TWM594175U - Computer host - Google Patents
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- TWM594175U TWM594175U TW109200456U TW109200456U TWM594175U TW M594175 U TWM594175 U TW M594175U TW 109200456 U TW109200456 U TW 109200456U TW 109200456 U TW109200456 U TW 109200456U TW M594175 U TWM594175 U TW M594175U
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Abstract
一種電腦主機,包含機殼、電路單元及散熱單元。機殼包括底壁、兩個側壁、前壁、後壁及上蓋,上蓋與後壁共同形成一排風口,後壁設有多個進風孔。電路單元包括一垂直底壁且偏靠後壁的第一電路板,及平行底壁且靠近上蓋及後壁的第二電路板,第一電路板設有多個卡連接器,第二電路板設有處理器。散熱單元包括散熱模組及風扇模組,散熱模組設於第二電路板並對應排風口,風扇模組位於散熱模組靠近前壁的一側且包括多個風扇,該等風扇相對於底壁呈傾斜以斜向朝前壁及底壁吸風並朝向上蓋及散熱模組吹風。藉此,形成能通過不同熱源區域的單一風道。A computer host includes a casing, a circuit unit and a heat dissipation unit. The cabinet includes a bottom wall, two side walls, a front wall, a rear wall, and an upper cover. The upper cover and the rear wall together form an air outlet, and the rear wall is provided with a plurality of air inlet holes. The circuit unit includes a first circuit board perpendicular to the bottom wall and leaning against the rear wall, and a second circuit board parallel to the bottom wall and close to the upper cover and the rear wall. The first circuit board is provided with a plurality of card connectors, and the second circuit board With a processor. The heat dissipation unit includes a heat dissipation module and a fan module. The heat dissipation module is disposed on the second circuit board and corresponds to the air outlet. The fan module is located on the side of the heat dissipation module near the front wall and includes a plurality of fans. The wall is inclined to absorb air obliquely toward the front wall and the bottom wall and blow air toward the upper cover and the heat dissipation module. In this way, a single air duct that can pass through different heat source areas is formed.
Description
本新型是有關於一種電腦主機,特別是指一種具有散熱系統的電腦主機。The present invention relates to a computer host, especially a computer host with a heat dissipation system.
近年來,電腦主機對於處理資訊的運算速度不斷提升,也使系統內的電子元件更容易發熱,如何快速散熱以避免電子元件過熱損壞,也是隨電腦主機運算速度不斷提升需要不斷改進的課題。In recent years, the computing speed of computer mainframes for processing information has been continuously improved, which also makes the electronic components in the system more likely to heat up. How to quickly dissipate heat to avoid overheating and damage of electronic components is also a subject that needs continuous improvement as the computing speed of the computer mainframe continues to increase.
一般電腦主機的熱源主要是處理器(CPU)及擴充卡,例如顯示卡、網路卡、影像擷取卡等,目前常見的散熱系統,是分別針對處理器及擴充卡設置散熱裝置,以將熱能排出機殼。其中針對處理器的散熱方式係透過大型鋁製散熱片或是專用的冷卻器傳導,再透過風扇加以散熱,而針對擴充卡係透過風扇或散熱鰭片散熱。The heat source of a general computer host is mainly a processor (CPU) and an expansion card, such as a display card, a network card, an image capture card, etc. The current common heat dissipation system is to provide a heat dissipation device for the processor and the expansion card, respectively, to Heat energy is discharged from the casing. Among them, the heat dissipation method for the processor is conducted through a large aluminum heat sink or a dedicated cooler, and then dissipated by the fan, and for the expansion card is dissipated by the fan or the heat sink fin.
然而,分別針對處理器及擴充卡設置風扇,則整個電腦主機需要的風扇數量較多,不僅增加成本與噪音干擾,而且機殼設計需要預留更多空間來安裝風扇與建立風道,不同熱源的風道在機殼內容易造成風流擾流。However, if fans are set separately for the processor and expansion card, the number of fans required for the entire computer host is not only increased cost and noise interference, but also the chassis design needs to reserve more space to install fans and establish air ducts, different heat sources The air duct in the chassis is likely to cause wind turbulence.
因此,本新型之其中一目的,即在提供一種可以解決前述問題的電腦主機。Therefore, one of the purposes of the present invention is to provide a computer host that can solve the aforementioned problems.
於是,本新型電腦主機在一些實施態樣中,是包含一機殼、一電路單元及一散熱單元。該機殼包括一底壁、兩個側壁、一前壁、一後壁及一上蓋,該兩側壁彼此相對地連接於該底壁左右兩側,該前壁與該後壁彼此相對地連接於該底壁前後兩側,該上蓋與該底壁相對地連接該兩側壁和該前壁,並與該後壁共同形成一排風口,該後壁設有多個進風孔。該電路單元設於該機殼內,並包括一垂直該底壁且偏靠該後壁的第一電路板,及一平行該底壁且靠近該上蓋及該後壁的第二電路板,該第一電路板設有多個卡連接器,該第二電路板與該第一電路板電連接且設有一面向該上蓋的處理器。該散熱單元包括一散熱模組及一風扇模組,該散熱模組設於該第二電路板並位於該第二電路板與該上蓋之間且對應該排風口,該風扇模組位於該散熱模組靠近該前壁的一側且包括多個並排的風扇,該等風扇相對於該底壁呈傾斜以斜向朝該前壁及該底壁吸風並朝向該上蓋及該散熱模組吹風。Therefore, in some implementations, the new computer host includes a casing, a circuit unit, and a heat dissipation unit. The cabinet includes a bottom wall, two side walls, a front wall, a rear wall and an upper cover, the two side walls are connected to the left and right sides of the bottom wall relative to each other, the front wall and the rear wall are connected to each other opposite to each other On the front and rear sides of the bottom wall, the upper cover connects the two side walls and the front wall opposite to the bottom wall, and forms an air outlet with the rear wall, and the rear wall is provided with a plurality of air inlet holes. The circuit unit is disposed in the casing, and includes a first circuit board perpendicular to the bottom wall and leaning to the rear wall, and a second circuit board parallel to the bottom wall and close to the upper cover and the rear wall, the The first circuit board is provided with a plurality of card connectors, the second circuit board is electrically connected to the first circuit board, and a processor facing the upper cover is provided. The heat dissipation unit includes a heat dissipation module and a fan module. The heat dissipation module is disposed on the second circuit board and is located between the second circuit board and the upper cover and corresponds to the air outlet. The fan module is located on the heat dissipation The module is close to one side of the front wall and includes a plurality of side-by-side fans that are inclined relative to the bottom wall to obliquely draw air toward the front wall and the bottom wall and blow air toward the upper cover and the heat dissipation module .
在一些實施態樣中,該上蓋具有一與該底壁相對的頂壁及兩個分別自該頂壁兩側彎折延伸並與該兩側壁連接的延伸壁,該風扇模組還包括一固定框架及一風扇架,該固定框架具有兩個彼此相對且分別與該兩延伸壁連接的連結壁,該等風扇固定於該風扇架,且該風扇架兩側分別與該等連結壁連接。In some embodiments, the upper cover has a top wall opposite to the bottom wall and two extension walls bent from two sides of the top wall and connected to the two side walls, the fan module further includes a fixing A frame and a fan frame. The fixing frame has two connecting walls facing each other and respectively connected to the two extension walls. The fans are fixed to the fan frame, and the two sides of the fan frame are respectively connected to the connecting walls.
在一些實施態樣中,該固定框架還具有一連接該兩連結壁且靠近該散熱模組的傾斜壁以供該風扇架靠抵。In some embodiments, the fixing frame further has an inclined wall connecting the two connecting walls and close to the heat dissipation module for the fan frame to bear against.
在一些實施態樣中,該散熱模組具有一底座及多個設於該底座且平行該等側壁並排的鰭片,該底座與該上蓋共同形成一與該排風口相連通的風道。In some embodiments, the heat dissipation module has a base and a plurality of fins disposed on the base and parallel to the side walls. The base and the upper cover together form an air duct that communicates with the air outlet.
在一些實施態樣中,該等鰭片位於該風道且露出該排風口。In some embodiments, the fins are located in the air duct and expose the air vent.
本新型具有以下功效:藉由前述電路單元及散熱單元的配置關係,形成能通過不同熱源區域的單一風道,不僅能減少風扇設置的數量及區域,有效提升風扇效能並降低整體功耗及噪音干擾,也能減少建置風扇的成本並提升機殼內部的空間利用率。The present invention has the following effects: through the arrangement relationship between the circuit unit and the heat dissipation unit, a single air duct that can pass through different heat source areas is formed, which not only reduces the number and area of fan settings, effectively improves fan performance and reduces overall power consumption and noise Interference can also reduce the cost of building fans and increase the space utilization inside the cabinet.
參閱圖1至圖3,本新型電腦主機100之一實施例,包含一機殼1、一電路單元2及一散熱單元3。Referring to FIGS. 1 to 3, an embodiment of the
該機殼1包括一底壁11、兩個側壁12、一前壁13、一後壁14及一上蓋15。該後壁14設有多個進風孔141,在本實施例中,該等進風孔141排列為多排。該兩側壁12彼此相對地連接於該底壁11左右兩側,該前壁13與該後壁14彼此相對地連接於該底壁11前後兩側,該上蓋15與該底壁11相對地連接該兩側壁12和該前壁13,並與該後壁14共同形成一排風口16。在本實施例中,該上蓋15具有一與該底壁11相對的頂壁151及兩個分別自該頂壁151兩側彎折延伸並與該兩側壁12連接的延伸壁152。The cabinet 1 includes a
該電路單元2設於該機殼1內,並包括一垂直該底壁11且偏靠該後壁14的第一電路板21,及一平行該底壁11且靠近該上蓋15及該後壁14的第二電路板22。該第一電路板21設有多個卡連接器211,該第二電路板22與該第一電路板21電連接且設有一面向該上蓋15的處理器221。在本實施例中,該第一電路板21固定於其中一側壁12,該第二電路板22位於該第一電路板21頂側並與該第一電路板21互相垂直。該等卡連接器211用以插接擴充卡(未圖示),例如顯示卡、網路卡、影像擷取卡等。The
該散熱單元3包括一散熱模組31及一風扇模組32。該散熱模組31設於該第二電路板22並位於該第二電路板22與該上蓋15之間且對應該排風口16。在本實施例中,該散熱模組31具有一底座311及多個設於該底座311且平行該等側壁12並排的鰭片312,該底座311與該上蓋15共同形成一與該排風口16相連通的氣體通道,該等鰭片312位於該氣體通道且露出該排風口16。該風扇模組32位於該散熱模組31靠近該前壁13的一側且包括一固定框架33、一風扇架34及多個風扇35。該固定框架33具有兩個彼此相對的連結壁331、一連接該兩連結壁331且靠近該散熱模組31的傾斜壁332,及一連接該兩連結壁331並位於該傾斜壁332相對側的橫接壁333。該等風扇35固定於該風扇架34而並排設置,該風扇架34的一側靠抵於該傾斜壁332且該風扇架34兩側分別與該等連結壁331連接,藉此與該固定框架33結合固定。該固定框架33的兩連結壁331分別與該上蓋15的兩延伸壁152連接,而使該風扇模組32與該上蓋15結合,方便組裝。亦即,該風扇模組32與該上蓋15先組裝在一起,再藉由該上蓋15與該兩側壁12組裝,即可將該風扇模組32固定於該機殼1內。當該風扇模組32固定於該機殼1內時,該等風扇35相對於該底壁11呈傾斜以斜向朝該前壁13及該底壁11吸風並朝向該上蓋15及該散熱模組31吹風。在本實施例中,該等風扇35轉軸相對於該底壁11的傾斜角度為45度。在變化的實施例,亦能使該等風扇35轉軸相對於該底壁11的角度為介於25度至75度之間的其它角度,不以本實施例為限。The heat dissipation unit 3 includes a
如圖4中代表氣流的箭頭所示,當該等風扇35運作時,能通過位於該後壁14的進風孔141吸進外部空氣形成氣流,進入的氣流先通過該第一電路板21設置卡連接器211的區域,亦即設有擴充卡的區域,有些擴充卡在運作時會產生熱能,藉由氣流可帶走擴充卡產生的熱能,而且,藉由該等風扇35傾斜設置而能將通過擴充卡區域的氣流吸入並往該上蓋15及該等鰭片312吹送,並由該上蓋15導引進入該氣體通道而從該排風口16排出。藉此,該機殼1內僅形成單一氣流即能通過擴充卡區域及處理器221區域,亦即將通過不同的熱源區域的風道整合為一,不僅能減少風扇35設置的數量及區域,有效提升風扇35效能並降低整體功耗及噪音干擾,也能減少建置風扇35的成本並提升機殼1內部的空間利用率。As shown by the arrows representing the airflow in FIG. 4, when the
綜上所述,藉由前述電路單元2及散熱單元3的配置關係,形成能通過不同熱源區域的單一風道,不僅能減少風扇35設置的數量及區域,有效提升風扇35效能並降低整體功耗及噪音干擾,也能減少建置風扇35的成本並提升機殼1內部的空間利用率。In summary, through the arrangement relationship between the
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above are only examples of the new model. When the scope of the new model cannot be limited by this, any simple equivalent changes and modifications made according to the patent application scope and patent specification content of the new model are still regarded as Within the scope of this new patent.
100:電腦主機 1:機殼 11:底壁 12:側壁 13:前壁 14:後壁 141:進風孔 15:上蓋 151:頂壁 152:延伸壁 16:排風口 2:電路單元 21:第一電路板 211:卡連接器 22:第二電路板 221:處理器 3:散熱單元 31:散熱模組 311:底座 312:鰭片 32:風扇模組 33:固定框架 331:連結壁 332:傾斜壁 333:橫接壁 34:風扇架 35:風扇 100: computer host 1: chassis 11: bottom wall 12: Side wall 13: front wall 14: Rear wall 141: Air inlet 15: upper cover 151: top wall 152: Extension wall 16: exhaust vent 2: Circuit unit 21: The first circuit board 211: Card connector 22: Second circuit board 221: processor 3: cooling unit 31: Cooling module 311: Base 312: Fin 32: Fan module 33: fixed frame 331: Link wall 332: Inclined wall 333: Cross wall 34: Fan bracket 35: Fan
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是本新型電腦主機的一實施例的一立體圖; 圖2是該實施例的一立體分解圖,其中部分元件未示出; 圖3是圖2的進一步分解圖;及 圖4是該實施例之一剖視圖。 Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: 1 is a perspective view of an embodiment of the new computer host; 2 is an exploded perspective view of the embodiment, in which some elements are not shown; Figure 3 is a further exploded view of Figure 2; and Fig. 4 is a cross-sectional view of one of the embodiments.
100:電腦主機 100: computer host
1:機殼 1: chassis
11:底壁 11: bottom wall
12:側壁 12: Side wall
13:前壁 13: front wall
14:後壁 14: Rear wall
141:進風孔 141: Air inlet
15:上蓋 15: upper cover
16:排風口 16: exhaust vent
2:電路單元 2: Circuit unit
21:第一電路板 21: The first circuit board
211:卡連接器 211: Card connector
22:第二電路板 22: Second circuit board
221:處理器 221: processor
3:散熱單元 3: cooling unit
31:散熱模組 31: Cooling module
32:風扇模組 32: Fan module
33:固定框架 33: fixed frame
35:風扇 35: Fan
Claims (5)
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TW109200456U TWM594175U (en) | 2020-01-13 | 2020-01-13 | Computer host |
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TW109200456U TWM594175U (en) | 2020-01-13 | 2020-01-13 | Computer host |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI806653B (en) * | 2022-06-10 | 2023-06-21 | 英業達股份有限公司 | Expansion frame assembly and expansion card frame |
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2020
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI806653B (en) * | 2022-06-10 | 2023-06-21 | 英業達股份有限公司 | Expansion frame assembly and expansion card frame |
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