KR200456335Y1 - cooling device of electronic equipment - Google Patents

cooling device of electronic equipment Download PDF

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Publication number
KR200456335Y1
KR200456335Y1 KR2020110005238U KR20110005238U KR200456335Y1 KR 200456335 Y1 KR200456335 Y1 KR 200456335Y1 KR 2020110005238 U KR2020110005238 U KR 2020110005238U KR 20110005238 U KR20110005238 U KR 20110005238U KR 200456335 Y1 KR200456335 Y1 KR 200456335Y1
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KR
South Korea
Prior art keywords
heat
electronic device
main body
exhaust
intake
Prior art date
Application number
KR2020110005238U
Other languages
Korean (ko)
Inventor
김상대
Original Assignee
김상대
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Publication date
Application filed by 김상대 filed Critical 김상대
Priority to KR2020110005238U priority Critical patent/KR200456335Y1/en
Application granted granted Critical
Publication of KR200456335Y1 publication Critical patent/KR200456335Y1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

The present invention is provided with an intake port for intake of external air and an exhaust port for exhausting hot air from the heat exchanger, respectively, which are connected to the heat exchanger by an intake pipe and an exhaust conduit. Since the heat generated from the heat generating element is heat-exchanged by the outside air introduced through the inlet port, the heat is radiated, and the heat released is discharged to the outside of the main body of the electronic device through the exhaust port. Not only can the heat exchanging efficiency of the internal heating element be significantly improved, but also the dust is introduced into the main body of the electronic device by maximizing the heat dissipation effect and not through the hole for introducing external air to the surface of the main body of the electronic device. Can be shut down to minimize electronics failures caused by dust. And, to provide an electronic device cooling apparatus that can suppress the generation of noise.
To this end, the present invention, the inlet port 20 is installed on the surface of the main body 10 of the electronic device is a natural air intake; An intake pipe 30 connected to the intake port 20 and positioned inside the main body of the electronic device 10; A heat exchanger (40) connected to one side of the intake pipe (30) and installed on a heat generating element (11) provided inside the main body (10) of the electronic device to radiate heat of the heat generating element (11) by heat exchange; An exhaust conduit (50) through which the heat exchanger (40) is connected to the other side and exhausted from the heat exchanged hot air; An exhaust port 60 connected to the exhaust conduit 50 and installed on the surface of the electronic device main body 10 and provided with an exhaust fan 61 for forcibly exhausting heat exchanged heat to the outside of the electronic device main body 10 is included. It is done.
The heat exchanger 40, the heat sink 42 is seated and fixed on the upper surface of the heat generating element 11 and a plurality of heat absorbing fins 41 are formed on the upper surface; The first opening 43 is formed to install an upper portion of the heat dissipation plate 42 and to connect the intake pipe 30, and the second opening 44 to open to connect the exhaust conduit 50. The cover 45 is included.

Description

Cooling device of electronic equipment

The present invention relates to an electronic device cooling device, and more particularly, to cool the heat of a heated heating element with air introduced from the outside due to the heat generation phenomenon of the heating element disposed on the printed circuit board inside the main body of the electronic device such as a computer. Not only improves heat exchange performance, but also completely blocks the body from the outside, preventing external dust from entering the body, preventing electronic equipment from being damaged by dust. An apparatus cooling apparatus is provided.

In general, many electronic devices are disposed in the main body of the electronic device according to the improvement of the function of the electronic device. Among the various electronic devices used in the electronic device, there is a heating element that generates heat when it is operated.

In particular, a heating element such as a central processing unit (hereinafter referred to as a CPU) or an image processing processor of a computer generates a lot of heat during operation, and this heat deteriorates not only the heating element itself but also other electronic elements around the heating element. They can degrade or degrade performance, shorten the life of electronic devices, or even cause failures.

Therefore, there is a need for a method of cooling the heat generated by the heating element, that is, a method of quickly moving the heat generated from the heating element to the outside of the electronic device so that heat does not accumulate inside the electronic device.

However, while the performance of the electronic device is gradually high performance and multi-functionality, as the shape is miniaturized and slimmer, the interior of the electronic device is highly integrated, and the heat generated by the heating element is accumulated in the electronic device.

In addition, in the case of computers, since users prefer a slim computer and a notebook computer, active research is being conducted to develop a cooling module that has a high cooling efficiency and occupies little space.

Currently, a method of increasing a cooling effect by installing a fan in a heat sink, a heat pipe, or the like in a heating element is used. Such a fan is mainly an axial flow fan. Although it is used, the axial fan is bulky, heavy, and generates a lot of noise, so it is difficult to apply to a slim computer or laptop.

In addition, since the flow direction of the air generated by the axial fan is directed toward the heat dissipation fin formed on the heat sink, foreign substances such as dust introduced into the computer main body frequently accumulate between the heat dissipation fins. The air heated by the air is discharged to the outside of the computer after passing through the inside of the computer, so that it may be heated by the flow path of the air warmed up to other electronic elements installed in the periphery.

In addition, in the case of a slim computer to which a cooling module with an axial fan is applied, a hole having a size corresponding to the diameter of the fan in order to introduce external air into the side of the slim computer main body corresponding to the position of the CPU installed on the main board. Because it must be through, the appearance is not beautiful and there are many noises.

In addition, the through hole is provided so that outside air flows into the main body case of the electronic device, and through the through hole, the outside air, which is relatively lower than the inside temperature of the main body, flows into the inside of the main body for heat exchange. However, there is another situation in which dust is accumulated inside the main body by introducing dust into the outside air introduced through the hole through the body case surface.

As a prior art, a computer cooling device using an impeller has been devised, which is not only to facilitate the heat exchange process by direct heat exchange is possible by configuring the heat exchanger with the impeller and the duct. In order to maximize the efficiency, the heat exchanged heat is transferred to the exhaust duct through the intake fan in close contact with the heat sink, and is discharged to the outside through the heat exhaust port on the side of the case, thereby preventing the loss of supply to the chipset.

However, this conventional technology does not solve the problem of deterioration of heat exchangeability caused by the cooling fan of the prior art because the cooling fan is configured as it is on top of the heat sink, the connection structure of the duct is connected only to the heating element Since the inflow of outside air is not made at all, efficient heat circulation is not achieved, and thus heat exchange is performed by the air warmed inside the main body.

In addition, the conventional electronic device cooling apparatus has a problem that the heated air discharged around the main body of the electronic device flows back into the main body through the ventilation hole formed in the main body of the electronic device, and the heated air flows back into the main body of the main body. There is a problem that the cooling efficiency is greatly reduced.

In addition, since a large number of cooling fans are installed to increase the cooling efficiency of the main body of the electronic device, there is another problem in which noise is severely generated by these cooling fans.

The present invention has been made to solve the problems of the conventional electronic device cooling device, the inlet port connected to the electronic device body surface and the exhaust port connected to the electronic device body surface and the conduit connecting the intake port and the exhaust port to the electronic device body By connecting directly to the heat exchanger connected to the provided heating element, the heat exchanger of the heating element is made by the outside air intaked by the intake port, and the heat exchanged hot air is exhausted by the exhaust port directly through the conduit so that the heat exchanger for the heating element In addition to maximizing the heat dissipation effect and cooling efficiency by improving the efficiency, the external dust can not be penetrated into the main body of the electronic device by preventing the inflow of external air into the main body of the electronic device. Provides an electronics cooler to minimize noise There is a purpose.

The electronic device cooling apparatus of the present invention as a means for achieving the above object, and installed on the surface of the main body of the electronic device and the inlet for inhaling the natural air outside; An air intake pipe connected to the intake port and positioned inside the main body of the electronic device; A heat exchanger connected to one side of the intake pipe and installed in a heat generating element to radiate heat of the heat generating element by heat exchange; An exhaust conduit through which the heat exchanger is connected to the other side and exhausts the heat exchanged hot air; An exhaust port is connected to the exhaust conduit and installed on the surface of the main body of the electronic device to provide exhaust air to the outside of the main body of the electronic device.

The heat exchanger includes: a heat sink mounted on and fixed to an upper surface of the heat generating element, and a plurality of heat absorbing fins formed on the upper surface; A cover having an upper portion of the heat dissipation plate and a first open portion opened to connect the intake pipe and a second open portion opened to connect the exhaust conduit.

In addition, a connection conduit is further provided between the intake pipe and the exhaust conduit, wherein the connection conduit is connected to a heat exchanger provided at each of two or more heating elements installed inside the main body of the electronic device. Heat generated from the heat generating element is heat-exchanged by the external air introduced through the intake pipe, and the heat-exchanged hot air is exhausted through the exhaust conduit.

In addition, the main body of the electronic device having the intake port, the intake pipe, the heat exchanger, the exhaust conduit, and the exhaust port is provided to be sealed to the outside so as to prevent the dust from entering the inside.

The present invention is provided with an intake port for intake of external air and an exhaust port for exhausting hot air from the heat exchanger, respectively, which are connected to the heat exchanger by an intake pipe and an exhaust conduit. Since the heat generated from the heat generating element is heat-exchanged by the outside air introduced through the inlet port, the heat is radiated, and the heat released is discharged to the outside of the main body of the electronic device through the exhaust port. Not only can the heat exchanging efficiency of the internal heating element be significantly improved, but also the dust is introduced into the main body of the electronic device by maximizing the heat dissipation effect and not through the hole for introducing external air to the surface of the main body of the electronic device. Can be shut down to minimize electronics failures caused by dust. And noise can be suppressed.

1 is a configuration of the heating device connected in series by the electronic device cooling device of the present invention.
Figure 2 is a configuration of the heating element is connected in parallel by the electronic device cooling device of the present invention.
Figure 3 is a perspective view of the electronic device cooling apparatus of the present invention connected to the heating element.
Figure 4 is an exploded perspective view showing a configuration of a state in which the electronic device cooling apparatus of the present invention is connected to the heating element.

Hereinafter, the structure and operation of the present invention will be described in more detail with reference to the accompanying drawings. In describing the present invention, the terminology or words used in the present specification and claims are based on the principle that the inventor can properly define the concept of the term in order to best explain his or her design in the best way. It should be interpreted as meanings and concepts corresponding to the technical idea of

As shown, the electronic device cooling apparatus of the present invention is installed on the surface of the main body of the electronic device 10, and an intake port 20 through which natural air is sucked in, and connected to the intake port 20 and the main body of the electronic device 10. ) Is installed in the intake air pipe 30 located inside, the heat generating device 11 is connected to one side of the intake air pipe 30 and provided inside the main body of the electronic device 10 to heat the heat generating element (11) A heat exchanger 40 that radiates heat by heat exchange, an exhaust conduit 50 connected to the other side of the heat exchanger 40, and exhausted hot air that is heat exchanged, and the exhaust conduit 50 connected to the main body of the electronic device. 10, an exhaust port 60 provided with an exhaust fan 61 is provided to forcibly exhaust the hot air heat-exchanged on the surface to the outside of the main body 10 of the electronic device.

The fan 61 provided in the exhaust port 60 may be configured to be relatively smaller than a cooling fan installed in a heating element and a main body casing such as a CPU installed in a computer main body, thereby minimizing noise of the fan itself.

The fan 61 may be installed inside the exhaust port 60 or adjacent to the exhaust port 60. The fan 61 may be installed inside the exhaust port 60 to block noise transmission due to rotation of the fan 61. It is preferable to do so and a separate sound absorbing material may be additionally installed inside the exhaust port 60.

The heat exchanger 40 is installed on the top surface of the heat generating element 11, the heat dissipation plate 42 and a plurality of heat sink fins 41 are formed on the upper surface, and the upper part of the heat dissipation plate 42 is installed The cover 45 is provided with a first open portion 43 for opening the intake pipe 30 and a second open portion 44 for opening the exhaust conduit 50.

In order to facilitate heat exchange, the heat dissipation fins 42 may have a wide surface area, and a plurality of heat dissipation fins 42 may be formed to widen the contact area with air.

Referring to the heat exchange of the present invention, the natural air of the outside is sucked through the intake port 20, the outside of the low-temperature air is introduced into the heat exchanger 40 through the intake pipe (30).

The low-temperature air introduced as described above is heat-exchanged by contacting the heat generated by the heat generating element 11 with the heat exchanger 40 with the heat absorbed by the heat absorbing fin 41 of the heat exchanger 40.

In addition, the heat-exchanged hot air flows through the exhaust conduit 50 toward the exhaust port 60 and is exhausted to the outside of the electronic device main body 10 by the exhaust port 60 so that the CPU is provided inside the electronic device main body 10. The heat of the heat generating element such as heat dissipation.

Thus, the heat-exchanged air of the heat exchanger 40 installed in the heat generating element 11 by the intake port 20, the intake airway pipe 30, and the exhaust conduit 50 and the exhaust port 60 does not spread to the whole inside of the main body of the electronic device. Since it is directly exhausted to the outside of the main body of the electronic device 10, heat exchange as well as heat dissipation effect is greatly improved.

The present invention is further provided with a connection conduit 70 between the intake airway pipe 30 and the exhaust conduit 50, the connection conduit 70 is two or more heating elements installed in the main body 10 of the electronic device Heat generated from two or more heat generating elements 11 and 11 by external air introduced by connecting heat exchangers 40 and 40 respectively provided to the heat exchangers 40 and 40 is connected to the intake air pipe 30. Heat exchanged by the external air introduced through, and the heat exchanged hot air is exhausted through the exhaust conduit (50).

Accordingly, heat exchange and heat dissipation of the heating elements provided in the electronic device main body 10 may be achieved, so that heat dissipation for each heating element may be achieved even if a plurality of heating elements are installed in the electronic device main body 10. As a result, heat dissipation and heat exchangeability are greatly improved.

In addition, the present invention, the inlet 20, the intake pipe 30, the heat exchanger 40, the exhaust conduit 50 and the exhaust body 60 is provided with the main body 10, the outside dust is It is provided to be sealed with the outside to block the flow into the inside.

Accordingly, since the conventionally formed holes do not penetrate the inside of the main body of the electronic device, external dust may be blocked from entering the main body of the electronic device, thereby minimizing the occurrence of electronic device failure due to dust. The dust can be prevented from accumulating on various components such as a printed circuit board installed in the main body of the electronic device.

In addition, the inlet 20 is further provided with a strainer 21 for blocking external dust from being introduced together with the outside air sucked through the inlet 20.

Accordingly, since the external dust that can be introduced through the inlet 20 can also be blocked, the problem caused by the dust can be prevented in advance.

As described above, the present invention has been described with reference to a preferred embodiment of the present invention as being capable of various modifications, but the present invention is not limited to such an embodiment, and the embodiments are simply combined with the existing known art. Together with the claims and the detailed description of the present invention, it should be seen that the techniques that can be used by those skilled in the art to which the present invention pertains are naturally included in the technical scope of the present invention.

10: electronic device body 20: intake vent
21: strainer 30: intake pipe
40: heat exchanger 41: endothermic fin
42: heat sink 43: first opening
44: second open part 45: cover
50 exhaust pipe 60 exhaust port
61: exhaust fan 70: connection conduit

Claims (5)

In the cooling device for cooling the inside of the main body of an electronic device such as a computer,
An intake port 20 installed on a surface of the main body 10 of the electronic device to suck external air in a natural state;
An intake pipe 30 connected to the intake port 20 and positioned inside the main body of the electronic device 10;
A heat exchanger (40) connected to one side of the intake pipe (30) and installed on a heat generating element (11) provided inside the main body (10) of the electronic device to radiate heat of the heat generating element (11) by heat exchange;
An exhaust conduit (50) through which the heat exchanger (40) is connected to the other side and exhausted from the heat exchanged hot air;
An exhaust port 60 connected to the exhaust conduit 50 and installed on the surface of the electronic device main body 10 and provided with an exhaust fan 61 for forcibly exhausting heat exchanged heat to the outside of the electronic device main body 10 is included. Become,
The inlet 20 is a device for cooling the electronic device, characterized in that further provided with a strainer (21) for blocking the inflow of dust outside with the outside air sucked through the inlet 20.
delete The method according to claim 1,
The heat exchanger 40,
A heat sink 42 seated and fixed to an upper surface of the heat generating element 11 and having a plurality of heat absorbing fins 41 formed on an upper surface thereof;
The first opening 43 is formed to install an upper portion of the heat dissipation plate 42 and to connect the intake pipe 30, and the second opening 44 to open to connect the exhaust conduit 50. Electronic device cooling apparatus characterized in that the cover 45 is included.
The method according to claim 1,
A connection conduit 70 is further provided between the air intake pipe 30 and the exhaust conduit 50.
The connection conduit 70 is connected to heat exchangers 40 and 40 respectively provided in at least two heat generating elements 11 and 11 installed inside the main body 10 of the electronic device. Heat generated from two or more heat generating elements 11 and 11 is heat-exchanged by external air introduced through the intake air pipe 30, and the heat-exchanged hot air is passed through the exhaust conduit 50. (10) The electronic device cooling apparatus, characterized in that the exhaust is made to the outside.
The method according to claim 1,
The electronic device main body 10 including the intake port 20, the intake air pipe 30, the heat exchanger 40, the exhaust conduit 50, and the exhaust port 60 may be provided with external dust introduced therein. Electronic device cooling apparatus characterized in that it is provided to be sealed to the outside to block.
KR2020110005238U 2011-06-13 2011-06-13 cooling device of electronic equipment KR200456335Y1 (en)

Priority Applications (1)

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KR2020110005238U KR200456335Y1 (en) 2011-06-13 2011-06-13 cooling device of electronic equipment

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Application Number Priority Date Filing Date Title
KR2020110005238U KR200456335Y1 (en) 2011-06-13 2011-06-13 cooling device of electronic equipment

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KR200456335Y1 true KR200456335Y1 (en) 2011-10-26

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112225A (en) * 2006-10-30 2008-05-15 Lenovo Singapore Pte Ltd Casing temperature suppression structure for electronic apparatus, and portable computer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112225A (en) * 2006-10-30 2008-05-15 Lenovo Singapore Pte Ltd Casing temperature suppression structure for electronic apparatus, and portable computer

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