CN212302406U

CN212302406U - PC host case capable of realizing efficient heat dissipation

Info

Publication number: CN212302406U
Application number: CN202022358011.0U
Authority: CN
Inventors: 张业生
Original assignee: Wuxi Luolile Technology Co ltd
Current assignee: Wuxi Luolile Technology Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-01-05
Anticipated expiration: 2030-10-21

Abstract

The utility model belongs to the field of personal computers, and provides a PC mainframe case for realizing high-efficiency heat dissipation, wherein a case body of the case body comprises a top plate, a bottom plate and four side cover plates, and any side cover plate is arranged into an integrated heat dissipation structure and comprises an outer plate and an inner plate, the outer plate and the inner plate are oppositely buckled and form a first cavity with the top plate and the bottom plate, heat dissipation fins and a heat pipe are arranged inside the case body, the heat pipe is provided with a reversed V-shaped arch and is connected with a CPU heat conduction block, the lower end of the inner plate is provided with an air; the inner panel encloses with other three side cover boards and becomes the second cavity, and CPU and the CPU heat conduction piece on the inside mainboard are connected, and the upper portion of second cavity is provided with radiator fan, and the roof is provided with the ventilation hole. The utility model provides a realize high-efficient radiating PC host computer machine case, heat radiation structure occupation space is few, can reduce host computer machine case volume as far as possible, adopts a radiator fan, at stall and the interval internal work of low-speed moving, has effectively reduced the noise.

Description

PC host case capable of realizing efficient heat dissipation

Technical Field

The utility model relates to a PC machine case especially relates to a realize high-efficient radiating PC machine case.

Background

With the continuous development of society and the improvement of living standard of people, personal computers (PC for short) have entered every family, and the PC not only improves the working efficiency of people, but also enriches the entertainment life of people.

In recent years, with the development of semiconductor technology, the performance of core chips such as a CPU and a GPU of a PC has been greatly improved, and regardless of the influence of the progress of the chip technology on professional industrial design and industrial manufacturing fields, the improvement of the performance of the PC has brought a great improvement to the working efficiency of digital creators in the field of personal video signals, and also greatly improved the game experience of game enthusiasts, and promoted the development of the high-definition game industry. The two application fields test the computational power of the GPU and the CPU; the computer with high calculation capacity and strong performance has a remarkably large chip heating value when carrying out heavy-load calculation; how to timely dissipate heat emitted by the CPU/GPU becomes a basic premise of stable operation of all high-performance computers at present, because the heat dissipation efficiency of the CPU/GPU directly influences the working performance of the high-performance computers, if the heat dissipation of the CPU/GPU is poor, the CPU/GPU can cause blue screen, black screen and crash of the computers due to overheating in a short time, and even directly causes 'burning' failure of the CPU/GPU.

In order to solve the problem, manufacturers of large computer components and parts actively develop various heat dissipation devices, but from the heat dissipation principle, the two ways of liquid cooling and air cooling, which are common heat sinks on the market at present, are different in design in the aspects of appearance and structure.

Because of the limitation of the heat dissipation form, increasing the surface area of a heat dissipation body and accelerating the speed of air flowing through the surface of the heat dissipation body are the main directions of the design of the heat dissipation device, the larger the tower-type air-cooled heat dissipation device is, the larger the head of the tower-type air-cooled heat dissipation device is, the heat dissipation device is directly fixed on a relatively weak PCB, the deformation of the PCB due to stress is caused after a long time, a printed circuit is broken, various inexplicable faults are generated, and great hidden dangers are brought to the reliability and the stability of the PC.

The above is a common problem of the air-cooling heat dissipation method. However, people familiar with the liquid cooling system know that the hidden danger of the liquid cooling system is more and more serious, and the problem of the liquid cooling system is more and more caused by various liquid leakage, which causes the short circuit of devices such as a display card of a main board and the like caused by water soaking, which is the most fatal and limited by the principle, and the liquid cooling system necessarily needs a cold radiator and a matched radiating fan. In order to enhance the air circulation efficiency of the case, a plurality of fans are additionally arranged on the case, and when the fans work together, noise is superposed, so that the use experience is influenced.

And these fans, cold row, the air-cooled radiator all needs occupation space, makes the PC host computer volume huge in the intangible, because the part is more, the reliability of complete machine also very reduces, and stability is relatively poor, the noise, the PC host computer volume is great is the general problem point of present desktop PC.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming current defect, providing a realize high-efficient radiating PC host computer machine case, solve present PC host computer and pursue the heat dissipation and bulky, the reliability poor, the poor stability of the big problem of noise that leads to.

In order to solve the technical problem, the utility model provides a following technical scheme:

a PC host case for realizing efficient heat dissipation comprises a case body, wherein the case body comprises a top plate, a bottom plate and four side cover plates, any side cover plate is arranged to be an integrated heat dissipation structure, the integrated heat dissipation structure comprises an outer plate and an inner plate, two sides of the outer plate are provided with surrounding plates, the outer plate and the inner plate are oppositely buckled and form a first cavity with the top plate and the bottom plate, a plurality of first heat dissipation fins are arranged on the end surfaces, facing the first cavity, of the outer plate and the inner plate, a plurality of heat pipes are clamped among the first heat dissipation fins, the heat pipes are provided with a plurality of L-shaped arches and connected with CPU heat conduction blocks, the connection parts of the L-shaped arches penetrate through the inner plate, the lower end of the inner plate is provided with an air flow channel, and the top plate is provided with a first air vent; the inner panel encloses into the second cavity with other three the side cover board, the inside functional element that is provided with of second cavity, functional element includes mainboard, display card and power, CPU on the mainboard with CPU heat conduction piece is connected, the upper portion of second cavity is provided with first radiator fan, the roof is in the top of second cavity is provided with the ventilation hole.

Furthermore, a plurality of second ventilation holes are formed in the outer plate and the first radiating fins on the inner side end face of the outer plate.

Furthermore, a plurality of second radiating fins are arranged on the end face of the outer side of the outer plate.

Furthermore, the outer side surface of the outer plate or any other side cover plate is provided with a foldable handle.

Furthermore, an integrated I/O interface module is arranged on the outer plate or any other side cover plate.

Furthermore, an upper air duct partition plate and a side air duct partition plate are respectively arranged on the upper portion and the two sides of the front end face of the display card, a first air inlet is formed in the bottom plate under the upper air duct partition plate, and a cushion block is arranged on the lower end face of the bottom plate.

Furthermore, a display card liquid cooling head is arranged on the front end face of the display card, the display card liquid cooling head is connected with a liquid cooling pump through a liquid cooling pipeline, and the liquid cooling pump is arranged in the second cavity; the CPU heat conducting block is replaced by a CPU liquid cooling head, and the heat pipe is replaced by a liquid cooling heat conducting pipe and communicated with the liquid cooling pipeline.

Furthermore, the preceding terminal surface of display card liquid cooling head is provided with third heat radiation fins, the both sides of terminal surface are provided with the air current deflector before the display card liquid cooling head, the bottom plate is in the below of terminal surface is provided with the second air inlet before the display card liquid cooling head, the lower terminal surface of bottom plate is provided with the cushion.

Furthermore, the outer side surfaces of any other three side cover plates are milled to form concave surfaces, and leather, wood veneer, cloth or composite materials are attached to the concave surfaces.

Furthermore, any other three side cover plates are provided with display holes, and display plates made of transparent materials are arranged on the display holes.

The utility model relates to a PC host case for realizing high-efficiency heat dissipation, which has compact structure, small occupied space of a heat dissipation structure, stable overall structure, improved reliability and stability of the case, no need of additional addition by adopting a heat dissipation fan, and active heat dissipation of the host by utilizing self heat dissipation fins when the host runs at low load; when the load of the host machine is larger, the cooling fan runs at a lower rotating speed; the active and passive heat dissipation mode greatly improves the heat dissipation efficiency, and the heat dissipation fan mainly works in the interval of the stop and the low-speed operation, thereby effectively reducing the noise.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic overall explosion diagram of embodiment 1 of the present invention;

fig. 2 is a schematic rear view of embodiment 1 of the present invention;

fig. 3 is a schematic view of an integrated heat dissipation structure in embodiment 1 of the present invention (arrows in the figure indicate intake airflow);

fig. 4 is a schematic view of a flow direction of a heat dissipating air flow in embodiment 1 of the present invention;

fig. 5 is an explosion diagram one of embodiment 2 of the present invention;

fig. 6 is an explosion diagram ii of embodiment 2 of the present invention (the inner plate is omitted).

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example 1

As shown in fig. 1-3, a PC mainframe chassis for realizing efficient heat dissipation comprises a box body, the box body comprises a top plate 1, a bottom plate 2 and four side cover plates 3, the rear side cover plate is an integrated heat dissipation structure, the integrated heat dissipation structure comprises an outer plate 4 and an inner plate 5, the two sides of the outer plate 4 are provided with surrounding plates, the outer plate 4 and the inner plate 5 are oppositely buckled and form a first cavity with the top plate 1 and the bottom plate 2, the end surfaces of the outer plate 4 and the inner plate 5 facing the first cavity are provided with a plurality of first heat dissipation fins 6, a plurality of heat pipes 7 are sandwiched between the first heat dissipation fins 6, the heat pipes 7 are provided with a zigzag arch and connected with a CPU heat conduction block 8, the connection part of the zigzag arch passes through the inner plate 5, the lower end of the inner plate 5 is provided with an airflow channel, and the top plate 1 is; the inner panel 5 encloses into the second cavity with other three side cover plate 3, and the inside functional element that is provided with of second cavity, functional element include mainboard 9, display card 10 and power 11, and CPU heat-conducting block 8 on the mainboard 9 are connected, and the upper portion of second cavity is provided with first radiator fan 12, and roof 1 is provided with the ventilation hole in the top of second cavity. The number of layers of the first radiating fins and the number of the heat pipes can be increased according to actual needs.

An upper air duct partition plate 15 and a side air duct partition plate 16 are respectively arranged on the upper portion and two sides of the front end face of the display card 10, a first air inlet 17 is arranged right below the upper air duct partition plate 15 on the bottom plate 2, and a cushion block 18 is arranged on the lower end face of the bottom plate 2.

The first radiating fins 6 on the inner side end surfaces of the outer plate 4 and the outer plate 4 are provided with a plurality of second air vents 19, and external air can enter the first cavity from the second air vents to increase the air inflow of the external air.

The working principle is as follows:

the active heat dissipation process is that heat emitted by the CPU is transferred to the heat pipe through the CPU heat conduction block, the heat pipe transfers the heat to the first heat dissipation fins, and the CPU heat conduction block can be provided with the heat dissipation fins according to requirements.

As shown in fig. 4, in the passive heat dissipation process, cold airflow (external air) enters the first cavity from the first vent hole and the second vent hole, cools the heat pipe and the first heat dissipation fins, then the airflow enters the second cavity from the airflow channel, and is discharged upwards through the first heat dissipation fan and the vent holes, which is the cooling process of the CPU; meanwhile, the negative pressure formed by the operation of the cooling fan enables cold air flow to enter an air channel formed by the upper air channel partition plate and the side air channel partition plate from the first air inlet, be sucked by the second cooling fan 14 carried by the display card, enter the second cavity through the cooling fins 13 carried by the display card at two sides, and be discharged upwards through the first cooling fan and the vent holes, so that the cooling process of the display card is realized. This airflow also carries away heat emitted by other components in the enclosure.

The outer end face of the outer plate 4 is provided with a plurality of second radiating fins 20, so that the active radiating performance of the outer plate is improved.

The outer side surface of the outer plate 4 is provided with a foldable handle 21, so that the case can be conveniently moved.

The integrated I/O interface module 22 is arranged on the outer plate, so that upgrading, maintenance or replacement are facilitated, and the cost is reduced.

The outer side surfaces of any other three side cover plates 3 are milled to form concave surfaces, and leather, wood veneer, cloth or composite materials are attached to the concave surfaces so as to improve the overall texture of the case.

Any other three side cover plates 3 are provided with display holes, and display plates made of transparent materials are arranged on the display holes to increase the transparent visual effect of the case so as to obtain better appearance.

Example 2

As shown in fig. 5 and 6, the present embodiment is different from embodiment 1 in that:

the front end face of the display card 10 is provided with a display card liquid cooling head 23, the display card liquid cooling head 23 is connected with a liquid cooling pump 25 through a liquid cooling pipeline 24, and the liquid cooling pump 25 is arranged in the second cavity; the CPU heat conduction block is replaced by a CPU liquid cooling head 26, and the heat pipe is replaced by a liquid cooling heat conduction pipe 27 and communicated with the liquid cooling pipeline 24.

The front end face of the liquid cooling head 23 of the display card is provided with a third heat dissipation fin, two sides of the front end face of the liquid cooling head of the display card are provided with airflow guide plates 28, instead of the upper air duct partition plate and the side air duct partition plate in embodiment 1, and the bottom plate 2 is provided with a second air inlet 29 below the front end face of the liquid cooling head 23 of the display card.

Utilize the liquid cooling to cooperate the air-cooled mode to lower the temperature CPU and display card, the radiating effect is better, simultaneously because the radiator fan of display card has been reduced, the silence effect of quick-witted case is better. In addition, all pipeline connecting parts in this scheme are outside being independent of mainboard and display card to connect less, even slight weeping, also can leak in the place of keeping away from mainboard and display card PCB relatively, simultaneously because there is the existence of first air inlet on the floor, the weeping can not accumulate in quick-witted incasement, can directly not cause the short circuit.

The utility model relates to a realize high-efficient radiating PC host computer machine case, compact structure, heat radiation structure occupation space is few, can reduce host computer machine case volume as far as possible, and overall structure is firm, has improved the reliability and the stability of quick-witted case, adopts a radiator fan and need not additionally to add, has passive heat dissipation function simultaneously concurrently, realizes radiator fan's low-power consumption operation or does not operate, has effectively reduced the noise.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a realize high-efficient radiating PC host computer machine case which characterized in that: the integrated heat dissipation structure comprises an outer plate and an inner plate, wherein the two sides of the outer plate are provided with surrounding plates, the outer plate and the inner plate are oppositely buckled and form a first cavity with the top plate and the bottom plate, the end faces, facing the first cavity, of the outer plate and the inner plate are provided with a plurality of first heat dissipation fins, a plurality of heat pipes are clamped between the first heat dissipation fins, the heat pipes are provided with a reversed V-shaped arch and connected with CPU heat conduction blocks, the connection parts of the reversed V-shaped arch penetrate through the inner plate, the lower end of the inner plate is provided with an airflow channel, and the top plate is provided with a first vent hole above the first cavity;

the inner panel encloses into the second cavity with other three the side cover board, the inside functional element that is provided with of second cavity, functional element includes mainboard, display card and power, CPU on the mainboard with CPU heat conduction piece is connected, the upper portion of second cavity is provided with first radiator fan, the roof is in the top of second cavity is provided with the ventilation hole.

2. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: and a plurality of second ventilation holes are formed in the outer plate and the first radiating fins on the inner side end surface of the outer plate.

3. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: and a plurality of second radiating fins are arranged on the end surface of the outer side of the outer plate.

4. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: the outer side of the outer plate or any other side cover plate is provided with a foldable handle.

5. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: and an integrated I/O interface module is arranged on the outer plate or any other side cover plate.

6. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: the upper portion and the two sides of the front end face of the display card are respectively provided with an upper air duct partition plate and a side air duct partition plate, a first air inlet is formed in the bottom plate under the upper air duct partition plate, and a cushion block is arranged on the lower end face of the bottom plate.

7. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: the front end face of the display card is provided with a display card liquid cooling head, the display card liquid cooling head is connected with a liquid cooling pump through a liquid cooling pipeline, and the liquid cooling pump is arranged in the second cavity;

the CPU heat conducting block is replaced by a CPU liquid cooling head, and the heat pipe is replaced by a liquid cooling heat conducting pipe and communicated with the liquid cooling pipeline.

8. The PC mainframe box for realizing efficient heat dissipation of claim 7, wherein: the front end face of the display card liquid cooling head is provided with a third radiating fin, the two sides of the front end face of the display card liquid cooling head are provided with airflow guide plates, the bottom plate is arranged below the front end face of the display card liquid cooling head and is provided with a second air inlet, and the lower end face of the bottom plate is provided with a cushion block.

9. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: the outer side surfaces of any other three side cover plates are milled to form concave surfaces, and leather, wood veneer, cloth or composite materials are attached to the concave surfaces.

10. The PC mainframe box for realizing efficient heat dissipation of claim 1, wherein: any other three the side cover plate is provided with a display hole, and a display plate made of transparent materials is arranged on the display hole.