JP6676212B2 - Electronic module and power supply - Google Patents

Description

  The present invention relates to an electronic module and a power supply.

  2. Description of the Related Art Conventionally, an electronic module on which a substrate having an electronic element is mounted is mounted on a power supply device. It is known that such a substrate may be warped through a manufacturing process. For example, when a substrate is sealed with a sealing member, there is a problem that the substrate is warped by pressing the substrate with the sealing member. Specifically, when the height of the end provided on the circumference of the sealing member (for example, a resin case) is uneven, pressing the substrate with the sealing member may warp the substrate. In addition, if the distribution of the heat radiating agent (for example, grease) between the back surface of the substrate and the housing is biased, the substrate may be warped when the substrate is screwed to the housing. In addition, since the chip is placed in a high-temperature furnace when it is soldered to the substrate, the substrate may be warped by high heat.

  To solve such a problem, Patent Document 1 (Japanese Patent Application Laid-Open No. 2002-280393) discloses that a warp is prevented by providing a grounding metal layer on the back surface of a semiconductor substrate. -204128) discloses that an opening reaching the substrate is provided in the second conductor pattern to prevent the substrate from being warped after the heat treatment.

  On the other hand, in addition to the problem that the substrate may be warped due to the manufacturing process, a current flows from an electronic element to a conductor layer (eg, copper foil) provided on the substrate, so that heat generated in the conductor layer is generated. Therefore, there is a problem that the temperature of the conductor layer increases.

  The present invention has been made in view of the above problems, and has as its object to provide an electronic module capable of reducing the possibility of warpage of a substrate and promoting heat radiation of a conductor layer.

[Concept 1]
An electronic module according to concept 1 of the present invention comprises:
Board and
A first conductor layer extending in a first direction on an upper surface of the substrate;
A second conductor layer connected to the first conductor layer and extending across the first conductor layer in a second direction different from the first direction;
An electronic element provided on the substrate at a different position from the first conductor layer and the second conductor layer;
A terminal provided on the first conductor layer;
With
The first conductor layer is connected to the electronic element at a position away from the terminal in the first direction so as to be a current path of a current flowing between the electronic element and the terminal.

[Concept 2]
In an electronic module according to concept 1 of the present invention,
There are a plurality of said electronic elements,
The terminal is connected to ground,
The plurality of electronic elements are arranged in the second direction with the first conductor layer interposed therebetween.

[Concept 3]
In an electronic module according to concept 2 of the present invention,
Further comprising a sealing member for sealing the substrate and having a through hole,
A second terminal provided on an upper surface of the substrate and extending substantially perpendicular to the substrate through the through hole.

[Concept 4]
In an electronic module according to any one of concepts 1 to 3 of the present invention,
A third conductor layer that is substantially parallel to the second conductor layer with a space therebetween and extends in a third direction different from the first direction with the first conductor layer interposed therebetween; Further provision.

[Concept 5]
In an electronic module according to any one of concepts 1 to 4 of the present invention,
The terminal is bifurcated, and the bifurcated end is connected to the first conductor layer.

[Concept 6]
A power supply according to concept 6 of the present invention comprises:
An electronic module according to any one of concepts 1 to 5 of the present invention is provided.

  Therefore, in the electronic module according to the present invention, the first conductor layer extends in the first direction on the upper surface of the substrate, and the second conductor layer extends in the second direction different from the first direction. As a result, the rigidity of the substrate in the second direction as well as in the first direction is improved, so that the possibility that the substrate is warped can be reduced. Further, heat generated by a current flowing through the first conductor layer, which is a current path of a current flowing between the electronic element and the terminal, can be released to the second conductor layer, and the heat of the first conductor layer can be reduced. Heat dissipation can be promoted.

FIG. 1 is a top view of a part of the configuration of an electronic module according to a first embodiment of the present invention, in which a sealing member is removed. FIG. 2 is a perspective view showing a configuration of a part of the power supply device according to the first embodiment when the sealing member 32 is made transparent for explanation. FIG. 3 is a perspective view when the electrode E1, the terminal T1, and the relay R1 of FIG. 2 are extracted. FIG. 4 is a sectional view taken along the line A-A ′ of FIG. FIG. 5 is a top view of a part of the configuration of the electronic module according to the second embodiment, which is one aspect of the present invention, with the sealing member removed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First embodiment>
As shown in FIG. 2, the power supply device 1 according to the first embodiment which is one aspect of the present invention is fixed to the housing 2, the transformer 4, and connected to the transformer 4. And an electronic module 5. Here, the housing 2 is, for example, a heat sink. The transformer 4 is a kind of electronic component, and is an electronic component that converts a voltage of AC power using electromagnetic induction, and is also called a transformer.
The electronic module 5 has a pressed member 3, which has a substrate 31 and a sealing member 32 that seals the substrate. FIG. 2 shows a case where the sealing member 32 is made transparent for explanation, but the sealing member 32 may or may not be transparent.

  The electronic module 5 further includes elastic members EB1 and EB2 connected to the sealing member 32 of the pressed member 3, and the elastic members EB1 and EB2 are fixed to the housing 2 by the corresponding locking members S1 and S2, respectively. Have been. Here, the locking members S1 and S2 according to the present embodiment are screws as an example.

  As shown in FIG. 1, in the electronic module 5, a conductor layer C3 is provided on a substrate 31, and an electrode E1 and electronic elements D1 and D2 are provided on the conductor layer C3. A conductor layer C4 is provided on the substrate 31, and an electrode E2 and electronic elements D3 and D4 are provided on the conductor layer. The conductor layers C3 and C4 are, for example, copper foils.

  As shown in FIG. 2, the electrode E1 of the electronic module 5 is connected to the terminal T1 of the transformer 4 via the relay R1. Here, the electrode E1, the relay R1, and the terminal T1 have conductivity. Thereby, the electronic elements D1 and D2 of the substrate 31 are electrically connected to the transformer 4 via the conductor layer C3, the electrode E1, the relay R1, and the terminal T1. Further, the relay R1 has elasticity. Since the relay R1 has elasticity in this manner, in the manufacturing process before connecting the relay R1 to the electrode E1 and the terminal T1, the positions of the terminal T1 and the electrode E1 are horizontal with respect to the substrate 31 from the position where it should be. Or, even if it is displaced vertically, the relay R1 sandwiched between the terminal T1 and the electrode E1 pushes both the terminal T1 and the electrode E1 by the force returned by the elastic force, so that the relay R1 is connected to the terminal T1 and the electrode E1. be able to.

  The electrode E1 is bifurcated, and the bifurcated end is connected to the conductor layer C3. Here, as an example, the electrode E1 is bifurcated in a direction from the electrode E1 toward the electrode E1 (y direction in FIG. 2). According to this configuration, the end of the electrode E1 is branched and connected in the direction from the electrode E1 toward the electrode E1 (the y direction in FIG. 2), so that the first direction from the relay R1 to the electrode E1 due to vibration or the like. Even if a load is applied (in the y direction in FIG. 2), the electrode E1 can hardly fall down.

  The electrode E2 of the electronic module 5 is connected to the terminal T2 of the transformer 4 via a relay R2. Here, the electrode E2, the relay R2, and the terminal T2 have conductivity. Thus, the electronic elements D3 and D4 on the substrate 31 are electrically connected to the transformer 4 via the conductor layer C4, the electrode E2, the relay R2, and the terminal T2. Further, the relay R2 has elasticity. Since the relay R2 has elasticity in this manner, in the manufacturing process before connecting the relay R2 to the electrode E2 and the terminal T2, the positions of the terminal T2 and the electrode E2 are horizontal with respect to the substrate 31 from the original position. Or, even if it is displaced vertically, the relay R2 sandwiched between the terminal T2 and the electrode E2 pushes both the terminal T2 and the electrode E2 with the force returned by the elastic force, so that the relay R2 is connected to the terminal T2 and the electrode E2. be able to.

  The electrode E2 is bifurcated, and the bifurcated end is connected to the conductor layer C4. Here, as an example, the electrode E2 is bifurcated in the direction from the electrode E2 toward the terminal T2 (the y direction in FIG. 2). With this configuration, the end of the electrode E2 is branched and connected in the direction from the electrode E2 toward the terminal T2 (the y direction in FIG. 2), so that the first direction from the relay R2 to the electrode E2 due to vibration or the like. Even if a load is applied (in the y direction in FIG. 2), the electrode E2 can hardly fall down.

  Since the relays R1, R2, the electrodes E1, E2, and the terminals T1, T2 have the same configuration, the configuration of the relay R1, the electrode E1, and the terminal T1 will be representatively described below.

  As shown in FIG. 3, the electrode E1 provided on the substrate 31 has shoulders E11 and E12 provided on the sides of the end, and a center E13 provided at the center of the end.

  As shown in FIG. 4, the relay R1 is curved in a U-shape between the electrode E1 and the terminal T1 in a longitudinal sectional view. Here, as an example, the relay element R1 is curved in a U-shape so as to be convex in a direction approaching the substrate 31 in a longitudinal sectional view. The vertical sectional view is a cut surface cut off on a plane perpendicular to the substrate 31.

  With this configuration, in the manufacturing process before connecting the relay R1 to the electrode E1 and the terminal T1, even if the position of the electrode E1 or the terminal T1 is shifted horizontally or vertically with respect to the substrate 31 from the position where it should be, the relay is performed. Since the child R1 is curved in a U-shape, one end of the relay R1 is pressed against the electrode E1 by the elastic force, and the other end of the relay R1 is pressed against the terminal T1, so that the relay R1 is connected to the electrode E1 and the electrode E1. It is fixed in a state sandwiched between the terminals T1. In this manner, the displacement in the height direction and the displacement in the horizontal direction of the electrode E1 and the terminal T1 can be absorbed.

  Further, as shown in FIG. 4, in the longitudinal section, the relay R1 has a U-shaped curve with one end sandwiching the end of the electrode E1 and the other end sandwiching the end of the terminal T1. In a U-shape. Here, as an example, one end and the other end of the relay R1 are curved in a U-shape so as to protrude in a direction away from the substrate 31.

  With this configuration, in the manufacturing process before connecting the relay R1 to the electrode E1 and the terminal T1, even if the position of the electrode E1 or the terminal T1 is shifted horizontally or vertically with respect to the substrate 31 from the position where it should be, the relay is performed. One end of the child R1 is fixed to the electrode E1 by sandwiching the electrode E1, and the other end of the relay R1 can be fixed to the terminal T1 by sandwiching the terminal T1. In this manner, the displacement in the height direction and the displacement in the horizontal direction of the electrode E1 and the terminal T1 can be absorbed.

  More specifically, as shown in FIG. 3, the electrode E1 provided on the substrate 31 includes shoulders E11 and E12 provided on the sides of the end, and a center E13 provided at the center of the end. And On the other hand, one end of the relay R1 is branched into a plurality (here, three as an example), and the outer surface of the first branch R11 is an electrode E1 among the plurality (here, three as an example) branches. Is fixed to the central portion E13 of the end portion by welding. Here, the first branch portion R11 is, for example, a branch located at the center of the three branches. Then, as shown in FIG. 3, the second branches R12 and R13 of the plurality of branches (here, three as an example) are curved in a U-shape so as to sandwich the corresponding shoulders E11 and E12 of the electrode E1. doing.

  With this configuration, in the manufacturing process before connecting the relay R1 to the electrode E1 and the terminal T1, even if the position of the electrode E1 or the terminal T1 is shifted horizontally or vertically with respect to the substrate 31 from the position where it should be, the relay is performed. The second branch portions R12 and R13 of the child R1 sandwich the shoulders E11 and E12 of the electrode E1 to fix the relay R1 to the electrode E1. In this manner, the displacement in the height direction and the horizontal direction of the electrode E1 can be absorbed. Further, since the second branch portions R12 and R13 of the relay R1 sandwich the shoulders E11 and E12 of the electrode E1, the fixing of the relay R1 to the electrode E1 can be strengthened.

  On the other hand, as shown in FIG. 3, the terminal T1 provided on the transformer 4 includes shoulders T11 and T12 provided on the sides of the end and a center T13 provided on the center of the end. Have. As shown in FIG. 3, the other end of the relay R1 is branched into a plurality (here, three as an example), and a first branch part among the plurality (here, three as an example) branches. The outer surface of R14 is fixed by welding to the center portion T13 of the end of the terminal T1 so that the second branches R15 and R16 of the plurality of branches sandwich the corresponding shoulders T11 and T12 of the terminal T1. In a U-shape.

  With this configuration, in the manufacturing process before connecting the relay R1 to the electrode E1 and the terminal T1, even if the position of the electrode E1 or the terminal T1 is shifted horizontally or vertically with respect to the substrate 31 from the position where it should be, the relay is performed. The second branch portions R15 and R16 of the child R1 sandwich the shoulders T11 and T12 of the terminal T1, whereby the relay R1 is fixed to the terminal T1. In this manner, the displacement in the height direction and the horizontal direction of the terminal T1 can be absorbed. Further, since the second branch portions R15 and R16 of the relay R1 sandwich the shoulders T11 and T12 of the electrode E1, the fixing of the relay R1 to the terminal T1 can be strengthened.

  The rigidity of the relay R1 is, for example, lower than the rigidity of the electrode E1. With this configuration, even if the position of the electrode E1 is displaced in the horizontal direction with respect to the substrate 31 due to a manufacturing process or vibration after manufacturing, the impact can be absorbed by bending the relay R1. Can be prevented from falling over. In the following embodiments, the rigidity of each relay is described as an example, assuming that the rigidity is lower than the rigidity of an electrode to which the relay is connected.

  As shown in FIG. 1, the electronic module 5 includes a first conductor layer C1 extending in the first direction on the upper surface of the substrate 31. Here, the first conductor layer C1 is, for example, a copper foil.

  Further, the electronic module 5 is connected to the first conductor layer C1 and has a first conductor in a second direction (for example, the x direction in FIG. 1) different from the first direction (for example, the y direction in FIG. 1). And second conductor layers C21 and C22 extending across the layer C1. Here, the second direction is, for example, a direction perpendicular to the first direction, and the second conductor layers C21 and C22 are, for example, copper foil.

  As described above, the electronic elements D1 to D4 are provided on the substrate 31 at positions different from the first conductor layer C1 and the second conductor layers C21 and C22.

  As shown in FIG. 1, the electronic module 5 includes a terminal M1 provided on the first conductor layer C1. The terminal M1 is bifurcated, and the bifurcated end is connected to the first conductor layer C1. Here, as an example, the terminal M1 is bifurcated in the first direction (the y direction in FIG. 1). With this configuration, since the end of the terminal M1 is branched and connected in the first direction (the y direction in FIG. 1), the terminal M1 is connected to the terminal M1 in the first direction (the y direction in FIG. 2) by vibration or the like. Even if a load is applied, the terminal M1 can hardly fall down.

  The sealing member 32 is provided with a through hole (not shown), and the terminal M1 extends substantially perpendicular to the substrate 31 through the through hole. The terminal M1 extends outside the sealing member 32 and is connected to another electronic component or the ground. In the present embodiment, as an example, the terminal M1 is connected to the ground.

  The first conductor layer C1 is separated from the terminal M1 along the first direction (for example, the positive direction y in FIG. 1) with the electronic elements D1 to D4 via, for example, the corresponding wirings W1 to W4. The first conductor layer C1 is connected, and serves as a current path of a current flowing between the electronic elements D1 to D4 and the terminal M1.

  With this configuration, the first conductor layer C1 extends in the first direction on the upper surface of the substrate 31, and the second conductor layers C21 and C22 extend in the second direction different from the first direction. Therefore, the rigidity of the substrate 31 in the second direction as well as the first direction is improved, so that the possibility that the substrate 31 is warped can be reduced. Furthermore, since the second conductor layers C21 and C22 do not form a current path from the electronic elements D1 to D4 to the terminal M1, no current flows through the second conductor layers C21 and C22 from the first conductor layer. The heat generated by the current flowing in the first conductor layer C1 can be released to the second conductor layers C21 and C22, and the heat dissipation of the first conductor layer C1 can be promoted.

  As shown in FIG. 1, electronic devices D1 and D3 are arranged in the second direction (x direction in FIG. 1) with the first conductor layer C1 interposed therebetween. Similarly, electronic elements D2 and D4 are arranged in the second direction (x direction in FIG. 1) with the first conductor layer C1 interposed therebetween. With this configuration, since the first conductor layer is connected to the ground, the first conductor layer C1 is also connected to the ground, and the electromagnetic noise generated from each electronic element is transmitted through the first conductor layer C1. Since it is absorbed by the ground, it is possible to reduce mixing of electric noise from another electronic element provided on the substrate in the target electronic element.

  As shown in FIG. 1, the electronic module 5 includes a terminal M2 provided on the first conductor layer C1. The sealing member 32 is provided with a through hole (not shown), and the terminal M2 extends substantially perpendicular to the substrate 31 through the through hole. The terminal M2 extends outside the sealing member 32 and is connected to another electronic component or the ground. In the present embodiment, as an example, the terminal M2 is connected to another electronic component. Accordingly, for example, when the terminal M1 is connected to the ground as shown in the present embodiment, the terminal M2 is also connected to the ground, and other electronic components are connected to the ground via the terminal M2. Can be.

  As described above, the electronic module 5 according to the first embodiment is connected to the substrate 31, the first conductor layer C1 extending in the first direction on the upper surface of the substrate 31, and the first conductor layer C1. And second conductor layers C21 and C22 extending across the first conductor layer C1 in a second direction different from the first direction, and the first conductor layer C1 on the substrate 31 And electronic elements D1 to D4 provided at positions different from the second conductor layers C21 and C22, and terminals M1 provided on the first conductor layer C1. The first conductor layer C1 is located at a position away from the terminal M1 in the first direction so that the first conductor layer C1 becomes a current path of a current flowing between the electronic elements D1 to D4 and the terminal M1. It is connected to electronic elements D1 to D4.

  With this configuration, the first conductor layer C1 extends in the first direction on the upper surface of the substrate 31, and the second conductor layers C21 and C22 extend in the second direction different from the first direction. Therefore, the rigidity of the substrate 31 in the second direction as well as the first direction is improved, so that the possibility that the substrate 31 is warped can be reduced. Furthermore, since the second conductor layers C21 and C22 do not form a current path from the electronic elements D1 to D4 to the terminal M1, no current flows through the second conductor layers C21 and C22 from the first conductor layer. The heat generated by the current flowing in the first conductor layer C1 can be released to the second conductor layers C21 and C22, and the heat dissipation of the first conductor layer C1 can be promoted.

<Second embodiment>
Next, a second embodiment will be described. In the first embodiment, the second conductor layers C21 and C22 extend across the first conductor layer C1. On the other hand, the second embodiment is different in that the third conductor layer extends across the first conductor layer C1 in addition to the second conductor layer. The overall configuration of the power supply device according to the second embodiment is the same as the overall configuration of the power supply device according to the first embodiment, and a description thereof will be omitted.

  As shown in FIG. 5, the electronic module 5b according to the second embodiment is substantially parallel to the second conductor layers C21 and C22 with an interval, and in the first direction (the y direction in FIG. 5). And third conductor layers C31 and C32 extending across the first conductor layer C1 in a third direction (x direction in FIG. 5) different from the first conductor layer C1. Here, the third direction is, for example, a direction perpendicular to the first direction.

  With this configuration, in the electronic module 5b according to the second embodiment, the second conductor layers C21 and C22 and the third conductor layers C31 and C32 extend in the third direction different from the first direction. Therefore, the rigidity of the substrate 31 in the second direction is higher than that of the electronic module 5 of the first embodiment, so that the possibility that the substrate 31 is warped can be further reduced.

  In the present embodiment, the third direction is the same as the second direction as an example, but is not limited thereto, and the third direction may be the same as or different from the second direction. Good.

  It should be noted that the description of each embodiment described above and the disclosure of the drawings are merely examples for describing the invention described in the claims, and the description of each embodiment described above or the disclosure of the drawings is intended to cover the scope of the claims. The described invention is not limited. The description of the claims at the beginning of the application is merely an example, and the description of the claims can be appropriately changed based on the description in the specification, drawings, and the like.

Reference Signs List 1 power supply device 2 housing 3 pressed member 31 substrate 32 sealing member 4 transformer 5, 5b electronic module C1 first conductor layer C21, C22 second conductor layer C31 third conductor layer C4 conductor layer D1, D2 , D3, D4 Electronic element E1, E2 Electrode E11, E12 Shoulder part E13 Central part EB1, EB2 Elastic body R1, R2 Relay R14 First branch part R15, R16 Second branch part S1, S2 Locking member M1 Terminal M2 Second terminal T1, T2 Terminal T11, T12 Shoulder portion T13 Central portion W1 to W4 Wiring

Claims (5)

Board and
A first conductor layer extending in a first direction on an upper surface of the substrate;
A second conductor layer connected to the first conductor layer and extending across the first conductor layer in a second direction different from the first direction;

An electronic element provided on the substrate at a different position from the first conductor layer and the second conductor layer;
A terminal provided on the first conductor layer;
With
The first conductor layer is connected to the electronic element at a position away from the terminal in the first direction so as to be a current path of a current flowing between the electronic element and the terminal ,
A third conductor layer that is substantially parallel to the second conductor layer with a space therebetween and extends in a third direction different from the first direction with the first conductor layer interposed therebetween; An electronic module further provided . There are a plurality of said electronic elements,
The terminal is connected to ground,
The electronic module according to claim 1, wherein the plurality of electronic elements are arranged with the first conductor layer interposed therebetween in the second direction. Further comprising a sealing member for sealing the substrate and having a through hole,
The electronic module according to claim 2, further comprising a second terminal provided on an upper surface of the substrate and extending substantially perpendicular to the substrate through the through hole. The terminal is bifurcated, the electronic module according to claim 1, any one of 3 to end divided into the bifurcated is connected to said first conductor layer. Power supply comprising an electronic module according to any one of claims 1 to 4.

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