M311240 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱器模組，尤指一種應用於個人 電腦之中央處理器或處理晶片所之散熱器模組。 【先前技術】 如第八圖所示，為習用散熱器模組之散熱氣流 圖，邊散熱裔模組的結構係於一基座（5 〇 )上設有複數 並排直立狀的散熱鰭片（5 1 ) ( 5 2 )，該基座（5 0 ) 底面可貼附於一電路板上之處理晶片（5 3 )表面。前述 政熱鰭片（5 1 )( 5 2 )之形狀、數量與擺設位置等均 對散熱效率有著極大的影響，當在一定的限制區域之内， 為了要提升散熱效能，可藉由增加散熱鰭片（5 i ) (5 2 )的數量來提高有效的總散熱面積，隨著散熱鰭片（5 Y )( 5 2 )的密度增片，彼此排列的間距自然縮小。而 搭配散熱模組共同使用之散熱風扇，其使用數量、轉速等 苓數均有一定的限制，因此當散熱鰭片（5丄）（5 2 ) 的排列密度提升到-定程度時，冑熱效能將不升反降，原 因在於高密度的繼片（51) (52)會使得風阻變 大、風速減低，造㈣流熱傳係數減低，原來提高總散熱 面積之效益將與對流熱傳係數相互抵消掉， 印从。j夫口，名包 政熱面積與對流熱傳係數這兩個參數具m肖長的: 係，受散熱風扇參數固定的限制下，散熱鰭片（5丄j ' 2)數量越多，散熱效率將有可能變差。 （5 再者，圖中所示之習用散熱器模組係由矩形鰭片（5 M311240 14梯形鰭片（5 2 )依序交替排列組成，基於這種架 構之下政熱為拉組的上半部其流道風阻最小，因此來自 散熱風：的氣流大部分均集中在散熱鰭片（51) (52) 的上半"卩，相較之下，氣流難以到達位於散熱鰭片（5 1 ) (5 2 )下半部的處理晶片（5 3 )，無法有效對熱源中心 進行散熱。 【新型内容】 # 銓於以往政熱換組之散熱氣流無法有效對發熱源提供 有效的散熱效果’本創作之主要目的係提供一種散熱器模 組，能有效導引散熱氣流朝向發熱源方向以提高散熱效 果0 為達成w述目的，本創作之散熱器模組係於一基座頂 面固設有散熱鰭片組，該散執鈇 ※政熱鰭片組當中包含具有斜邊的 散熱鰭片，且該斜邊對散埶裔汚 分 τ这玎舣…巩/瓜之仃進方向係具有向下 引之作用。 • 月1J述散熱鰭片組可由兩種不同形狀之群組構成，第一 群組係為矩形μ，第二群組之各散_片係具有該斜 邊，且該斜邊對散熱氣流之行進方向係具有向下導引 用。 卞 形。 前述第二群組之各散熱鰭片可為平行 四邊形或為倒梯 且前述散熱鰭 前述散熱器模組之側邊可供設有風屬 片之斜邊係該散熱風扇。 前述散熱鰭片可形成供熱導管穿設的貫孔 M311240 【實施方式】 清芩閱第一圖所不，為本創作之立體分解圖，主要包 含有·· 基座（ίο) ’係以導熱效率良好之金屬材質構成 的矩形片冑，係具有適當厚纟，於基座（i Q)四個角落 係分別形成有一固定孔（丄丄），藉由該固定孔（丄工）M311240 VIII. New Description: [New Technology Field] This creation is about a heat sink module, especially a heat sink module applied to a central processing unit or a processing chip of a personal computer. [Prior Art] As shown in the eighth figure, for the heat dissipation airflow diagram of the conventional heat sink module, the structure of the heat sink module is provided on a base (5 〇) with a plurality of heat sink fins arranged side by side ( 5 1 ) ( 5 2 ), the bottom surface of the susceptor (50) can be attached to the surface of the processing wafer (53) on a circuit board. The shape, number and position of the above-mentioned political fins (5 1 ) ( 5 2 ) have a great influence on the heat dissipation efficiency. When the heat dissipation efficiency is improved within a certain limited area, the heat dissipation can be increased. The number of fins (5 i ) (5 2 ) increases the effective total heat dissipation area, and as the density of the heat sink fins (5 Y ) ( 5 2 ) increases, the spacing between the arrays is naturally reduced. The cooling fan that is used together with the heat dissipation module has a certain limit on the number of uses, the number of rotations, and the like. Therefore, when the arrangement density of the heat dissipation fins (5 丄) (5 2 ) is raised to a certain degree, it is hot. The performance will not rise and fall, because the high-density successor (51) (52) will make the wind resistance become larger, the wind speed will decrease, and the heat transfer coefficient will be reduced. The original heat dissipation area will be improved and the convection heat transfer coefficient will be improved. Offset each other, printed from. Jfukou, the two parameters of the hot area of the package and the convection heat transfer coefficient are m-long: The system is limited by the fixed parameters of the cooling fan, and the number of heat-dissipating fins (5丄j '2) is more. Efficiency will likely deteriorate. (5 In addition, the conventional heat sink module shown in the figure is composed of rectangular fins (5 M311240 14 trapezoidal fins (5 2 ) are arranged alternately in order, based on this structure, the political heat is the upper group of the pull group The half of the flow path has the smallest wind resistance, so most of the airflow from the heat dissipation wind is concentrated in the upper half of the heat sink fins (51) (52). In contrast, the airflow is difficult to reach on the heat sink fins (5) 1) (5 2 ) The processing chip (5 3 ) in the lower half cannot effectively dissipate heat from the heat source center. [New content] # The heat dissipation airflow in the past has not been effective in providing effective heat dissipation to the heat source. The main purpose of this creation is to provide a heat sink module that can effectively guide the heat dissipation airflow toward the direction of the heat source to improve the heat dissipation effect. The heat sink module of the present invention is fixed on the top surface of a base. With a heat sink fin group, the loose 鈇 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 巩 巩 巩 巩 巩 巩 巩 巩 巩 巩 巩 巩It has the function of downward guidance. A group of two different shapes is formed. The first group is a rectangle μ, and each of the second group has the oblique side, and the oblique side has a downward guiding direction for the traveling direction of the heat dissipation airflow. The heat dissipating fins of the second group may be parallelograms or inverted ladders, and the side edges of the heat sink fins of the heat dissipating fins may be provided with a beveled edge of the wind piece to be the heat dissipating fan. The fins can form a through hole M311240 through which the heat pipe is bored. [Embodiment] The first figure is not shown in the first figure. The three-dimensional exploded view of the present invention mainly includes a base (ίο) 'for good heat conduction efficiency. The rectangular piece of metal material has a suitable thick ridge, and a fixing hole (丄丄) is formed in each of the four corners of the base (i Q), by the fixing hole (completed)
配合適當之扣件、固定件等，可將該基座（i 〇 )固設於 一電路板上； 政熱鰭片組（2 0 )，係由兩種不同形狀的鰭片群組 構成，其第一群組係複數片的矩形鰭片（2 ^ )，第二群 組係平行四邊形鰭片（2 2 )，兩者排列於該基座（丄〇 ) 表面上，該矩形鰭片（2 i )與平行四邊形鰭片（2 2 ) 之數里非要求絕對等同，且其排列方式亦非絕對要求依序 排列’例如可以在兩矩形㈣（2 i <間排列有多數片 平行四邊形片（2 2 )，而在本實施财，兩種不同形 狀的鰭片（2 1 )( 2 2 )係逐片交替排列。 月·J迷各平行四邊形鰭片（2 2 )係具有兩平行的第一 斜邊（23)與第二斜邊（24)，當本創作如第二圖所 不配令散熱風扇（3 0 )使用時，前述平行四邊形鰭片（2 2)均是以第一斜邊（23)朝向該散熱風扇（3〇)， :非以其第二斜邊（24)面向散熱風扇（3〇)。以唁 !斜邊（2 3 )朝向散熱風扇（3 〇 )係有助" 貫際:用時的散熱效率，原因如下： “在 明苓閱第三、四圖所示，本創作於實際運用時，該美 M311240 座（1 0 )之底面係供貼合於一電路板（4 〇 )上的處理 晶片（4 1 )，將處理晶片（4 1 )所產生的熱能吸附並 傳導到上方的散熱鱗片組（2 〇 )，配合來自散熱風扇（3 0 )的氣流加速熱能的排放’在第四圖中，散熱氣流的流 動路徑係如同箭號群組A所示，當散熱氣流進入至散熱鰭 片組（2 0 )時，係受到各平行四邊形鰭片（2 2 )的第 :斜邊（2 3 )所導引，由於第一斜邊（2 3 )係由上端 往下端傾斜，因此在兩相鄰的矩形鰭片（2 1 )之間會形 成-上窄下寬的間隙，該些間隙將構成導引氣流向下流動 的風道，當散熱氣流吹向散熱模組時第一斜邊（2 3 )上 而所又的風阻比下端所受的風阻大，因此散熱氣流將順勢 往散熱鰭片組（2 〇 )之中央底部行進，故直接對熱源上 二：座（1 0)表面中心提供散熱作用。由於散熱氣流 (=政熱鰭片組（2〇)日夺，並非被導引至散熱韓片組 的上方，故能提供最佳的散熱效率。 呈現= 相對於散熱氣流行徑的方向，係 的行進路：因Γ其號B所指示），故能決定氣流 之平行四、r 此向下導引的原則之下，本創作 示的倒梯开Λ11片（22)亦可改為如第或六a圖所 係以具向片（2 5 )，本創作之倒梯形鰭片（2 5 ) 知梯形鳍$引作用的斜邊面向散熱氣流，而不是如同習 如第"以向上導引效果的斜邊朝向散熱氣流。 的各個、六B圖所示，在本創作散熱鰭片組（2〇) (21) (22)上，可更進一步形成有複數 M311240 ^貫孔（26)，該些貫孔（26)可供導熱管（圖中未示） 牙β又第七圖係本創作另一實施例，散熱鰭片（2 2 )同 樣具有第-斜邊（2 3 )，惟第-斜邊（2 3 )非全面形 成於散熱鰭片（22)之側邊，於第一斜邊（23)之末 點係轉折形成一垂直邊。 綜上所述，本創作之散熱器模組利用具有向下導引氣 流作用的鰭片，可令散熱氣流在通過散熱器模組時帶出發 熱源產生的熱能，有效提升散熱效率。 【圖式簡單說明】 苐圖·係本創作之立體分解圖。 第一圖·係本創作搭配散熱風扇使用之組合立體圖。 第二圖：係本創作實際運用時之示意圖。 第四圖：係本創作實際運用時之散熱氣流示意圖。 第五Α圖：係本創作第二實施例於實際運用時之散熱 氣流示意圖。 • 第五B圖·係第：實施例之散熱鰭片形成有貫孔之示 意圖。 第/、A圖·係本創作第三實施例於實際運用時之散熱 氣流示意圖。 第六B圖：待篦二徐μ , 系弟一 a施例之散熱鰭片形成有貫孔之示 意圖。 第七圖·係、本倉Η乍第四實施例於實際運用日夺之散熱氣 流示意圖。 第八圖·係習用散熱器模組使用散熱風扇時之氣流示 M311240 意圖。 【主要元件符號說明】 (10)基座 （11)固定孔 (2 0 )散熱鰭片組 （2 1 )矩形鰭片 (2 2 )平行四邊形鰭片The base (i 〇) can be fixed on a circuit board according to appropriate fasteners, fixing parts, etc. The political fin group (20) is composed of two fin groups of different shapes. The first group is a plurality of rectangular fins (2 ^ ), and the second group is a parallelogram fin (2 2 ), which are arranged on the surface of the pedestal, the rectangular fins ( 2 i ) is absolutely equivalent to the number of parallelogram fins (2 2 ), and its arrangement is not absolutely required to be sequentially arranged 'for example, two rectangles (four) can be arranged (2 i < Piece (2 2 ), and in this implementation, two different shapes of fins (2 1 ) ( 2 2 ) are alternately arranged one by one. Moon·J fans each parallelogram fins (2 2 ) have two parallels The first beveled edge (23) and the second beveled edge (24) are the first parallelogram fins (2 2) when the creation is not used in the second figure to make the cooling fan (30) The oblique side (23) faces the cooling fan (3〇), not facing the cooling fan (3〇) with its second oblique side (24). The 斜! oblique side (2 3 ) faces the cooling air (3 〇) is helpful " continually: the efficiency of heat dissipation during use, for the following reasons: “In the third and fourth figures of Mingyu, the creation of the M311240 (10) The bottom surface is a processing wafer (4 1 ) attached to a circuit board (4 〇), and the thermal energy generated by the processing wafer (4 1 ) is adsorbed and conducted to the upper heat radiation scale group (2 〇), and the heat dissipation is combined with heat dissipation. The airflow of the fan (30) accelerates the discharge of thermal energy. In the fourth figure, the flow path of the heat dissipation airflow is as shown by the arrow group A. When the heat dissipation airflow enters the heat dissipation fin group (20), it is subjected to The first bevel (2 3 ) of each parallelogram fin (2 2 ) is guided by the oblique side (2 3 ), and the first oblique edge (2 3 ) is inclined from the upper end to the lower end, so that two adjacent rectangular fins (2 1 There will be a gap between the upper and lower widths, which will constitute a duct for guiding the downward flow of the airflow, and the first oblique bevel (2 3 ) when the heat radiating air is blown toward the heat dissipation module The wind resistance is greater than the wind resistance at the lower end, so the heat dissipation airflow will travel to the central bottom of the fin assembly (2 〇). Directly providing heat dissipation to the surface of the heat source on the second: seat (1 0) surface. Because the heat dissipation airflow (= political fin group (2〇) is captured, it is not guided to the top of the heat dissipation Korean group, so it can provide the most Good heat dissipation efficiency. Rendering = relative to the direction of the heat-dissipating air path, the traveling path of the system: as indicated by its number B), it can determine the parallelism of the airflow, and the principle of downward guidance, this creation The 11 pieces of inverted ladders (22) can also be changed to the directional angles of the trapezoidal fins (2 5 ) as shown in the first or sixth figure. The side faces the cooling airflow, rather than the slanting edge with the upward guiding effect toward the cooling airflow. Each of the six B diagrams shows that a plurality of M311240 through holes (26) can be further formed on the heat dissipation fin group (2) (21) (22), and the through holes (26) can be further formed. For the heat pipe (not shown), the tooth β and the seventh figure are another embodiment of the present invention. The heat sink fin (2 2 ) also has a first bevel (2 3 ), but the first bevel (2 3 ) Not fully formed on the side of the heat dissipating fins (22), and turned to form a vertical side at the end of the first bevel (23). In summary, the heat sink module of the present invention utilizes a fin having a downwardly directed air flow, so that the heat dissipation airflow can bring the heat energy generated by the heat source when passing through the heat sink module, thereby effectively improving the heat dissipation efficiency. [Simple description of the diagram] The diagram is a three-dimensional exploded view of the creation. The first picture is a combination of the creation and the combination of the cooling fan. The second picture: a schematic diagram of the actual application of the creation. The fourth picture is a schematic diagram of the heat dissipation airflow in the actual application of the creation. The fifth diagram is a schematic diagram of the heat dissipation airflow of the second embodiment of the present invention in actual use. • Fig. 5B is a schematic view of the heat sink fins of the embodiment formed with through holes. Fig. /, Fig. A is a schematic diagram of the heat dissipation flow of the third embodiment of the present invention in actual use. The sixth B picture: Waiting for the second Xu, the younger brother a. The heat sink fins of the example form the intention of the through hole. The seventh figure, the fourth embodiment of the warehouse, is a schematic diagram of the heat dissipation flow of the fourth embodiment. Figure 8 is the airflow of the conventional radiator module when using the cooling fan. M311240 Intent. [Description of main component symbols] (10) Base (11) Fixing hole (2 0) Heat sink fin set (2 1 ) Rectangular fin (2 2 ) Parallelogram fin
(2 3 )第一斜邊 (2 5 )梯形鰭片 (3 0 )散熱風扇 (41)處理晶片 (5 0 )基座 (5 2 )梯形鰭片 (2 4 )第二斜邊 (2 6 )貫孔 (4 0 )電路板 (5 1 )矩形鰭片 (5 3 )處理晶片(2 3) first oblique side (2 5 ) trapezoidal fin (30) cooling fan (41) processing wafer (50) base (5 2) trapezoidal fin (2 4) second oblique side (2 6 )through hole (40) circuit board (5 1 ) rectangular fin (5 3 ) processing wafer