaging portions 634 are adapted for engagement with a corresponding one of the first engagingportions 624 and a corresponding one of the secondengaging portions 634, so as to facilitate stacking thecooling fins 6 a and forming the coolingfin set 6. The modification stays within the scope of the claims of the present invention and serves to increase heat dissipation area, guide a fluid to the center of the coolingfin 6 a, and concentrate the outgoing fluid as taught in the preceding embodiments. - The
trough 65 of the cooling fin set 6 not only contributes to an increased heat dissipation area of the cooling fin set 6, but also guides and concentrates the heat-dissipatingfluid 71 generated by thefan 7 for heat dissipation. Accordingly, the heat-dissipatingmodule 10 is rendered efficient in heat dissipation, and thus the drawbacks of the prior art are overcome. - The above-described preferred embodiments are intended to illustrate the principles and features of the present invention. The present invention is not intended to be limited to the preferred embodiments. All equivalent modifications and changes made in the preferred embodiments without departing from the spirit and scope of the present invention will be readily apparent to those skilled in the art. The scope of the present invention should be determined with reference to the appended claims.
- In conclusion, the cooling fin structure and the heat-dissipating module thereof provided by the present invention are capable of accomplishing the effect thereof and achieving the objectives thereof, and thus the present invention is novel, non-obvious, and useful, and meets all the conditions for filing an invention patent application. The applicant hereby files the invention patent application in hopes of receiving allowance of the invention patent application and securing patent protection.
Claims (16)
1. A cooling fin structure comprising a plate, a first guiding portion, and a second guiding portion, the first and second guiding portions extending from and formed integrally with the plate with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate.
2. The cooling fin structure of claim 1 , wherein the first guiding portion angles upwardly relative to the plate, the second guiding portion angles upwardly relative to the plate.
3. The cooling fin structure of claim 1 , wherein the first guiding portion and the second guiding portion flank the plate.
4. The cooling fin structure of claim 2 , wherein the first guiding portion and the second guiding portion flank the plate.
5. The cooling fin structure of claim 1 , wherein the first guiding portion extends to form a first heat-dissipating portion, and the second guiding portion extends to form a second heat-dissipating portion.
6. The cooling fin structure of claim 5 , wherein the first and second heat-dissipating portions are formed with at least a through hole.
7. The cooling fin structure of claim 1 , wherein the first and second included angles are one of less than 90 degrees, equal to 90 degrees, and greater than 90 degrees.
8. The cooling fin structure of claim 1 , wherein the plate and the first and second guiding portions together define a trough.
9. The cooling fin structure of claim 2 , wherein the plate and the first and second guiding portions together define a trough.
10. A heat-dissipating module, comprising:
a base;
a heat pipe with at least a heat absorption portion and at least a heat transfer portion, the heat absorption portion being connected to the base; and
a cooling fin set comprising a plurality of cooling fins stacked up and penetrated by the heat transfer portion of the heat pipe, the cooling fins each comprising a plate, a first guiding portion, and a second guiding portion, the first and second guiding portions extending from and formed integrally with the plate with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate.
11. The heat-dissipating module of claim 10 , wherein the first guiding portion and the second guiding portion angle upwardly relative to the plate, and the first guiding portion and the second guiding portion together define a trough.
12. The heat-dissipating module of claim 10 , wherein the first guiding portion extends to form a first heat-dissipating portion, and the second guiding portion extends to form a second heat-dissipating portion.
13. The heat-dissipating module of claim 12 , wherein the first and second heat-dissipating portions are formed with at least one of a plurality of through hole, the through holes being oppositely sequentially disposed with the heat transfer portion.
14. The heat-dissipating module of claim 10 , wherein the first and second included angles are one of less than 90 degrees, equal to 90 degrees, and greater than 90 degrees.
15. The heat-dissipating module of claim 10 , wherein a channel is formed between two adjacent ones of the cooling fins of the cooling fin set.
16. The heat-dissipating module of claim 10 , wherein the cooling fin set is coupled to a fan sideward, and the fan faces the plate and the first and second guiding portions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097208684U TWM346266U (en) | 2008-05-19 | 2008-05-19 | Heat dissipation fin and heat dissipation module having the same |
TW097208684 | 2008-05-19 |
Publications (1)
Publication Number | Publication Date |
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US20090283246A1 true US20090283246A1 (en) | 2009-11-19 |
Family
ID=41315029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/288,523 Abandoned US20090283246A1 (en) | 2008-05-19 | 2008-10-21 | Cooling fin structure and heat-dissipating module thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090283246A1 (en) |
TW (1) | TWM346266U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100193162A1 (en) * | 2009-02-05 | 2010-08-05 | Wistron Corporation | Heat dissipation device |
US20110000641A1 (en) * | 2009-07-06 | 2011-01-06 | Xiaozhen Zeng | Radiating fin structure and heat sink thereof |
US20110094711A1 (en) * | 2009-10-22 | 2011-04-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
US20120261096A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Radiating fin structureand thermal module using same |
US20160100511A1 (en) * | 2013-03-15 | 2016-04-07 | A.K. Stamping Company, Inc. | Aluminum EMI / RF Shield with Fins |
WO2017106242A1 (en) * | 2015-12-14 | 2017-06-22 | A.K. Stamping Company, Inc. | Aluminum emi / rf shield with fins |
EP3108195A4 (en) * | 2014-02-18 | 2018-05-16 | Forced Physics LLC | Assembly and method for cooling |
US10542644B2 (en) | 2016-12-14 | 2020-01-21 | A.K. Stamping Company, Inc. | Two-piece solderable shield |
Citations (9)
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US5529120A (en) * | 1994-02-01 | 1996-06-25 | Hubbell Incorporated | Heat exchanger for electrical cabinet or the like |
US20060219392A1 (en) * | 2005-04-01 | 2006-10-05 | Tong-Hua Lin | Heat dissipating apparatus |
US7124808B2 (en) * | 2004-12-14 | 2006-10-24 | Quanta Computer Inc. | Heat dissipation device |
US20060266500A1 (en) * | 2005-05-29 | 2006-11-30 | Tong-Hua Lin | Heat dissipating apparatus |
US7245492B2 (en) * | 2004-02-27 | 2007-07-17 | Quanta Computer Inc. | Heat-dissipating module and structure thereof |
US7249626B2 (en) * | 2005-06-10 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7304847B2 (en) * | 2006-02-10 | 2007-12-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US7478668B2 (en) * | 2006-11-28 | 2009-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7661466B2 (en) * | 2007-04-18 | 2010-02-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
-
2008
- 2008-05-19 TW TW097208684U patent/TWM346266U/en not_active IP Right Cessation
- 2008-10-21 US US12/288,523 patent/US20090283246A1/en not_active Abandoned
Patent Citations (9)
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US5529120A (en) * | 1994-02-01 | 1996-06-25 | Hubbell Incorporated | Heat exchanger for electrical cabinet or the like |
US7245492B2 (en) * | 2004-02-27 | 2007-07-17 | Quanta Computer Inc. | Heat-dissipating module and structure thereof |
US7124808B2 (en) * | 2004-12-14 | 2006-10-24 | Quanta Computer Inc. | Heat dissipation device |
US20060219392A1 (en) * | 2005-04-01 | 2006-10-05 | Tong-Hua Lin | Heat dissipating apparatus |
US20060266500A1 (en) * | 2005-05-29 | 2006-11-30 | Tong-Hua Lin | Heat dissipating apparatus |
US7249626B2 (en) * | 2005-06-10 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7304847B2 (en) * | 2006-02-10 | 2007-12-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
US7478668B2 (en) * | 2006-11-28 | 2009-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7661466B2 (en) * | 2007-04-18 | 2010-02-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100193162A1 (en) * | 2009-02-05 | 2010-08-05 | Wistron Corporation | Heat dissipation device |
US20110000641A1 (en) * | 2009-07-06 | 2011-01-06 | Xiaozhen Zeng | Radiating fin structure and heat sink thereof |
US20110094711A1 (en) * | 2009-10-22 | 2011-04-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
US8579016B2 (en) * | 2009-10-22 | 2013-11-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
US20120261096A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Radiating fin structureand thermal module using same |
US20160100511A1 (en) * | 2013-03-15 | 2016-04-07 | A.K. Stamping Company, Inc. | Aluminum EMI / RF Shield with Fins |
US9603292B2 (en) * | 2013-03-15 | 2017-03-21 | A.K. Stamping Company, Inc. | Aluminum EMI/RF shield with fins |
EP3108195A4 (en) * | 2014-02-18 | 2018-05-16 | Forced Physics LLC | Assembly and method for cooling |
US10379582B2 (en) | 2014-02-18 | 2019-08-13 | Forced Physics Llc | Assembly and method for cooling |
US11327540B2 (en) | 2014-02-18 | 2022-05-10 | Forced Physics Llc | Assembly and method for cooling |
WO2017106242A1 (en) * | 2015-12-14 | 2017-06-22 | A.K. Stamping Company, Inc. | Aluminum emi / rf shield with fins |
US10542644B2 (en) | 2016-12-14 | 2020-01-21 | A.K. Stamping Company, Inc. | Two-piece solderable shield |
Also Published As
Publication number | Publication date |
---|---|
TWM346266U (en) | 2008-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, CHIH MING;REEL/FRAME:021776/0397 Effective date: 20081001 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |