CN205723496U - A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization - Google Patents
A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization Download PDFInfo
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- CN205723496U CN205723496U CN201620398045.3U CN201620398045U CN205723496U CN 205723496 U CN205723496 U CN 205723496U CN 201620398045 U CN201620398045 U CN 201620398045U CN 205723496 U CN205723496 U CN 205723496U
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Abstract
The utility model discloses the three-dimensional microwave circuit structure of a kind of micro-group dress miniaturization, including ltcc substrate, metal support plate, organic substrate, aluminum cavity, connector, power supply and the isolator of band partition wall and cavity upper and lower cover plates can be cut down；Install the most successively above partition wall and can cut down metal support plate, ltcc substrate；Partition wall organic substrate installed below；Connector welding is on organic substrate；Some confession electric(al) insulators and isolator are fixedly welded on partition wall, and insulator pin one end is welded to back substrate pad relevant position, and the insulator pin other end is connected on the ltcc substrate pad of front by gold wire bonding；Cavity upper cover plate is welded on cavity by Laser seal welding, makes upper cavity inner sealing；This utility model is simple for assembly process, and mechanical strength is high, and encapsulation volume is little.
Description
Technical field
This utility model belongs to the small-sized encapsulated technical field of microwave or millimetre-wave circuit and system, particularly relates to the three-dimensional microwave circuit structure of a kind of micro-group dress miniaturization.
Background technology
Microwave Micro-package technique (MMCM) is to realize complete electronic set miniaturization, lightweight, high-performance and highly reliable key technology, LTCC(LTCC) substrate is owing to microwave signal transmission performance is good, can realize the embedded set of passive device, and the technology therefore filled based on ltcc substrate and micro-group is to realize the important channel of microwave module and system compact.But ceramic substrate has on expensive, brittle, ceramic substrate and welds the shortcomings such as device adhesive force is the strongest.Although and organic substrate low price, mechanical strength are high, it is reliable and stable to weld, but common organic substrate can not carry out the micro-group dress of bare chip, this makes again to use organic substrate to be difficult to reduce volume, improves integrated level.The advantage the most how combining both the above substrate, reduces cost, improves integrated level and reliability, is microwave or millimetre-wave circuit small-sized encapsulated technology problem demanding prompt solution.
Utility model content
In order to overcome the shortcoming of above-mentioned ceramic substrate and organic substrate, give full play to two kinds of respective advantages of substrate, improve integrated level, reducing volume, this utility model provides the three-dimensional microwave circuit structure of a kind of micro-group dress miniaturization, and this circuit structure volume is little, technique is simple, and mechanical strength is high.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization, it is characterised in that: include ltcc substrate, metal support plate, organic substrate, aluminum cavity, connector and cavity upper and lower cover plates can be cut down；Described aluminum cavity includes two sides and is positioned at the partition wall of two sides by-level；Described cavity upper and lower cover plates is individually fixed at the upper and lower opening of aluminum cavity, makes upper and lower inside cavity seal, and protection bare chip is not by external environment influence；Form cavity above between cavity upper cover plate and aluminum cavity side, partition wall, between cavity lower cover and aluminum cavity side, partition wall, form following cavity；In described cavity above, install the most successively above partition wall and can cut down metal support plate, ltcc substrate；In described cavity below, partition wall organic substrate installed below；Described connector welding is on organic substrate；Some confession electric(al) insulators and isolator it is welded with on described partition wall.
Described ltcc substrate is fixed on by welding manner and can cut down on metal support plate, can cut down metal support plate and is fixed on partition wall by screw；Described organic substrate is fixed and on cavity partition wall by screw.
The upper surface of described ltcc substrate has bare chip and packaging to realize the circuit function of microwave circuit boards by conductive adhesive, and bare chip is by connecting between gold wire bonding and microstrip line.
Described ltcc substrate is by 5-30 layer, and every layer thickness is low temperature co-fired to form at 850 DEG C-900 DEG C after the ferro A6s material of 0.094mm is laminated to one.
Described organic substrate uses common microwave substrate material (FR4 etc.), a cloth circuits mask placement device, and another side all-tin plating, to contact with aluminum cavity, produces good earth effect.
Described aluminum cavity is produced by mechanical processing technique, and certain thickness partition wall is stayed in centre, can cut down support plate with guarantee and organic substrate can be fixed, and screw can not penetrate partition wall simultaneously, to ensure the sealing of upper and lower cavity.
Described connector uses bend cutting type connector.
Described one end for electric(al) insulator and the pin of isolator afterbody is welded to organic substrate pad relevant position, and the other end is connected on the pad of ltcc substrate by gold wire bonding.
Described cavity upper cover plate is welded on aluminum cavity by Laser seal welding, and described cavity lower cover is fixed on aluminum cavity by screw.
This utility model has the advantages that
The Micro-package technique that this utility model front utilizes ltcc substrate to combine bare chip can effectively reduce circuit module volume, improves microwave circuit integrated level.The back substrate common microwave substrate material of employing (FR4 etc.), the main device placing low-frequency band encapsulation, conveniently fix, cost can be reduced simultaneously；The partition wall of aluminum cavity medium design, can be divided into two separate space by upper and lower cavity, is conducive to reducing electromagnetic interference each other, optimizes Electro Magnetic Compatibility.Upper cavity can fully seal simultaneously, the bare chip on protection ltcc substrate, improves reliability；Ltcc substrate is welded to cut down on metal support plate, then can cut down support plate and be fixed on cavity partition wall by screw, is conducive to improving maintainability；Connector uses bend cutting type connector, is welded direct on back substrate, decreases the use of fly line welding, is conducive to improving productibility and reliability；
Structure of the present utility model uses common ltcc substrate to combine the microwave assembly technology of bare chip and the welding procedure of packaging and common metal structure mechanical processing technique can realize, and technique is simple；Can cut down metal support plate, organic substrate is adopted and is attached by screws on partition wall, has the advantage that mechanical strength is high and ground connection is good.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model.
In figure, reference is: 1 ltcc substrate, and 2 can cut down metal support plate, 3 organic substrates, 4 aluminum cavitys, and 5 for electric(al) insulator and isolator, 6 connectors, 7 cavity upper cover plates, 8 cavity lower covers, 9 electronic devices and components, 10 partition walls.
Detailed description of the invention
As it is shown in figure 1, this utility model includes: ltcc substrate 1, metal support plate 2, organic substrate 3, aluminum cavity 4, connector 6 and cavity upper and lower cover plates 7,8 can be cut down.
Described aluminum cavity 4 includes two sides and is positioned at the partition wall 10 of two sides by-level；Described cavity upper and lower cover plates is individually fixed at the upper and lower opening of aluminum cavity 4, makes upper and lower inside cavity seal, and protection bare chip is not by external environment influence.Described cavity upper cover plate 7 is welded on aluminum cavity 4 by Laser seal welding, and described cavity lower cover 8 is fixed on aluminum cavity 4 by screw.
Form cavity above between described cavity upper cover plate 7 and aluminum cavity 4 side, partition wall 10, between cavity lower cover 8 and aluminum cavity 4 side, partition wall 10, form following cavity；In described cavity above, partition wall 10 is installed the most successively can cut down metal support plate 2, ltcc substrate 1；In described cavity below, partition wall 10 organic substrate 3 installed below；Described connector 6 is welded on organic substrate 3；Some confession electric(al) insulators and isolator 5 it is welded with on described partition wall 10.
Described ltcc substrate 1 is fixed on by welding manner and can cut down on metal support plate 2, can cut down metal support plate 2 and is fixed on partition wall 10 by screw；Described organic substrate 3 is fixed and on cavity partition wall 10 by screw.
Described ltcc substrate 1 is by 5-30 layer, and every layer thickness is low temperature co-fired to form at 850 DEG C-900 DEG C after the ferro A6s material of 0.094mm is laminated to one, and ltcc substrate 1 thickness can choose about 1mm.The intermediate layer of described ltcc substrate 1 and upper surface can printed metal layer thus form circuit.After ltcc substrate 1 produces well, the upper surface of ltcc substrate 1 has bare chip and packaging to realize the circuit function of microwave circuit boards by conductive adhesive, bare chip is by connecting between gold wire bonding and microstrip line, and the lower surface platinum plating silver of ltcc substrate 1 is to form circuit stratum.
The described metal support plate 2 that cuts down uses the metal material with ltcc substrate 1 matched coefficients of thermal expansion, so that ltcc substrate 1 not fragmentation in follow-up packaging technology, can cut down metal support plate 2 also acts as fixing ltcc substrate 1 and the effect of ground connection simultaneously.Metal support plate 2 can be cut down and can be processed into the profile consistent with ltcc substrate 1 by mechanical processing technique, and be machined with mounting ear, to facilitate screw to be fixed on aluminum cavity 4.Described cut down metal support plate 2 surface gold-plating, to weld with ltcc substrate 1.
Described organic substrate 3 uses common microwave substrate material (FR4 etc.), a cloth circuits, putting electronic device 9, and another side all-tin plating, to contact with aluminum cavity 4, produces good earth effect.
Described aluminum cavity 4 is produced by mechanical processing technique, and certain thickness partition wall 10 is stayed in centre, and to ensure that support plate can be cut down in front and back side organic substrate 3 can be fixed by screws on cavity partition wall 10, screw can not penetrate partition wall 10 simultaneously, to ensure the sealing of upper cavity.Described aluminum cavity 4 is internal, gold-plated for the position of mounting hole of electric(al) insulator and isolator 5, to facilitate insulator welding and to improve Electro Magnetic Compatibility.
Described one end for electric(al) insulator and the pin of isolator 5 afterbody is welded to the pad relevant position of organic substrate 3, and the other end is connected on the pad of ltcc substrate 1 by gold wire bonding.
Described connector 6 uses bend cutting type connector, is welded direct on back substrate, thus avoids the connection using fly line.Simultaneously because the back side is all the device of encapsulation, back side cavity is without sealing, so being also required for the connector of welding type.
As an example, this structure is utilized to devise a microwave transmitting and receiving miniaturization three-dimensional circuit module.Structure front portion comprises microwave circuit part, and the Micro-package technique using ltcc substrate to combine bare chip realizes；Back portion comprises frequency source and power distribution circuit, and the solder technology using organic substrate to combine packaging realizes；Signal between front and back circuit connects realization by insulator.This module volume is little, and technique is simple, low cost.
Claims (8)
1. the three-dimensional microwave circuit structure of a micro-group dress miniaturization, it is characterised in that: include ltcc substrate (1), metal support plate (2), organic substrate (3), aluminum cavity (4), connector (6) and cavity upper and lower cover plates can be cut down；Described aluminum cavity (4) includes two sides and is positioned at the partition wall (10) of two sides by-level；Described cavity upper and lower cover plates is individually fixed at the upper and lower opening of aluminum cavity (4)；Forming cavity above between described cavity upper cover plate (7) and aluminum cavity (4) side, partition wall (10), described cavity lower cover (8) and aluminum cavity (4) side, partition wall form following cavity between (10)；In described cavity above, partition wall (10) is installed the most successively and can be cut down metal support plate (2), ltcc substrate (1)；In described cavity below, partition wall (10) organic substrate installed below (3)；Described connector (6) is welded on organic substrate (3)；Some confession electric(al) insulators and isolator (5) it is welded with on described partition wall (10).
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterized in that: described ltcc substrate (1) is fixed on by welding manner and can cut down on metal support plate (2), can cut down metal support plate (2) and is fixed on partition wall (10) by screw；Described organic substrate (3) is fixed and on cavity partition wall (10) by screw.
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 and 2 dress miniaturization, it is characterized in that: the upper surface of described ltcc substrate (1) has bare chip and packaging by conductive adhesive, described bare chip is connected by gold wire bonding and microstrip line.
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterised in that: described ltcc substrate (1) is by 5-30 layer, and every layer thickness is that the ferro A6s material of 0.094mm is laminated to integrally fire form.
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterized in that: described organic substrate (3) uses microwave substrate material, the circuit mask placement device disposed below of organic substrate (3), the above tin plating of organic substrate (3) contacts with aluminum cavity (4).
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterised in that: described connector (6) uses bend cutting type connector.
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterized in that: described one end for electric(al) insulator and the pin of isolator (5) afterbody is welded to organic substrate (3) pad relevant position, and the other end is connected on the pad of ltcc substrate (1) by gold wire bonding.
The three-dimensional microwave circuit structure of a kind of micro-group the most according to claim 1 dress miniaturization, it is characterized in that: described cavity upper cover plate (7) is welded on aluminum cavity (4) by Laser seal welding, described cavity lower cover (8) is fixed on aluminum cavity (4) by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620398045.3U CN205723496U (en) | 2016-05-05 | 2016-05-05 | A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620398045.3U CN205723496U (en) | 2016-05-05 | 2016-05-05 | A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization |
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| CN201620398045.3U Expired - Fee Related CN205723496U (en) | 2016-05-05 | 2016-05-05 | A kind of three-dimensional microwave circuit structure of micro-group dress miniaturization |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789141A (en) * | 2016-05-05 | 2016-07-20 | 中国工程物理研究院电子工程研究所 | Micro-assembling miniaturized three-dimensional microwave circuit structure |
| CN110225656A (en) * | 2019-06-06 | 2019-09-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of assemble method minimizing printing plate |
-
2016
- 2016-05-05 CN CN201620398045.3U patent/CN205723496U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789141A (en) * | 2016-05-05 | 2016-07-20 | 中国工程物理研究院电子工程研究所 | Micro-assembling miniaturized three-dimensional microwave circuit structure |
| CN110225656A (en) * | 2019-06-06 | 2019-09-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of assemble method minimizing printing plate |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20170505 |
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| CF01 | Termination of patent right due to non-payment of annual fee |