CN214757261U

CN214757261U - Totally enclosed microcircuit mounting structure

Info

Publication number: CN214757261U
Application number: CN202120717918.3U
Authority: CN
Inventors: 刘欣; 李章宇; 高少勇
Original assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Current assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-11-16
Anticipated expiration: 2031-04-08

Abstract

The utility model provides a totally enclosed microcircuit mounting structure, totally enclosed microcircuit mounting structure includes: the silicon-aluminum cover plate is fixedly connected with the shell, the mounting column is arranged on the silicon-aluminum cover plate, the mounting hole is formed in the PCB, one end of the fastener is abutted to the PCB, the other end of the fastener penetrates through the mounting hole and is fixedly connected with the mounting column, the PCB is located in the shell, the positioning groove for positioning an element on the PCB is formed in the silicon-aluminum cover plate, and the fixing seat is omitted in the shell of the fully-sealed microcircuit mounting structure, so that the shell is simpler in production process, the precision of integrated molding is reduced or welding processing is not needed to be carried out on the inner portion of the shell in the process of producing the shell, the processing cost of the shell is reduced, the processing precision of the shell is reduced, and the shell is convenient to produce.

Description

Totally enclosed microcircuit mounting structure

Technical Field

The utility model belongs to the technical field of microcircuit module and specifically relates to a totally enclosed microcircuit mounting structure.

Background

The patent application numbers are: 201921729108.9, a "hermetically sealed metal case with heat dissipation on the back of the output terminal", is required to fix the PCB module 24 to the fixing seat 11 in the housing 10 by the screw 13 during the assembly process, which is very inconvenient to fix the PCB module 24 due to the small operable space in the housing 10, resulting in troublesome installation of the PCB module 24; because be equipped with fixing base 11 on the four corners in the casing 10, in the production course of working, the mode of producing casing 10 has two kinds: the first is to produce the housing 10 and the fixing seat 11 in an integrated manner, the integrated manner requires high precision and is inconvenient to produce and process, the second is to weld the produced fixing seat 11 to four corners in the housing 10 in a welding manner, and the operable space in the housing 10 is small, so that the welding is very inconvenient.

Meanwhile, the lead pins 23 need to be separately welded to the metal ring 22 by soldering, and then the connection gap between the housing 10 and the cover substrate 17 needs to be sealed by laser, which is inconvenient to operate.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the utility model provides a totally enclosed microcircuit mounting structure.

The utility model discloses a following technical scheme realizes:

the utility model provides a totally enclosed microcircuit mounting structure, totally enclosed microcircuit mounting structure includes: the PCB comprises a silicon-aluminum cover plate, a PCB, a shell and a fastener, wherein the silicon-aluminum cover plate is fixedly connected with the shell, the silicon-aluminum cover plate is provided with a mounting column, the PCB is provided with a mounting hole, one end of the fastener is abutted to the PCB, the other end of the fastener penetrates through the mounting hole and is fixedly connected with the mounting column, the PCB is positioned in the shell, and the silicon-aluminum cover plate is provided with a positioning groove for positioning an element on the PCB.

Furthermore, the totally enclosed microcircuit mounting structure still includes the guide pin, crosses cab apron, insulator, be equipped with the accepting groove on the silicon-aluminum apron, cross the cab apron fixed accept in the accepting groove, cross and be equipped with the mounting groove on the cab apron, the insulator is fixed accept in the mounting groove, guide pin one end with the PCB board is connected electrically, the guide pin other end runs through the insulator extends to cross outside the cab apron.

The utility model has the advantages that:

1. the utility model provides a pair of fixing base has been cancelled in totally enclosed microcircuit mounting structure's the casing for the casing is simpler at production technology, and at the in-process of producing the casing, reduces integrated into one piece's precision or need not to carry out welding process to casing inside, has reduced the processing cost of casing, has reduced the machining precision of casing, is convenient for produce the casing.

2. The utility model provides a pair of totally enclosed microcircuit mounting structure, when the equipment, at first pass through the fastener with the PCB board and install the aluminous silica apron, the operable space is big, because the aluminous silica apron is equipped with the constant head tank, makes on the PCB board more accurate quick location to the aluminous silica apron, is convenient for install fixedly to the PCB board.

3. The utility model provides a pair of totally enclosed microcircuit mounting structure, when the encapsulation, will draw needle and silicon-aluminum apron, silicon-aluminum apron and casing through laser seal welding to realize sealedly, need not to fix the mode of drawing needle with the soldering to silicon-aluminum apron alone, be convenient for fix a position the PCB board fast and install silicon-aluminum apron on, reduce the time of equipment and be favorable to the encapsulating encapsulation, adopt totally enclosed microcircuit mounting structure's sealed encapsulation effect is better, and the reliability is better during the use.

4. The utility model provides a totally enclosed microcircuit mounting structure, the radiator can be installed additional on the casing back, realizes the back heat dissipation, reduces the occupation plane area of integrated circuit module part in the system; the whole sealing package has good reliability.

Drawings

Fig. 1 is an exploded view of a fully encapsulated microcircuit mounting structure of the present invention;

fig. 2 is a partially exploded view of the hermetically sealed microcircuit mounting structure of the present invention.

Detailed Description

For a more clear and complete description of the technical solution of the present invention, the following description is made with reference to the accompanying drawings.

Referring to fig. 1 to 2, the present invention provides a hermetically sealed microcircuit mounting structure, including: silicon-aluminum apron 10, PCB board 20, casing 30, fastener 31, silicon-aluminum apron 10 with casing 30 fixed connection, be equipped with erection column 11 on the silicon-aluminum apron 10, be equipped with mounting hole 21 on the PCB board 20, fastener 31 one end with PCB board 20 butt, the fastener 31 other end runs through mounting hole 21 with erection column 11 fixed connection, PCB board 20 is located in the casing 30, be equipped with on the silicon-aluminum apron 10 and be used for the location the constant head tank 12 of component on the PCB board 20.

In the embodiment, the silicon-aluminum cover plate 10 is made of a silicon-aluminum material with low density and high thermal conductivity, so that high thermal conductivity can be realized, the requirement of a high-power circuit is met, and weight reduction is realized while performance and power density are improved; the PCB module is independent and is provided with an encapsulation structure, the PCB module is convenient to test and screen, and a fixed seat is omitted in the shell 30 of the totally-enclosed microcircuit installation structure, so that the production process of the shell 30 is simpler, the precision of integral forming is reduced or welding processing is not needed to be carried out inside the shell 30 in the process of producing the shell 30, the processing cost of the shell 30 is reduced, the processing precision of the shell 30 is reduced, and the shell 30 is convenient to produce; during assembly, the PCB 20 is firstly mounted on the silicon-aluminum cover plate 10 through the fastener 31, and the positioning groove 12 is formed in the silicon-aluminum cover plate 10, so that elements on the PCB 20 are more accurately and quickly positioned on the silicon-aluminum cover plate 10, the operable space is large, the PCB 20 is conveniently mounted, and finally the silicon-aluminum cover plate 10 and the shell 30 are sealed and welded through laser, so that the assembly time is reduced, and glue filling and packaging are facilitated; a radiator can be additionally arranged on the back surface of the shell 30, so that back surface heat dissipation is realized, and the occupied planar area of the integrated circuit module part in the system is reduced; the sealing and packaging effect of the fully-sealed microcircuit mounting structure is better, and the reliability is better when the fully-sealed microcircuit mounting structure is used.

Further, the totally enclosed microcircuit installation structure further comprises a guide pin 32, a transition plate 33 and an insulator 34, wherein an accommodating groove 13 is formed in the silicon-aluminum cover plate 10, the transition plate 33 is fixedly accommodated in the accommodating groove 13, an installation groove 331 is formed in the transition plate 33, the insulator 34 is fixedly accommodated in the installation groove 331, one end of the guide pin 32 is electrically connected with the PCB 20, and the other end of the guide pin 32 penetrates through the insulator 34 and extends out of the transition plate 33.

In this embodiment, a mounting groove 42 communicating a housing cavity 41 with the housing cavity 41 is provided in the housing 30, when assembling, the transition plate 33 is mounted in the housing groove 13, then the insulator 34 is fixedly housed in the mounting groove 331, then one end of the lead pin 32 is electrically connected to the PCB 20, the other end of the lead pin 32 penetrates through the insulator 34 and extends out of the transition plate 33, then the PCB 20 is mounted on the cover plate 10 by the fastening member 31, because the positioning groove 12 is provided on the cover plate 10, the PCB 20 can be more precisely mounted on the cover plate 10, the PCB 20 can be mounted on the cover plate 10 more precisely on the housing 30, the cover plate 10 can be mounted on the cover plate 10 with a higher precision and a larger operable space, then the housing cavity 41 is filled with glue and sealed, and finally the cover plate 10 with the PCB 20 and the lead pin 32 is mounted on the mounting groove 42, the PCB 20 and the guide pin 32 are accommodated in the mounting groove 42, the guide pin 32 and the silicon-aluminum cover plate 10, the silicon-aluminum cover plate 10 and the shell 30 are sealed and welded through laser, sealing is achieved, the guide pin 32 does not need to be fixed on the silicon-aluminum cover plate 10 in a tin soldering mode, and the fully-sealed microcircuit mounting structure is better in sealing and packaging effect and better in reliability during use.

Of course, the present invention can also have other various embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative work, and all of them belong to the protection scope of the present invention.

Claims

1. A hermetically sealed microcircuit mounting structure, said hermetically sealed microcircuit mounting structure comprising: the PCB comprises a silicon-aluminum cover plate, a PCB, a shell and a fastener, wherein the silicon-aluminum cover plate is fixedly connected with the shell, the silicon-aluminum cover plate is provided with a mounting column, the PCB is provided with a mounting hole, one end of the fastener is abutted to the PCB, the other end of the fastener penetrates through the mounting hole and is fixedly connected with the mounting column, the PCB is positioned in the shell, and the silicon-aluminum cover plate is provided with a positioning groove for positioning an element on the PCB.

2. The totally enclosed microcircuit mounting structure of claim 1, further comprising a guide pin, a transition plate, and an insulator, wherein the silicon-aluminum cover plate is provided with a receiving groove, the transition plate is fixedly received in the receiving groove, the transition plate is provided with a mounting groove, the insulator is fixedly received in the mounting groove, one end of the guide pin is electrically connected to the PCB, and the other end of the guide pin penetrates through the insulator and extends out of the transition plate.