CN103576807A - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
- Publication number
- CN103576807A CN103576807A CN201210254583.1A CN201210254583A CN103576807A CN 103576807 A CN103576807 A CN 103576807A CN 201210254583 A CN201210254583 A CN 201210254583A CN 103576807 A CN103576807 A CN 103576807A
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- CN
- China
- Prior art keywords
- heat
- air
- air outlet
- heater element
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A heat dissipation module comprises a computer mainboard, a heat conduction device installed on the computer mainboard and a fan installed on the heat conduction device. One end of the heat conduction device is in thermal contact with a first heating element installed on the computer mainboard so as to conduct heat of the first heating element to the other end of the heat conduction device, a second heating element adjacent to the first heating element is installed on the computer mainboard, and the fan comprises at least one first air inlet, one first air outlet and one second air outlet. The first air outlet is opposite to the other end of the heat conduction device, the second air outlet is opposite to the second heating element, cold air with a low temperature enters the fan through the first air inlet, part of air flow is blown to the other end of the heat conduction device after blowing out of the first air outlet, and another part of air flow is blown to the second heating element after blowing out of the second air outlet.
Description
Technical field
The present invention relates to a kind of heat radiation module, relate in particular to a kind of heat radiation module that can simultaneously dispel the heat for a plurality of heater elements.
Background technology
Manufacturer computer is integrated into main frame in display, thereby forms integral computer (all-in-one), is abbreviated as AIO.AIO compares conventional desktop machine the advantage that line is few, volume is little, and integrated level is higher, and price also there is no significant change, and shapeable Ze Gengqiang， manufacturer can design the product that has individual character.How designing AIO that volume is less becomes the key of product design, simultaneously because the integrated level of AIO is higher, and small volume, thereby the heat dissipation design of AIO is particularly important.
Summary of the invention
In view of above content, be necessary to provide a kind of heat radiation module that can simultaneously dispel the heat for a plurality of heater elements.
A kind of heat radiation module, comprise a computer main board, be installed on the heat-transfer device on described computer main board and be installed on the fan on described heat-transfer device, thereby one end of described heat-transfer device is transmitted to the heat of described the first heater element the other end of described heat-transfer device with the one first heater element thermo-contact being installed on described computer main board, on described computer main board, contiguous described the first heater element is installed one second heater element, described fan comprises at least one the first air inlet, one first air outlet and one second air outlet, described the first air outlet is over against the other end of described heat-transfer device, described the second air outlet is over against described the second heater element, the cold air of lower temperature enters fan from described the first air inlet, part air-flow is blown to the other end of described heat-transfer device from described the first air outlet blows out, another part air-flow is blown to described the second heater element from described the second air outlet blows out.
Compared with prior art, above-mentioned heat radiation module is the other end over against described heat-transfer device by described the first air outlet, described the second air outlet is over against described the second heater element, the cold air of lower temperature enters fan from described the first air inlet, part air-flow is blown to the other end of described heat-transfer device from described the first air outlet blows out, another part air-flow is blown to described the second heater element from described the second air outlet blows out, make described fan can be the second heater element heat radiation in for described the first heater element heat radiation, improved the radiating efficiency of described fan.
Accompanying drawing explanation
Fig. 1 is a dispel the heat three-dimensional exploded view of module better embodiment of the present invention, and described heat radiation module comprises heat-transfer device and fan.
Fig. 2 is a schematic diagram of Fig. 1 fan.
Fig. 3 is a three-dimensional assembly diagram of Fig. 1.
Main element symbol description
| Computer |
100 |
| The |
110 |
| The |
120 |
| Heat- |
200 |
| |
210 |
| |
220 |
| |
221 |
| |
230 |
| |
231 |
| |
232 |
| |
233 |
| |
300 |
| |
310 |
| |
311 |
| The |
3111 |
| Diapire | 312 |
| The |
3121 |
| Connecting |
313 |
| The |
314 |
| The |
315 |
| |
320 |
| Securing |
600 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, a dispel the heat better embodiment of module of the present invention comprises a computer main board 100, a heat-transfer device 200 and a fan 300.
One first heater element 110 is installed on described computer main board 100.Described heat-transfer device 200 comprises some heat pipes 210 and heat radiator 220.Described heat pipe 210 is bending, mutual adjacent and parallel being placed on described the first heater element 110 of each heat pipe 210.One holder 230 is installed on described heat pipe 210.Described holder 230 comprises a body 231, four jiaos of extended legs 232 of difference of described body 231.On each leg 232, offer a mounting hole 233.Some securing members 600 are arranged on described holder 230 on described computer main board 100 through corresponding mounting hole 233.Described holder 230 is resisted against described the first heater element 110 on described computer main board 100 by one end of some heat pipes 210.On each heat radiator 220, offer a mounting groove 221.The other end of some heat pipes 210 is through the mounting groove 221 on described heat radiator 220, thus being arranged on described heat pipe 210 that described heat radiator 220 is parallel to each other.On described computer main board 100, contiguous described the first heater element 110 is also installed one second heater element 120.In one embodiment, described the first heater element 110 is a central processing unit, and described the second heater element 120 comprises some voltage-regulation unit.
Refer to Fig. 2, described fan 300 comprises that a housing 310 and is installed on the interior rotatable impeller 320 of described housing 310.Described housing 310 comprises a roof 311, be parallel to a diapire 312 of described roof 311 and connect a connecting wall 313 of described roof 311 and diapire 312.Described housing 310 is offered one first air inlet 3111 on described roof 311.Described housing 310 is offered one second air inlet 3121 on described diapire 312.Described the first air inlet 3111 and the second air inlet 3121 are over against described impeller 320.Described housing 310 forms one first air outlet 314 between described roof 311, diapire 312 and connecting wall 313.Described housing 310 forms one second air outlet 315 on described connecting wall 313.The air intake passage that described the first air inlet 3111 forms and the rotating shaft of described fan 300 are in the same way.The air intake passage that described the second air inlet 3121 forms and the rotating shaft of described fan 300 are in the same way.The air-out passage that described the first air outlet 314 forms is vertical with the rotating shaft of described fan 300.The air-out passage that described the second air outlet 315 forms is vertical with the rotating shaft of described fan 300.The air-out passage that described the first air outlet 314 forms is vertical with the air-out passage that the second air outlet 315 forms.
Refer to Fig. 1 to Fig. 3, during assembling, first described the first heater element 110 is arranged on described computer main board 100.Successively described heat pipe 210 and holder 230 are placed on described the first heater element 110, make the lower surface of one end of described heat pipe 210 be close to described the first heater element 110, the upper surface of one end of described heat pipe 210 is close to described holder 230 simultaneously.The mounting hole 233 that described securing member 600 is passed on described holder 230, thus described holder 230 is arranged on described computer main board 100.The other end of described heat pipe 210 is passed to the mounting groove 221 on described heat radiator 220 successively, thereby described heat radiator 220 is arranged on described heat pipe 210.A side that finally described fan 300 is arranged on to described heat radiator 220 makes described the first air outlet 314 over against described heat radiator 220, and described the second air outlet 315 is over against described the second heater element 120.Wherein, described fan 300 is with stickup, riveted or be otherwise fixed on described heat radiator 220.
During work, the heat that described the first heater element 110 produces conducts to some heat radiator 220 via described heat pipe 210.Described fan 300 rotates, and the cold air of lower temperature enters described fan 300 from described the first air inlet 3111 and the second air inlet 3121 respectively.Part air-flow is blown to described heat radiator 220 from the first air outlet 314 blows out, thereby the heat that the cold air of lower temperature has been taken away on described heat radiator 220 is described the first heater element 110 heat radiations.Another part air-flow is blown to described the second heater element 120 from described the second air outlet 315 blows out, thereby the heat that the cold air of lower temperature has been taken away on described the second heater element 120 is described the second heater element 120 heat radiations.
The hot analysis software Icepak of electronic product knowing by an industry carries out emulation testing to the usefulness of described fan 300.Simulated conditions are set as: original ambient temperature is 35 degree, the radiating efficiency of described the first heater element 110 is 58.5W, the radiating efficiency of described the second heater element 120 is 12.2W, the maximum wind flow of the first air outlet 314 of described fan 300 is 23.88cfm, maximum static pressure is 0.46inch-H2O, the maximum wind flow of described the second air outlet 315 is 2.9cfm, and maximum static pressure is 0.17inch-H2O.According to above-mentioned simulated conditions, to apply after this heat abstractor, the result drawing is: the maximum temperature of described the second heater element 120 is 106.8 degree, and while not applying this heat radiation module, the maximum temperature of described the second heater element 120 is degree 125.5 degree.Find out thus, after improvement, the maximum temperature of described the second heater element 120 declines to some extent, has promoted the radiating effect to the voltage-regulation unit on described computer main board 100, also can guarantee the radiating effect to central processing unit simultaneously.
The present invention dispel the heat module by described the first air outlet 314 over against the heat radiator 220 of described heat-transfer device 200, described the second air outlet 315 is over against described the second heater element 120, the cold air of lower temperature enters fan 300 from described the first air inlet 3111 and the second air inlet 3121, part air-flow is blown to described heat radiator 220 from described the first air outlet 314 blows out, thereby be described the first heater element 110 heat radiations, another part air-flow is blown to described the second heater element 120 from described the second air outlet 315 blows out, make described fan 300 can be the second heater element 120 heat radiations in for described the first heater element 110 heat radiations, improved the radiating efficiency of described fan 300.
Claims (10)
- One kind heat radiation module, comprise a computer main board, be installed on the heat-transfer device on described computer main board and be installed on the fan on described heat-transfer device, it is characterized in that: thus one end of described heat-transfer device is transmitted to the heat of described the first heater element the other end of described heat-transfer device with the one first heater element thermo-contact being installed on described computer main board, on described computer main board, contiguous described the first heater element is installed one second heater element, described fan comprises at least one the first air inlet, one first air outlet and one second air outlet, described the first air outlet is over against the other end of described heat-transfer device, described the second air outlet is over against described the second heater element, the cold air of lower temperature enters fan from described the first air inlet, part air-flow is blown to the other end of described heat-transfer device from described the first air outlet blows out, another part air-flow is blown to described the second heater element from described the second air outlet blows out.
- 2. heat radiation module as claimed in claim 1, is characterized in that: in the same way, described the first air outlet is vertical with the rotating shaft of described fan with the air-out passage that the second air outlet forms for the air intake passage that described the first air inlet forms and the rotating shaft of described fan.
- 3. heat radiation module as claimed in claim 1, is characterized in that: the air-out passage that described the first air outlet forms is vertical with the air-out passage that the second air outlet forms.
- 4. heat radiation module as claimed in claim 1, it is characterized in that: described fan comprises a housing, described housing comprises a roof, be parallel to a diapire of described roof and connect a connecting wall of described roof and diapire, and described the first air inlet is opened on described roof.
- 5. heat radiation module as claimed in claim 4, it is characterized in that: described fan is offered one second air inlet on described diapire, described the second air inlet is relative with described the first air inlet, and the air intake passage that described the second air inlet forms and the rotating shaft of described fan are in the same way.
- 6. heat radiation module as claimed in claim 5, is characterized in that: described fan also comprises that one is installed on rotatable impeller in described housing, and described the first air inlet and the second air inlet are over against described impeller.
- 7. heat radiation module as claimed in claim 4, is characterized in that: described the first air outlet is formed between described roof, diapire and connecting wall, and described the second air outlet is formed on described connecting wall.
- 8. heat radiation module as claimed in claim 1, it is characterized in that: described heat-transfer device comprises some heat pipes and heat radiator, one holder is installed on described heat pipe, described holder is resisted against described the first heater element on described brain mainboard by one end of some heat pipes, on each heat radiator, offer a mounting groove, the other end of some heat pipes is through the mounting groove on described heat radiator.
- 9. heat radiation module as claimed in claim 7, it is characterized in that: described holder comprises a body, four jiaos of described body are extended respectively a leg, offer a mounting hole on each leg, and some securing members are arranged on described holder on described computer main board through corresponding mounting hole.
- 10. heat radiation module as claimed in claim 8, it is characterized in that: described the first heater element is a central processing unit, described the second heater element comprises some voltage-regulation unit, and described fan is with stickup, riveted or be otherwise fixed on described heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210254583.1A CN103576807A (en) | 2012-07-23 | 2012-07-23 | Heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210254583.1A CN103576807A (en) | 2012-07-23 | 2012-07-23 | Heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103576807A true CN103576807A (en) | 2014-02-12 |
Family
ID=50048777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210254583.1A Pending CN103576807A (en) | 2012-07-23 | 2012-07-23 | Heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103576807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494013A (en) * | 2019-07-29 | 2019-11-22 | 联想(北京)有限公司 | Electronic equipment |
| US10497641B2 (en) | 2014-03-18 | 2019-12-03 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832280A (en) * | 2009-03-13 | 2010-09-15 | 富准精密工业(深圳)有限公司 | Heat-dissipating device, centrifugal fan thereof and electronic device using same |
| CN102421273A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Cooling device and electronic device using same |
| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN102478924A (en) * | 2010-11-24 | 2012-05-30 | 富准精密工业(深圳)有限公司 | Thermal module |
-
2012
- 2012-07-23 CN CN201210254583.1A patent/CN103576807A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832280A (en) * | 2009-03-13 | 2010-09-15 | 富准精密工业(深圳)有限公司 | Heat-dissipating device, centrifugal fan thereof and electronic device using same |
| CN102421273A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Cooling device and electronic device using same |
| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN102478924A (en) * | 2010-11-24 | 2012-05-30 | 富准精密工业(深圳)有限公司 | Thermal module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10497641B2 (en) | 2014-03-18 | 2019-12-03 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
| CN110494013A (en) * | 2019-07-29 | 2019-11-22 | 联想(北京)有限公司 | Electronic equipment |
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Application publication date: 20140212 |