JP2005223208A - Circuit substrate and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of components in a circuit substrate wherein the circuit substrate is divided into a plurality and the divided substrates are arranged in different directions (to form right angles mutually, for example), and to provide a manufacturing method of the circuit substrate. <P>SOLUTION: A plurality of divided substrates 20a, 20b are mutually linked through bus bars 10a to 10f (conductive member), and circuits of the divided substrates 20a, 20b are mutually connected through the bus bars 10a to 10f. Two divided substrates 20a, 20b can be disposed in different directions by bending a projection part from the divided substrates 20a, 20b in the bus bars 10a to 10f. Since the divided substrates 20a, 20b are linked by the bus bars 10a to 10f constituting circuits of the divided substrates 20a, 20b, the number of components can be reduced when compared with a method for connecting divided substrates mutually by using a jumper line besides a circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit board and a method for manufacturing the circuit board.

  In general, a circuit board has a flat plate shape, but in order to accommodate a flat circuit board, it is necessary to secure a wide space in a two-dimensional direction. There is a problem that it is low.

  Therefore, as a countermeasure, a method is considered in which the circuit board is divided into a plurality of parts and the divided boards are arranged in different directions (for example, at right angles to each other).

In addition, there exists what is described in patent document 1 as what arrange | positions a several division | segmentation board | substrate in a different direction.
Japanese Patent Laid-Open No. 11-177187

  In the above conventional one, the circuits of a plurality of divided substrates arranged in different directions are connected by jumper wires. This jumper wire is a component that is required separately from the circuit of the divided substrate, and moreover, since a plurality of jumper wires are usually required, there is a problem that the number of components increases.

  The present invention has been completed based on the above-described circumstances, and an object thereof is to reduce the number of parts.

  As a means for achieving the above object, the invention of claim 1 is a circuit board composed of a plurality of divided boards which can be arranged in different directions, to which mounting components are connected. A conductive member integrated with the plurality of divided substrates in such a manner that the contact portions are exposed to the plurality of divided substrates. The conductive member is characterized in that it can be bent at a protruding portion from the divided substrate.

  A second aspect of the invention is characterized in that, in the first aspect of the invention, the divided substrate is made of a synthetic resin and integrated with the conductive member by insert molding.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the conductive member is made of a metal plate and is a bus bar capable of maintaining the bending angle in a bent state. Has characteristics.

  Invention of Claim 4 is a method of manufacturing the circuit board according to any one of Claims 1 to 3, wherein a plurality of the conductive members are connected by connecting pieces, It is characterized in that the plurality of conductive members are separated by integrating with a divided substrate and cutting the connecting piece.

<Invention of Claim 1>
The plurality of divided substrates are connected to each other via a conductive member, and the circuits of the divided substrates are connected to each other via the conductive member. By bending the protruding portion of the conductive member from the divided substrate, the plurality of divided substrates can be arranged in different directions. Since the plurality of divided boards are connected by the conductive members constituting the circuit of the divided boards, the number of components can be reduced as compared with the case where the divided boards are connected to each other using a jumper wire separately from the circuit.

<Invention of Claim 2>
Since the divided substrate is integrated with the conductive member by insert molding, the number of manufacturing steps can be reduced as compared with the case where the plurality of divided substrates and the conductive member are assembled after forming the plurality of divided substrates. In addition, since the divided substrate is made of synthetic resin, a connector as a connection means with other components, a wire harness, or the like can be formed integrally with the divided substrate, so that the divided substrate and the connector are separated from each other. The number of parts can be reduced compared to what to do.

<Invention of Claim 3>
Since the conductive member is a bus bar and the bus bar keeps its bending angle in the bent state, it is not necessary to provide a dedicated means for maintaining the positional relationship between the divided substrates separately from the conductive member.

<Invention of Claim 4>
In the case where a plurality of conductive members are separated from each other and integrated with a divided substrate, there is a concern that the manufacturing process will be complicated because of the trouble of positioning and handling the conductive members. In the invention, since the plurality of conductive members are integrated as a connecting body, the labor for positioning, handling, etc. can be reduced, and the manufacturing process can be simplified.

<Embodiment 1>
A first embodiment of the present invention will be described below with reference to FIGS. The circuit board A of the present embodiment includes a plurality of bus bars 10a to 10f (conducting paths which are constituent elements of the present invention) (two or fewer or seven or more in this embodiment). It is configured to include a plurality of divided substrates 20a and 20b and a plurality of mounting components 30 (eight in this embodiment, but may be seven or less or nine or more).

  The bus bars 10a to 10f are made of a relatively thick metal plate material and can pass a large current. Each bus bar 10a to 10f has a predetermined shape and is disposed along a predetermined path so as to constitute a circuit of the circuit board A. The plurality of bus bars 10a to 10f are arranged at a constant height (on a two-dimensional plane) so that all of them are flush with each other, and are substantially constant between adjacent bus bars 10a to 10f. A gap 11 having a width of 1 mm is provided. In a state before the bus bars 10a to 10f are integrated with the divided substrates 20a and 20b (before the circuit board A is manufactured), the bus bars 10a to 10f are adjacent to each other. The connecting body 13 is connected to each other by the connecting pieces 12 arranged flush with the bus bars 10a to 10f in the gap, thereby maintaining a fixed positional relationship. The connecting body 13 has a generally rectangular flat plate shape as a whole. Two of the six bus bars 10a and 10b are formed with tabs 14 protruding in a stepped shape from the outer edge to the back side. The three bus bars 10a, 10c, and 10d are formed with terminal portions 15 that extend from the outer edges thereof in a flush manner. Further, the four bus bars 10a, 10c, 10d, and 10e are formed with bent portions 16, and the bent portions 16 are provided with grooves 17 having a shape in which the front surface or the back surface is elongated and formed in a straight line. It forms so that it may line up (refer FIG. 6).

  The divided substrates 20a and 20b are made of synthetic resin and have a rectangular plate shape. The two divided substrates 20a and 20b are integrated with the plurality of bus bars 10a to 10f by insert molding. The bus bars 10a to 10f are embedded in the divided substrates 20a and 20b except for the tabs 14, the terminal portions 15 and the bent portions 16 (not exposed on the front and back surfaces of the divided substrates 20a and 20b). ing. The plurality of bus bars 10a to 10f connect the two divided substrates 20a and 20b to each other. At the same time, the divided substrates 20a and 20b hold the plurality of bus bars 10a to 10f in a predetermined positional relationship.

  The two divided substrates 20a and 20b that have been insert-molded are aligned and arranged flush with each other, and the bent portion 16 is exposed in the elongated gap between the two divided substrates 20a and 20b. In addition, in the divided substrates 20a and 20b that have been insert-molded, the window holes 21 in a form in which regions corresponding to the contact portions 18 of the bus bars 10a to 10f are cut out in a square shape open on both the front and back surfaces of the divided substrates 20a and 20b. Is formed. Furthermore, circular holes 22 are formed at positions corresponding to the connecting pieces 12 in the divided substrates 20a and 20b so as to open on both the front and back surfaces of the divided substrates 20a and 20b. It is to be excised.

  From the front edge (the right edge in FIG. 1) of one (the lower side in FIG. 1) divided block 20 having a female screw hole 24 opened in the front is the surface ( 1 and a rectangular tube-like board-side connector 25 that accommodates the tab 14 protrudes greatly toward the back side of the divided board 20a and is on the front side. It protrudes forward like the receiving part 23 in the form which protruded slightly. From the front edge of the other divided substrate 20b, a block-shaped receiving portion 26 having a female screw hole 27 opened in the front is projected forward along the surface of the divided substrate 20b. Further, the above-described three terminal portions 15 protrude from the outer edge of the one divided substrate 20a opposite to the substrate-side connector 25.

  The mounting component 30 is arranged along the surface side of the divided substrates 20 a and 20 b, and the leads 31 extending from both ends of each mounting component 30 are soldered to the contact portion 18 exposed in the window hole 21. Connected by attaching.

Next, the manufacturing process of the circuit board A will be described.
First, the metal plate material is punched into a predetermined shape by pressing, and then the tabs 14 are bent to produce the coupling body 13 (see FIG. 3). Next, this connecting body 13 is set in a mold for insert molding (not shown), and molten resin is injected into the mold to mold the divided substrates 20a and 20b, and at the same time, a plurality of bus bars 10a to 10f. It is assumed that the majority is embedded in the two divided substrates 20a and 20b. By this insert molding, the bus bars 10a to 10f and the divided substrates 20a and 20b are integrated (see FIG. 4). In this state, as shown in FIG. 5A, the bus bars 10 a to 10 f are still connected by the connecting piece 12, and the connecting piece 12 is exposed in each circular hole 22.

  Thereafter, the connecting piece 12 in each circular hole 22 is cut out by punching in the thickness direction of the divided substrates 20a and 20b, and the adjacent bus bars 10a to 10f are separated (see FIG. 5B). By cutting off the connecting piece 12, all the bus bars 10a to 10f are electrically insulated from each other.

  Next, the mounting components 30 are arranged along the surfaces of the divided substrates 20 a and 20 b, and the leads are connected to the contact portions 18 exposed in the window holes 21. Thereby, each mounting component 30 is mounted on the circuit board A. As described above, the circuit of the circuit board A is configured by the plurality of bus bars 10a to 10f and the plurality of mounting components 30, and the manufacture of the circuit board A is completed.

Next, the process of assembling the circuit board A to the LED module B will be described.
The LED module B includes a base 40, a heat sink 50, an LED substrate 60, and an LED side connector 70. The base 40 has a disk shape with the central axis directed in the front-rear direction, and a harness connector 41 projects from the rear surface. A terminal (not shown) is provided on the front surface of the base 40, and the terminal portion 15 of the circuit board A is connected to the terminal, and the divided board 20a on the lower side of the circuit board A is fixed to the base 40 (FIG. 8). See). The fixed circuit board A has a posture in which the upper divided board 20b is inclined downward at an angle of about 120 ° with respect to the lower divided board 20a with the groove 17 of the bent portion 16 of the bus bars 10a to 10f as a fulcrum. Displace (see FIG. 9). The bus bars 10a to 10f are made of a thick metal plate material, and have shape maintaining performance (rigidity) that maintains a predetermined bending angle even after being bent. Therefore, the positional relationship between the divided substrates 20a and 20b is maintained without using dedicated means different from the bus bars 10a to 10f.

  The heat radiating plate 50 includes a regular hexagonal front plate 51 and a pair of vertically symmetrical trapezoidal plates 52 extending rearward from the front plate 51, and the rear end portion of the trapezoidal plate 52 is fixed to the front surface of the base 40. Has been. In the fixed state, the upper and lower two trapezoidal plates 52 surround the bent circuit board A from above and below, and the front board 51 is arranged along the front edge of the circuit board A. And the attachment hole 53 formed in the front board 51 corresponds to the board | substrate side connector 25, and the two through-holes 54 formed in the front board 51 are the receiving parts 23 and 26 of the division | segmentation board | substrates 20a and 20b. Corresponds to the female screw holes 24 and 27 (see FIG. 9).

  The LED board 60 has an LED lamp 61 arranged in the center, and six notches 62 are formed on the outer periphery with an angular interval of 60 °. In addition, two pairs of contacts 63 are disposed on the front surface of the LED substrate 60. The LED-side connector 70 has a plate-like main body 71 and a fitting portion 72 that protrudes rearward from the plate-like main body 71, and two terminal fittings 73 are embedded therein. One contact 74 of the terminal fitting 73 faces the fitting portion 72, and the other contact 75 is exposed on the rear surface of the plate-like main body 71. The LED substrate 60 is assembled so as to be in contact with the front surface of the front plate 51 of the heat radiating plate 50, and the LED side connector 70 is addressed to the front surface of the LED substrate 60, and between the LED side connector 70 and the front plate 51. While the LED substrate 60 is sandwiched, the LED lamp 61 passes through the rectangular fitting hole 76 of the plate-like main body 71 and protrudes forward of the LED-side connector 70. Further, the bolt 78 inserted into the through hole 77 of the plate-like main body 71 of the LED side connector 70 passes through the notch 62 of the LED board 60, penetrates the through hole 54 of the front board 51, and the female screw hole of the circuit board A. 24, 27. Thus, the LED board 60 and the component-side connector 70 are fixed to the heat sink 50, and the assembly of the LED module B is completed.

  In this state, the contact 63 of the LED lamp 61 is connected to the contact 75 of the terminal fitting 73 of the LED side connector 70, and the fitting portion 72 of the LED side connector 70 is fitted to the board side connector 25 of the circuit board A. As a result, the terminal fitting 73 and the tab 14 of the circuit board A are connected, so that the LED lamp 61 is connected to the circuit (bus bars 10a to 10f) of the circuit board A.

  As described above, the circuit board A of the present embodiment is composed of the two divided boards 20a and 20b that can be arranged in different directions, and the two divided boards 20a and 20b are arranged. 20b is connected to each other via bus bars 10a to 10f, and the circuits of the divided substrates 20a and 20b are connected to each other via bus bars 10a to 10f. Then, by bending the bent portion 16 protruding from the divided substrates 20a and 20b in the bus bars 10a to 10f, the two divided substrates 20a and 20b can be arranged in different directions. According to the present embodiment, since the two divided substrates 20a and 20b are connected by the bus bars 10a to 10f constituting the circuit of the divided substrates 20a and 20b, the divided substrates are connected to each other using a jumper line separately from the circuit. The number of parts can be reduced compared to what is to be done.

  In addition, since the divided substrates 20a and 20b are integrated with the bus bars 10a to 10f by insert molding, the number of manufacturing processes is reduced as compared with the case where the plurality of divided substrates and the bus bar are assembled after forming the plurality of divided substrates. can do. Further, by forming the divided substrates 20a and 20b from synthetic resin, the substrate-side connector 25 as a connecting means to other components, conductive paths, etc. (LED-side connector 70) is formed integrally with the divided substrate 20a. Therefore, the number of components can be reduced as compared with the case where the divided substrate and the board side connector are separate components.

  In addition, since the conductive members constituting the circuit of the divided substrates 20a and 20b are bus bars 10a to 10f, and the bus bars 10a to 10f maintain the bending angle in the bent state, the positional relationship between the divided substrates 20a and 20b is determined. It is not necessary to provide dedicated means for maintaining separately from the bus bars 10a to 10f.

  In addition, when integrating the plurality of bus bars 10a to 10f with the divided substrates 20a and 20b in a state where they are separated from each other, the manufacturing process is complicated because it takes time to position and handle the bus bars 10a to 10f. In this embodiment, since the plurality of bus bars 10a to 10f are integrated as the coupling body 13, it is possible to reduce the labor of positioning and handling and simplify the manufacturing process. Can do.

<Other embodiments>
The present invention is not limited to the embodiment described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.

  (1) In the above embodiment, the conductive member is a bus bar. However, according to the present invention, a circuit formed on the surface of a resin sheet or conductive rubber can be used as the conductive member.

  (2) In the above embodiment, two divided substrates are used. However, according to the present invention, three or more divided substrates may be used.

  (3) In the above embodiment, the divided substrate is a flat plate. However, according to the present invention, the divided substrate may be a bent or curved plate.

  (4) In the above embodiment, the bus bar (conductive member) is accommodated inside the divided substrate (within the thickness range) except for a part, but according to the present invention, either the front or back of the divided substrate is used. The entire bus bar (conductive member) may be exposed on the surface.

  (5) In the above embodiment, the divided substrate and the bus bar (conductive member) are integrated in the insert molding step. However, according to the present invention, the divided substrate is previously formed, and the formed divided substrate and bus bar are formed. (Conductive member) may be assembled and integrated.

  (6) In the above embodiment, the bus bar (conductive member) is integrated by being embedded in the divided substrate by insert molding. However, according to the present invention, the bus bar (conductive member) is divided by a fixing means such as a screw, an adhesive, or a locking claw. The substrate and the bus bar (conductive member) may be integrated.

  (7) In the above embodiment, the bus bar (conductive member) is embedded in the divided substrate by insert molding. However, according to the present invention, the divided substrate is overlapped on the front and back, and the bus bar (conductive member) is sandwiched therebetween. Good.

  (8) In the above-described embodiment, the circuit of the divided substrate is entirely constituted by the bus bar (conductive member). However, according to the present invention, only a part of the circuit of the divided substrate is constituted by the bus bar (conductive member). These portions may be configured by printed wiring. In this case, the number of bus bars may be only one.

  (9) In the above embodiment, the divided substrate is made of synthetic resin. However, according to the present invention, ceramics, glass, or the like may be used.

Circuit board top view Front view of circuit board Top view of bus bar connector Plan view showing the integrated state of the bus bar and the divided board in the circuit board manufacturing process (A) Partial enlarged plan view showing a state before cutting the connecting piece (b) Partial enlarged plan view showing a state after cutting the connecting piece Partial enlarged sectional view showing the bent part of the bus bar Partial enlarged sectional view of the circuit board Side view showing the disassembled state of the LED module to which the circuit board is assembled Side view showing the bent state of the circuit board attached to the base in the LED module assembly process Front view showing the completed LED module assembly LED front view Front view of component side connector

Explanation of symbols

A ... Circuit board 10a-10f ... Bus bar (conductive member)
DESCRIPTION OF SYMBOLS 12 ... Connection piece 13 ... Connection body 16 ... Bending part 18 ... Contact part 20a, 20b ... Divided board 30 ... Mounting component

Claims (4)

A circuit board composed of a plurality of divided boards that can be arranged in different directions,
A conductive portion having a contact portion to which a mounting component is connected and arranged so as to constitute a circuit of the plurality of divided substrates, and integrated with the contact portion exposed to the plurality of divided substrates. Comprising a member,
The circuit board, wherein the conductive member can be bent at a portion protruding from the divided substrate. The circuit board according to claim 1, wherein the divided substrate is made of a synthetic resin and is integrated with the conductive member by insert molding. The circuit board according to claim 1, wherein the conductive member is made of a metal plate and is a bus bar capable of maintaining a bending angle in a bent state. A method for manufacturing the circuit board according to any one of claims 1 to 3,
Integrating a plurality of conductive members connected with connecting pieces with a plurality of divided substrates;
A method of manufacturing a circuit board, wherein the plurality of conductive members are separated by cutting the connecting piece.

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