CN103869910A - Mainboard cooling system - Google Patents
Mainboard cooling system Download PDFInfo
- Publication number
- CN103869910A CN103869910A CN201210533723.9A CN201210533723A CN103869910A CN 103869910 A CN103869910 A CN 103869910A CN 201210533723 A CN201210533723 A CN 201210533723A CN 103869910 A CN103869910 A CN 103869910A
- Authority
- CN
- China
- Prior art keywords
- heat
- cooling system
- mounting groove
- heating radiator
- main board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a mainboard cooling system. The mainboard cooling system comprises a computer mainboard and a heating element mounted on the computer mainboard, wherein the computer mainboard is provided with a fan, a cooling unit and a heat tube, and the cooling unit is provided with a first mounting slot; the heating element is provided with a thermal conductive plate, and the thermal conductive plate is provided with a second mounting slot; one end of the heat tube is mounted inside the first mounting slot, and the other end of the heat tube is mounted inside the second mounting slot; heat generated by the heating element is transferred to the cooling unit through the thermal conductive board and the heat tube; airflow generated by the fan is blown to the cooling unit to take heat on the cooling unit away.
Description
Technical field
The present invention relates to a kind of cooling system, refer to especially a kind of computer main board cooling system.
Background technology
Along with dwindling of display sizes, manufacturer computer starts main frame to be integrated in display, thereby forms integral computer (all-in-one), is abbreviated as AIO.AIO compares conventional desktop machine the advantage that line is few, volume is little, and integrated level is higher, and price also there is no significant change, and shapeable is stronger, and manufacturer can design the product that has individual character.How designing AIO that volume is less becomes the key of product design, simultaneously because the integrated level of AIO is higher, and small volume, thereby the heat dissipation design of AIO is particularly important.
Summary of the invention
In view of above content, be necessary to provide a kind of radiator structure with better heat sinking function.
A kind of mainboard cooling system, comprise that a computer main board and is installed on the heater element on described computer main board, on described computer main board, also install a fan, one heating radiator and a heat pipe, on described heating radiator, offer one first mounting groove, one heat-conducting plate is installed on described heater element, on described heat-conducting plate, offer one second mounting groove, one end of described heat pipe is installed in described the first mounting groove, the other end of described heat pipe is installed in described the second mounting groove, the heat that described heater element produces is passed to described heating radiator via described heat-conducting plate and described heat pipe, the air-flow that described fan produces blows to described heating radiator and takes away the heat on described heating radiator.
Compared to prior art, above-mentioned mainboard cooling system is installed in described the first mounting groove by one end of described heat pipe, the other end of described heat pipe is installed in described the second mounting groove, the heat that described heater element produces is passed to described heating radiator via described heat-conducting plate and described heat pipe, the air-flow that described fan produces blows to described heating radiator and takes away the heat on described heating radiator, because described the second mounting groove has increased the heat transfer area of described heat-conducting plate, improve the radiating efficiency of described heating radiator, described heat-conducting plate and described heat pipe.
Accompanying drawing explanation
Fig. 1 is an exploded view of computer main board cooling system one preferred embodiment of the present invention.
Fig. 2 is a schematic diagram of heat-conducting plate in Fig. 1.
Fig. 3 is a three-dimensional assembly diagram of Fig. 1.
Main element symbol description
| Computer |
10 |
| |
11 |
| |
12 |
| |
20 |
| |
30 |
| Housing | 31 |
| |
311 |
| |
312 |
| |
32 |
| |
40 |
| |
41 |
| The first mounting groove | 42 |
| Heat-conducting |
50 |
| The |
51 |
| Through |
52 |
| |
60 |
| Securing |
80 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 and Fig. 2, preferred embodiments computer main board cooling system of the present invention comprises that a computer main board 10 and is installed on the heater element 20 on described computer main board 10.
On described computer main board 10, offer the mounting hole 11 of some circles, on described computer main board 10, offer the socket 12 of an arc in a side of some mounting holes 11.Interior installing one fan 30 of described socket 12 and a heating radiator 40.Described fan 30 comprises that a housing 31 and is installed on the interior rotatable impeller 32 of described housing 31.On described housing 31, offer an air inlet 311 and an air outlet 312.In the same way, the air-out passage that described air outlet 312 forms is vertical with the rotating shaft of described fan 30 for the air intake passage that described air inlet 311 forms and the rotating shaft of described fan 30.Described heating radiator 40 comprises some heat radiator that be arranged in parallel 41, on described heating radiator 40, offers a first microscler mounting groove 42 in a side of some heat radiator 41.The air outlet 312 of described fan 30 is towards a side of some heat radiator 41.
One heat-conducting plate 50 is installed on described heater element 20.On described heat-conducting plate 50, offer a second microscler mounting groove 51, on described heat-conducting plate 50, offer respectively the through hole 52 of a circle in corner location place.The heat pipe 60 of one bending is installed on described computer main board 10, and one end of described heat pipe 60 is installed in the first mounting groove 42 on described heating radiator 40, and the other end of described heat pipe 60 is installed in the second mounting groove 51 on described heat-conducting plate 50.Wherein, described the first mounting groove 42 and the degree of depth of described the second mounting groove 51 are suitable with the thickness of described heat pipe 60.The aperture of described mounting hole 11 and described through hole 52 is suitable.Described heater element 20 is a central processing unit.
Refer to Fig. 1 to Fig. 3, when assembling, described heater element 20 and described heat-conducting plate 50 are installed on described computer main board 10 successively, corresponding mounting hole 11 on through hole 52 on described heat-conducting plate 50 and described computer main board 10 is alignd.Some securing members 80 pass corresponding through hole 52 and mounting hole 11, thereby described heater element 20 and described heat-conducting plate 50 are fixed on described computer main board 10.Then described fan 30 and heating radiator 40 are installed in the socket 12 on described computer main board 10, make the air outlet 312 of described fan 30 towards a side of some heat radiator 41.Finally one end of described heat pipe 60 is installed in the first mounting groove 42 on described heating radiator 40, the other end of described heat pipe 60 is installed in the second mounting groove 51 on described heat-conducting plate 50, thereby described heat pipe 60 is installed on described computer main board 10.
When work, the central processing unit on described computer main board 10 starts heating, and the heat that described central processing unit produces is passed to some heat radiator 41 via described heat-conducting plate 50 and described heat pipe 60.Described fan 30 is in axial direction drawn into air in described air inlet 311, and impeller 32 high-speed rotation of described fan 30 make air-flow dispel the heat for some heat radiator 41 to described heating radiator 40 from described air outlet 312 cross-currents.Because described the second mounting groove 51 has increased the heat transfer area of described heat-conducting plate 50, improve the radiating efficiency of described heating radiator 40, described heat-conducting plate 50 and described heat pipe 60.
Claims (9)
1. a mainboard cooling system, comprise that a computer main board and is installed on the heater element on described computer main board, it is characterized in that: on described computer main board, also install a fan, one heating radiator and a heat pipe, on described heating radiator, offer one first mounting groove, one heat-conducting plate is installed on described heater element, on described heat-conducting plate, offer one second mounting groove, one end of described heat pipe is installed in described the first mounting groove, the other end of described heat pipe is installed in described the second mounting groove, the heat that described heater element produces is passed to described heating radiator via described heat-conducting plate and described heat pipe, the air-flow that described fan produces blows to described heating radiator and takes away the heat on described heating radiator.
2. mainboard cooling system as claimed in claim 1, it is characterized in that: on described computer main board, offer some mounting holes, described heat-conducting plate is offered some through holes, some securing members pass corresponding through hole and mounting hole, thereby described heater element and described heat-conducting plate are fixed on described computer main board.
3. mainboard cooling system as claimed in claim 2, is characterized in that: the aperture of described mounting hole and described through hole is suitable.
4. mainboard cooling system as claimed in claim 2, is characterized in that: the side in some mounting holes on described computer main board is offered a socket, and described fan and described heating radiator are installed in described socket.
5. mainboard cooling system as claimed in claim 1, it is characterized in that: described fan comprises an air inlet and an air outlet, air-flow from described fan outside flows to described fan from described air inlet along a first direction, the air-flow that described fan produces flows out described air outlet along a second direction, described heating radiator comprises some heat radiator, and described air outlet is towards a side of some heat radiator.
6. mainboard cooling system as claimed in claim 5, is characterized in that: described first direction is perpendicular to described second direction.
7. mainboard cooling system as claimed in claim 5, is characterized in that: described the first mounting groove is opened on described heating radiator and is positioned at a side of some heat radiator.
8. mainboard cooling system as claimed in claim 1, is characterized in that: described the first mounting groove and the degree of depth of described the second mounting groove are suitable with the thickness of described heat pipe.
9. mainboard cooling system as claimed in claim 1, is characterized in that: described heater element is a central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210533723.9A CN103869910A (en) | 2012-12-12 | 2012-12-12 | Mainboard cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210533723.9A CN103869910A (en) | 2012-12-12 | 2012-12-12 | Mainboard cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103869910A true CN103869910A (en) | 2014-06-18 |
Family
ID=50908541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210533723.9A Pending CN103869910A (en) | 2012-12-12 | 2012-12-12 | Mainboard cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103869910A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017008564A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Heat dissipation structural component of electronic device and electronic device |
| TWI598555B (en) * | 2016-06-04 | 2017-09-11 | 宏碁股份有限公司 | Heat pipe assembly and heat pipe structure |
| CN108093598A (en) * | 2016-11-21 | 2018-05-29 | 英业达科技有限公司 | Radiator and its heat-conductive assembly |
-
2012
- 2012-12-12 CN CN201210533723.9A patent/CN103869910A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017008564A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Heat dissipation structural component of electronic device and electronic device |
| TWI598555B (en) * | 2016-06-04 | 2017-09-11 | 宏碁股份有限公司 | Heat pipe assembly and heat pipe structure |
| CN108093598A (en) * | 2016-11-21 | 2018-05-29 | 英业达科技有限公司 | Radiator and its heat-conductive assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140618 |