CN216489359U - Ring main unit heat dissipation device - Google Patents
Ring main unit heat dissipation device Download PDFInfo
- Publication number
- CN216489359U CN216489359U CN202123352188.0U CN202123352188U CN216489359U CN 216489359 U CN216489359 U CN 216489359U CN 202123352188 U CN202123352188 U CN 202123352188U CN 216489359 U CN216489359 U CN 216489359U
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- Prior art keywords
- heat
- heat dissipation
- main unit
- heat sink
- ring main
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model relates to an electrical equipment technical field, specificly relate to a looped netowrk cabinet heat abstractor. The utility model discloses a ring main unit heat dissipation device, which comprises an upper heat dissipation mechanism fixedly arranged on a cabinet box; the upper radiating mechanism comprises a heat conducting plate, heat conducting supports are annularly distributed by taking the heat conducting plate as the center, and the heat conducting plate is fixed on the cabinet box through the heat conducting supports; the interval radiating plate component is connected with the heat conducting plate; the spaced heat sink plate assembly includes a plurality of heat sink plates connected by thermally conductive struts. The upper radiating mechanism is designed to enhance the radiating effect and overcome the potential safety hazard caused by the traditional manual radiating; the heat conduction support transmits heat to the heat conduction plate, and then the heat is fully transmitted out through the layer-by-layer heat dissipation of the interval heat dissipation plate assembly.
Description
Technical Field
The utility model relates to an electrical equipment technical field, specificly relate to a looped netowrk cabinet heat abstractor.
Background
The high-voltage ring main unit is used for improving the power supply reliability, so that a user can obtain power from two directions, and the power supply network is generally connected into a ring, and the power supply mode is called ring network power supply.
Current looped netowrk cabinet, inside many annular main lines constitute large-scale circuit system, and the electric wire all has resistance, can produce the heat in the use to lead to the inside temperature of looped netowrk cabinet to rise gradually, and then cause the potential safety hazard to the use of insulating layer on the electric wire and circuit, therefore need dispel the heat to looped netowrk cabinet inside, the heat dissipation is handled the heat dissipation to the manual work of present heat dissipation to the looped netowrk cabinet all being discontinuity basically. Some ring main units use a water-cooling heat dissipation mode, but the cost is higher, and the later after-sale maintenance is troublesome.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a looped netowrk cabinet heat abstractor, it is not high to solve traditional manual work and carry out the radiating efficiency that heat treatment, water-cooling heat dissipation brought, leads to insulating layer, circuit on the electric wire to use the problem that has the potential safety hazard.
In order to achieve the above object, one or more embodiments of the present invention provide the following technical solutions:
the utility model discloses a ring main unit heat dissipation device, which comprises an upper heat dissipation mechanism fixedly arranged on a cabinet box; the upper radiating mechanism comprises a heat conducting plate, heat conducting supports are annularly distributed by taking the heat conducting plate as the center, and the heat conducting plate is fixed on the cabinet box through the heat conducting supports; the interval radiating plate component is connected with the heat conducting plate; the spaced heat sink plate assembly includes a plurality of heat sink plates connected by thermally conductive struts.
According to a further technical scheme, the upper heat dissipation mechanism further comprises a shell, and the interval heat dissipation plate assembly is located in the shell.
According to a further technical scheme, the interval heat dissipation plate assembly is located in the center of the shell.
In a further technical scheme, a heat radiation fan is arranged on the shell.
Further technical scheme, the heat-conducting plate is the cylinder structure, and the heat conduction support is connected with the circular terminal surface that is close to cabinet case one side of heat-conducting plate, and interval radiator unit is connected with the circular terminal surface that the heat-conducting plate is close to the external world.
According to the further technical scheme, the heat conducting supporting rod is of a multi-section folding structure, and two ends of the heat conducting supporting rod are connected with the adjacent group of heat dissipation plates respectively.
According to the further technical scheme, a bottom heat dissipation mechanism is further arranged on the cabinet box.
In a further aspect, the bottom heat dissipation mechanism includes a fan.
According to a further technical scheme, the bottom heat dissipation mechanism is located below the upper heat dissipation mechanism.
According to a further technical scheme, at least three heat dissipation plates are adopted.
The beneficial effects of one or more technical schemes are as follows:
1. the upper radiating mechanism is designed to enhance the radiating effect and overcome the potential safety hazard caused by the traditional manual radiating; the heat conduction support transmits heat to the heat conduction plate, and then the heat is fully transmitted out through the layer-by-layer heat dissipation of the interval heat dissipation plate assembly.
2. Be located cabinet bottom of the case portion and be provided with the fan, directly go out the heat transfer of cabinet incasement portion, cooperate upper portion heat dissipation mechanism to strengthen the radiating effect, improved holistic radiating effect.
3. The device has simple structure, reduces the used heat dissipation cost, and is more convenient for later maintenance and repair. Can be conveniently disassembled and replaced.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the heat dissipation mechanism with the upper portion removed;
FIG. 3 is a schematic view of a spacer heat sink assembly;
in the figure, 1, a cabinet box, 2, an upper radiating mechanism, 3, an interval radiating plate component, 4, a shell, 5, a radiating fan, 6, a radiating plate, 7, a heat conducting support rod, 8, a heat conducting support, 9, a heat conducting plate, 10 and a fan.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-3, the present invention discloses a heat dissipation device for a ring main unit, which includes a main unit 1, and as shown in fig. 1, in this embodiment, for convenience of description, upper heat dissipation mechanisms 2 are symmetrically disposed on the left and right sides of the main unit 1.
The upper radiating mechanism 2 comprises a shell 4, an interval radiating plate component 3 is arranged in the shell 4, and the shell 4 is rectangular and has a hollow structure; the spaced-heat-dissipation-plate assembly 3 is fixedly installed in the housing 4 and is located at the center of the housing 4.
The upper portion heat dissipation mechanism 2 can be fixed in on the cabinet case 1, also can be through being the mode of splicing with cabinet case 1 with the design of shell 4, realize detachable and connect on cabinet case 1, when not needing or changing or wash upper portion heat dissipation mechanism 2, can conveniently dismantle.
As shown in fig. 3, the structure diagram of the spaced heat dissipation plate assembly 3 shows that the spaced heat dissipation plate assembly 3 includes a plurality of vertical heat dissipation plates 6 arranged side by side, the heat dissipation plates are rectangular, the number of the heat dissipation plates is at least three, two adjacent heat dissipation plates are connected through a heat conduction support rod, one end of the heat conduction support rod is connected with one of the two adjacent heat dissipation plates, the other end of the heat conduction support rod is connected with the other of the two adjacent heat dissipation plates, and the specific connection mode can be a bolt connection, so that the disassembly is convenient.
The heat dissipation plates 6 are positioned and connected through a plurality of heat conduction support rods 7, and each heat conduction support rod 7 is of a multi-section folding structure and has certain heat conduction, heat dissipation and supporting functions. Because each heat conducting supporting rod is of a multi-section folding structure, a certain space can be reserved among the plurality of heat radiating plates, the heat radiating plates are not completely connected together, and therefore sufficient heat radiation is achieved.
And the heat conduction supporting rod between two adjacent heat dissipation plates can select any end of two ends of the heat conduction supporting rod to be connected with one of the adjacent heat dissipation plates, as long as two ends of the heat conduction supporting rod are respectively connected with the adjacent heat dissipation plates.
In this embodiment, only three heat dissipation plates 6 are shown and only the heat conductive support rods 7 on one heat dissipation plate 6 are shown, and the number of heat dissipation plates 6 can be designed according to the actual engineering requirements.
The heat dissipation fan 5 is further arranged on the shell 4, the heat dissipation fan 5 is arranged on one side face of the shell 4, located in the vertical plane, the heat dissipation fan 5 is embedded in the shell 4 and communicated with the shell 4, and heat of the spaced heat dissipation plate assembly 3 in the shell 4 is transmitted out through the heat dissipation fan 5. The specific size of the heat dissipation fan 5 is smaller than the length and width of the side of the housing 4, and is specifically matched according to actual needs.
The upper radiating mechanism 2 further comprises a heat conducting support 8, one end of the heat conducting support 8 fixed on the cabinet box 1 is connected with the cabinet box 1, the other end of the heat conducting support 8 is connected with a heat conducting plate 9, and the number of the heat conducting supports is at least three.
The heat conduction support 8 on the cabinet box is annularly distributed by taking the heat conduction plate as a center heat conduction support, wherein the heat conduction plate is of a cylindrical structure and is connected with the circular end face of the heat conduction plate, close to one side of the cabinet box, of the heat conduction support, and the interval heat dissipation assembly is connected with the circular end face of the heat conduction plate, close to the outside. The heat conducting bracket 8 is used for conducting heat on the inner support frame to the heat conducting plate 9.
The heat-conducting plate 9 is located at the center of the heat-conducting support 8 distributed annularly, the heat-conducting plate 9 is used for connecting the interval heat-radiating plate component 3 of the upper heat-radiating mechanism 2, the heat-conducting plate 9 is connected in the rail direction through the heat-conducting support 8, the heat-conducting support 8 is connected on the end face of the heat-conducting plate 9 facing the inner side of the cabinet box 1, and the interval heat-radiating plate component 3 of the upper heat-radiating mechanism 2 is connected on the end face of one side of the heat-conducting plate 9 facing the outside.
The bottom heat dissipation mechanism is arranged below the upper heat dissipation mechanism 2 and located on the cabinet box 1, the bottom heat dissipation mechanism comprises fans 10, the fans 10 are symmetrically arranged on two side faces of the cabinet box 1, the fans 10 are embedded into the cabinet box 1, and heat in the cabinet box 1 is transferred to the outside through the fans 10. In order to keep the fan 10 clean, a cover may be disposed outside the fan 10, and the cover is configured to have a strip-shaped hole, so that heat may be exchanged with the outside, and the fan 10 may block dust from the outside.
Through two sets of heat dissipation mechanisms, better heat dissipation can be carried out in the cabinet box, the lower heat dissipation mechanism can dissipate heat of air in the cabinet box, and the upper heat dissipation mechanism can be used for dissipating heat through an external novel interval heat dissipation plate assembly, so that the overall heat dissipation effect is improved. And the cost of this heat dissipation mechanism is lower, and maintenance and later maintenance are more convenient.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A ring main unit heat dissipation device is characterized by comprising an upper heat dissipation mechanism fixedly arranged on a cabinet box; the upper radiating mechanism comprises a heat conducting plate, heat conducting supports are annularly distributed by taking the heat conducting plate as the center, and the heat conducting plate is fixed on the cabinet box through the heat conducting supports; the interval radiating plate component is connected with the heat conducting plate; the spaced heat sink plate assembly includes a plurality of heat sink plates connected by thermally conductive struts.
2. The ring main unit heat sink device as claimed in claim 1, wherein the upper heat sink mechanism further includes a housing, and the spaced heat sink assembly is disposed in the housing.
3. The ring main unit heat sink device as claimed in claim 2, wherein the partition heat sink assembly is located at a central position of the housing.
4. The ring main unit heat sink device as claimed in claim 2, wherein a heat dissipating fan is disposed on the housing.
5. The ring main unit heat sink of claim 1, wherein the heat conducting plate is cylindrical, the heat conducting bracket is connected to a circular end surface of the heat conducting plate near one side of the cabinet case, and the spacer heat sink assembly is connected to a circular end surface of the heat conducting plate near the outside.
6. The ring main unit heat dissipating device as claimed in claim 1, wherein the heat conducting supporting rod is a multi-section folding structure, and two ends of the heat conducting supporting rod are connected to a set of adjacent heat dissipating plates respectively.
7. The ring main unit heat dissipation device as claimed in claim 1, wherein a bottom heat dissipation mechanism is further disposed on the main unit.
8. The ring main unit heat sink device as claimed in claim 7, wherein the bottom heat sink mechanism includes a fan.
9. The ring main unit heat sink device as claimed in claim 7, wherein the bottom heat sink mechanism is located below the upper heat sink mechanism.
10. The ring main unit heat dissipation device as claimed in claim 1, wherein at least three heat dissipation plates are adopted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123352188.0U CN216489359U (en) | 2021-12-28 | 2021-12-28 | Ring main unit heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123352188.0U CN216489359U (en) | 2021-12-28 | 2021-12-28 | Ring main unit heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216489359U true CN216489359U (en) | 2022-05-10 |
Family
ID=81430808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123352188.0U Active CN216489359U (en) | 2021-12-28 | 2021-12-28 | Ring main unit heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216489359U (en) |
-
2021
- 2021-12-28 CN CN202123352188.0U patent/CN216489359U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 717, Huaihe West Road, Huangdao District, Qingdao City, Shandong Province 266000 Patentee after: Qingdao Yihe Energy Storage Technology Co.,Ltd. Address before: No. 717, Huaihe West Road, Huangdao District, Qingdao City, Shandong Province 266000 Patentee before: Qingdao Yihe Intelligent Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |