CN105609625A - Thermoelectric power generation device agglutinated by silver paste - Google Patents

Thermoelectric power generation device agglutinated by silver paste Download PDF

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Publication number
CN105609625A
CN105609625A CN201610140254.2A CN201610140254A CN105609625A CN 105609625 A CN105609625 A CN 105609625A CN 201610140254 A CN201610140254 A CN 201610140254A CN 105609625 A CN105609625 A CN 105609625A
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CN
China
Prior art keywords
described
characterized
thermoelectric generator
thermoelectric
microns
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CN201610140254.2A
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Chinese (zh)
Inventor
张旻澍
林建平
林文倩
曹宁
杨欣昊
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厦门理工学院
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Priority to CN201610140254.2A priority Critical patent/CN105609625A/en
Publication of CN105609625A publication Critical patent/CN105609625A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L35/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L35/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L35/02Details

Abstract

The invention discloses a thermoelectric power generation device agglutinated by silver paste. The thermoelectric power generation device comprises a thermoelectric sheet, heat conducting fins and thermal dissipation fins, wherein the thermoelectric sheet comprises a hot end and a cold end that are arranged in opposite, multiple first electrodes, multiple second electrodes, multiple p type thermoelectric structures and n type thermoelectric structures; the first electrodes are arranged on the inner surface of the hot end; the second electrodes are arranged on the inner surface of the cold end; the p type thermoelectric structures and the n type thermoelectric structures are arranged alternatively at intervals, and are connected in series through the first electrodes and the second electrodes; the heat conducting fins and the thermal dissipation fins are agglutinated on the outer surfaces of the hot end and the cold end through the silver paste adhesive respectively; and the silver paste adhesive comprises 80-90wt% of silver particles, 0.5-6wt% of curing agent and the balance of epoxy resin.

Description

Adopt the Thermoelectric Generator of silver slurry bonding

Technical field

The present invention relates to a kind of device of thermoelectric generator, particularly a kind of thermoelectricity that adopts silver slurry bonding is sent outElectrical part.

Background technology

Thermoelectric material is a kind of functional material that heat energy and electric energy can be changed mutually, the Sai Bei finding for 1823Gram effect and the peltier effect found for 1834 provide for the application of thermoelectric energy converter and thermoelectric coolingTheoretical foundation. Along with the progress of the increase of space exploration interest, Medical Physics and be difficult to day at the earthThe resource that benefit increases is investigated and Exploratory behavior, and need to develop a class can self energy supply and without the power supply of looking afterSystem, thermoelectric power generation is especially suitable to these application.

Utilize the nature temperature difference and industrial waste heat all to can be used for thermoelectric power generation, it can utilize the non-of nature existencePollution power sources, has good comprehensive social benefit. In addition, utilize micro element prepared by thermoelectric material to useIn preparing, micro power, microcell are cooling, the thermoregulating system of optic communication laser diode and infrared ray sensor,Greatly expand the application of thermoelectric material. Therefore, thermoelectric material is a kind of extensive application prospectMaterial, in environmental pollution and energy crisis day by day serious today, the research of carrying out Novel hot electric material hasVery strong realistic meaning and market prospects. Existing Thermoelectric Generator generally passes through sticky in the both sides of thermoelectricity sheetTwo radiator structures of knot agent bonding, but existing binding agent is generally polymeric material, is unfavorable for heatConduction, therefore the efficiency of this Thermoelectric Generator is lower.

Summary of the invention

The invention provides a kind of Thermoelectric Generator that adopts silver slurry bonding, can effectively address the above problem.

A Thermoelectric Generator that adopts silver slurry bonding, comprising:

Thermoelectricity sheet, comprises the hot junction that is oppositely arranged and cold junction, multiple the first electrode, multiple the second electrode, manyIndividual p-type thermoelectric structure and N-shaped thermoelectric structure, described the first electrode is arranged at the inner surface in described hot junction,Described the second electrode is arranged at the inner surface of described cold junction, and described p-type thermoelectric structure and N-shaped thermoelectric structure are handed overFor being spaced, and by the first electrode and the series connection of the second electrode;

Heat conduction fin and radiating fin, starch glue bond outside described hot junction and described cold junction by silver respectivelySurface;

Wherein, described silver slurry glue comprise 80~90wt% silver particles, 0.5~6wt% curing agent and more thanThe epoxy resin of amount.

Preferably, described silver slurry glue comprises the silver particles of 83~87wt%.

Preferably, described silver slurry glue comprises the silver particles of 85wt%.

Preferably, the thickness of described silver slurry glue is 10 microns to 100 microns.

Preferably, the thickness of described silver slurry glue is 20 microns to 50 microns.

Preferably, the thickness of described silver slurry glue is 30 microns to 40 microns.

Preferably, described epoxy resin is bisphenol type or phenol aldehyde type epoxy resin.

Preferably, the particle diameter of described silver particles is 500 nanometers to 5 micron.

Preferably, the particle diameter of described silver particles is 1 micron to 5 microns.

Preferably, described curing agent is selected from amine curing agent, imidazole curing agent and acid anhydride type curing agent.

The Thermoelectric Generator that adopts silver slurry bonding provided by the invention, by the use of heat conduction silver slurry glue, canBe transmitted to the conduction efficiency of cold junction from hot junction to improve heat, therefore, described Thermoelectric Generator can be improvedGenerating efficiency. In addition, the present invention is with the performance parameter of optimizing described silver slurry glue, described in can further improvingThe efficiency of Thermoelectric Generator.

Brief description of the drawings

Fig. 1 is the structural representation that adopts the Thermoelectric Generator of silver slurry bonding.

Fig. 2 is the cross-sectional scans electromicroscopic photograph figure that adopts the Thermoelectric Generator of silver slurry bonding.

Detailed description of the invention

Below in conjunction with drawings and Examples, the present invention is described in further detail. Be understandable that, thisLocate described specific embodiment only for explaining the present invention, but not limitation of the invention. Also need in additionIllustrate, for convenience of description, in accompanying drawing, only show part related to the present invention but not entire infrastructure.

Please refer to Fig. 1-2, the invention provides a kind of Thermoelectric Generator 100 that adopts silver slurry bonding, comprising:Thermoelectricity sheet 10, heat conduction fin 12 and radiating fin 13. Described heat conduction fin 12 and described radiating fin13 starch glue 11 by silver is respectively bonded in described thermoelectricity sheet 10 both sides.

Described thermoelectricity sheet 10 comprise packaging frame 105, multiple the first electrode 101, multiple the second electrode 102,Multiple p-type thermoelectric structures 103 and N-shaped thermoelectric structure 104. Described packaging frame 105 has relatively to be establishedThe hot junction (not indicating in figure) of putting and cold junction (not indicating in figure). Described the first electrode 101 is arranged at instituteState the inner surface in hot junction, described the second electrode 102 is arranged at the inner surface of described cold junction, described p-type thermoelectricityStructure 103 and N-shaped thermoelectric structure 104 alternate intervals are arranged, and by the first electrode 101 and the second electrode102 series connection.

Described in described heat conduction fin 12 and described radiating fin 13 are bonded in by described silver slurry glue 11 respectivelyThe outer surface of hot junction and described cold junction. Described silver slurry glue 11 comprise the silver particles, 0.5 of 80~90wt%~The curing agent of 6wt% and the epoxy resin of surplus. In the time of the increase of silver particles content, although can increase instituteState the heat conductivility of silver slurry glue 11, still, the viscosity of described silver slurry glue 11 can significantly reduce. Preferably,Described silver slurry glue comprises the silver particles of 83~87wt%. Preferred, described silver slurry glue comprises 84~86wt%Silver particles. In the present embodiment, described silver slurry glue 11 comprises the silver particles of 85wt% left and right. In addition, whenWhen the particle diameter of described silver particles is excessive, be unfavorable for effectively contacting with interface formation, therefore be unfavorable for increasing described silverThe heat conductivility of slurry glue 11; When too small, be not easy to reunite, be unfavorable for disperseing in epoxy resin, therefore also notBe beneficial to the heat conductivility that increases described silver slurry glue 11. The particle diameter of described silver particles is 500 nanometers to 5 micron.Preferably, the particle diameter of described silver particles is 1 micron to 5 microns. In the present embodiment, the grain of described silver particlesFootpath is 3 microns of left and right. Please refer to Fig. 2, as can be seen from Figure 2, described silver slurry glue 11 and described thermoelectricity sheet10 and described heat conduction fin 12 all form good combination.

Experiment showed, on the one hand, in the time that the thickness of described silver slurry glue 11 is excessive, heat conducting owing to having increasedDistance, is unfavorable for the quick conduction of heat; On the other hand, in the time that the thickness of described silver slurry glue 11 is too small, difficultyTo form effective bonding, thermoelectricity sheet 10 and described heat conduction fin 12 and described radiating fin 13 are easy to take offFall. Therefore, preferred, the thickness of described silver slurry glue is 10 microns to 100 microns. Preferred, described inThe thickness of silver slurry glue is 20 microns to 50 microns. In the present embodiment, the thickness of described silver slurry glue is 30 micronsTo 40 microns of left and right. The type of described epoxy resin is not limit, preferably bisphenol type or phenol aldehyde type epoxy resin.Described curing agent is selected from amine curing agent, imidazole curing agent and acid anhydride type curing agent.

The material of described radiating fin 13 and described heat conduction fin 12 all can adopt CNT, preferred,Adopt orderly carbon nano pipe array, the basic edge of CNT in described carbon nano pipe array is perpendicular to describedThe surface alignment in cold junction and described hot junction, thus heat transfer efficiency improved.

In use, described heat conduction fin 12 can be with for the described Thermoelectric Generator 100 that adopts silver slurry bondingThe liquid contacts such as the water that temperature is high, to conduct heat to described p-type thermoelectric structure 103 and described N-shaped thermoelectricityStructure 104; Described radiating fin 13 can be low with temperature the liquid such as water contact, will conduct described in heatThe heat of p-type thermoelectric structure 103 and described N-shaped thermoelectric structure 104 is transmitted to Thermoelectric Generator 100Outside, thus the heat conduction via from described hot junction to described cold junction formed, and then form electric current.

Further, in order to obtain the preferably temperature of heat conduction fin 12 and radiating fin 13, do as table 1Contrast test.

Table 1

When the initial temperature in hot junction is 100 DEG C, when the initial temperature of cold junction is 23 DEG C, through 4 points of 20 seconds left sidesThe right side, the temperature in hot junction becomes 63 DEG C, when the temperature of cold junction becomes 34 DEG C, can also keep 2.5 volts of voltagesLeft and right; And the initial temperature of working as hot junction is 80 DEG C, when the initial temperature of cold junction is 23 DEG C, through 3 points of left and right,The temperature in hot junction becomes 58 DEG C, and the temperature of cold junction becomes 26 DEG C, is just difficult to detect voltage. Thus, described inThe temperature in hot junction is preferably 70~100 DEG C, and the temperature of described cold junction is preferably 20~30 DEG C.

Note, above are only preferred embodiment of the present invention and institute's application technology principle. Those skilled in the artWill appreciate that, the invention is not restricted to specific embodiment described here, can enter for a person skilled in the artThe various obvious variations of row, readjust and substitute and can not depart from protection scope of the present invention. Therefore, thoughSo by above embodiment, the present invention is described in further detail, but the present invention be not limited only toUpper embodiment, in the situation that not departing from the present invention's design, can also comprise more other equivalent embodiment,And scope of the present invention is determined by appended claim scope.

Claims (10)

1. a Thermoelectric Generator that adopts silver slurry bonding, is characterized in that, comprising:
Thermoelectricity sheet, comprise the hot junction and cold junction, multiple the first electrode, multiple the second electrode, multiple p-type thermoelectric structure and the N-shaped thermoelectric structure that are oppositely arranged, described the first electrode is arranged at the inner surface in described hot junction, described the second electrode is arranged at the inner surface of described cold junction, described p-type thermoelectric structure and N-shaped thermoelectric structure alternate intervals are arranged, and by the first electrode and the series connection of the second electrode;
Heat conduction fin and radiating fin, starch glue bond in the outer surface of described hot junction and described cold junction by silver respectively;
Wherein, described silver slurry glue comprises silver particles, the curing agent of 0.5~6wt% and the epoxy resin of surplus of 80 ~ 90wt%.
2. Thermoelectric Generator according to claim 1, is characterized in that, described silver slurry glue comprises the silver particles of 83 ~ 87wt%.
3. Thermoelectric Generator according to claim 2, is characterized in that, described silver slurry glue comprises the silver particles of 85wt%.
4. Thermoelectric Generator according to claim 1, is characterized in that, the thickness of described silver slurry glue is 10 microns to 100 microns.
5. Thermoelectric Generator according to claim 4, is characterized in that, the thickness of described silver slurry glue is 20 microns to 50 microns.
6. Thermoelectric Generator according to claim 5, is characterized in that, the thickness of described silver slurry glue is 30 microns to 40 microns.
7. Thermoelectric Generator according to claim 1, is characterized in that, described epoxy resin is bisphenol type or phenol aldehyde type epoxy resin.
8. Thermoelectric Generator according to claim 1, is characterized in that, the particle diameter of described silver particles is 500 nanometers to 5 micron.
9. Thermoelectric Generator according to claim 1, is characterized in that, the particle diameter of described silver particles is 1 micron to 5 microns.
10. Thermoelectric Generator according to claim 1, is characterized in that, described curing agent is selected from amine curing agent, imidazole curing agent and acid anhydride type curing agent.
CN201610140254.2A 2016-03-11 2016-03-11 Thermoelectric power generation device agglutinated by silver paste CN105609625A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101469856A (en) * 2007-12-27 2009-07-01 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 LED lamp
CN101527346A (en) * 2008-03-04 2009-09-09 富士迈半导体精密工业(上海)有限公司;沛鑫半导体工业股份有限公司 Thermoelectric cooler and illuminating apparatus adopting same
RU2534445C1 (en) * 2013-06-04 2014-11-27 Открытое акционерное общество "РИФ" Thermoelectric cooling module
KR101519071B1 (en) * 2013-11-29 2015-05-08 한국기계연구원 Thermoelectric module assembly for dehumidifier
CN204792914U (en) * 2015-07-27 2015-11-18 电子科技大学 Anti high overstrain semiconductor cooler
CN105255385A (en) * 2015-10-23 2016-01-20 中国电器科学研究院有限公司 Single-component and high-performance conductive silver adhesive and preparation method thereof
CN205488232U (en) * 2016-03-11 2016-08-17 厦门理工学院 Adopt thermoelectric power generation device of silver thick liquid bonding

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101469856A (en) * 2007-12-27 2009-07-01 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 LED lamp
CN101527346A (en) * 2008-03-04 2009-09-09 富士迈半导体精密工业(上海)有限公司;沛鑫半导体工业股份有限公司 Thermoelectric cooler and illuminating apparatus adopting same
RU2534445C1 (en) * 2013-06-04 2014-11-27 Открытое акционерное общество "РИФ" Thermoelectric cooling module
KR101519071B1 (en) * 2013-11-29 2015-05-08 한국기계연구원 Thermoelectric module assembly for dehumidifier
CN204792914U (en) * 2015-07-27 2015-11-18 电子科技大学 Anti high overstrain semiconductor cooler
CN105255385A (en) * 2015-10-23 2016-01-20 中国电器科学研究院有限公司 Single-component and high-performance conductive silver adhesive and preparation method thereof
CN205488232U (en) * 2016-03-11 2016-08-17 厦门理工学院 Adopt thermoelectric power generation device of silver thick liquid bonding

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