CN101652050A - Wind scooper - Google Patents
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- CN101652050A CN101652050A CN200810135147A CN200810135147A CN101652050A CN 101652050 A CN101652050 A CN 101652050A CN 200810135147 A CN200810135147 A CN 200810135147A CN 200810135147 A CN200810135147 A CN 200810135147A CN 101652050 A CN101652050 A CN 101652050A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 238000012546 transfer Methods 0.000 claims description 13
- 238000009957 hemming Methods 0.000 claims description 6
- 230000000881 depressing effect Effects 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 description 14
- 238000001816 cooling Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明涉及一种散热技术,特别是涉及一种应用于电子装置中的导风罩。The invention relates to a heat dissipation technology, in particular to a wind guide cover applied to an electronic device.
背景技术 Background technique
现行市场上使用的电子装置,常由于使用次数频繁及操作时间过久而导致电子装置内部的温度升高,易影响电子装置的正常运行。同时,由于电子装置内部所含的发热元件,如中央处理单元(Centralprocessing unit,CPU)、内存、北桥芯片、及电源供应器等,可达成的运算速度愈来愈快,数据处理量也呈倍数增加,因此,常因工作温度过高而导致故障的情形发生。为了避免发热元件因过热而导致故障,现行业界的解决手段是在电子装置中设置散热风扇,以将发热元件所产生的热能导出电子装置外,而避免发热元件因温度过高而损坏,进而造成电子装置运行不稳定的情况发生。The electronic devices currently used in the market often cause the internal temperature of the electronic device to rise due to frequent use and long operation time, which easily affects the normal operation of the electronic device. At the same time, due to the heating elements contained in the electronic device, such as the central processing unit (Central processing unit, CPU), memory, north bridge chip, and power supply, etc., the computing speed that can be achieved is getting faster and faster, and the data processing capacity is also multiplying. Increase, therefore, often due to high operating temperature and cause failures. In order to prevent the heating element from malfunctioning due to overheating, the current solution in the industry is to install a cooling fan in the electronic device to export the heat energy generated by the heating element to the outside of the electronic device, so as to prevent the heating element from being damaged due to excessive temperature, thereby causing Unstable operation of the electronic device occurs.
但是,在实际散热过程中,仅通过散热风扇导出热能的方法也存在散热过慢的问题,而无法达到最佳散热效果,进而导致发热元件因温度过高而损坏;故设计人员在该发热元件上增设散热导风罩以产生流动空间,从而使气流可集中流动,以使散热风扇旋转产生的气流密集通过该导风罩而将热气排出,而有效提升散热风扇对发热元件的散热效果;因此,导风罩已成为散热系统中的必备的物件。However, in the actual heat dissipation process, the method of only exporting heat energy through the cooling fan also has the problem of too slow heat dissipation, which cannot achieve the best heat dissipation effect, and then causes the heating element to be damaged due to excessive temperature; Add a heat dissipation air guide cover to create a flow space, so that the air flow can flow concentratedly, so that the airflow generated by the rotation of the cooling fan is densely passed through the air guide cover to discharge the hot air, and effectively improve the heat dissipation effect of the cooling fan on the heating element; therefore , The air guide cover has become an essential item in the cooling system.
请参阅图1A及图1B,现有导风罩1为一中空罩体,其包括一顶盖10以及沿该顶盖10两对边向下延伸的二侧壁11,且导风罩1二端则分别具有一入风口12及一出风口13。使用时,可将该导风罩1设置于电子装置的主板14上,以罩盖电子装置的发热元件15,使发热元件15位于该导风罩1内,且配合该散热风扇16产生的气流160从该入风口12进入而由该出风口13散出,以达到散热效果。Please refer to Fig. 1A and Fig. 1B, the existing
但是,对该发热元件15而言,现有导风罩1的顶盖10及二侧壁11形成一直线流道,当气流160通过该导风罩1内时,仅通过流道散热,其散热速度有限,令该发热元件15的温度超过可控制的范围,以致使该发热元件15处于危险的工作状态。However, for the
因此,如何找到一种散热效率更高的导风罩,以避免发热元件处于危险状态下工作的情况发生,实为目前急待解决的问题。Therefore, how to find a wind guide cover with higher heat dissipation efficiency to avoid the situation that the heating element works in a dangerous state is an urgent problem to be solved at present.
发明内容 Contents of the invention
鉴于上述现有技术的缺点,本发明的一目的是提供一种可提高散热效率的导风罩。In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an air guide cover that can improve heat dissipation efficiency.
本发明的另一目的是提供一种增加换热系数,以提高对流换热效率的导风罩。Another object of the present invention is to provide a wind guide cover with increased heat transfer coefficient to improve convective heat transfer efficiency.
本发明的又一目的是提供一种减小风阻的导风罩。Another object of the present invention is to provide a wind deflector with reduced wind resistance.
为达到上述及其他目的,本发明提供一种导风罩,应用于设有发热元件的主板,且导风罩盖住发热元件而与主板形成风道,该导风罩包括:入风部,具有位于风道一侧的入风口;出风部,具有位于风道相对入风口的一侧的出风口;以及换热区,设于该入风口及出风口之间,且位于发热元件上方,并且该换热区具有邻近入风部的气流紊流部。In order to achieve the above and other purposes, the present invention provides an air guide cover, which is applied to a main board provided with a heating element, and the air guide cover covers the heating element to form an air duct with the main board. The air guide cover includes: an air inlet part, There is an air inlet on one side of the air duct; the air outlet has an air outlet on the side of the air duct opposite to the air inlet; and a heat exchange area is located between the air inlet and the air outlet and above the heating element, And the heat exchange area has an air flow turbulent portion adjacent to the air inlet portion.
前述的导风罩中,该入风部还可具有气流下压部,设于该入风口与换热区之间,以使气流下压集中至换热区;且该换热区还可具有气流扩散部,设于该气流紊流部及出风部之间,以降低气流的风阻;又该气流紊流部可具有V型折边结构。In the above-mentioned wind guide cover, the air inlet part can also have an airflow downpressing part, which is arranged between the air inlet and the heat exchange area, so that the airflow can be pressed down and concentrated to the heat exchange area; and the heat exchange area can also have The airflow diffuser is arranged between the airflow turbulent part and the air outlet part to reduce the wind resistance of the airflow; and the airflow turbulent part can have a V-shaped hemming structure.
前述的导风罩中,该气流紊流部可具有第一斜面及第二斜面,该第一斜面连接该入风部,为该换热区顶部内壁沿气流方向向下延伸的斜面,该第二斜面沿气流方向设置于该第一斜面的后侧,为该换热区顶部内壁沿气流方向向上倾斜的斜面,较佳地,该第一及第二斜面可形成V型折边结构。In the aforementioned air guide cover, the air flow turbulent part may have a first slope and a second slope, the first slope is connected to the air inlet part, and is the slope extending downward along the airflow direction on the top inner wall of the heat exchange area. Two slopes are arranged on the rear side of the first slope along the airflow direction, and are slopes on the top inner wall of the heat exchange area inclined upward along the airflow direction. Preferably, the first and second slopes can form a V-shaped hem structure.
依上述结构,以气流紊流部具有第一斜面为基本需求,该入风部还可具有气流下压部,为设于该入风口与气流紊流部之间的向下倾斜面,较佳地,可连结该第一斜面,且与第一斜面的倾斜角度相同。According to the above structure, the air turbulence part has a first inclined surface as the basic requirement, and the air inlet part can also have an air flow downward pressure part, which is a downward inclined surface between the air inlet and the air turbulence part, preferably Therefore, the first slope can be connected, and the slope angle of the first slope is the same as that of the first slope.
依上述结构,以气流紊流部具有第二斜面为基本需求,该换热区还可具有气流扩散部,设于该第二斜面及出风部之间,且该气流扩散部可为该换热区的顶部内壁沿气流方向向上倾斜的斜面,并与第二斜面的倾斜角度相同,较佳地,该气流扩散部与水平面的夹角可小于三十度。According to the above structure, the air turbulence part has a second slope as the basic requirement, the heat exchange area can also have an air diffusion part, which is arranged between the second slope and the air outlet part, and the air diffusion part can be the heat exchanger The top inner wall of the hot zone is an inclined plane inclined upwards along the airflow direction, and the inclination angle is the same as that of the second inclined plane. Preferably, the included angle between the airflow diffuser and the horizontal plane may be less than thirty degrees.
由上可知,本发明导风罩通过在换热区上形成气流紊流部的设计,当该导风罩覆盖发热元件时,该气流紊流部与发热元件形成相对的狭窄风道;相比于现有技术,当气流通过该狭窄风道时,通过该导风罩得以强化热对流效果,可达到增加对流换热系数,以提高对流换热效率的目的,且可控制发热元件的温度,而达到提高散热效率的目的。另外,通过换热区的气流扩散部的设计,以使气流的流出风道的空间增大,而达到减小风阻的目的。As can be seen from the above, the air guide cover of the present invention is designed to form an air flow turbulent part on the heat exchange area. When the air guide cover covers the heating element, the air flow turbulence part forms a relatively narrow air passage with the heating element; In the prior art, when the airflow passes through the narrow air duct, the heat convection effect can be enhanced through the air guide cover, which can achieve the purpose of increasing the convective heat transfer coefficient to improve the convective heat transfer efficiency, and can control the temperature of the heating element. To achieve the purpose of improving heat dissipation efficiency. In addition, through the design of the airflow diffuser in the heat exchange area, the space for the airflow to flow out of the air duct is increased to achieve the purpose of reducing wind resistance.
附图说明 Description of drawings
图1A及图1B为现有导风罩的应用示意图;1A and FIG. 1B are schematic diagrams of the application of the existing air guide;
图2A为本发明导风罩的第一实施例的立体图;Fig. 2A is a perspective view of the first embodiment of the wind guide cover of the present invention;
图2B为本发明导风罩的第一实施例应用于电子装置的示意图;2B is a schematic diagram of the application of the first embodiment of the air duct of the present invention to an electronic device;
图3为本发明导风罩的第二实施例应用于电子装置的示意图;FIG. 3 is a schematic diagram of a second embodiment of the air guide cover of the present invention applied to an electronic device;
图4为本发明导风罩的第三实施例应用于电子装置的示意图。FIG. 4 is a schematic diagram of a third embodiment of the wind deflector of the present invention applied to an electronic device.
主要元件符号说明:Description of main component symbols:
1、2 导风罩1, 2 Wind hood
10、2a 顶盖10. 2a top cover
11、2b 侧壁11. 2b side wall
12,210 入风口12,210 air inlet
13,220 出风口13,220 Air outlet
14,4 主板14, 4 motherboard
15、3 发热元件15. 3 Heating elements
16 散热风扇16 cooling fan
160 气流160 airflow
20 换热区20 heat exchange zone
200、200’气流紊流部200, 200' air turbulence section
201 气流扩散部201 Air diffuser
200a、200a’ 第一斜面200a, 200a' first slope
200b、200b’ 第二斜面200b, 200b' second slope
21,21’ 入风部21, 21' into the wind department
211 气流下压部211 Airflow lower pressure part
22 出风部22 Air outlet department
5 风扇模块5 fan module
50 冷气流50 cold air flow
6 风道6 Air Duct
θ 夹角θ included angle
具体实施方式 Detailed ways
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点与功效。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
第一实施例first embodiment
请参阅图2A及图2B,为本发明的导风罩一实施例的示意图。在本实施例及其他实施例中所示的导风罩结构仅为例示性说明,只要应用于具有发热元件的电子装置中,包括换热区、相对的入风部及出风部,在该换热区设有气流紊流部,以使气流通过气流紊流部形成扰动,均适用于本发明。Please refer to FIG. 2A and FIG. 2B , which are schematic diagrams of an embodiment of the wind guide cover of the present invention. The structure of the windshield shown in this embodiment and other embodiments is only illustrative, as long as it is applied to an electronic device with a heating element, including the heat exchange area, the opposite air inlet part and the air outlet part, in this The heat exchange area is provided with an air flow turbulence part, so that the air flow passes through the air flow turbulence part to form a disturbance, all of which are applicable to the present invention.
如图2A所示,在本实施例中,该导风罩2由顶盖2a以及沿该顶盖2a二相对边向下延伸的二侧壁2b所组成的无底盖罩体,各该侧壁2b可为一体成型于顶盖2a。As shown in Fig. 2A, in this embodiment, the
所述的导风罩2包括:换热区20、相对的入风部21及出风部22;该入风部21具有入风口210,该出风部22具有相对入风口210的出风口220,该换热区20设于入风口210及出风口220之间,且具有邻近入风部21的气流紊流部200。The
如图2B所示,将该导风罩2应用于具有发热元件3的电子装置中,该电子装置包括一主板4及一风扇模块5,该发热元件3设于主板4上,且该导风罩2罩盖发热元件3而与主板4形成一风道6。As shown in Figure 2B, the
所述的入风口210位于该风道6一侧,且连接该风扇模块5,使该风扇模块5所产生的冷气流50由入风口210进入风道6,而所述的出风口220位于风道6相对入风口210的一侧,且所述的换热区20位于发热元件3上方,以供由入风口210进入的冷气流50在换热区20以与发热元件3进行热交换,并在换热区20形成热气流而由出风口220排出。The
所述的气流紊流部200具有第一斜面200a及第二斜面200b,该第一斜面200a连接该入风部21,为该换热区20顶部内壁沿气流方向向下延伸的斜面,而该第二斜面200b沿气流方向设置于该第一斜面200a的后侧,为该换热区20顶部内壁沿气流向上倾斜的斜面,且该第一及第二斜面200a、200b相连结以使气流紊流部200具有单一V型折边结构。当然,在其他实施例中,也可为多个V型折边结构或其他形状及数目的凹折结构,并非局限于此;换言之,只要在该换热区20设有朝发热元件3(容后陈述)弯折的结构,以供进入换热区20的冷气流50通过而增加气流扰动,以提高换热系数,且增加对流换热效率,即适用于本发明的气流紊流部200。The air
较佳地,该气流紊流部200临近该入风部21设置,使气流在刚进入换热区20时,就使气流扰动增强,换热系数增加,而使换热效果更佳。Preferably, the
再者,应注意的是,在本实施例中,该电子装置为服务器,但并非以此为限,而该导风罩2罩设于例如内存的发热元件3,但并非以此为限,该发热元件3也可为中央处理单元、北桥芯片、电源供应器、集成电路(integrated circuit,IC)元件、或其他发热元件。由于该发热元件3及风扇模块5是属于现有技术,且其结构与作用原理皆为公知,故应知本实施例中所示的仅为例示性说明。Furthermore, it should be noted that, in this embodiment, the electronic device is a server, but not limited thereto, and the
本实施例的导风罩2通过该气流紊流部200的设计,相比于现有技术,在该风扇模块5提供相同的冷气流50的情况下,当该冷气流50通过换热区20时,依靠气流紊流部200增加气流扰动,而提高换热系数,进而增加换热区20的对流换热效率。Compared with the prior art, the
第二实施例second embodiment
请参阅图3,本实施例与第一实施例的差异在于换热区20的结构,而其余相关导风罩2的设计则大致相同,因此,相同的元件与对应说明将予以省略,而不再赘述,特此述明。Please refer to Fig. 3, the difference between the present embodiment and the first embodiment lies in the structure of the
如图所示,该换热区20的气流紊流部200’具有两个V型折边结构时,以提升冷气流50形成紊流的程度,而增加散热效果(容后陈述);且可令两个第一斜面200a、200a’的长度及倾斜角度为不同或相同、及/或该两个第二斜面200b、200b’的长度及倾斜角度为不同或相同;当然,在其他实施例中,各该V型折边结构的凹折长度、斜面倾斜角度、及凹折深度均可加以改变。As shown in the figure, when the air flow turbulence part 200' of the
该换热区20还具有一气流扩散部201,设于该气流紊流部200’及出风部22之间,以通过扩大风道6的空间而使气流有足够的空间流动,从而达到降低气流的风阻而使气流较快由出风口220流出,进而将热能散出;在本实施例中,该气流扩散部201为该换热区20的顶部内壁沿气流方向向上倾斜的斜面且连结该第二斜面200b’,较佳地,该气流扩散部201与该第二斜面200b’的倾斜角度相同;另外,该气流扩散部201与水平面的夹角θ小于三十度。The
第三实施例third embodiment
请参阅图4,本实施例与第二实施例的差异在于入风部21′的结构,而其余相关导风罩2的设计则大致相同,因此,相同的元件与对应说明将予以省略,而不再赘述,特此述明。Please refer to Fig. 4, the difference between the present embodiment and the second embodiment lies in the structure of the air inlet portion 21', and the design of the other related wind guide covers 2 is substantially the same, therefore, the same elements and corresponding descriptions will be omitted, and No more details, hereby state.
如图所示,当风扇模块5相对于热源高度较高时,该导风罩2的入风口210的高度也相对较高,为了使气流更集中,该入风部21’还具有一气流下压部211,设于该入风口210与换热区20之间,以供由风扇模块5所产生的冷气流50下压集中在换热区20,而使冷气流50的流速增加;在本实施例中,该气流下压部211为向下倾斜面且与该气流紊流部200’的第一斜面200a相连,较佳地,该气流下压部211与该第一斜面200a的倾斜角度相同。As shown in the figure, when the height of the
第二及第三实施例的气流紊流部200’具有两处V型折边结构,而各该V型折边结构与该发热元件3之间形成狭窄处。因此,通过各该狭窄处的冷气流50可形成紊流而提高换热系数,进而增加对流换热效率。The air turbulence portion 200' of the second and third embodiments has two V-shaped hemming structures, and a narrow place is formed between each of the V-shaped hemming structures and the
此外,为了验证本发明的导风罩与现有导风罩的散热效果,申请人针对现有导风罩、以及本发明中设计一个V型折边结构的导风罩与设计两个V型折边结构的导风罩进行了相关的测试实验,经测试实验可得到下表,其中,DIMM 1至12代表不同的发热元件,F表示在发热元件的正面进行测试,B表示在发热元件的背面进行测试,标准温度等于85表示不能超过85度。In addition, in order to verify the heat dissipation effect of the air guide cover of the present invention and the existing air guide cover, the applicant designed a V-shaped hem structure wind guide cover and designed two V-shaped air guide covers for the existing air guide cover and the present invention. Relevant test experiments have been carried out on the windshield with folded edge structure, and the following table can be obtained through the test experiments, where
由上表可知,加了两个V型折边结构之后,可增加通过该发热元件3的气流扰动,温度的降幅也普遍较大;但是,并非增加愈多V型折边结构,该发热元件3的温度降幅愈大,在本实验中,三个V型折边结构的降温效果与两个V型折边结构的降温效果相似。It can be seen from the above table that after adding two V-shaped hemming structures, the airflow disturbance passing through the
综上所述,本发明导风罩通过气流紊流部的设计,当导风罩覆盖该发热元件时,通过该气流紊流部改变风道的形状,从而使冷气流通过该气流紊流部时增加气流扰动而强化热对流效果,有效增加对流换热系数,而有效达到提高散热效率的目的。To sum up, the air guide cover of the present invention adopts the design of the air flow turbulence part. When the air guide cover covers the heating element, the shape of the air duct is changed through the air flow turbulence part, so that the cold air flow passes through the air flow turbulence part. When the airflow disturbance is increased, the thermal convection effect is enhanced, the convective heat transfer coefficient is effectively increased, and the purpose of improving heat dissipation efficiency is effectively achieved.
再者,通过换热区的气流扩散部的设计,以使气流的流动空间增大,而达到减小风阻的目的,进而使热气流较快散出。Furthermore, through the design of the airflow diffuser in the heat exchange area, the flow space of the airflow is increased to achieve the purpose of reducing the wind resistance, and then the hot airflow can be dissipated quickly.
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下,对上述实施例进行修饰与改变。因此,本发明的权利保护范围,应以权利要求书的范围为依据。The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be based on the scope of the claims.
Claims (12)
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102213984A (en) * | 2010-04-09 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | Heat radiating system |
CN102781198A (en) * | 2011-05-10 | 2012-11-14 | 鸿富锦精密工业(深圳)有限公司 | Electronic product with wind scooper |
CN106852080A (en) * | 2017-03-02 | 2017-06-13 | 珠海格力电器股份有限公司 | Heat dissipation air duct structure and baking equipment with same |
CN108195753A (en) * | 2018-02-27 | 2018-06-22 | 招商局重庆交通科研设计院有限公司 | A kind of road driving safely and fast test and evaluation device |
CN108681381A (en) * | 2018-05-24 | 2018-10-19 | 黑龙江工业学院 | A kind of computer high speed circulation radiator |
CN113760065A (en) * | 2020-06-03 | 2021-12-07 | 鸿富锦精密工业(武汉)有限公司 | Air guide cover, heat dissipation structure having the same, and electronic device |
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2008
- 2008-08-13 CN CN200810135147A patent/CN101652050A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102213984A (en) * | 2010-04-09 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | Heat radiating system |
CN102781198A (en) * | 2011-05-10 | 2012-11-14 | 鸿富锦精密工业(深圳)有限公司 | Electronic product with wind scooper |
CN106852080A (en) * | 2017-03-02 | 2017-06-13 | 珠海格力电器股份有限公司 | Heat dissipation air duct structure and baking equipment with same |
CN106852080B (en) * | 2017-03-02 | 2023-04-07 | 珠海格力电器股份有限公司 | Heat dissipation air duct structure and baking equipment with same |
CN108195753A (en) * | 2018-02-27 | 2018-06-22 | 招商局重庆交通科研设计院有限公司 | A kind of road driving safely and fast test and evaluation device |
CN108681381A (en) * | 2018-05-24 | 2018-10-19 | 黑龙江工业学院 | A kind of computer high speed circulation radiator |
CN108681381B (en) * | 2018-05-24 | 2021-02-09 | 黑龙江工业学院 | A high-speed flow cooling device for a computer |
CN113760065A (en) * | 2020-06-03 | 2021-12-07 | 鸿富锦精密工业(武汉)有限公司 | Air guide cover, heat dissipation structure having the same, and electronic device |
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