CN103742885A - Light-emitting diode (LED) lamp heat conduction structure - Google Patents
Light-emitting diode (LED) lamp heat conduction structure Download PDFInfo
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- CN103742885A CN103742885A CN201310711271.3A CN201310711271A CN103742885A CN 103742885 A CN103742885 A CN 103742885A CN 201310711271 A CN201310711271 A CN 201310711271A CN 103742885 A CN103742885 A CN 103742885A
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- led lamp
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Abstract
An LED lamp heat conduction structure comprises an LED lamp, a lamp panel and a radiator. The lamp panel is fixed on the radiator, a rectangular hollow structure is arranged in the middle of the lamp pane, a radiation boss matched with the hollow structure of the lamp panel is arranged on the radiator, and the LED lamp is fixed on the lamp panel and in direct contact with the radiation boss. The size of the radiation boss is identical to the size of the heat conduction plane of the bottom of the LED lamp. By means of the structure, the bottom of the LED lamp is in direct contact with the radiator, so that heat conduction links are reduced, heat generated by an LED chip is conducted to the radiator directly, the cooling effect is improved, and the LED lighting product service life is prolonged.
Description
Technical field
The present invention relates to a kind of conductive structure, relate in particular to a kind of conductive structure of LED lamp.
Background technology
LED lamp is cold light source, but still can produce heat in photoelectric conversion process, and heat dissipation problem is the major reason that determines the LED lamp life-span.Existing LED lamp generally adopts the materials such as aluminium base, ceramic substrate, FR4 to make lamp plate, and lamp plate is closely fixed on radiator again, thereby heat is transmitted to lamp plate from LED chip, then is transmitted to radiator.But because gapped capacity of heat transmission between different materials medium or between adjacent media of the same race is poor, can make LED lamp reduce the life-span because of weak heat-dissipating.
Summary of the invention
To the object of the invention is in order solving the problems of the technologies described above, to propose a kind of LED lamp conductive structure.
The object of the invention is to be achieved through the following technical solutions:
A kind of LED lamp plate conductive structure, wherein, comprise LED lamp, lamp plate, radiator, described lamp plate is fixed on radiator, have a rectangular hollow structure in the middle of lamp plate, have a heat radiation boss matching with the hollow structure of lamp plate on described radiator, described LED lamp is fixed on lamp plate, and directly contact with heat radiation boss, the size of described heat radiation boss is identical with the thermal conductive surface size of LED lamp bottom.
Above-mentioned a kind of LED lamp plate conductive structure, wherein, is evenly distributed four screw holes at the Si Jiaochu of lamp plate, with screw, lamp plate is fixed on radiator.
Above-mentioned a kind of LED lamp plate conductive structure wherein, is provided with a plurality of through holes on lamp plate, and for improving air thermal convection current thermolysis, wherein two through holes are as pad hole.
Above-mentioned a kind of LED lamp plate conductive structure, wherein, the heat radiation height of boss is identical with the thickness of lamp plate.
Above-mentioned a kind of LED lamp plate conductive structure, wherein, described LED lamp bottom adopts aluminum or aluminum alloy to make.
Above-mentioned a kind of LED lamp plate conductive structure, wherein, described radiator adopts aluminium alloy to make.
With PCB substrate manufacture lamp plate, the size of hollow structure, shape are to arrange according to the heat-conducting area of LED lamp bottom, and there is pad on the both sides of hollow structure, connect the positive and negative electrode of LED lamp.
On radiator, make a heat radiation boss, size, the shape of heat radiation boss are mated with the hollow structure of lamp plate, and heat radiation boss is done polishing, improve the capacity of heat transmission that heat radiation boss contacts with LED lamp thermal conductive surface.
LED lamp is fixed on lamp plate by Reflow Soldering, and electric wire is received on pad through the pad eyelet welding on lamp plate by lamp plate back, and the lamp plate of mounted LED lamp is placed into behind the relevant position of the heat radiation boss on radiator, is screwed on radiator.
In sum, owing to having adopted technique scheme, the bottom of LED lamp is directly contacted with radiator, reduce heat conduction link, the heat that LED chip produces is directly transferred in radiator, improves radiating effect, has extended the life-span of LED illuminating product.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of LED lamp plate of the present invention conductive structure.
Fig. 2 is the view after the installation of a kind of LED lamp plate of the present invention conductive structure.
Fig. 3 is the Facad structure schematic diagram of the lamp plate of a kind of LED lamp plate of the present invention conductive structure.
Fig. 4 is the radiator top view of a kind of LED lamp plate of the present invention conductive structure.
Fig. 5 is that the present invention surveys the electric current of LED lamp and the graph of a relation between lumen fraction.
Fig. 6 is that the present invention surveys graph of a relation between the electric current of LED lamp and Vf voltage.
Fig. 7 is that the present invention surveys the temperature of LED lamp and the graph of a relation of lumen fraction.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, a kind of LED lamp plate conductive structure, comprise LED lamp 1, lamp plate 2, radiator 3, described lamp plate 2 is fixed on radiator 3, in the middle of lamp plate 2, there is a rectangular hollow structure 4, on described radiator 3, there is a heat radiation boss 5 matching with the hollow structure 4 of lamp plate 2, described LED lamp 1 is fixed on lamp plate 2, and directly contact with heat radiation boss 5, the size of described heat radiation boss 5 is identical with the thermal conductive surface size of LED lamp 1 bottom, and LED lamp 1 bottom adopts aluminum or aluminum alloy to make.
With PCB substrate manufacture lamp plate 2, the size of hollow structure 4, shape are to arrange according to the thermal conductive surface of LED lamp 1 bottom, and there is pad on the both sides of hollow structure 4, connect LED lamp 1 positive and negative electrode.On the lamp plate position with a certain distance from LED lamp 1, be evenly distributed four screw holes 6, with screw 8, lamp plate 2 be fixed on radiator 3.A plurality of through holes 7 that distribute on the lamp plate position between LED lamp 1 and four screw holes 6, for improving air thermal convection current effect, wherein two through holes 7 are as pad hole.
Radiator 3 is aluminum alloy material, on radiator 3, make a heat radiation boss 5, size, the shape of heat radiation boss 5 are mated with the hollow structure 4 of lamp plate 2, heat radiation boss 5 is done polishing, improve the capacity of heat transmission that heat radiation boss 5 contacts with LED lamp 1 thermal conductive surface, the height of heat radiation boss 5 is identical with the thickness of lamp plate 2.
LED lamp 1 is fixed on lamp plate 2 by Reflow Soldering, and electric wire is received on pad through the pad eyelet welding on lamp plate 2 by lamp plate 2 backs, and the lamp plate 2 of mounted LED lamp 1 is placed into behind the relevant position of the heat radiation boss 5 on radiator 3, is screwed on radiator 3.
Select the LED lamp of 3000K to test, the luminous flux of the LED lamp of selecting minimum of a value when 85 ℃ of junction temperatures is 520lm, actual measurement mean value is 540lm, the relation between the electric current of surveying and lumen fraction as shown in Figure 5, when 185mA, lumen fraction is 100%, the lumen fraction that calculates a setting 200mA is 108%, and the luminous flux at 85 ℃ when electric current is 200mA is Ф=540lm*1.08=583.2lm.
Between the electric current of the LED lamp of surveying and Vf voltage, as shown in Figure 6, design rated current is 200mA to relation, and the mean value of its Vf is 33.5V, the power P 0=I*Vf=200mA*33.5V=6.7W of whole light source.
According to the power of light source and internal resistance, calculate the poor of radiator core and light source DIE Temperature, light source internal thermal resistance is 1.5 ℃/W, and the thermal resistance of direct contact type of the present invention, considers the impact of two plane clearances, Tr1=1.5+0.1=1.6 ℃/W;
If without hollow structure and heat radiation boss, with the direct heat conduction of aluminium base, owing to there being insulating barrier, larger on internal resistance impact, Tr2=1.5+1.8=3.3 ℃/W;
Direct contact type light source 1 DIE Temperature and the poor Tj1=Tr1*P0=1.6*6.7=10.72 ℃ of radiator temperature;
Aluminium base welding light source 2 DIE Temperatures and the poor Tj2=Tr2*P0=3.3*6.7=22.11 ℃ of radiator temperature.
At room temperature LED lamp was lighted after 1 hour, recorded 62 ℃ of radiator bottom centre temperature, light source and radiator contact-making surface temperature T 0=62+2=64 ℃;
Direct contact type light source 1 DIE Temperature Tj1+T0=10.72+64=74.72 ℃;
Aluminium base welding light source 2 DIE Temperature Tj2+T0=22.11+64=86.11 ℃.
Fig. 7 is the graph of a relation of surveyed LED light temperature and lumen fraction, while being 104%, 86.11 ℃ while being 100%, 74.72 ℃ in the time of 80 ℃, is 98%, and light source 1 light leads to Ф 1=Ф * 1.04=606.5lm, and light source 2 light lead to Ф 2=Ф * 0.98=571.5lm.
The two kinds of direct luminance difference=Ф of mode 1-Ф 2=606.5-571.5=35lm, more than the light efficiency of LED lamp is lost in 4lm/W, so the present invention directly contacts the bottom of LED lamp with radiator, reduce heat conduction link, the heat that LED chip produces is directly transferred in radiator, improve radiating effect, extended the life-span of LED illuminating product, on economy, Performance and quality, had corresponding improvement.
Claims (6)
1. a LED lamp plate conductive structure, comprise LED lamp, lamp plate, radiator, it is characterized in that, described lamp plate is fixed on radiator, have a rectangular hollow structure in the middle of lamp plate, have a heat radiation boss matching with the hollow structure of lamp plate on described radiator, described LED lamp is fixed on lamp plate, and directly contact with heat radiation boss, the size of described heat radiation boss is identical with the thermal conductive surface size of LED lamp bottom.
2. a kind of LED lamp plate conductive structure according to claim 1, is characterized in that, at the Si Jiaochu of lamp plate, is evenly distributed four screw holes.
3. a kind of LED lamp plate conductive structure according to claim 2, is characterized in that, is provided with a plurality of through holes on lamp plate, and wherein two through holes are as pad hole.
4. a kind of LED lamp plate conductive structure according to claim 1, is characterized in that, the heat radiation height of boss is identical with the thickness of lamp plate.
5. a kind of LED lamp plate conductive structure according to claim 1, is characterized in that, described LED lamp bottom adopts aluminum or aluminum alloy to make.
6. a kind of LED lamp plate conductive structure according to claim 1, is characterized in that, described radiator adopts aluminium alloy to make.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310711271.3A CN103742885A (en) | 2013-12-23 | 2013-12-23 | Light-emitting diode (LED) lamp heat conduction structure |
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| CN201310711271.3A CN103742885A (en) | 2013-12-23 | 2013-12-23 | Light-emitting diode (LED) lamp heat conduction structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197210A (en) * | 2014-08-22 | 2014-12-10 | 江苏日月照明电器有限公司 | LED low-voltage device capable of passing European ERP6000H authentication and forming method |
| CN104251478A (en) * | 2014-09-01 | 2014-12-31 | 中山市宇之源太阳能科技有限公司 | LED light emitting unit efficient in radiation and LED lamp |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
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| CN201973510U (en) * | 2011-01-25 | 2011-09-14 | 苏州金美家具有限公司 | Super heat conducting LED (Light Emitting Diode) lamp |
| CN101539284B (en) * | 2008-03-21 | 2012-05-16 | 富准精密工业(深圳)有限公司 | LED illumination device |
| CN102818238A (en) * | 2012-07-17 | 2012-12-12 | 吕大明 | Liquid container wind-cylinder-type LED (light-emitting diode) lamp |
| CN202955673U (en) * | 2012-12-28 | 2013-05-29 | 姚耀安 | Radiator for light emitting diode (LED) bulb lamp |
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2013
- 2013-12-23 CN CN201310711271.3A patent/CN103742885A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101539284B (en) * | 2008-03-21 | 2012-05-16 | 富准精密工业(深圳)有限公司 | LED illumination device |
| CN201973510U (en) * | 2011-01-25 | 2011-09-14 | 苏州金美家具有限公司 | Super heat conducting LED (Light Emitting Diode) lamp |
| CN102818238A (en) * | 2012-07-17 | 2012-12-12 | 吕大明 | Liquid container wind-cylinder-type LED (light-emitting diode) lamp |
| CN202955673U (en) * | 2012-12-28 | 2013-05-29 | 姚耀安 | Radiator for light emitting diode (LED) bulb lamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197210A (en) * | 2014-08-22 | 2014-12-10 | 江苏日月照明电器有限公司 | LED low-voltage device capable of passing European ERP6000H authentication and forming method |
| CN104251478A (en) * | 2014-09-01 | 2014-12-31 | 中山市宇之源太阳能科技有限公司 | LED light emitting unit efficient in radiation and LED lamp |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
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Application publication date: 20140423 |