CN201601122U - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN201601122U CN201601122U CN2009203176734U CN200920317673U CN201601122U CN 201601122 U CN201601122 U CN 201601122U CN 2009203176734 U CN2009203176734 U CN 2009203176734U CN 200920317673 U CN200920317673 U CN 200920317673U CN 201601122 U CN201601122 U CN 201601122U
- Authority
- CN
- China
- Prior art keywords
- air port
- radiator
- heat abstractor
- radiator fan
- described radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A radiating device includes a radiator and a radiating fan arranged on the radiator and used for radiating the radiator, the radiator includes a basal body and a plurality of radiating fins extended from the basal body, the basal body defines a central axis, the radiating fan includes a first wind port and a second wind port for air flow, the second wind port is adjacent to the basal body, each radiating fin is provided with a free end, the free ends are bended around the central axis along one of clockwise direction and counter-clockwise direction, and the radiating fan rotates around the central axis in an opposite direction to the bending direction of the free ends. The radiating device is capable of radiating heating elements effectively.
Description
Technical field
The utility model relates to a kind of heat abstractor, refers to the heat abstractor that a kind of radiating efficiency is high especially.
Background technology
Central processing unit (CPU) is the heart of modern computer, if there is not good heat radiation, this heart may quit work at any time, and this will bring very big inconvenience to the user.The heat abstractor that is usually used in central processing unit now is that aluminium extruded is just blowing radiator, development along with technology, the function of computer is more and more, CPU (Central Processing Unit, central processing unit) constantly upgrading, the power consumption of CPU continues to increase, but chassis space is more and more littler, radiator heat-dissipation effect commonly used is limited, and CPU Yin Wendu sometimes is too high and influence operate as normal.
The utility model content
In view of above content, be necessary the heat abstractor that provides a kind of radiating efficiency high.
A kind of heat abstractor, comprising that a radiator and is installed in is used for radiator fan that described radiator is dispelled the heat on the described radiator, described radiator comprises a matrix and a plurality of radiating fin that extends to form from described matrix, described matrix defines a central shaft, described radiator fan comprises and is used for distinguished and admirable one first mobile air port and one second air port, described second air port is near described matrix, each radiating fin of described a plurality of radiating fins is provided with a free end, described free end reaches one of them direction bending counterclockwise along clockwise direction around described central shaft, and described radiator fan is a fan around the direction rotation opposite with described free end overbending direction of described central shaft edge.
Preferably, described matrix radial extension forms described a plurality of radiating fin.
Preferably, described free end arc bending.
Preferably, the vertical described a plurality of radiating fins in described second air port.
Preferably, described first air port is the air inlet of described radiator fan, and described second air port is the air outlet of described radiator fan.
Preferably, described first air port is the air outlet of described radiator fan, and described second air port is the air inlet of described radiator fan.
Preferably, parallel described second air port, described first air port.
Preferably, the matrix of described radiator is cylindrical.
Preferably, described radiator fan comprises a locking part, and described locking part is provided with a through hole, and described radiator is provided with an installing hole, and a screw is fixed together described radiator fan and described radiator by described through hole and described installing hole.
Preferably, described radiator comprises the fixture of described radiator on a circuit board that be used to lock.
Relative prior art, the free end overbending direction of the radiating fin of the radiator of the utility model heat abstractor and the direction of rotation of radiator fan, because air-flow is subjected to the ordering about of radiating fin of described radiator in flow process, cause the intermolecular disturbance of air-flow strong, thereby improved radiating efficiency.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the heat abstractor of the utility model preferred embodiment.
Fig. 2 is the vertical view of the radiator among Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of the heat abstractor among Fig. 1.
The main element symbol description
|
30 |
|
31 |
Radiating |
32 |
Free end | 322 |
Fixed |
33 |
|
331 |
Fixture | 3311 |
|
332 |
Installing |
3321 |
The |
34 |
Radiator fan | 50 |
First air port | 51 |
Second air port | 52 |
The locking part | 522 |
Through hole | 523 |
Screw | 60 |
Embodiment
See also Fig. 1 and Fig. 2, the heat abstractor of the utility model preferred embodiment comprises a radiator 30 and a radiator fan 50.
Described radiator 30 comprise one be used to contact the heater element matrix 31 of (figure does not show), a plurality of from described matrix 31 to around the radiating fin 32 that forms of radial extension and four from described matrix 31 to around the fixed part 33 that extends, described matrix 31 is cylindrical, described matrix 31 definition one central shaft.Each fixed part 33 is between the two adjacent radiating fins 32, each fixed part 33 comprises one first installation portion 331 and one second installation portion 332, described first installation portion 331 comprises that one is used for fixing the fixture 3311 of described radiator 30 on a circuit board (figure does not show), and described second installation portion 332 is provided with an installing hole 3321.Each radiating fin 32 comprises a free end 322, and described free end 322 is provided with a gap 34 around the central shaft arc bending along clockwise direction of described matrix 31 between per two radiating fins 32.
Described radiator fan 50 comprises second air port 52 in one first air port 51 and parallel described first air port 51, in the present embodiment, described first air port 51 is as the air inlet of described radiator fan 50, described second air port 52 is as the air outlet of described radiator fan 50, and described radiator fan 50 rotates counterclockwise.Described radiator fan 50 is respectively established a locking part 522 in described second air port 52 4 sides, and each locking part 522 is provided with the through hole 523 of a corresponding described installing hole 3321.
See also Fig. 1 to Fig. 3, during assembling, second installation portion 332 of the locking part 522 corresponding described radiators 30 of described radiator fan 50 is made the installing hole 3321 of through hole 523 corresponding described second installation portions 332 of described radiator fan 50.Four screws 60 are locked the through hole 523 of described radiator fan 50 and the installing hole 3321 of described radiator 30 respectively, and described radiator fan 50 is fixed on the described radiator 30, thereby described heat abstractor assembling finishes, at this moment, second air port 52 of the radiating fin 32 vertical described radiator fans 50 of described radiator 30.
When described radiator fan 50 rotates counterclockwise around the central shaft edge of described matrix 31, the distinguished and admirable gap 34 that flows into described radiator 30 from top to bottom, because described radiator fan 50 rotates counterclockwise around the central shaft of described matrix 31, thereby drive the distinguished and admirable described radiator 30 that blows to counterclockwise downwards, and the free end 322 of described radiating fin 32 bends along clockwise direction around the central shaft of described matrix 31, because air-flow is subjected to ordering about of described radiator 30 shapes in flow process, cause the intermolecular disturbance of air-flow strong, thereby improved radiating efficiency.
In another embodiment, first air port 51 of described radiator fan 50 is as the air outlet of described radiator fan 50, described second air port 52 is as the air inlet of described radiator fan 50, described radiator 30, distinguished and admirable outflow from the bottom up, described radiator fan 50 clockwise rotates around the central shaft edge of described matrix 31, and the free end 322 of described radiating fin 32 bends in the counterclockwise direction around the central shaft of described matrix 31.
By test, same heater element is dispelled the heat, under other identical conditions, the utility model heat abstractor execution mode is compared the heat abstractor that existing radiating fin does not have bending, can make the temperature of heater element reduce the 2-3 degree.Compare existing heat abstractor, the utility model heat abstractor execution mode has higher radiating efficiency.
Claims (10)
1. heat abstractor, comprising that a radiator and is installed in is used for radiator fan that described radiator is dispelled the heat on the described radiator, described radiator comprises a matrix and a plurality of radiating fin that extends to form from described matrix, described matrix defines a central shaft, described radiator fan comprises and is used for distinguished and admirable one first mobile air port and one second air port, described second air port is near described matrix, it is characterized in that: each radiating fin of described a plurality of radiating fins is provided with a free end, described free end reaches one of them direction bending counterclockwise along clockwise direction around described central shaft, and described radiator fan is a fan around the direction rotation opposite with described free end overbending direction of described central shaft edge.
2. heat abstractor as claimed in claim 1 is characterized in that: described matrix radial extension forms described a plurality of radiating fin.
3. heat abstractor as claimed in claim 1 is characterized in that: described free end arc bending.
4. heat abstractor as claimed in claim 1 is characterized in that: the vertical described a plurality of radiating fins in described second air port.
5. heat abstractor as claimed in claim 1 is characterized in that: described first air port is the air inlet of described radiator fan, and described second air port is the air outlet of described radiator fan.
6. heat abstractor as claimed in claim 1 is characterized in that: described first air port is the air outlet of described radiator fan, and described second air port is the air inlet of described radiator fan.
7. heat abstractor as claimed in claim 1 is characterized in that: parallel described second air port, described first air port.
8. heat abstractor as claimed in claim 1 is characterized in that: the matrix of described radiator is cylindrical.
9. heat abstractor as claimed in claim 1, it is characterized in that: described radiator fan comprises a locking part, described locking part is provided with a through hole, and described radiator is provided with an installing hole, and a screw is fixed together described radiator fan and described radiator by described through hole and described installing hole.
10. heat abstractor as claimed in claim 1 is characterized in that: described radiator comprises the fixture of described radiator on a circuit board that be used to lock.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009203176734U CN201601122U (en) | 2009-12-17 | 2009-12-17 | Radiating device |
US12/723,709 US8199502B2 (en) | 2009-12-17 | 2010-03-15 | Heat dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009203176734U CN201601122U (en) | 2009-12-17 | 2009-12-17 | Radiating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201601122U true CN201601122U (en) | 2010-10-06 |
Family
ID=42812183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009203176734U Expired - Fee Related CN201601122U (en) | 2009-12-17 | 2009-12-17 | Radiating device |
Country Status (2)
Country | Link |
---|---|
US (1) | US8199502B2 (en) |
CN (1) | CN201601122U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130052937A1 (en) * | 2011-08-29 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
CN111432594A (en) * | 2019-01-09 | 2020-07-17 | 迈萪科技股份有限公司 | Heat sink device |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8593814B2 (en) * | 2011-01-26 | 2013-11-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly |
EP2762766B1 (en) * | 2011-10-02 | 2017-02-15 | Nanker (Guang Zhou) Semiconductor Manufacturing Corp. | Led photo-electric source assembly and led road lamp improved from traditional road lamp |
TWM465602U (en) * | 2013-05-22 | 2013-11-11 | Tai Sol Electronics Co Ltd | Heat dissipating apparatus |
US20150260091A1 (en) * | 2014-03-14 | 2015-09-17 | Chung-Shan Institute Of Science And Technology, Armaments Bureau, M.N.D | External cooling fin for rotary engine |
US20200232714A1 (en) * | 2019-01-23 | 2020-07-23 | Taiwan Microloops Corp. | Heat dissipating device |
CN114390854A (en) * | 2020-10-21 | 2022-04-22 | 宏碁股份有限公司 | Heat sink device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
TW590268U (en) * | 2000-08-08 | 2004-06-01 | Wistron Corp | Heat dissipating device |
TWM244719U (en) * | 2003-08-27 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat sink |
JP2005197303A (en) * | 2003-12-26 | 2005-07-21 | Nippon Densan Corp | Heatsink fan |
US20080066898A1 (en) * | 2006-09-15 | 2008-03-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
CN101222835A (en) * | 2007-01-12 | 2008-07-16 | 富准精密工业(深圳)有限公司 | Heat radiating device |
TWM342540U (en) * | 2008-04-01 | 2008-10-11 | Tai Sol Electronics Co Ltd | Heat sink module |
TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
CN102098901A (en) * | 2009-12-15 | 2011-06-15 | 富准精密工业(深圳)有限公司 | Heat radiating device |
-
2009
- 2009-12-17 CN CN2009203176734U patent/CN201601122U/en not_active Expired - Fee Related
-
2010
- 2010-03-15 US US12/723,709 patent/US8199502B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130052937A1 (en) * | 2011-08-29 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
CN111432594A (en) * | 2019-01-09 | 2020-07-17 | 迈萪科技股份有限公司 | Heat sink device |
Also Published As
Publication number | Publication date |
---|---|
US20110149514A1 (en) | 2011-06-23 |
US8199502B2 (en) | 2012-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101006 Termination date: 20111217 |