CN108461616B - Packaging method of thermoelectric separation heat dissipation structure for high-power L ED - Google Patents
Packaging method of thermoelectric separation heat dissipation structure for high-power L ED Download PDFInfo
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- CN108461616B CN108461616B CN201810490997.1A CN201810490997A CN108461616B CN 108461616 B CN108461616 B CN 108461616B CN 201810490997 A CN201810490997 A CN 201810490997A CN 108461616 B CN108461616 B CN 108461616B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 71
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000000926 separation method Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 238000003801 milling Methods 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a packaging method of a thermoelectric separation heat dissipation structure for a high-power L ED, which comprises a heat dissipation substrate, an insulating layer and a copper foil layer which are sequentially arranged on the heat dissipation substrate, wherein a notch A is formed in the insulating layer and a notch B is formed in the copper foil layer through a milling process, a L ED packaging structure is arranged in the notch A and the notch B which are matched with the L ED packaging structure, a L ED base is connected with the heat dissipation substrate, and a L ED chip arranged on the L ED base is electrically connected with the copper foil layer through an electrode.
Description
Technical Field
The invention relates to the technical field of high-power L ED heat dissipation, in particular to a packaging method of a thermoelectric separation heat dissipation structure for a high-power L ED.
Background
L ED is an excellent semiconductor photoelectric device, and becomes a new generation of ideal solid-state energy-saving lighting source with the advantages of small volume, low power consumption, long service life and environmental protection lamp, along with the development of L ED towards high light intensity and high power, the heat dissipation problem of L ED is increasingly prominent, which affects the light output characteristic of L ED and the service life of the device, and is a key problem in the high-power L ED packaging.
At present, the heat dissipation problem is a main factor limiting the development of L ED, experiments prove that the service life of L ED is exponentially reduced along with the increase of the junction temperature of a L ED chip, and the heat dissipation problem is a great technical bottleneck faced by the whole high-power L ED industry when the limit temperature is broken through.
In the prior art, a high-power L ED lamp bead is directly packaged on a traditional aluminum-based copper-clad plate (a copper foil, an insulating layer and an aluminum plate are sequentially arranged from top to bottom), and heat generated by a L ED chip needs to pass through the insulating layer with high thermal resistance, so that the heat dissipation efficiency is low, the heat dissipation is poor, the temperature of the chip is increased, the stress distribution is uneven, the service life is shortened, the conversion efficiency of fluorescent powder is reduced, and the light emitting efficiency of the chip is reduced.
Therefore, it is necessary to provide a technical solution to solve the technical problems of the prior art.
Disclosure of Invention
In view of this, it is necessary to provide a packaging method of a thermoelectric separation heat dissipation structure for a high-power L ED with good heat dissipation performance, so as to greatly reduce the thermal resistance of a high-power L ED and solve the bottleneck problem of heat dissipation of a high-power L ED.
In order to solve the technical problems in the prior art, the technical scheme of the invention is as follows:
a packaging method of a thermoelectric separation heat dissipation structure for high-power L ED is characterized by comprising the following steps:
copper plating is carried out on the upper surface and the lower surface of the aluminum plate subjected to double-sided anodic oxidation to form a composite heat dissipation substrate;
sequentially covering an insulating layer and a copper foil layer on the upper surface of the composite heat dissipation substrate and laminating the insulating layer and the copper foil layer together to form a copper-clad plate;
milling a copper foil and an insulating layer corresponding to the L ED base on the upper surface of the copper-clad plate to form a notch A and a notch B;
arranging a copper layer in the position of the insulation layer milled out of the notch A;
l ED chips are arranged on L ED bases to form a L ED packaging structure, and the bases are arranged on the copper-clad plate prepared in the above steps to enable the bases to be directly connected with the composite heat dissipation substrate, so that a thermoelectric separation discrete thermal structure is formed.
As a preferred technical scheme, an insulating layer and a copper foil layer are sequentially arranged on a composite heat dissipation substrate, a part of insulating layer materials are removed through a milling process to expose the heat dissipation substrate and form a gap a, and a part of copper foil layer materials are removed through the milling process on two sides of the gap a to expose the insulating layer and form a gap B.
Adopt above-mentioned technical scheme, through structural improvement, make L ED packaging structure can direct block set up breach A and breach B, because L ED heat dissipation base is direct to be connected with the heat dissipation base plate to can directly conduct the heat that L ED chip produced to the heat dissipation base plate, avoid the high thermal resistance insulating layer in the traditional heat dissipation base plate, reduce the thermal resistance of high-power L ED by a wide margin.
As a preferable technical solution, the L ED package structure is disposed in the gap a and the gap B matched with the gap a, so that the L ED base is physically connected with the composite heat dissipation substrate, and the L ED chip disposed on the L ED base is electrically connected with the copper foil layer through an electrode;
the composite heat dissipation substrate comprises a composite aluminum layer and composite copper layers arranged on two sides of the composite aluminum layer.
Preferably, the copper layer is equal in thickness to the insulating layer and is connected to the L ED pad by soldering.
According to the technical scheme, the copper layer with the thickness equal to that of the insulating layer is electroplated on the notch A of the milled insulating layer, and the copper plating can be packaged with the ceramic heat dissipation base of the L ED chip, so that the problems that the soldering flux is not high enough in soldering height and aluminum is not easy to solder are solved.
Preferably, the copper layer is disposed in the gap a by electroplating.
Preferably, an L ED base is disposed on one surface of the composite heat dissipation substrate, and a heat sink is disposed on the other surface.
As a preferable technical solution, the heat sink is connected with the composite heat dissipation substrate in a welding manner.
Among the above-mentioned technical scheme, the heat dissipation base plate is made by aluminum plate upper and lower two sides copper facing, has improved the packaging mode of base plate and L ED lamp pearl and the connected mode of base plate and radiator simultaneously, has reduced the thermal resistance of high-power L ED by a wide margin.
Meanwhile, the lower surface copper of the composite plate is directly welded with a radiator of an L ED lamp through tin soldering, the problem of poor soldering resistance of aluminum is solved, meanwhile, the traditional high-heat-resistance connecting method using bolts, heat-conducting silicon or phase-change materials is improved, and the heat resistance of high-power L ED can be greatly reduced through direct welding.
Preferably, the composite copper layer is disposed on the composite aluminum layer by electroplating.
Preferably, the composite copper layer is disposed on the composite aluminum layer in a laminated manner.
As a preferred technical scheme, the L ED base is a L ED ceramic heat dissipation base.
Compared with the prior art, the structure of the invention can directly conduct the heat generated by the L ED chip to the radiating substrate, thereby avoiding a high-heat-resistance insulating layer in the traditional radiating substrate, greatly reducing the heat resistance of high-power L ED, improving the packaging mode of the substrate and L ED lamp beads and the connecting mode of the substrate and a radiator, and greatly reducing the heat resistance of high-power L ED.
Drawings
Fig. 1 is a schematic diagram of a copper-clad plate structure.
Fig. 2 is a schematic structural view of the heat dissipation substrate of the present invention.
FIG. 3 is a schematic diagram of the copper-clad plate structure of the present invention.
Fig. 4 is a schematic view of the copper foil and the insulating layer milled at one time.
Fig. 5 is a schematic diagram of the structure after a layer of copper is plated on the primary milled notch.
Fig. 6 is a schematic view of a structure of double-milled copper foil.
Fig. 7 is a schematic diagram after packaging L ED and a heat sink on a thermoelectric separation heat sink substrate.
In the figure, reference numeral 1 is a copper foil layer, 2 is an insulating layer, 3 is a heat dissipation substrate, 31 is a composite copper layer, 32 is a composite aluminum layer, 4 is a copper layer on a gap A, 5 is soldering liquid, 601 is an electrode, 602 is an L ED chip, 603 is a base, 604 is a silicon layer, 7 is a solder resist layer, 8 is soldering liquid, 9 is a heat sink, A is a primary milling gap, and B is a secondary milling gap.
The following specific embodiments will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solution provided by the present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1-7, the present invention provides a packaging method of a thermoelectric separation heat dissipation structure for high power L ED, comprising the following steps:
the first step is as follows: and plating copper on the upper surface and the lower surface of the aluminum plate subjected to double-sided anodic oxidation to form the composite heat dissipation substrate. As shown in fig. 2.
The second step is that: and sequentially covering an insulating layer and a copper foil layer on the upper surface of the composite heat dissipation substrate, and then laminating the insulating layer and the copper foil layer together. As shown in fig. 3.
And thirdly, milling once, namely milling off the copper foil layer and the insulating layer corresponding to the L ED base on the upper surface of the copper-clad plate, as shown in figure 4.
The fourth step: and electroplating a copper layer with the same thickness as the insulating layer at the position of the milled insulating layer. As shown in fig. 5.
The fifth step: and (4) milling for the second time, and then milling away a part of the copper foil on two sides of the notch of the copper foil so as to increase the distance between the copper foil and the copper plating in the fourth step, increase the arc voltage and prevent breakdown. As shown in fig. 6.
The thermoelectric separation heat dissipation substrate produced by the above steps has the upper surface connected with the base of the L ED chip and the lower surface connected with the heat sink through the soldering tin liquid and the soldering flux, as shown in FIG. 7.
In a preferred embodiment, the thermoelectric separation heat dissipation structure realized by the process specifically comprises a heat dissipation substrate 3, an insulating layer 2 and a copper foil layer 1 which are sequentially arranged on the heat dissipation substrate 3, a notch A is formed in the insulating layer 2 and a notch B is formed in the copper foil layer 1 sequentially by a milling process, an L ED packaging structure is arranged in the notch A and the notch B matched with the insulating layer 2, so that a L ED base 603 is connected with the heat dissipation substrate 3, and the L ED chip 602 arranged on the L ED base 603 is electrically connected with the copper foil layer 1 through an electrode 601.
Adopt above-mentioned technical scheme, through structural improvement, make L ED packaging structure can direct block set up breach A and breach B, because L ED heat dissipation base is direct to be connected with the heat dissipation base plate to can directly conduct the heat that L ED chip produced to the heat dissipation base plate, avoid the high thermal resistance insulating layer in the traditional heat dissipation base plate, reduce the thermal resistance of high-power L ED by a wide margin.
In a preferred embodiment, the heat dissipation substrate 3 is a composite substrate, and includes a composite aluminum layer 32 and a composite copper layer 31 disposed on at least one surface of the composite aluminum layer 32, and the composite copper layer 31 is connected to the L ED base 603 by soldering.
In a preferred embodiment, the aluminum composite layer 32 is provided with a copper composite layer 31 on both sides, an L ED pad 603 on one side, and a heat sink 9 on the other side.
In a preferred embodiment, the heat sink 9 is connected to the composite copper layer 31 by soldering.
In a preferred embodiment, the thermoelectric separation heat dissipation structure for the high-power L ED provided by the invention is characterized in that a composite heat dissipation substrate is formed by plating copper on the upper surface and the lower surface of double-sided anodic aluminum oxide, then an insulating layer and copper foil are sequentially coated, gaps A and B are formed by primary milling, copper plating and secondary milling, a copper layer with the same thickness as the insulating layer is electroplated on the gap A of the milled insulating layer, the copper plating can be packaged with a ceramic heat dissipation base of a L ED chip, heat generated by a L ED chip is directly conducted onto the composite heat dissipation substrate, a high-heat-resistance insulating layer in a traditional heat dissipation substrate is avoided, the heat resistance of the high-power L ED is greatly reduced, in addition, the copper on the lower surface of the composite heat dissipation substrate is directly welded with a radiator of a L ED lamp through soldering, the problem of poor soldering resistance of aluminum is solved, meanwhile, a high-heat-resistance connecting method of traditional bolts, heat conduction silicon or phase change materials is also improved, and the direct welding can greatly reduce the.
Preferably, the copper foil layer and the insulating layer corresponding to the ceramic heat dissipation base of the L ED chip are milled off on the upper surface of the copper-clad plate by one-time milling, and the copper on the upper surface of the composite plate is exposed.
Preferably, the copper foil is milled from the middle to two sides in a secondary washing mode on the basis of primary milling, so that the distance between the copper-clad layer and the copper plating is increased, the arc voltage is increased, and breakdown is prevented.
Fig. 7 is a schematic diagram of a heat dissipation substrate after encapsulating L ED and a heat sink according to the present invention, wherein the working principle is that the L ED heat dissipation path is that heat generated by L ED L ED die 602 passes through the solder layer 8, the copper layer 4, the composite copper layer 31, the composite aluminum layer 32, the composite copper layer 31, the solder liquid and the soldering flux 5 in sequence, and finally the heat is dissipated to the outside through the heat sink 9.
In order to overcome the defects of the prior art, the invention also provides a thermoelectric separation heat dissipation packaging method for high-power L ED,
the above description of the embodiments is only intended to facilitate the understanding of the method of the invention and its core idea. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (3)
1. A packaging method of a thermoelectric separation heat dissipation structure for high-power L ED is characterized by comprising the following steps:
copper plating is carried out on the upper surface and the lower surface of the aluminum plate subjected to double-sided anodic oxidation to form a composite heat dissipation substrate; the composite heat dissipation substrate comprises a composite aluminum layer and composite copper layers arranged on two sides of the composite aluminum layer;
sequentially covering an insulating layer and a copper foil layer on the upper surface of the composite heat dissipation substrate and laminating the insulating layer and the copper foil layer together to form a copper-clad plate;
milling a copper foil and an insulating layer corresponding to the L ED base on the upper surface of the copper-clad plate to form a notch A and a notch B;
arranging a copper layer in the position of the insulation layer milled out of the notch A;
arranging L ED chips on L ED bases to form a L ED packaging structure, and arranging the bases on the copper-clad plate prepared in the above step to directly connect the bases with the composite heat dissipation substrate, so as to form a thermoelectric separation discrete thermal structure;
sequentially arranging an insulating layer and a copper foil layer on a composite radiating substrate, removing partial insulating layer materials through a milling process to expose the radiating substrate and form a gap A, and removing partial copper foil layer materials through the milling process on two sides of the gap A to expose the insulating layer and form a gap B;
l ED packaging structure is arranged in the gap A and the gap B matched with the LED packaging structure, so that the L ED base is physically connected with the composite heat dissipation substrate, and the L ED chip arranged on the L ED base is electrically connected with the copper foil layer through electrodes;
the copper layer is equal to the insulating layer in thickness and is connected with an L ED base in a welding mode;
the composite heat dissipation substrate is characterized in that an L ED base is arranged on one surface of the composite heat dissipation substrate, and a radiator is arranged on the other surface of the composite heat dissipation substrate and is connected with the composite heat dissipation substrate in a welding mode;
a composite copper layer is disposed on the composite aluminum layer in an electroplated or laminated manner.
2. The method for packaging a high power L ED with a thermoelectric separation and heat dissipation structure, as recited in claim 1, wherein the copper layer is disposed in the gap A by electroplating.
3. The method for packaging a high power L ED with a thermoelectric separation heat dissipation structure as recited in claim 1 or 2, wherein the L ED base is a L ED ceramic heat dissipation base.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810490997.1A CN108461616B (en) | 2018-05-21 | 2018-05-21 | Packaging method of thermoelectric separation heat dissipation structure for high-power L ED |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810490997.1A CN108461616B (en) | 2018-05-21 | 2018-05-21 | Packaging method of thermoelectric separation heat dissipation structure for high-power L ED |
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| Publication Number | Publication Date |
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| CN108461616A CN108461616A (en) | 2018-08-28 |
| CN108461616B true CN108461616B (en) | 2020-08-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111637428B (en) * | 2020-04-21 | 2021-10-15 | 江西吉丰工业技术有限公司 | Integrated high-power LED thermoelectric separation support |
| CN113369626B (en) * | 2021-06-25 | 2023-03-24 | 中国电子科技集团公司第五十四研究所 | Low-contact thermal resistance mounting method for high-power amplifier chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2063334U (en) * | 1989-09-04 | 1990-10-03 | 南开大学 | Metal printed circuit board |
| CN201918423U (en) * | 2010-12-07 | 2011-08-03 | 山东山泰集团有限公司 | LED heat conduction and dissipation mechanism |
| CN202363517U (en) * | 2011-12-01 | 2012-08-01 | 珠海全宝电子科技有限公司 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201918430U (en) * | 2011-01-27 | 2011-08-03 | 深圳市德泽能源科技有限公司 | Integral heat dissipation structure for LED substrate |
| CN204611406U (en) * | 2015-03-20 | 2015-09-02 | 北京科睿兆明光电科技有限公司 | Led lamp component |
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- 2018-05-21 CN CN201810490997.1A patent/CN108461616B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2063334U (en) * | 1989-09-04 | 1990-10-03 | 南开大学 | Metal printed circuit board |
| CN201918423U (en) * | 2010-12-07 | 2011-08-03 | 山东山泰集团有限公司 | LED heat conduction and dissipation mechanism |
| CN202363517U (en) * | 2011-12-01 | 2012-08-01 | 珠海全宝电子科技有限公司 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
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