JP2016152234A - Electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic module capable of efficiently radiating heat generated from heating components.SOLUTION: An electronic module 1 is composed of a plurality of resin substrates, circuit conductors 5a, 5b, 5c, heating components 7a, 7b, an electronic component 9, and so on. The plurality of circuit conductors 5a, 5c, 5b are arranged on a heating component mounting substrate 3a, a side face substrate 3c, and a heating component counter side substrate 3b, respectively. The heating components 7a, 7b are arranged on the heating component mounting substrate 3a. The heating component 7a is brought into contact with the circuit conductor 5a on the heating component mounting substrate 3a. The circuit conductor 5c on the heating component counter side substrate 3b is brought into surface-contact with an upper surface of the heating component 7a. Namely, the heating component 7a is held between the circuit conductors 5a, 5c of the heating component mounting substrate 3a and the heating component counter side substrate 3b, and the circuit conductors 5a, 5c are thermally connected to the heating component 7a.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic module on which electronic components are mounted.

  In various applications, an electronic module in which a plurality of electronic components are mounted on a substrate is used.

  For example, a metal plate punched into a wiring pattern, a high thermal conductive composite insulating material molded with the metal plate, a cavity provided in the composite insulating material, etc., and the external electronic component connecting portion is a composite insulating material There is an electronic circuit module that is bent in a cavity so as to protrude more (Patent Document 1).

  In addition, the inter-board connection terminal, which is a part of the lead frame, includes a plurality of metal plates, a heat dissipation board composed of a lead frame fixed on the heat transfer layer thereon, and a circuit board connected to the heat dissipation board. There is a module in which a circuit board is bent (Patent Document 2).

JP 11-195747 A JP 2010-3718 A

  In both Patent Documents 1 and 2, high-density mounting and miniaturization can be achieved by bending a part of the substrate.

  On the other hand, there is an electronic module in which a circuit conductor is arranged on a substrate and a heat generating component is arranged. Since such a heat generating component needs to be cooled, it is necessary to further provide a heat radiating member adjacent to the heat generating component, and it is difficult to downsize the entire module including the electronic module and the heat radiating member for cooling. Become.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide an electronic module capable of efficiently radiating heat generated from a heat-generating component.

  In order to achieve the above-described object, the present invention includes a plurality of resin substrates, a plurality of circuit conductors fixed to the resin substrates, and a heat generating component disposed on the resin substrate and connected to the circuit conductors. The plurality of resin substrates include a heat generating component mounting substrate on which the heat generating component is mounted, a heat generating component facing substrate disposed to face the heat generating component mounting substrate, the heat generating component mounting substrate, and the A side substrate disposed between the heat generating component facing substrate, the heat generating component mounting substrate, the heat generating component facing substrate, and the side substrate being connected and integrated by the circuit conductor, In the electronic module, the circuit conductor disposed on the substrate facing the heat generating component is thermally connected to the upper surface of the heat generating component, and the heat generating component is sandwiched between the circuit conductors facing each other. Ah .

  It is desirable that other electronic components other than the heat generating components are mounted on the side substrate.

  A part of the circuit conductor may protrude from an end face of the resin substrate to constitute a terminal.

  A plurality of the resin substrates may form a box shape, and a surface other than the surface from which the terminals protrude may be covered with the resin substrate.

  A space surrounded by the resin substrate may be filled with resin.

  A connection mechanism for connecting the resin substrates, in which adjacent resin substrates are not connected by the circuit conductor, may be provided in a part of the resin substrate.

  A heat transfer member may be sandwiched between the upper surface of the heat generating component and the circuit conductor disposed on the heat generating component facing substrate.

  The resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate may be different from the resin constituting the side surface substrate.

  In this case, the heat conductivity of the resin constituting the heat generating component mounting substrate and the heat generating component facing substrate may be higher than the heat conductivity of the resin forming the side substrate.

  The thermal expansion coefficient of the resin constituting the side substrate may be lower than the thermal expansion coefficient of the resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate.

  A part of the circuit conductor thermally connected to the heat generating component in the heat generating component facing substrate contacts a terminal portion of the heat generating component connected to the circuit conductor in the heat generating component mounting substrate. The circuit conductor of the substrate facing the heat generating component that sandwiches the component may have the same potential as the terminal portion.

  The entirety of the resin substrate may be accommodated in a container, and the container and a part of the resin substrate may contact each other.

  The thickness of at least a part of the circuit conductors disposed on the heat generating component mounting substrate and the heat generating component opposing substrate may be greater than the thickness of at least a portion of the circuit conductors disposed on the side substrate.

  The thickness of the portion where the circuit conductor is bent may be smaller than the thickness of other portions.

  According to the present invention, since the heat generating components are sandwiched between the circuit conductors facing each other, the upper and lower circuit conductors function as a heat sink for the heat generating components. For this reason, the heat generated in the heat generating component can be efficiently radiated.

  In addition, the electronic components other than the heat generating components are arranged on the side substrate and are arranged away from the heat generating components, so that the electronic components are not affected by heat and high-density mounting can be achieved. it can.

  Moreover, it is not necessary to join a terminal member separately by using a part of circuit conductor as a terminal as it is. For this reason, size reduction of an electronic module can be achieved.

  Further, by covering the portion other than the terminal projecting surface with the resin substrate, it is possible to prevent the entry of foreign matter into the inside, and it is possible to obtain a shielding effect by the circuit conductor disposed on each resin substrate.

  At this time, by providing a connection mechanism for connecting adjacent resin substrates to a part of the resin substrate, the resin substrates can be easily connected and held.

  In addition, by filling the space surrounded by the resin substrate with resin, it is possible to prevent foreign matter from entering the inside and improve heat dissipation.

  In addition, by disposing the heat transfer member between the upper surface of the heat generating component and the circuit conductor of the heat generating component facing substrate, heat from the heat generating component can be more reliably transferred to the circuit conductor.

  In the present invention, the resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate and the resin constituting the side surface substrate may be made of different resins. For example, if the heat conductivity of the resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate is higher than the heat conductivity of the resin constituting the side surface substrate, heat can be radiated to the outside more efficiently. .

  Further, the thermal expansion coefficient of the resin constituting the side substrate is made lower than the thermal expansion coefficient of the resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate, thereby connecting the substrates sandwiching the heat generating components. Thermal contraction of the side substrate can be suppressed. For this reason, a heat-emitting component can be pinched reliably.

  In addition, the circuit conductor that sandwiches the heat generating component is set to the same potential as the terminal portion of the heat generating component, and a part of the circuit conductor of the substrate facing the heat generating component is brought into contact with the terminal portion of the heat generating component. Heat can be efficiently transferred to the circuit conductor.

  In addition, by accommodating the entire resin substrate in the container, it is possible to prevent foreign matter from entering the interior, facilitate handling, and reliably protect the substrate.

  By making the thickness of some circuit conductors arranged on the heat generating component mounting board and the heat generating component opposite side board thicker than the thickness of the circuit conductor arranged on the side board, the heat from the heat dissipating parts can be radiated more efficiently. can do. Further, for example, fine electronic components are arranged on the side substrate. By reducing the thickness of the circuit conductor at this portion, a fine circuit such as a signal circuit can be easily formed.

  Moreover, the circuit conductor can be easily bent by reducing the thickness of the bent portion.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic module which can thermally radiate the heat | fever produced from a heat-emitting component efficiently can be provided.

FIG. 3 is a developed perspective view of the electronic module 1. The perspective view of the electronic module 1. FIG. It is sectional drawing of the electronic module 1, and is the sectional view on the AA line of FIG. Sectional drawing of the electronic module 1a. Sectional drawing of the electronic module 1b. (A) is sectional drawing of the electronic module 1c, (b) is sectional drawing of the electronic module 1d. (A) is sectional drawing of the electronic module 1e, (b) is sectional drawing of the electronic module 1f. The exploded perspective view of electronic module 1g.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is an exploded perspective view of the electronic module 1, FIG. 2 is a perspective view of the electronic module 1, and FIG. 3 is a cross-sectional view taken along line AA of FIG. The electronic module 1 includes a plurality of resin substrates and circuit conductors 5a, 5b, and 5c, heat generating components 7a and 7b, an electronic component 9, and the like. Note that the arrangement and number of components are not limited to the illustrated example.

  The resin substrate includes a heat generating component mounting substrate 3a on which the heat generating component 7a and the like are mounted, a heat generating component facing substrate 3b arranged to face the heat generating component mounting substrate 3a, and the heat generating component mounting substrate 3a and the heat generating component facing side. It includes at least a side substrate 3c disposed between the substrate 3b. That is, the adjacent heat generating component mounting substrate 3a, side surface substrate 3c, and heat generating component facing substrate 3b are disposed in a substantially vertical direction.

  A plurality of circuit conductors 5a, 5b, and 5c are disposed on the heat generating component mounting substrate 3a, the side surface substrate 3c, and the heat generating component facing substrate 3b, respectively. The circuit conductors 5a, 5b, and 5c are metal plates such as a copper plate and an aluminum plate, for example, are formed into a desired shape by pressing or the like, and are fixed on each substrate (or across each substrate). That is, the heat generating component mounting substrate 3a, the side surface substrate 3c, and the heat generating component facing substrate 3b are connected and integrated by the circuit conductors 5a, 5b, and 5c.

  Heat generating components 7a and 7b are disposed on the heat generating component mounting substrate 3a. Note that there may be one heat generating component or three or more heat generating components. The heat generating components 7a and 7b are, for example, power components, mechanical relays, fuses, and the like, and are electric components that generate a large amount of heat when a current is passed.

  The heat generating component 7a contacts the circuit conductor 5a on the heat generating component mounting board 3a. In the following description, the heat generating component 7a will be described, but the heat generating component 7b can have the same structure. As shown in FIG. 3, a circuit conductor 5a is arranged between the heat generating component 7a and the heat generating component mounting board 3a. The circuit conductor 5a is not only the terminal portion 13 of the heat generating component 7a, but also the lower surface of the main body. Contact. The circuit conductor 5a on the heat generating component mounting board 3a is embedded with resin except for the portion where the heat generating component 7a is disposed. That is, at the portion where the heat generating component 7a is disposed, the resin is opened and a part of the internal circuit conductor 5a is exposed.

  Further, the circuit conductor 5c of the heat generating component facing substrate 3b is in surface contact with the upper surface of the heat generating component 7a. The circuit conductor 5c of the heat generating component opposite side substrate 3b is embedded with resin except for the contact portion with the heat generating component 7a and the like. That is, the resin opens at the contact portion with the heat generating component 7a and the like, and a part of the internal circuit conductor 5c is exposed. Accordingly, the heat generating component 7a is sandwiched between the circuit conductors 5a and 5c facing each other between the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b, and the circuit conductors 5a and 5c and the heat generating component 7a are thermally connected. .

  On the other hand, another electronic component 9 that is not a heat-generating component is mounted on the side substrate 3c. The electronic component 9 is, for example, a resistor, a capacitor, a diode, or a transistor. The electronic component 9 is connected to the circuit conductor 5b. The circuit conductor 5b on the side substrate 3c is embedded with resin except for the portion where the electronic component 9 is disposed. That is, the resin is opened at the portion where the electronic component 9 is disposed, and a part of the internal circuit conductor 5b is exposed.

  Here, the circuit conductors 5a and 5c mainly disposed on the heat generating component mounting substrate 3a and the heat generating component opposing substrate 3b constitute, for example, a circuit through which a large current flows, and are mainly disposed on the side substrate 3c. The conductor 5b constitutes a signal circuit or the like through which a small current such as a signal current flows. In the following description, the circuit conductor disposed on the heat generating component mounting substrate 3a is referred to as the circuit conductor 5a, and the circuit conductor disposed on the heat generating component facing substrate 3b is referred to as the circuit conductor 5c, and is disposed on the side substrate 3c. The circuit conductor will be described as the circuit conductor 5b.

  In this case, it is desirable that the thickness of at least some of the circuit conductors 5a and 5c is greater than the thickness of at least some of the circuit conductors 5b. Specifically, it is preferable to increase the thickness of a circuit conductor through which a large current flows during operation, for example, a circuit conductor serving as a power supply line or a circuit conductor in contact with the heat generating components 7a and 7b. Further, it is more preferable to increase the thickness of the circuit conductor disposed on the heat generating component opposite side substrate 3b that comes into contact with the heat generating components 7a and 7b when the substrate is bent. Thus, by increasing the thickness of the circuit conductors 5a and 5c, it is possible to efficiently flow a large current. The circuit conductors 5a and 5c also function as heat sinks that release heat from the heat-generating component 7a and the like to the outside. For this reason, by increasing the thickness of the circuit conductors 5a and 5c, heat can be radiated to the outside more efficiently.

  On the other hand, by reducing the thickness of the circuit conductor 5b on the side substrate 3c, the weight can be reduced and the material cost can be reduced, and a finer shape can be easily processed. For this reason, a circuit having a fine shape such as a signal circuit can be easily formed. As described above, the thickness of at least a part of the circuit conductors 5a and 5c disposed on the heat generating component mounting board 3a and the heat generating component facing substrate 3b is set to be larger than the thickness of at least a part of the circuit conductors 5b disposed on the side board 3c. By increasing the thickness, both heat dissipation and downsizing can be achieved.

  Further, it is desirable that the circuit conductor at the connecting portion of the heat generating component mounting substrate 3a, the heat generating component facing substrate 3b, and the side substrate 3c is thin. By doing in this way, a thin part can be bent easily.

  Moreover, as shown in FIG. 2, it can also be utilized as the terminal 11 of the electronic module 1 by protruding a part of circuit conductors 5a and 5c from the end surface of each resin substrate. A part of the circuit conductor 5b may be used as a terminal. For example, a part of the circuit conductor 5b may be bent at a right angle and protruded in a direction perpendicular to the substrate to be used as a terminal.

  The heat generating component mounting substrate 3a, the side surface substrate 3c, and the heat generating component facing substrate 3b are made of insulating resin, for example, polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE), polyamideimide (PAI). Resins such as polyethylene terephthalate (PET) and polyethylene are applicable.

  Here, it is desirable that the heat-generating component mounting substrate 3a and the heat-generating component facing substrate 3b have high heat dissipation properties that sandwich the heat-generating component 7a and the like. For this reason, it is desirable to select a resin having higher thermal conductivity for the side substrate 3c. By doing in this way, higher heat dissipation can be ensured.

  Further, since the side substrate 3c has a role of maintaining a distance between the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b, for example, the thermal expansion coefficient is higher than that of the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b. It is desirable to select a small resin. In this way, the heat generating component 7a and the like can be reliably sandwiched between the circuit conductors 5a and 5c of the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b. In addition, the influence on electronic components such as solder cracks due to substrate deformation can be suppressed. As described above, the heat generating component mounting substrate 3a, the side surface substrate 3c, and the heat generating component facing substrate 3b may be made of different resins.

  As described above, according to the present embodiment, the heat generating component 7a having a large heat generation amount is sandwiched between the circuit conductors 5a and 5c, and the circuit conductors 5a and 5c are caused to function as a heat radiating plate. Heat can be radiated efficiently.

  Further, since the electronic components 9 other than the heat generating components 7a and the like are disposed on the side substrate 3c away from the heat dissipating components, the electronic components 9 are efficiently placed between the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b. Can be arranged. For this reason, while being able to raise the volume efficiency of the electronic module 1, the influence of the heat with respect to the electronic component 9 can also be suppressed.

  Further, a part of the circuit conductors 5a, 5b, and 5c can be used as the terminal 11 by protruding from the resin substrate. For this reason, since it is not necessary to connect with other terminal members, the number of connection points can be reduced, reliability can be improved, and other terminal blocks and the like are unnecessary, thereby achieving miniaturization. Is possible.

  Moreover, heat dissipation and reliability can be improved by optimizing the material of the resin substrate and the thickness of the circuit conductor according to each part.

(Second Embodiment)
Next, a second embodiment will be described. FIG. 4 is a cross-sectional view of the electronic module 1a. In the following description, components having the same functions as those of the electronic module 1 are denoted by the same reference numerals as those in FIGS. 1 to 3 and redundant description is omitted.

  The electronic module 1a has substantially the same configuration as the electronic module 1, but differs in that a heat transfer member 17 is provided. The heat transfer member 17 is provided between the circuit conductor 5c of the heat generating component facing substrate 3b and the heat generating component 7a. The heat transfer member 17 is, for example, silicon rubber, acrylic rubber, or the like, which eliminates the influence of fine irregularities on the contact surface between the circuit conductor 5c and the heat generating component 7a, and more reliably connects the upper surface of the heat generating component 7a and the circuit conductor 5c. It is closely attached to increase heat transfer efficiency.

  On the heat generating component mounting board 3a, the circuit conductor 5a and the heat generating component 7a can be joined by soldering, for example, via the terminal portion 13. For this reason, heat can be transferred from the heat generating component 7a to the circuit conductor 5a by soldering. However, a heat transfer member 17 is further arranged between the circuit conductor 5a and the heat generating component 7a on the heat generating component mounting board 3a side. Also good. It is possible to increase the heat transfer efficiency by bringing the circuit conductor 5a and the heat generating component 7a into surface contact.

  According to the second embodiment, an effect similar to that of the first embodiment can be obtained. Further, the heat transfer member 17 can dissipate heat from the heat-generating component 7a and the like more efficiently.

(Third embodiment)
Next, a third embodiment will be described. FIG. 5 is a cross-sectional view of the electronic module 1b. The electronic module 1b has substantially the same configuration as the electronic module 1, but differs in that an arm portion 19 is provided on a part of the circuit conductor 5c on the side of the heat generating component facing substrate 3b. A part of the arm portion 19 is in contact with the terminal portion 13 of the heat generating component 7a. That is, a part of the circuit conductor 5 c that sandwiches the heat generating component 7 a has the same potential as the terminal portion 13. The case where the circuit conductor 5c and the terminal portion 13 are at the same potential is, for example, the case where the terminal portion 13 is a grounding (GND) terminal or the like.

  According to the third embodiment, the same effect as that of the first embodiment can be obtained. Further, the arm portion 19 can also transfer the heat generated from the heat generating component 7a to the circuit conductor 5c from the terminal portion 13 of the heat generating component 7a.

(Fourth embodiment)
Next, a fourth embodiment will be described. FIG. 6A is a cross-sectional view of the electronic module 1c. The electronic module 1c has substantially the same configuration as the electronic module 1 except that the other surface is covered with a resin substrate except for the surface from which the terminal 11 (see FIG. 2) protrudes.

  The electronic module 1c is formed in a box shape, and the three surfaces between the heat generating component mounting substrate 3a and the heat generating component facing substrate 3b are covered with the side substrates 3c, 3d, and 3e, respectively. The side substrates 3d and 3e are connected to the heat generating component mounting substrate 3a or the heat generating component facing substrate 3b by circuit conductors 5a, 5b, and 5c, similarly to the side substrate 3c.

  Thus, by covering the surfaces other than the projecting surface of the terminal 11 (5 surfaces in the present embodiment) with the resin substrate to which the circuit conductors 5a, 5b, and 5c are fixed, it is possible to suppress the entry of foreign matters into the interior and Shielding performance against electronic parts can be improved.

  In order to suppress the entry of foreign matter into the interior, the resin 21 may be filled into the interior covered with each resin substrate as in the electronic module 1d shown in FIG. 6B. The resin 21 has insulating properties, and for example, a silicon resin, an epoxy resin, a polyurethane resin, or the like can be applied.

  Moreover, when forming in a box shape, you may provide another connection mechanism in the site | part which the adjacent resin substrates are not connected. For example, like the electronic module 1e shown in FIG. 7A, the coupling mechanism 23a may be provided at the end of the side substrate 3d and the end of the heat generating component mounting substrate 3a. The coupling mechanism 23a projects a part of the circuit conductor from the end of the side board 3d, inserts the tip of the circuit conductor into the hole of the heat generating component mounting board 3a, and adheres it as necessary, thereby bonding the side board 3d. Are connected to the heat generating component mounting board 3a.

  Further, as in the electronic module 1 f shown in FIG. 7B, the coupling mechanism 23 b may be provided at the end of the side substrate 3 d and the end of the heat generating component mounting substrate 3 a. The connecting mechanism 23b inserts the end portion of the side substrate 3d into the hole of the heat generating component mounting substrate 3a and bonds it as necessary, thereby connecting the side substrate 3d and the heat generating component mounting substrate 3a. Thus, by connecting adjacent resin substrates on all sides other than the opening, the resin substrates can be easily connected to each other, and the mechanical strength can be increased. In addition, as a connection mechanism, as long as resin board | substrates can be connected and hold | maintained, such as a nail | claw part and a latching | locking part, any structure is applicable.

  According to the fourth embodiment, the same effect as that of the first embodiment can be obtained. Moreover, by making the whole into a box shape, it is possible to prevent foreign matter from entering the inside and to ensure shielding properties.

(Fifth embodiment)
Next, a fifth embodiment will be described. FIG. 8 is an exploded perspective view of the electronic module 1g. The electronic module 1g is different in that the electronic module 1 and the like are accommodated in the container 25.

  The container 25 is made of resin or metal. When the inner surface of the container 25 is in contact with the heat generating component mounting substrate 3a, the heat generating component facing substrate 3b, etc., heat from each resin substrate can be radiated to the outside. The electronic module housed in the container 25 may be the electronic modules 1 a to 1 f instead of the electronic module 1.

  According to the fifth embodiment, the same effects as those of the first embodiment can be obtained. Moreover, by accommodating in the container 25, the mechanical strength as a whole can be improved and mixing of a foreign material can be suppressed.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, it goes without saying that the above-described configurations can be combined with each other.

  In the above-described embodiment, the heat generating components 7a, 7b and the like are disposed only on the heat generating component mounting board 3a. However, the present invention is not necessarily limited to this configuration, and faces the heat generating component mounting board 3a. A heat generating component may be disposed on each of the heat generating component facing substrates 3b disposed in this manner, and the upper surface of each heat generating component may be thermally connected to the facing substrate.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g .... Electronic module 3a .... Heat component mounting substrate 3b .... Heat component facing substrate 3c, 3d, 3e. 5c ......... Circuit conductors 7a, 7b ......... Heat component 9 ......... Electronic component 11 ......... Terminal 13 ......... Terminal part 17 ......... Heat transfer member 19 ......... Arm part 21 ......... Resin 23a, 23b ......... connecting mechanism 25 ......... container

Claims (14)

A plurality of resin substrates;
A plurality of circuit conductors fixed to the resin substrate;
A heat generating component disposed on the resin substrate and connected to the circuit conductor;
Comprising
The plurality of resin substrates include a heat generating component mounting substrate on which the heat generating component is mounted, a heat generating component facing side substrate disposed to face the heat generating component mounting substrate, and the heat generating component mounting substrate and the heat generating component facing. A side substrate disposed between the side substrate,
The heat generating component mounting substrate, the heat generating component facing substrate and the side substrate are connected and integrated by the circuit conductor,
The electronic circuit module, wherein the circuit conductor disposed on the substrate facing the heat generating component is thermally connected to an upper surface of the heat generating component, and the heat generating component is sandwiched between the circuit conductors facing each other. .   The electronic module according to claim 1, wherein other electronic components excluding the heat-generating component are mounted on the side substrate.   3. The electronic module according to claim 1, wherein a part of the circuit conductor protrudes from an end surface of the resin substrate to constitute a terminal. A plurality of the resin substrates are box-shaped,
4. The electronic module according to claim 3, wherein a surface other than the surface from which the terminal protrudes is covered with the resin substrate.   The electronic module according to claim 4, wherein a resin is filled in a space surrounded by the resin substrate.   6. The connection mechanism for connecting the resin substrates, in which adjacent resin substrates are not connected by the circuit conductor, is provided in a part of the resin substrate. The electronic module according to Crab.   7. The heat transfer member is sandwiched between an upper surface of the heat generating component and the circuit conductor disposed on the heat generating component facing substrate. 8. Electronic module.   8. The electronic module according to claim 1, wherein a resin constituting the heat generating component mounting substrate and the heat generating component opposite side substrate is different from a resin constituting the side surface substrate. 9.   9. The electronic module according to claim 8, wherein the heat conductivity of the resin constituting the heat generating component mounting substrate and the heat generating component facing substrate is higher than the heat conductivity of the resin constituting the side substrate.   10. The thermal expansion coefficient of the resin constituting the side substrate is lower than the thermal expansion coefficient of the resin constituting the heat generating component mounting substrate and the heat generating component facing substrate. Electronic module.   A part of the circuit conductor thermally connected to the heat generating component in the heat generating component facing substrate contacts a terminal portion of the heat generating component connected to the circuit conductor in the heat generating component mounting substrate. 11. The electronic module according to claim 1, wherein the circuit conductor of the substrate facing the heat generating component sandwiching the component has the same potential as the terminal portion. The entire resin substrate is accommodated in a container,
The electronic module according to any one of claims 1 to 11, wherein the container and a part of the resin substrate are in contact with each other.   The thickness of at least a part of the circuit conductors disposed on the heat generating component mounting substrate and the heat generating component opposing substrate is thicker than the thickness of at least a part of the circuit conductors disposed on the side substrate. The electronic module according to any one of claims 1 to 12.   14. The electronic module according to claim 1, wherein the thickness of the bent portion of the circuit conductor is smaller than the thickness of the other portion.

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