CN101527346A - Thermoelectric cooler and illuminating apparatus adopting same - Google Patents
Thermoelectric cooler and illuminating apparatus adopting same Download PDFInfo
- Publication number
- CN101527346A CN101527346A CN200810300461A CN200810300461A CN101527346A CN 101527346 A CN101527346 A CN 101527346A CN 200810300461 A CN200810300461 A CN 200810300461A CN 200810300461 A CN200810300461 A CN 200810300461A CN 101527346 A CN101527346 A CN 101527346A
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- CN
- China
- Prior art keywords
- cooling module
- thermoelectric cooling
- metallic plate
- type semiconductor
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a thermoelectric cooler which comprises a plurality of P-type semiconductor columns, a plurality of N-type semiconductor columns, a plurality of connecting circuits, one cool end and one hot end. The P-type semiconductor columns and the N-type semiconductor columns are electrically connected by the connecting circuits. The P-type semiconductor columns, the N-type semiconductor columns and the connecting circuits are clamped between the cool end and the hot end and respectively and thermally connected with the cool end and the hot end. The cool end comprises a first metal plate and a first metal oxide insulation film which is formed on the first metal plate and positioned at one side of the first metal plate, which is adjacent to the P-type semiconductor columns, the N-type semiconductor columns and the connecting circuits. Furthermore, the invention also relates to an illuminating apparatus adopting the thermoelectric cooler for heat conduction.
Description
Technical field
The present invention relates to a kind of thermoelectric cooling module, relate in particular to a kind of thermoelectric cooling module with better cooling efficiency, and a kind of lighting device that adopts this thermoelectric cooling module.
Background technology
At present, light-emitting diode (Light Emitting Diode, LED) characteristic such as good and luminous efficiency height replaces cold-cathode fluorescence lamp (Cold Cathode Fluorescent Lamp gradually because of the tool light quality, CCFL), become the light-emitting component in the lighting device, specifically can consult people such as Michael S.Shur in the IEEE system, " Solid-State Lighting:Toward Superior Illumination " literary composition that American Control Conference delivered on (in October, 2005).
Light-emitting diode stability in use is subjected to the influence of environment temperature easily, and for example, when temperature was too high, the luminous intensity of light-emitting diode decayed easily, thereby caused shorten its useful life.
Usually, for the heat that light-emitting diode is sent can distribute quickly, can use thermoelectric cooling module (thermoelectric Cooler, TE Cooler) light-emitting diode is dispelled the heat, traditional thermoelectric cooling module generally comprises a cold junction and hot junction that is oppositely arranged, this light-emitting diode is arranged on the circuit board, this circuit board is connected with the cold junction of thermoelectric cooling module is hot, when to this thermoelectric cooling module energising, this thermoelectric cooling module can shift out heat from light-emitting diode, and force via its cold junction and to be transferred to its hot junction, thereby can utilize and the contacted heat abstractor in this hot junction, heat is further conducted and finally be distributed to the external world as radiating fin etc.
The hot junction and the cold junction of existing thermoelectric cooling module are generally insulating material, as pottery etc., it has bigger thermal resistance, make that the radiating efficiency of existing thermoelectric cooling module is low, and in the prior art, between the cold junction and circuit board of thermoelectric cooling module, and the common heat-conducting glue that uses between the hot junction of thermoelectric cooling module and the heat abstractor, as elargol etc., so that thermoelectric cooling module and circuit board and heat abstractor are linked together, and the thermal resistance of heat-conducting glue is bigger, and it has further reduced the radiating efficiency of thermoelectric cooling module.
In view of this, providing a kind of has the thermoelectric cooling module of better cooling efficiency and adopts a kind of lighting device of this thermoelectric cooling module real in necessary.
Summary of the invention
To a kind of thermoelectric cooling module be described and adopt a kind of lighting device of this thermoelectric cooling module with embodiment below.
A kind of thermoelectric cooling module, comprise a plurality of P type semiconductor posts, a plurality of N type semiconductor posts, a plurality of connecting circuits, a cold junction and a hot junction, these a plurality of connecting circuits should a plurality of P type semiconductor posts and these a plurality of N type semiconductor posts be electrically connected, these a plurality of P type semiconductor posts, a plurality of N type semiconductor posts and these a plurality of connecting circuits are folded between this cold junction and this hot junction and form hot the connection with this cold junction and this hot junction respectively, this cold junction comprises one first metallic plate and first a metal oxide insulation film that is formed on this first metallic plate, and this first metal oxide insulation film is positioned at these a plurality of P type semiconductor posts of vicinity of this first metallic plate, one side of a plurality of N type semiconductor posts and a plurality of connecting circuits.
And, a kind of lighting device that adopts above-mentioned thermoelectric cooling module to carry out heat conduction, this lighting device comprises above-mentioned thermoelectric cooling module; At least one light source is arranged on first metallic plate of cold junction of thermoelectric cooling module and with this thermoelectric cooling module and forms hot the connection; And a heat abstractor, be arranged on the hot junction of thermoelectric cooling module and and form hot the connection with this thermoelectric cooling module.
With respect to prior art, thermoelectric cooling module of the present invention is set to comprise one first metallic plate by its cold junction, and first metal oxide insulation film that is formed on this first metallic plate, at least one light source is arranged on this first metallic plate, thereby can connect this thermoelectric cooling module and heat abstractor, reach the heat that utilizes thermoelectric cooling module that at least one light source is sent and conduct to the purpose that heat abstractor dispels the heat.Because the heat conductivility of first metallic plate and the first metal oxide insulation film is better, the feasible cold junction of the thermoelectric cooling module of this first metallic plate and the first metal oxide insulation film that comprises has preferable heat conductivity, therefore this thermoelectric cooling module has preferable radiating efficiency, can effectively ensure to adopt this thermoelectric cooling module to carry out the characteristics of luminescence of the lighting device of heat conduction.
Description of drawings
Fig. 1 is the generalized section of the thermoelectric cooling module that provides of first embodiment of the invention.
Fig. 2 is the generalized section of the cold junction of thermoelectric cooling module shown in Figure 1.
Fig. 3 is the generalized section in the hot junction of thermoelectric cooling module shown in Figure 1.
Fig. 4 is the generalized section of the first metal oxide insulation film of cold junction shown in Figure 2.
Fig. 5 is the generalized section of the lighting device that provides of second embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
See also Fig. 1, a kind of thermoelectric cooling module 10 that first embodiment of the invention provides, it comprises a plurality of P type semiconductor posts 11, a plurality of N type semiconductor post 13, a plurality of connecting circuit 15, a cold junction 12 and a hot junction 14.
These a plurality of P type semiconductor posts 11 and a plurality of N type semiconductor post 13 can adopt tellurium compound, as bismuth telluride (Bi
2Te
3) or antimonial etc. as material.This connecting circuit 15 can be electrically connected these a plurality of P type semiconductor posts 11 and these a plurality of N type semiconductor posts 13, and it can specifically adopt electric conducting materials such as aluminium, tin, silver, copper, gold or alloy to make.
Please consult Fig. 2 together, this cold junction 12 is a metallic circuit (Metal Core PCB, MCPCB) 120, it specifically comprises one first metallic plate 1200, a copper foil layer 1202, and be arranged on a dielectric layer 1204 between this first metallic plate 1200 and this copper foil layer 1202, wherein, grow the first metal oxide insulation film 122 on this first metallic plate 1200.
See also Fig. 1 and Fig. 3, further, this hot junction 14 can be one second metallic plate 140, and grows one second metal oxide insulation film 142 on this second metallic plate 140.
Above-mentioned first, second metal oxide insulation film 122,142 can be respectively via adopt anodic oxidation aluminum technology (Anodic Aluminum Oxide on first, second metallic plate 1200,140, AAO) handle formation, its material can be specially the metal oxide of first, second metallic plate 1200,140.As shown in Figure 4, particularly, first metallic plate 1200 is connected with an anode and immerses in the electrolyte, the Main Ingredients and Appearance of this electrolyte is an acidic liquid, as sulfuric acid, oxalic acid, phosphoric acid or chromic acid etc., further, this anode is applied voltage, make the surface of this first metallic plate 1200 produce the layer of metal oxide.In the present embodiment, this first metallic plate 1200 can be an aluminium metal sheet, and therefore, the Main Ingredients and Appearance that is formed on the first metal oxide insulation film 122 on this first metallic plate 1200 is an aluminium oxide.As shown in Figure 4, after above-mentioned anodic oxidation aluminum technology AAO processing, this first metal oxide insulation film 122 is an aluminum oxide film 1220 with high regular hole array structure, at this moment, can in this aluminum oxide film 1220, add filler 1222, so that this first metal oxide insulation film 122 becomes a plane 1224 away from a side of first metallic plate 1200.This filler 1222 is evenly distributed in the aluminum oxide film 1220, and it is usually by the thing that is electrically insulated, as silica, aluminium oxide, spin-on glasses (Spin On Glass, SOG), composition such as organic compound.Be understandable that this second metal oxide insulation film 142 also can adopt above-mentioned anodised aluminium technical finesse to form, and it have the structure identical with the first metal oxide insulation film 122.
Certainly, above-mentioned first, second metal oxide insulation film 122,142 also can adopt other anode treatment technology, handles forming as differential arc oxidization technique (Macro-Arc Oxidation).Particularly, first, second metallic plate 1200,140 is connected with an anode and immerses in the electrolyte, the Main Ingredients and Appearance of electrolyte is a halogen liquid in the method, as avirulence solution such as potassium hydroxide (KOH) or silicates, further, this anode is applied voltage, at this moment, high-octane little arcing in the surface of first, second metallic plate 1200,140 and with moment molten sintering mode form the metal oxide layer of a densification on this surface.In the present embodiment, this first, second metallic plate 1200,140 is set to an aluminium metal sheet, its coefficient of heat conduction is roughly 160W/mK, thickness is roughly 0.5mm, after above-mentioned differential arc oxidization technique processing, these first, second metallic plate 1200,140 surfaces form the aluminum oxide film that a thickness is roughly 0.2mm respectively, and this aluminum oxide film has characteristics such as corrosion-resistant, wear-resistant, high temperature resistant, that hardness is high, thickness is even.
Be understandable that, because first, second metallic plate 1200,140 adopt heat conductivity preferred metal material, and first, the second metal oxide insulation film 122,142 material is respectively first, second metallic plate 1200,140 metal oxide, it has heat-conductive characteristic preferably equally, this feasible cold junction 12 that comprises this first metallic plate 1200 and the first metal oxide insulation film 122, and the hot junction 14 that comprises this second metallic plate 140 and the second metal oxide insulation film 142 all has preferable heat conductivity, and can conduct heat quickly and evenly.In addition, this hot junction 14 is oppositely arranged with this cold junction 12, these a plurality of P type semiconductor posts 11, a plurality of N type semiconductor post 13 and these a plurality of connecting circuits 15 are folded between this cold junction 12 and this hot junction 14, and the second metal oxide insulation film 142 in the first metal oxide insulation film 122 of these a plurality of connecting circuits 15 and this cold junction 12 and this hot junction 14 contacts and forms hot the connection.
See also Fig. 5, the lighting device 50 of a kind of tool better cooling efficiency that second embodiment of the invention provides, it adopts above-mentioned thermoelectric cooling module 10 to carry out heat conduction.This lighting device 50 comprises at least one light source 56, a heat abstractor 58, and the thermoelectric cooling module that first embodiment of the invention provided 10.Wherein, this thermoelectric cooling module 10 is used to dispelling the heat to this heat abstractor 58 from the heat that is sent by this at least one light source 56.
This at least one light source 56 can be at least one solid state light emitter, as light-emitting diode etc.The number of this at least one light source 56 can be a plurality of, and as a plurality of light-emitting diodes, and these a plurality of light-emitting diodes can be white light-emitting diode or colorful light-emitting diode, as red, green, blue light-emitting diode etc.The copper foil layer 1202 of this cold junction 12 can form a circuit (figure does not show), this at least one light source 56 can be connected on this copper foil layer 1202 by eutectic adhesion or welding adhesion, thereby form hot the connection with this thermoelectric cooling module 10, further, can be by luminous to drive this at least one light source 56 to the external power supply of this circuit.
This heat abstractor 58 comprises a pedestal 582 and a plurality of radiating fin 580, wherein, these a plurality of radiating fins 580 are arranged at the side away from the hot junction 14 of thermoelectric cooling module 10 of this pedestal 582, can adhere by eutectic (eutectic bonding) method or welding adhesion (solder bonding) method of the pedestal 582 of this heat abstractor 58 and second metallic plate 140 in this hot junction links together, thereby makes this heat abstractor 58 and this 10 hot connections of formation of thermoelectric cooling module.
During work, utilize 10 power supplies of 59 pairs of these thermoelectric cooling modules of an external power source, wherein, N type semiconductor 13 connects the positive pole of external power source 59, and P type semiconductor 11 connects the negative pole of external power source 59.During energising, the electronics that has negative electricity in the N type semiconductor 13 moves towards the positive pole of outside power supply 59, the hole that has positive electricity in the P type semiconductor 11 will be moved towards the negative pole of outside power supply 59, thus, the heat of cold junction 12 will be passed to hot junction 14 along with moving of electronics and hole, be transferred to hot junction 14 thereby heat that this at least one light source 56 produces is forced via the cold junction 12 of thermoelectric cooling module 10.
Since at least one light source 56 heat of being distributed can by with its hot connection, the preferable cold junction 12 of heat-conductive characteristic conducts on the thermoelectric cooling module 10, and when heat conducts on this thermoelectric cooling module 10, it can further conduct on the heat abstractor 58 by the good hot junction 14 of heat-conductive characteristic, thus, the heat that this at least one light source 56 is distributed can conduct to heat abstractor 58 quickly and evenly via this thermoelectric cooling module 10 and dispel the heat, make the lighting device 50 that adopts this thermoelectric cooling module 10 obtain preferable radiating efficiency, thereby effectively ensured the characteristics of luminescence of at least one light source 56.
Be understandable that, for the person of ordinary skill of the art, can technical conceive according to the present invention make the change and the distortion of other various correspondences, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (11)
1. thermoelectric cooling module, comprise a plurality of P type semiconductor posts, a plurality of N type semiconductor posts, a plurality of connecting circuits, a cold junction and a hot junction, these a plurality of connecting circuits should a plurality of P type semiconductor posts and these a plurality of N type semiconductor posts be electrically connected, these a plurality of P type semiconductor posts, a plurality of N type semiconductor posts and these a plurality of connecting circuits are folded between this cold junction and this hot junction and form hot the connection with this cold junction and this hot junction respectively, this cold junction comprises one first metallic plate and first a metal oxide insulation film that is formed on this first metallic plate, and this first metal oxide insulation film is positioned at these a plurality of P type semiconductor posts of vicinity of this first metallic plate, one side of a plurality of N type semiconductor posts and a plurality of connecting circuits.
2. thermoelectric cooling module as claimed in claim 1 is characterized in that, the material of this first metal oxide insulation film is the metal oxide of first metallic plate.
3. thermoelectric cooling module as claimed in claim 2 is characterized in that, this first metal oxide insulation film is that this first metallic plate is carried out anodized is formed.
4. thermoelectric cooling module as claimed in claim 1, it is characterized in that, this thermoelectric cooling module further comprises a copper foil layer and a dielectric layer, this copper foil layer forms a circuit, metallic circuit of the superimposed formation of this first metallic plate, dielectric layer and copper foil layer, and this dielectric layer is arranged between this first metallic plate and this copper foil layer.
5. thermoelectric cooling module as claimed in claim 1, it is characterized in that, this hot junction comprises one second metallic plate and second a metal oxide insulation film that is formed on this second metallic plate, and this second metal oxide insulation film is positioned at a side of these a plurality of P type semiconductor posts of vicinity of this second metallic plate, a plurality of N type semiconductor posts and a plurality of connecting circuits.
6. thermoelectric cooling module as claimed in claim 5 is characterized in that, the material of this second metal oxide insulation film is the metal oxide of second metallic plate.
7. thermoelectric cooling module as claimed in claim 5 is characterized in that, this first, second metallic plate is respectively an aluminium metal sheet, and this first, second metal oxide insulation film is respectively aluminum oxide film.
8. thermoelectric cooling module as claimed in claim 7 is characterized in that, this thermoelectric cooling module further comprises a plurality of fillers that are evenly distributed in the aluminum oxide film, and this filler is made up of silica, aluminium oxide, spin-on glasses and organic compound.
9. lighting device, it comprises:
One as any described thermoelectric cooling module in the claim 1 to 8;
At least one light source is arranged on first metallic plate of cold junction of thermoelectric cooling module and with this thermoelectric cooling module and forms hot the connection; And
A heat abstractor is arranged on the hot junction of thermoelectric cooling module and with this thermoelectric cooling module and forms hot the connection.
10. lighting device as claimed in claim 9 is characterized in that, this at least one light source is a light-emitting diode.
11. lighting device as claimed in claim 9 is characterized in that, first metallic plate of this at least one light source and this cold junction links together by eutectic adhesion or welding adhesion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810300461A CN101527346A (en) | 2008-03-04 | 2008-03-04 | Thermoelectric cooler and illuminating apparatus adopting same |
| US12/233,005 US20090225556A1 (en) | 2008-03-04 | 2008-09-18 | Thermoelectric cooler and illumination device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810300461A CN101527346A (en) | 2008-03-04 | 2008-03-04 | Thermoelectric cooler and illuminating apparatus adopting same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101527346A true CN101527346A (en) | 2009-09-09 |
Family
ID=41053412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810300461A Pending CN101527346A (en) | 2008-03-04 | 2008-03-04 | Thermoelectric cooler and illuminating apparatus adopting same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20090225556A1 (en) |
| CN (1) | CN101527346A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103697619A (en) * | 2013-12-27 | 2014-04-02 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor cooler module |
| WO2015027708A1 (en) * | 2013-09-02 | 2015-03-05 | 华为技术有限公司 | Optical device packaging device and optical module |
| CN105609625A (en) * | 2016-03-11 | 2016-05-25 | 厦门理工学院 | Thermoelectric power generation device agglutinated by silver paste |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100127299A1 (en) * | 2008-11-25 | 2010-05-27 | Cooper Technologies Company | Actively Cooled LED Lighting System and Method for Making the Same |
| JP5742174B2 (en) * | 2009-12-09 | 2015-07-01 | ソニー株式会社 | Thermoelectric generator, thermoelectric power generation method, and electric signal detection method |
| US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
| FR2989831B1 (en) * | 2012-04-19 | 2015-04-10 | Valeo Systemes Thermiques | THERMO-ELECTRIC DEVICE, HEAT EXCHANGER COMPRISING SUCH A DEVICE AND METHOD OF MANUFACTURE |
| CN103423915B (en) * | 2013-08-20 | 2015-04-15 | 上海理工大学 | Semiconductor flexible refrigeration band |
| CN105202801A (en) * | 2015-10-24 | 2015-12-30 | 唐玉敏 | Refrigerating device |
| WO2018081783A1 (en) * | 2016-10-31 | 2018-05-03 | Phononic, Inc. | Metal core thermoelectric device |
| CN110260556B (en) * | 2019-05-06 | 2021-06-08 | 武汉理工大学 | Thermoelectric refrigerating device and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1228581B (en) * | 1982-06-29 | 1991-06-24 | Italtecno Srl | Sealing anodically oxidised aluminium and alloys - with solns. contg. hydroxylated organic cpd. to improve resistance to alkali |
| US5441576A (en) * | 1993-02-01 | 1995-08-15 | Bierschenk; James L. | Thermoelectric cooler |
| JP4949832B2 (en) * | 2004-06-17 | 2012-06-13 | 株式会社ユニバーサルエンターテインメント | Thermoelectric conversion module |
| TWM302675U (en) * | 2006-07-13 | 2006-12-11 | Ind Tech Res Inst | Light source devices |
-
2008
- 2008-03-04 CN CN200810300461A patent/CN101527346A/en active Pending
- 2008-09-18 US US12/233,005 patent/US20090225556A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015027708A1 (en) * | 2013-09-02 | 2015-03-05 | 华为技术有限公司 | Optical device packaging device and optical module |
| CN104426052A (en) * | 2013-09-02 | 2015-03-18 | 华为技术有限公司 | Optical device packaging device and optical module |
| CN104426052B (en) * | 2013-09-02 | 2019-01-08 | 华为技术有限公司 | A kind of package of optical device device and optical module |
| CN103697619A (en) * | 2013-12-27 | 2014-04-02 | 江苏天楹环保科技有限公司 | High-thermal-conductivity metal circuit semiconductor cooler module |
| CN105609625A (en) * | 2016-03-11 | 2016-05-25 | 厦门理工学院 | Thermoelectric power generation device agglutinated by silver paste |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090225556A1 (en) | 2009-09-10 |
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Open date: 20090909 |