JP4762024B2 - System board and method for manufacturing system board - Google Patents

Description

  The present invention relates to a system board that expands a board size while maintaining an existing header pin arrangement when an electronic device or the like is configured using a plurality of boards of different sizes and a general-purpose bus, and manufacturing of the system board Regarding the method.

  When an electronic device or the like is configured using a plurality of substrates and a general-purpose bus, a commercially available general-purpose substrate and a newly manufactured dedicated substrate may be used. In addition, an extension board having an additional function may be connected to a conventional basic board having a connector pin arrangement while maintaining the connector pin arrangement to increase the board size.

In this case, there is no problem as long as the general-purpose board and the dedicated board have the same size, but the dedicated board may be larger than the general-purpose board in terms of component mounting density, function sharing, and the like.
In such a case, in order to store a plurality of substrates having different sizes in one rack, it is necessary to unify the connection method to the general-purpose bus in order to make the sizes of the respective substrates uniform and prevent deterioration of electrical characteristics. In view of this, a technique has been conventionally known in which an extension board is used to change the size of a general-purpose board to the size of a dedicated board so that all the boards are unified.

  Further, regarding a size conversion board that unifies the board size, there is known a technique for enabling the use of a general-purpose bus without deteriorating electrical characteristics even when a plurality of boards having different sizes are used ( For example, see Patent Document 1).

However, in this prior art, in order to obtain a unified board size for different board sizes, a method is realized in which a plurality of boards on which connectors are mounted and a fixing member are used. For this reason, a larger number of parts are required to increase the substrate size, which may cause a problem of increased cost.
JP-A-8-32196 (FIG. 1, abstract)

  The object of the present invention is to enable the interconnection of substrates for each functional block or substrates having different layer configurations, and it is easy to assemble and divert existing substrates to expand the substrate size. It is an object of the present invention to provide a system board and a system board manufacturing method that achieve both improvement in manufacturability and stable product quality.

  In order to achieve the above object, the system board of the present invention is a polygonal base board having basic board header pins arranged at a predetermined interval in the vicinity of one side of the front face, and the polygonal front face. An extension board header pin having the same arrangement as the arrangement of the basic board header pins is provided in the vicinity of the side facing the one side of the basic board, and the basic board is provided in the vicinity of a side different from the side facing the basic board. An extension board having a motherboard connector having contacts in the same arrangement as the header pin arrangement, a first connection portion that is smaller than the basic board and the extension board and is in electrical contact with the basic board header pins, and for the extension board And an extended small board having a second connection portion electrically connected to the header pin.

  The system board manufacturing method of the present invention includes assembling a basic board having basic board header pins that are polygonal and arranged at a predetermined interval in the vicinity of one side of the front surface, and the basic board and the extension board. A small extension board having a first connection portion electrically connected to the basic board header pin and a second connection part electrically connected to the extension board header pin is mounted on the basic board. A side that faces the basic substrate and has extended substrate header pins in the same arrangement as the basic substrate header pins in the vicinity of the side of the polygonal front surface facing the one side of the basic substrate. Mounting an extension board having contacts in the same arrangement as the arrangement of header pins of the basic board near the side different from the extension board on the extension small board, and arranging the header pins of the basic board on the extension board And a step of mounting the motherboard connector with contacts of the same sequence.

  According to the above invention, it is possible to interconnect substrates for each functional block, or substrates having different layer configurations, and it is easy to assemble and divert existing substrates to expand the substrate size. It is possible to provide a system board and a system board manufacturing method that achieve both improvement in manufacturability and stable product quality.

  Since the system board and the method for manufacturing the system board of the present invention have the above-described configuration and operation, the boards for each functional block or the boards having different layer configurations can be interconnected. It is easy to assemble, and an existing substrate can be used to expand the size of the substrate. Thus, it is possible to provide a system substrate and a method for manufacturing the system substrate that achieve both improvement in manufacturability and stability of product quality.

Hereinafter, a system board and a method for manufacturing the system board according to an embodiment of the present invention will be described in detail with reference to the drawings.
First, the structure of the system board according to the present embodiment will be described with reference to FIGS.
FIG. 1 is a front view of the entire system board according to the embodiment of the present invention. FIG. 2 is a perspective view of the entire system board according to the embodiment of the present invention. The system board according to the present embodiment is a flat plate having a front surface (front surface) and a rear surface (back surface), and is configured as a polygon (in the present embodiment, a rectangle having a long side and a short side). A basic substrate 1 having basic substrate header pins 5a and 5c arranged at a predetermined interval in the vicinity of the side is provided.

  The size of the basic board 1 is the same as the board size of the existing system. Instead of removing the motherboard connector from the board of the existing system, basic header pins 5a and 5c having the same contact arrangement as the motherboard connector of the existing system board are provided. In the vicinity of one long side of the front surface (surface).

  Further, the system board according to the present embodiment is a flat plate having a front surface (front surface) and a rear surface (back surface) as in the case of the basic substrate 1, and is a polygon (in this embodiment, a rectangle having a long side and a short side). The extension board header pins 5b and 5d having the same arrangement as the arrangement of the basic board header pins 5a and 5c are provided on the front surface (front surface) in the vicinity of the side opposite to the long side which is one side of the basic board 1. An extension substrate 2 is provided.

The extension board 2 further includes a motherboard connector 3a having contacts in the same arrangement as the arrangement of the header pins 5a and 5c of the basic board 1 on the front surface (front surface) near the side different from the side facing the basic board 1. 3b is provided.

Furthermore, the system board according to the present embodiment is a flat plate having a front surface (front surface) and a rear surface (back surface), and is configured as a polygon (in this embodiment, a rectangle having a long side and a short side), and is a basic substrate. 1st connection part 6a, 6c which is smaller than 1 and extension board 2 and is in electrical contact with basic board header pins 5a, 5c, and second connection which is in electrical connection with extension board header pins 5b, 5d It has extended small substrates 4a and 4b having portions 6b and 6d.

  The extended small boards 4a and 4b in the present embodiment are composed of two boards. However, the invention is not limited to this, and the first connection parts 6a and 6c are on one side, and the second connection parts 6b. , 6d can be configured by a single substrate arranged on the other side. It is also possible to configure the first and second connection portions with a large number of small substrates divided into three or more.

  In addition, as shown in FIG. 3, the extended small board | substrate 4 used for the board | substrate system which concerns on this embodiment is divided | segmented into at least 2 or more as mentioned above. When the extended small substrate 4 divided into two pieces is a first extended small substrate 4a and a second extended small substrate 4b, the first connecting portion 6a of the first extended small substrate 4a and the second extended small substrate 4a The interval between the connection portions 6b is different from the interval between the first connection portion 6c and the second connection portion 6d of the second extended small substrate 4b.

  Specifically, the distance between the first connection portion 6a of the first extension small substrate 4a and the second connection portion 6b is the same as that between the first connection portion 6c of the second extension small substrate 4b and the second connection portion 6b. It is longer than the interval between the connection portions 6d, and conversely the second extension small substrate 4b than the interval between the first connection portion 6a of the first extension small substrate 4a and the second connection portion 6b. The distance between the first connecting portion 6c and the second connecting portion 6d is shortened.

That is, the distance between the first connection portion 6a and the second connection portion 6b of the first extended small board 4a is for the basic board when the sides with the header pins of the basic board 1 and the extended board 2 are attached together. The distance between the header pin 5a and the extension board header pin 5b is the same as that between the first connection part 6c and the second connection part 6d of the second extension small board 4b. The distance between the base board header pin 5c and the extension board header pin 5d when the side where the header pin of the board 2 is attached is the same. These intervals are different.

The basic board 1 and the extension board 2 can be made smaller by arranging the header pins for the basic board as described above, the header pins for the extension board, and the first and second connection portions of the first and second extension small boards. When connecting the substrates 4a and 4b, it is possible to prevent the front surface (front surface) of the basic substrate 1 and the rear surface (back surface) of the extension substrate 2 from being erroneously connected. That is, it becomes possible to improve manufacturability at the time of board expansion.

Further, the system board in this embodiment has a second extension board 4 divided into two, and the first extension small board 4a and the second extension small board 4b are the second extension board 4a. The first marking A is provided in the vicinity of the connecting portion 6b. Specifically, in the present embodiment, the first marking A is formed by marking one rectangle as shown in FIG. 3 on the surface of the first extended small substrate 4a.

Further, in the vicinity of the second connecting portion 6d of the second extended small substrate 4b, a second marking having a form different from that of the first marking A in the vicinity of the second connecting portion 6b of the first extended small substrate 4a. I have B. Specifically, in the second marking B, two rectangles as shown in FIG. 3 are arranged in the longitudinal direction and marked on the surface of the second extended small substrate 4b.

And, on the front surface (front surface) of the extension board 2, the first marking A and the second marking B of the second extension small boards 4 a and 4 b are opposed to the first marking A and the second marking B, respectively. Markings A ′ and B ′ having the same shape as the marking A and the second marking B are marked.

That is, one rectangular marking A ′ having the same shape as the first marking A is provided on the front surface (front surface) of the extension board 2 that faces the first marking A, and faces the second marking B. On the front surface (front surface) of the extension substrate 2 to be provided, a marking B ′ in which two rectangles having the same shape as the second marking B are arranged in the longitudinal direction is provided.

By marking the above-mentioned markings A, A ′, B, B ′ on the first and second extended small substrates 4a, 4b and the extended substrate 2, the basic substrate 1 and the extended substrate 2 are connected to the extended small substrate 4a. 4b, it is possible to prevent the front surface (front surface) of the basic substrate 1 and the rear surface (back surface) of the extension substrate 2 from being erroneously connected. That is, it becomes possible to improve manufacturability at the time of board expansion.

Next, a system board manufacturing method according to an embodiment of the present invention will be described with reference to FIG.
FIG. 4 is a flowchart showing the steps of the system board manufacturing method according to the present embodiment. First, in this embodiment, first, the main part of the existing system board is assembled. A basic board 1 corresponding to an existing system board portion having basic board header pins 5a and 5c arranged in a polygonal shape with a predetermined interval in the vicinity of one side of the front surface (front surface) is assembled (S1). At this time, the motherboard connectors 3 a and 3 b are not mounted on the basic board 1.

Next, the extended small substrates 4a and 4b are assembled. That is, the first connection portions 6a and 6c that are smaller than the basic board 1 and the extension board 2 and are in electrical contact with the basic board header pins 5a and 5c, and the second connection terminals that are electrically connected to the extension board header pins 5b and 5d. The extended small boards 4a and 4b having the connecting portions 6b and 6d are mounted on the basic board 1 (S2). The basic board header pins 5a and 5c, which are board header pins, are mounted on the extended small boards 4a and 4b and assembled in a solder bath.

Next, the basic board 1 and the extension board 2 which are the existing system boards are connected by the extension small boards 4a and 4b. That is, it has extension board header pins 5b and 5d having the same arrangement as the arrangement of the basic board header pins 5a and 5c in the vicinity of the side facing the one side of the basic board 1 on the front surface (front surface) of the plate polygon. An extension board 2 having contacts in the same arrangement as the arrangement of the header pins 5a and 5c of the basic board 1 is assembled in the vicinity of a side different from the side facing the basic board 1, and the extension board 2 is assembled into the extension small boards 4a and 4b. Mount and connect (S3). The basic board 1 and the extension board 2 of the existing system board portion by the extension small boards 4a and 4b are assembled and connected.

In particular, the pattern wirings on the left and right extension small boards 4a and 4b are not the same, and in the case of different pattern wirings, the board header pins 5a and 5c on the extension small boards 4a and 4c are arranged to be deep. Mount at different positions in the direction. This eliminates left and right mounting errors.

Further, it is urged to align the mounting direction by square marking (silk display) or the like to prevent mounting errors in the 180 ° rotation direction (in accordance with markings such as A and A ′ and B and B ′ in FIG. 3 in this embodiment). Implement).

Further, a motherboard connector having contacts in the same arrangement as the header pins of the basic board 1 is mounted on the extension board 2 (S3).
Through the above process, substrates for each functional block or substrates with different layer structures can be interconnected, and assembly is easy and the existing substrate can be diverted to expand the substrate size. The system board and the method for manufacturing the system board can be provided that achieves both improvement of the product and stability of product quality.

The front view of the whole system board concerning the embodiment of the present invention. The perspective view of the whole system board concerning the embodiment of the present invention. The expansion perspective view explaining the connection state of the basic board and extension board in an extension small board. The flowchart of the manufacturing method of the system board which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Basic board 2 ... Extension board 3a, 3b ... Motherboard connector 4a ... 1st extension small board 4b ... 2nd extension small board 5a, 5c ... Header pin 5b for basic board 5b ... Extension Board header pins 6a, 6c... First connection portions 6b, 6d... Second connection portions

Claims (3)

A basic board having basic board header pins arranged in a polygonal shape with a predetermined interval near one side of the front surface;
An extension board header pin having the same arrangement as the arrangement of the basic board header pins is provided in the vicinity of a side of the front face facing the one side of the basic board on the front surface, separate from the side facing the basic board. an extension board having a mother board connector to the vicinity of the edge with the contacts of the same arrangement of header pins of the base substrate,
A first connection portion that is smaller than the basic substrate and the extension substrate and is in electrical contact with the header pin for the basic substrate; and a second connection portion that is electrically connected to the header pin for the extension substrate; A system board comprising: a first extension board and a second extension board, wherein the first connection part and the second connection part are different from each other. A second marking having a first marking in the vicinity of the second connection portion of the first extension small substrate and having a form different from the first marking in the vicinity of the second connection portion of the second extension small substrate. The marking similar to the first and second markings is provided on a portion of the front surface of the extension board facing the first and second markings. System board. Assembling a basic board having basic board header pins arranged in a polygonal shape with a predetermined interval near one side of the front surface;
A first connection part that is smaller than the basic board and the extension board and is in electrical contact with the basic board header pin; and a second connection part that is in electrical connection with the extension board header pin; Mounting the first and second extension small substrates on the basic substrate, wherein the first connection portion and the second connection portion are different from each other;
An extension board header pin having the same arrangement as the arrangement of the basic board header pins is provided in the vicinity of a side of the front face facing the one side of the basic board on the front surface, separate from the side facing the basic board. Mounting an extension board having contacts in the same arrangement as the arrangement of the header pins of the basic board on the first and second extension small boards in the vicinity of
Method for producing a system board and a step of mounting a mother board connector with the contacts of the same arrangement of header pins of the base substrate to the extension board.

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